JP2005085774A - Process for producing multilayer printed wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a process for producing a multilayer printed wiring board, capable of reducing the production man-hours. <P>SOLUTION: In the process for producing a multilayer printed wiring board by laying works provided with a wiring pattern in layers, respective layers are combined, such that the layer arrangement of wiring pattern becomes symmetric at the center part of the layer (between L3 and L4). <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing a multilayer printed wiring board in which wiring patterns are stacked in layers.

Conventionally, a printed wiring board in which different wiring patterns are layered is known. FIG. 10 is a diagram for explaining circuit formation of a printed wiring board having six layers of wiring patterns (circuit data). In the production of a printed wiring board, it is often used for so-called imposition efficiency, in which a plurality of panels (wiring pattern forming regions) are formed on one work as shown in the figure. In the figure, numbers 1 to 6 are attached to the films of the respective layers. Since the inner layer uses a core material and circuit data is printed on the front and back, two numbers are shown (the upper number indicates the front surface and the lower number indicates the back surface). In the case of six layers, film drawing for six layers and circuit formation are performed three times.
FIG. 11 is a flowchart of the manufacturing process of the printed wiring board of FIG. As shown in FIG. 11, it is manufactured in the process sequence of drawing, inner layer circuit formation, appearance inspection, lamination, drilling, copper plating, outer layer circuit formation, appearance inspection, and solder resist formation.
As another conventional technique, there is a technique in which graphic data on both sides of a printed circuit board is simultaneously output on the same plane, so that the labor of photo drawing and plate making can be reduced. (For example, refer to Patent Document 1).
In this technique, as shown in FIG. 12, a first step (a) in which a front surface pattern 1 and a back surface pattern 2 are superposed into two layers is copied, The second step (b) to obtain 1 'and 2' by reversing the data in the left and right direction respectively, and moving the figure data on the front and back sides that are superposed into two layers in this inverted state, that is, A third step (c) for moving the position in the up and down direction; a surface pattern 1 in a non-reversed state in the first step; and a reverse side pattern in a reversed state moved to the surface layer side by the third step This is a graphic data synthesis processing method comprising a fourth step (d) in which 2 'is arranged in parallel on the same plane and synthesized as a synthesis pattern 3.
JP-A-6-203103

However, in the printed wiring board of FIG. 10, the circuit data needs to be formed and inspected by the number of inner layers (4 layers in the case of 6 layers). In addition, the circuit data of 2 layers of the surface layer is formed. And the inspection process is also required ((1) and (2) in FIG. 11). For this reason, it took time and effort to manufacture the printed wiring board.
Further, in the processing method of graphic data of printed circuit boards and component mounting data by CAD disclosed in Japanese Patent Laid-Open No. 6-203103, graphic data inversion and graphic data layer movement are required. There is a problem that it takes time and effort to process.
The present invention has been made in view of the above-described circumstances, and an object thereof is to provide a method for manufacturing a multilayer printed wiring board that can reduce the number of man-hours during manufacturing.

In order to solve the above-described problem, the invention according to claim 1 is a method for manufacturing a multilayer printed wiring board in which a work on which a wiring pattern is formed is manufactured in a layered manner, and the layer configuration by the wiring pattern is a layer. The most important feature is a method of manufacturing a multilayer printed wiring board that is symmetric in the central portion.
According to a second aspect of the present invention, a plurality of wiring pattern forming regions are provided in the same surface of the work on which the wiring pattern is formed, and the number of the wiring pattern forming regions in the same surface of the work is an even number. The manufacturing method of the multilayer printed wiring board is a main feature.
According to a third aspect of the present invention, when there are a plurality of types of wiring patterns in the same surface of the workpiece, the same number of the wiring patterns are arranged in the same surface of the workpiece. The main feature is a method of manufacturing a wiring board.
In the invention according to claim 4, in order to make the layer configuration by the wiring pattern symmetrical in the center portion of the layer, when creating a reversal work in which the base work is reversed, A multilayer printed wiring board in which the base work is reversed by an axis parallel to the direction in which the same wiring pattern formation regions are arranged when there are a plurality of the same wiring pattern formation regions in the same surface of the work. The manufacturing method is the main feature.
Further, in the invention according to claim 5, in order to make the layer structure by the wiring pattern symmetrical in the center part of the layer, when making an inverted work in which the original work is inverted, When there are a plurality of the same wiring pattern formation regions on the same surface of the workpiece, the orientation and position of the shaft so that the base workpiece can be reversed by an axis parallel to the direction in which the same wiring pattern formation regions are arranged. The main feature is a method for manufacturing a multilayer printed wiring board in which a mark for indicating is attached to the cut-off portion of the base workpiece.

  According to the present invention, since the combination is performed so that the layer configuration by the wiring pattern is symmetric at the center of the layer, the number of man-hours for manufacturing the multilayer printed wiring board can be reduced.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a view for explaining Example 1 of a method for producing a multilayer printed wiring board according to an embodiment of the present invention. The example in the figure shows a printed wiring board having a six-layer wiring pattern (circuit data). In this figure, the film of each layer is numbered 1 to 6. Since the inner layer uses a core material and circuit data is printed on the front and back, two numbers are shown (the upper number indicates the front surface and the lower number indicates the back surface).
The combinations of the layers are combined so that the layer configuration by the wiring pattern is symmetric at the center of the layers (see FIG. 2). In this example, the center of the layer corresponds to between L3 (L is a layer) and L4. Thus, in the manufacturing method of the multilayer printed wiring board of Example 1, the film which used to be 6 layers is reduced to 3 layers, and the number of circuit formations is also reduced to 2 times. Also, the number of inner layer inspections required for the inner layer is reduced to half since two types of wiring patterns are formed in one work. Therefore, the man-hour at the time of manufacturing a multilayer printed wiring board is reduced.
That is, the panels (4 in total) in which L1 and L6 are formed on the first and fourth workpieces are formed in a symmetrical positional relationship (FIG. 2), and L2 is provided on each of the second and third workpieces. , L3, L4, and L5 (a total of four panels) are formed in a symmetrical positional relationship (FIG. 2).
Therefore, by superposing these four workpieces in the order shown, a printed wiring board is obtained in which the four panels on each workpiece overlap and are stacked in order from top to bottom, L1 to L6, and bottom to L1 to L6. It is done.
In FIG. 2, L1 and L6 coexist on the first and fourth workpieces, and L2, L3, L4, and L5 coexist on the second and third workpieces. Yes.

  FIG. 3 is an explanatory view of a method for producing a multilayer printed wiring board in Example 2. Example 2 is a case where a plurality of wiring pattern forming regions are provided in the same surface of a work on which a wiring pattern is formed, and the number of wiring pattern forming regions in the same surface of the work is an even number. When an even number of panels (wiring pattern forming regions) are imposed on one work, all panel stacking states are normal layer structures (see FIG. 3A). On the other hand, as shown in FIG. 3B, when an odd number of panels are impositioned on one panel, one panel does not have the designed layer structure. Thus, in Example 2, since the number of wiring pattern formation regions in the same plane of the work is an even number, a layer structure as designed can be obtained. In addition, the same effect as in the first embodiment can be obtained.

  Next, the manufacturing method of the multilayer printed wiring board in Example 3 is demonstrated using Fig.3 (a). In the third embodiment, when there are a plurality of types of wiring patterns on the same surface of the workpiece, the same number of wiring patterns are arranged on the same surface of the workpiece. On the other hand, FIG. 4 shows a case where the same number of wiring patterns are not arranged on the same surface of the workpiece. In this case, the layer structure of the portion surrounded by the dotted line on the right side does not become as designed. As described above, when there are a plurality of types of wiring patterns on the same surface of the workpiece, the same number of wiring patterns can be arranged on the same surface of the workpiece to obtain a layer structure as designed. In addition, the same effect as in the first embodiment can be obtained.

5-8 is explanatory drawing of the manufacturing method of the multilayer printed wiring board in Example 4. FIG. In the fourth embodiment, in order to make the layer configuration by the wiring pattern symmetrical in the center of the layer, in the case of making a reversal work in which the base work is reversed, the same panel is formed on the same surface of the base work. When there are a plurality of the workpieces, the base workpiece is inverted by an axis parallel to the direction in which the same panels are arranged.
FIG. 5 shows a case where two different types of panels are arranged in the work. In this case, inversion is performed with the side where the panels are not arranged as an axis. By doing so, a layer structure as designed can be obtained (L1-L2-L3-L4-L5-L6).
That is, when the other three workpieces to be stacked are arranged with respect to the three workpieces on the left side of the rotation axis, the three workpieces on the left side with the rotation axis as the center are reversed 180 degrees as illustrated. The other three workpieces are arranged on the right side as described above, and the right three workpieces whose directions are determined in this way are arranged at the positions indicated by dotted lines, respectively, so that the efficient superposition structure intended by the present invention is achieved. It can be obtained and workability is improved.
6 and 7 show a case where four panels (two types of two panels are arranged) in the work. As shown in FIG. 6, the layer structure as designed can be obtained by inverting the base workpiece with an axis parallel to the direction in which the same panels are arranged (L1-L2-L3-L4-L5-L6).
Similarly to FIG. 5, the example of FIG. 6 also shows a method of arranging the panels prior to the stacking operation. The three panels arranged in advance in a row are arranged around the rotation axis located on the right side of the three panels. Three panels having the orientation when the panels are inverted 180 degrees as they are are arranged in a symmetrical positional relationship. By moving the three panels arranged on the right side of the rotation axis to the positions indicated by dotted lines, the efficient stacking order intended by the present invention can be achieved by stacking in this order.
On the other hand, FIG. 7 shows a case where the same panel is inverted by an axis that is not parallel to the direction in which the panels are arranged. In this case, the layer structure is not as designed (L1-L2-L3-L3-L2-L1).
FIG. 8 shows a case where six panels (two types of three panels each) are arranged in the work. As shown in FIG. 8A, the layer structure as designed can be obtained by inverting the base workpiece with an axis parallel to the direction in which the same panels are arranged (L1-L2-L3-L4-L5- L6). On the other hand, FIG. 8B shows a case in which the same panel is reversed by an axis that is not parallel to the direction in which the same panels are arranged. In this case, the layer structure is not as designed (L1-L2-L3-L3-L2-L1). In addition, in the manufacturing method of the multilayer printed wiring board of Example 4, the effect similar to the case of Example 1 can be acquired.

Next, the manufacturing method of the multilayer printed wiring board in Example 5 is demonstrated using FIG. In the fifth embodiment, in order to make the layer configuration by the wiring pattern symmetrical in the center portion of the layer, when the reversal work in which the base work is reversed is formed, the same panel is formed on the same surface of the base work. If there is more than one, a mark (arrow mark) to indicate the direction and position of the axis is attached to the cut-off part of the base work so that the base work can be reversed by an axis parallel to the direction in which the same panel is aligned Is the case.
As shown in FIG. 9, an arrow → is provided as a mark indicating the direction and position of the reversal axis in the cut-off portion of the workpiece. The arrows are shifted for each workpiece. This is because if they are provided at the same position, they cannot be judged whether they have been reversed correctly. The arrow for each work shows one direction, but when it is reversed correctly and overlapped, it becomes an arrow pointing in both directions as shown in FIG. Therefore, in the method for manufacturing a multilayer printed wiring board of Example 5, the reversal direction can be easily confirmed. In addition, the same effect as in the first embodiment can be obtained.

The figure explaining Example 1 of the manufacturing method of the multilayer printed wiring board which is embodiment of this invention. The figure explaining the combination of a layer. Explanatory drawing of the manufacturing method of the multilayer printed wiring board in Example 2 and Example 3. FIG. The figure explaining the case where the same number of wiring patterns are arranged on the same surface of the workpiece. The figure explaining the case where two types of different panels are arranged in the work. Explanatory drawing in the case of reversing a base workpiece | work by the axis | shaft parallel to the direction where the same panel is located in a line (when the number of panels is two). Explanatory drawing in the case of reversing the base workpiece by an axis that is not parallel to the direction in which the same panels are arranged (when the number of panels is two). Explanatory drawing in case the number of panels is six. The figure which shows the case where the mark which shows the direction and position of an inversion axis | shaft is provided in the cut-off part of the workpiece | work. The figure explaining the manufacturing method of the conventional printed wiring board with a 6-layer wiring pattern. The flowchart of the manufacturing process of the printed wiring board of FIG. The figure explaining the technique in patent document 1. FIG.

Explanation of symbols

1, 1 'surface pattern 2, 2' back surface pattern 3 synthetic pattern

Claims (5)

A method for manufacturing a multilayer printed wiring board, wherein a work in which a wiring pattern is formed is manufactured in a layered manner,
A method of manufacturing a multilayer printed wiring board, wherein a layer structure by the wiring pattern is symmetric at the center of the layer.   The multilayer according to claim 1, further comprising a plurality of wiring pattern forming regions in the same surface of the work on which the wiring pattern is formed, wherein the number of the wiring pattern forming regions in the same surface of the work is an even number. Manufacturing method of printed wiring board.   2. The multilayer printed wiring according to claim 1, wherein when there are a plurality of types of wiring patterns in the same surface of the workpiece, the same number of each type of wiring pattern is arranged in the same surface of the workpiece. A manufacturing method of a board.   In order to make the layer structure by the wiring pattern symmetric in the center part of the layer, in the case of creating a reversal work in which the base work is reversed, the same wiring pattern is formed on the same surface of the base work. 2. The multilayer printed wiring board according to claim 1, wherein when there are a plurality of forming regions, the base work is inverted by an axis parallel to the direction in which the same wiring pattern forming regions are arranged. Method.   In order to make the layer structure by the wiring pattern symmetric in the center part of the layer, in the case of creating a reversal work in which the base work is reversed, the same wiring pattern is formed on the same surface of the base work. When there are a plurality of formation regions, a mark for indicating the orientation and position of the base work is provided on the base work so that the base work can be reversed by an axis parallel to the direction in which the same wiring pattern formation regions are arranged. The method for producing a multilayer printed wiring board according to claim 1, wherein the method is applied to a cut-off portion.

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