JP2002163316A - Three-dimensional observation method for multiplayer printed circuit board, and recording medium therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a three-dimensional(3D) observation method for multilayer printed circuit board, with which the inside of a multilayer printed circuit board designed on the basis of garber data and drill data can be three-dimensionally observed in free directions, and to provide a recording medium therefor. SOLUTION: Data are read (S1), the presence/absence of a spot mixed with negative data is checked (S2) and when there is a subtraction spot, 3D display processing only of positive data is performed (S3a) but when there is no subtraction spot, 3D display processing is performed as it is (S3b). An operator designates an observation spot with a mouse and when an angle is instructed, the observation spot is displayed at the designated angle (S6 and S7). In internal zoom observation, the change of angle and the change of zoom magnification power are performed (S8 and S9). Therefore, since thickness can be added to the cross section of an aperture or the like, there is no sense of incompatibility in view and the observation is facilitated.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for three-dimensionally observing a multilayer printed circuit board and a recording medium thereof, and more particularly, to a method for three-dimensionally designing the inside of a multilayer printed circuit board designed based on Gerber data and drill data. The present invention relates to a method for observing a three-dimensional multilayer printed circuit board and a recording medium for the method.

[0002]

2. Description of the Related Art In recent years, for example, there has been a tremendous reduction in the size and functionality of mobile phones and mobile terminals. For miniaturization and the like, it is essential to reduce the size and performance of electronic components and increase the number of layers on a printed circuit board. is there. In particular, a multilayer printed circuit board having about 20 layers has been put to practical use. In a multilayer printed circuit board, through drill holes are used to electrically connect both sides of a single printed circuit board. In recent years, new manufacturing technologies such as inner vias and blind vias have been used. Further, it has been developed into a build-up multilayer printed circuit board in which wiring boards are laminated in layers via an insulating resin.

[0003] Here, a blind via is a manufacturing technique in which a surface layer and an inner layer are penetrated by a drill from a surface layer to a designated inner layer, instead of being drilled through all the layers. An inner via is a blind via. In a further development, the inner layers are penetrated by a plurality of drills between the layers (for example, in an eight-layer printed circuit board, two layers and three layers).
Interlayer drill, 6-7 layer drill, inner layer drill of 2 layer 7 layer drill) Surface layer and inner layer are blind, surface layer-
This refers to a manufacturing technique that allows penetration by an inner interlayer drill.

That is, not only the through-drilled holes but also interlayer drilled holes for connecting layers (inside the insulating resin) are used to achieve a high-density build-up multilayer printed circuit board. Generally, Gerber data and drill data are used as basic data for manufacturing a multilayer printed circuit board. Gerber data and drill data are created after designing using a computer. Here, the Gerber data refers to NC data (numerical control data) composed of a specific aperture and a start point and an end point when the aperture is moved. Drill data refers to data passed to a drilling device to indicate a position at which a hole for conducting between the layers of a printed circuit board is to be made.
This is C data.

On the other hand, it is necessary to check whether the multi-layer printed circuit board, which has been designed, satisfies the basic rules of printed circuit board design, or whether the designed data can withstand the capability of the manufacturing process. If the original function is not exhibited after the production of the multilayer printed circuit board, it is necessary to clarify the cause and take appropriate measures. Here, as the basic rules, for example, the circuit pattern must not be an acute angle, the minimum value of the remaining copper foil of the drill and the pad, the allowable value of the deviation of the upper and lower drills, the signal line and the signal There is an allowable value of the line interval, an allowable value of the pad and the like, and the like. FIG. 8 shows, for example, 80 × 40 m
FIG. 4 is a plan view in which a pattern of m-th six-layer printed circuit board 100 and through drill holes are two-dimensionally displayed.

[0006]

However, as shown in FIG. 8, in a drawing (plan view) of a conventional printed circuit board, when there are a plurality of interlayer drills, "the data of which layer and which layer It is almost impossible to visually confirm whether drilling has been performed.
Only a / CAM engineer could observe. That is,
The number of personnel who can confirm whether or not the basic rules and the like are satisfied is limited, and it takes time to confirm the securing of the basic rules and the like, and the cost is high. In such a case, if the inside of the multilayer printed circuit board can be visually recognized in three dimensions,
Even a worker (operator) with a low level of skill can check the inside, and the time and cost are large.

Therefore, an object of the present invention is to provide Gerber data,
An object of the present invention is to provide a method for three-dimensionally observing a multilayer printed circuit board in a three-dimensional free direction, which is designed based on drill data, and a recording medium for the method.

[0008]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a three-dimensional display of a member portion and an interlayer inside of a multilayer printed circuit board designed using data for designing a multilayer printed circuit board in a two-dimensional display. , To observe. Further, when the three-dimensional display is performed, a thickness is given to a member portion of the data for designing a multilayer printed circuit board in the two-dimensional display, and a space is provided between layers. The negatively displayed portion of the two-dimensionally displayed multi-layer printed circuit board design data is positively displayed. In addition, an observation position, an observation angle, and a zoom observation can be freely set with respect to the inside of the three-dimensionally displayed multilayer printed circuit board.

In this way, as shown in FIG. 4, for example, a member (copper foil or the like) of the multilayer printed circuit board can have a thickness and a space between the layers to provide three-dimensional display. Since zoom observation and the like can be freely performed on the inside, even a worker (operator), for example, whose skill level is not so high can check the inside of the multilayer printed circuit board.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the illustrated embodiment. FIG. 1 is a block diagram of an embodiment of a three-dimensional observation apparatus TD for a multilayer printed circuit board to which the present invention is applied. As shown in FIG. 1, a three-dimensional observation apparatus TD for a multilayer printed circuit board includes a data storage device 10 for storing various data.
And a control device 20 for performing various controls, and an input / output device 30 for inputting and outputting various data.

The data storage device 10 comprises a Gerber data storage unit 11 for storing Gerber data and a drill data storage unit 12 for storing drill data. The control device 20 includes a data reading unit 21, a three-dimensional display data generation unit 22, an observation angle control unit 23, an internal zoom observation control unit 24, and a positive data display control unit 25.
The data reading unit 21 reads specified Gerber data or drill data from the data storage device 10.

The three-dimensional display data generating section 22 attaches “thickness” described below and “space between layers” based on two-dimensional display data, ie, Gerber data and drill data.
Is provided to generate data for three-dimensional display. To display the two-dimensional display data in three dimensions, commercially available three-dimensional display software (for example, Adobe dimension of Adobe) is used. Regarding the thickness, since the thickness is not represented in Gerberda used for wiring patterns, etc.,
For example, as shown in FIG. 2 (A), the pattern, the through-drilled hole, the land, and the like, which are “member parts”, are provided with a thickness to facilitate visual observation with the naked eye. Similarly, an appropriate space is provided between the layers so that the layers can be easily observed with the naked eye.

The process shown in FIG. 3 is performed to provide the above-mentioned thickness and provide a space. That is, as shown in FIG. 3, the Gerber data and the drill data are read, a certain thickness parameter is given to a member such as a pattern, and the thickness is given. It is applied and thickened.

The observation angle control unit 23 is, for example, as shown in FIG.
2B or from the angle shown in FIG. 2B so as to enable observation from an angle desired by the operator. Note that the observation angle control is performed using the three-dimensional display software (Adobe dimensio by Adobe).
Perform by n). The internal zoom observation control unit 24 performs external appearance observation from the side of the printed circuit board at an angle shown in FIG. 4A, for example, and performs control when performing internal zoom observation as shown in FIG. 4B. Do. In addition, zoom observation from a 360-degree direction is possible while maintaining the magnification during zoom observation. The internal zoom observation control is performed by the three-dimensional display software (Adobe dimension by Adobe).
Done by

The function of the positive data display control unit 25 will be described with reference to FIGS. For example, when a thermal aperture (radiation aperture) is two-dimensionally displayed by Gerber data, a small black circle is subtracted from a large black circle, and a diagonal line A is further subtracted, as shown in FIG.
It is necessary to generate the shape of the thermal aperture 41 by subtracting the oblique line B. That is, the Gerber data is two-dimensional data, but not all data expressed in black but data expressed in white. For example, a donut shape can be expressed by subtracting a small black circle from a large black circle. In such a case, the small black circle to be subtracted is called negative data.

However, if the thermal aperture data obtained in this manner is three-dimensionally displayed as it is, the background is erased by the negative data.
The background that should be transparent cannot be observed. For example, FIG.
As shown in (B), the display becomes the negative data mixed display 42 in which the positive data 42a and the negative data 42b are mixed, and a portion other than the three-dimensional display is generated (for example, a cross section of the thermal aperture). This makes you feel strange. Therefore, in order to solve this problem, the Gerber data is read, the Gerber data is analyzed, and the negative part is converted into a positive expression. That is, a value (thickness) in the Z direction is given to the Gerber data and the drill data of the two-dimensional display data, and converted into the positive data display 43 (see FIG. 6). This makes it easy for the operator to confirm the basic rules without feeling uncomfortable in the appearance of the operator.

Next, the operation of this embodiment will be described with reference to the flowchart shown in FIG. As shown in FIG.
The Gerber data and the drill data are read (step S1), and when a three-dimensional display such as a thermal aperture is displayed, it is checked whether or not there is a negative data mixed portion (subtraction portion) (step S2). In this case, a three-dimensional display process using only positive data (see FIG. 6) is performed (step S3a). If there is no subtraction point, three-dimensional display processing is performed (step S3b). In these steps S3 and S3a, "thickness" is given to the member portion as described above, and "space" is provided between the layers.

Next, the operator designates an interlayer / member portion to be observed on the multilayer printed circuit board with a mouse via a display (step S4), designates an observation point (step S5), and designates an observation angle (step S5).
6) The information is displayed on the display with the specified interlayer / member portion, location, and angle (step S7). When performing the internal zoom observation (step S8), an internal observation is instructed via a mouse to perform the internal zoom observation. During this internal zoom observation, it is possible to change the observation angle, change the zoom magnification, and the like (step S9). When the internal zoom observation is not performed (step S8), the operator determines whether or not the observation is completed, and when the observation is completed, the operation is ended (step S1).
0). If the observation is not completed, the flow returns to step S4, and a new interlayer / member portion to be observed is designated, and steps S5 to S5 are performed.
Step S10 is repeated.

In the above-described embodiment, the case of a through-type drill is shown. However, the present invention is naturally applicable to a case of a non-through-type drill such as an inner via and a blind via.

[0020]

As described above, according to the present invention, the following effects can be obtained. Since the inside of the multilayer printed circuit board can be observed in three-dimensional display, it is easy to observe and judge whether the pattern, through-drilled hole, etc., are as designed, or whether this design value is appropriate. Can be. Further, since the thickness can be added to the cross section of the thermal aperture or the like by the positive data, there is no unnaturalness in appearance and the observation becomes easy.

[Brief description of the drawings]

FIG. 1 is a block diagram of an apparatus to which an embodiment of the present invention is applied.

FIG. 2 is a perspective view showing a difference in observation angle in the embodiment.

FIG. 3 is a flowchart of thickness setting and space setting in the embodiment.

FIG. 4 is a perspective view showing a zoom state of interlayer observation in the embodiment.

FIG. 5 is a conceptual diagram showing a relationship between positive data and negative data and a perspective view of simultaneous display of positive display and negative display in the embodiment.

FIG. 6 is a flowchart of three-dimensional display using only positive data in the embodiment.

FIG. 7 is a flowchart of an overall operation of the embodiment.

FIG. 8 is a plan view of a conventional multilayer printed circuit board.

[Explanation of symbols]

 ТD Multi-layer printed board three-dimensional observation device 10 Data storage device 11 Gerber data storage unit 12 Drill data storage unit 20 Control device 21 Data reading unit 22 3D display data generation unit 23 Observation angle control unit 24 Internal zoom observation control unit 25 Positive Data display control unit 30 I / O device 31 Output unit 32 Input unit

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5B046 AA08 BA06 DA05 DA10 FA02 FA16 GA01 5E346 BB01 GG31 HH31

Claims (7)

[Claims] 1. A three-dimensional observation of a multi-layer printed circuit board characterized by displaying and observing three-dimensionally a member portion and an interlayer inside of the multi-layer printed circuit board designed using the two-dimensionally displayed multi-layer printed circuit board design data. Method. 2. The multi-layer printing according to claim 1, wherein, when the three-dimensional display is performed, a thickness is given to a member portion of the multi-layered printed circuit board design data for the two-dimensional display and a space is provided between layers. A three-dimensional observation method for substrates. 3. The three-dimensional observation method for a multilayer printed circuit board according to claim 1, wherein a negatively displayed portion of the two-dimensionally displayed multilayer printed circuit board design data is displayed positively. 4. The apparatus according to claim 1, wherein an observation position, an observation angle, and a zoom observation are made freely with respect to the inside of the three-dimensionally displayed multilayer printed circuit board. 3D observation method of multilayer printed circuit board. 5. The tertiary multi-layer printed circuit board according to claim 1, wherein the two-dimensionally displayed multi-layer printed circuit board design data is Gerber data and drill data. Original observation method. 6. A process for reading multi-layer printed circuit board design data for two-dimensional display, and a process for giving a thickness to a member portion of the read two-dimensional display multi-layer printed circuit board design data and providing a space between interlayer portions. A process of performing a positive display on a negative display portion of the data given the thickness; and a process of passing the two-dimensional display multilayer printed circuit board design data that has been subjected to the positive display process to a three-dimensional display means. A recording medium that stores a program to be executed by a computer. 7. The method for observing a three-dimensionally printed circuit board according to claim 1, wherein the display means of the three-dimensional display is an Adobe dimension of Adobe. recoding media.