JP3297611B2 - Manufacturing panel design system - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a manufacturing panel design system, and more particularly to a manufacturing panel design system suitable for use in designing a manufacturing panel when designing a printed circuit board by a computer-aided CAD system. About.

[0002] A "manufacturing panel" is a unit for manufacturing a printed circuit board, and is generally constituted by a plurality of boards. Here, the plurality of substrates may be the same type of substrate or a different type of substrate. In addition, a symbol called an “alignment mark” for performing alignment in the manufacturing process, a drawing number, and the like are added to the manufacturing panel.

[0003]

2. Description of the Related Art In a conventional CAD system, when designing a manufacturing panel, each substrate constituting the manufacturing panel is grasped as a layer structure. Here, “layer” refers to C
It is a logical unit handled as a unit of design when modeling and expressing a substrate and a manufacturing panel on an AD system, and may be referred to as a “logical layer”. Then, a name (layer name) or a number (layer number) is assigned to each of these layers to provide processing.

[0004] In the conventional CAD system, when correlating the respective substrates constituting the manufacturing panel, the respective layers are correlated by recognizing the same layer by matching the layer names or the layer numbers. However, it has not been possible to arrange the substrates having different layer configurations in which the layer names or the layer numbers do not match on the same manufacturing panel and to design the manufacturing panel and create the manufacturing data.

[0005] For this reason, when arranging substrates having different layer configurations having different layer names or layer numbers on the same manufacturing panel, if the manufacturing panel is managed by the layer name, the layer name must be changed. When the manufacturing panel is managed by the layer number, it is necessary to move the data between layers for each layer so as to match the layer name or the layer number between the substrates, and the processing is complicated. There was a problem.

[0006] The manufacturing data refers to NC data (Numerical Control D) for directly operating a photo plotter, an NC drill machine, or the like.
ata), and all data related to the manufacture of printed circuit boards, such as a drawing such as a manufacturing instruction drawing, a processed outline drawing, or a hole drawing, or a form showing coordinate values of holes such as vias and through holes. Shall be.

[0007]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems of the prior art, and an object of the present invention is to provide different layers whose layer names or layer numbers do not match. When arranging substrates having the same structure on the same manufacturing panel, build an appropriate layer structure and design the manufacturing panel and create manufacturing data without changing the layer name or moving the data of each layer between layers. It is an object of the present invention to provide a manufacturing panel design system which enables the above.

[0008]

In order to achieve the above object, according to the first aspect of the present invention, there is provided a board information reading means for reading board information, and a manufacturing panel information reading means for reading manufacturing panel information. And associating means for associating the board information read by the board information reading means with the manufacturing panel information read from the manufacturing panel information reading means.

According to a second aspect of the present invention, there is provided a board information reading means for reading board information including board layer configuration information and board outline information, and reading manufacturing panel information including manufacturing panel layer configuration information. Manufacturing panel information reading means, display means for displaying the board information read by the board information reading means and the manufacturing panel information read by the manufacturing panel information reading means, and the board read by the board information reading means A substrate arranging means for arranging information on the manufacturing panel, and the manufacturing panel layer configuration information in the manufacturing panel information read by the manufacturing panel information reading means and the substrate layer in the substrate information read by the substrate information reading means. Compare the configuration information with the board information and the manufacturing panel information. And associating means for attaching, in which to have a manufacturing data generating means for generating manufacturing data from the above substrates information and the production panel information associated by said associating means.

In the invention according to claim 2, for example, as in the invention according to claim 3 of the present invention, the production panel layer configuration information and the substrate information in the production panel information are different from each other. The layer configuration may be different from the above-mentioned substrate layer configuration information.

According to a fourth aspect of the present invention, there is provided a board information reading means for reading board information including board layer configuration information and board outer shape information, and reading manufacturing panel information including manufacturing panel layer configuration information. Manufacturing panel information reading means, display means for displaying the board information read by the board information reading means and the manufacturing panel information read by the manufacturing panel information reading means, and the board read by the board information reading means A substrate arranging means for arranging information on the manufacturing panel, and the manufacturing panel layer configuration information in the manufacturing panel information read by the manufacturing panel information reading means and the substrate layer in the substrate information read by the substrate information reading means. Compare the configuration information with the board information and the manufacturing panel information. Attaching means, changing means for selectively changing the association between the board information and the manufacturing panel information associated by the associating means, and associating the board information and the manufacturing panel information which are not changed by the changing means. With regard to the above, the production information is generated from the board information and the production panel information associated by the association means, and the association between the substrate information and the production panel information changed by the modification means is performed by the modification means And a manufacturing data generating means for generating manufacturing data from the board information and the manufacturing panel information associated with each other by the change according to the above.

[0012] In the above-mentioned invention of the second, third or fourth aspect, for example, as in the invention of the fifth aspect of the present invention, the substrate layer configuration information and the manufacturing panel layer configuration information may be different from each other. Designating means for designating the layer described above, and the display means may display the substrate information and the manufacturing panel information corresponding to the layer designated by the designating means.

Further, in the above-mentioned invention of claim 2, 3 or 4, for example, as in the invention of claim 6, the substrate layer configuration information and the manufacturing panel layer configuration information And a designating means for designating a layer of the above-mentioned layer, and the manufacturing data generating means may generate the manufacturing data for each layer specified by the specifying means. Further, in the invention described in claim 4, for example,
As in the invention according to claim 7 of the present invention, correspondence information reading means for reading correspondence information for associating the substrate layer configuration information with the manufacturing panel layer configuration information, and the substrate layer configuration information and the manufacturing Automatic association means for automatically associating and storing the substrate information and the manufacturing panel information from the panel layer configuration information and the correspondence information may be provided.

[0014] In the above-mentioned invention, the correspondence information is composed of a physical layer number, a layer attribute, and a layer name, as in the invention of the eighth aspect of the present invention. May be performed.

Here, the "physical layer" means a physical layer on which a copper foil for supplying electricity is printed in the course of manufacturing the substrate.

Therefore, when arranging substrates having different layer configurations in which the layer names or layer numbers do not match on the same manufacturing panel, the proper layer configuration can be achieved without changing the layer names or moving the data of each layer between layers. Can be used to design manufacturing panels and create manufacturing data, so that even the data of boards with different layer configurations designed by different design departments can be used when manufacturing the same manufacturing panel. Become.

After a manufacturing panel in which a plurality of substrates are arranged is created, a design change occurs in any one of the substrates incorporated in the manufacturing panel, and a change in the layer configuration such as addition or deletion of a layer. Even if there is, when the output relating to the changed layer is not performed, the manufacturing data can be output by the manufacturing panel without any change. Also, the output of the changed portion can be manufactured using the manufacturing panel by changing only the correspondence between the layer and the layer of the manufacturing panel.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an example of an embodiment of a manufacturing panel design system according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a block diagram showing a manufacturing panel design system according to the present invention. The whole operation of the manufacturing panel design system is controlled by a microcomputer 10. The microcomputer 10 includes a central processing unit (CPU) that executes various processes described below, and a read / write processor that stores a program executed by the CPU to execute various processes described below.
There is provided a only memory (ROM) and a random access memory (RAM) as a working area when the CPU executes a program stored in the ROM.

The microcomputer 10 stores, via a bus line, board layer structure information, manufacturing panel layer structure information, layer structure related information, automatic connection rule information, additional rule information, and board figure information. A storage device 12 such as a magnetic disk;
A display device 14 having a display for displaying a figure or the like indicating a board based on the control of the display device; an input device 16 such as a keyboard and a mouse as operators for selecting and editing display contents on the display device 14; And an output device 18 such as a plotter for outputting a figure or the like showing a substrate under the control of the microcomputer 10.

Then, as shown in FIG. 2A, the substrate layer configuration information stored in the storage device 12 includes “substrate layer ID,
Board name, corresponding physical layer number, layer attribute, layer name ". Here, "substrate layer"
Means one logical layer in one substrate, and "substrate layer ID" is an identification number unique to the substrate layer. Also,
"Board name" means the name registered on the board by the user, "Corresponding physical layer number" means the number of the physical layer corresponding to the board layer, and "Layer attribute" has the board layer Among the logical attributes, it means the most important attribute in manufacturing, and “layer name” means the name registered in the substrate layer by the user.

The layer attributes in the example of the board layer configuration information shown in FIG. 2B include "board outer layer", "layout area layer", "wiring layer", and "symbol / mark layer". The “board outline” means data showing the appearance of the completed board, the “layout area” means the area where components are placed on the board and the wiring pattern is placed, and the “wiring” is electrical Means copper foil that connects to
The "symbol mark" is a mark on a board for recognizing the part with human eyes, such as the arrangement position of the part and a reference to the part, and means a mark printed on the board. The layer name in the example of the substrate layer configuration information shown in FIG. 2B is "user layer", and "user" means data arbitrarily stored by a user of this manufacturing panel design system.

As shown in FIG. 3A, the manufacturing panel layer configuration information stored in the storage device 12 has a data format of "manufacturing panel layer ID, corresponding physical layer number, layer attribute, layer name". It has. Here, "manufacturing panel layer" means one logical layer in the manufacturing panel.
The “manufacturing panel layer ID” is an identification number unique to the manufacturing panel layer. The “corresponding physical layer number” refers to the number of the physical layer corresponding to the manufacturing panel, and the “layer attribute” refers to the most important attribute in manufacturing among the logical attributes of the manufacturing panel. The “layer name” means the name registered by the user in the manufacturing panel layer.

Note that the layer attributes in the example of the manufacturing panel layer configuration information shown in FIG.
There are “layout area layer”, “wiring layer”, and “symbol / mark layer”, but “board outline” means data showing the appearance of the completed board, and “layout area” The “wiring” refers to the copper foil that is electrically connected, and the “symbol / mark” refers to the location of the component and the reference to the component. , A symbol for recognizing a component with human eyes, which is printed on a substrate. The layer name in the example of the manufacturing panel layer configuration information shown in FIG.
However, "user" means data arbitrarily stored by a user of the manufacturing panel design system.

The layer configuration related information stored in the storage device 12 is, as shown in FIG.
D, substrate layer ID, manufacturing panel layer ID ". Here, “layer configuration-related” means the correspondence between the manufacturing panel layer and the substrate layer, and “layer configuration-related ID” is an identification number unique to the relationship. FIG. 4B shows an example of the layer configuration related information.

As shown in FIG. 5A, the automatic connection rule information stored in the storage device 12 includes "rule ID, rule type, layer name (and additional rule ID)" (hereinafter, "additional rule ID"). ID "may be added or not.). Here, the “rule ID” is an identification number unique to the automatic connection rule. The additional rule information has a data format of “additional rule ID, rule type, and layer name” as in the case of the automatic connection rule information. Here, the “additional rule ID” is an identification number unique to the additional rule. FIG.
(B) shows an example of the automatic connection rule information and the additional rule information.

The board figure information stored in the storage device 12 is figure information indicating the shape of each board for each board name.

Next, the processing executed by the manufacturing panel design system will be described with reference to the outline of the processing flow in the manufacturing panel design system shown in FIG.

First, when the user turns on the power and starts the manufacturing panel design system, information such as the outer shape information of the manufacturing panel is read from the storage device 12, and the outer shape information and the like are displayed on the display device 14. An input screen for determining the layer configuration of the manufacturing panel is displayed, and the layer configuration of the manufacturing panel is determined (step S602).
Here, in order to determine the layer configuration of the manufacturing panel, for example,
A table in which a plurality of layer configurations are defined in advance is set, and a selection is made from the table. Thus, a logical layer configuration of the manufacturing panel is constructed. Build data that governs the skeleton.

In the flowchart shown in FIG. 6, the layer structure of the manufacturing panel is associated with the layer structure of the substrate.
By reading out the layer configuration of the manufacturing panel, a process is performed so that all the layer configurations of the corresponding substrates are read out, whereby substrates having different layer configurations in which the layer names or the layer numbers do not match are the same. When arranging on a manufacturing panel, it is possible to construct an appropriate layer structure and design a manufacturing panel and create manufacturing data without changing the layer name and moving data for each layer between layers. It is.

FIG. 7 shows an example of the layer structure of the production panel. Here, in FIG. 7, the “system layer” is a layer that is set so that the location of data can be uniquely specified when the manufacturing panel design system performs processing. The “board outline layer” in this system layer is a layer for storing data showing the appearance of the board, and the “layout area layer” is an area where components and wiring patterns are arranged on the board. This is a layer for storing data, and the “hole layer” is a layer for storing data indicating vias and through holes.

The "symbol / mark layer" is a mark that describes a symbol for recognizing a component with human eyes, such as the arrangement position of the component and a reference of the component. "Solder / resist layer" is a layer that stores data indicating a mask layer for protecting copper foil and preventing solder bridges between pads, and a "metal mask layer". "Is a layer for storing data indicating cream solder for soldering surface mount components.

Next, a substrate to be arranged is specified (step S604). Specifically, a file name of a board to be arranged (a name that uniquely determines the board in the system) is indicated, and coordinates of arrangement on the manufacturing panel (relative coordinates with respect to the outer shape of the manufacturing panel displayed on the display device 14). ).

Next, based on the automatic connection rule information and the additional rule information, the relation between the layer of the manufacturing panel and the layer of the substrate is determined (step S606). Here, as shown in the first line of the example of the automatic connection rule information shown in FIG. 5B, “Associate the layer attribute with the board outline” as in “1, substrate 1,... In this case, the layer of the substrate whose attribute is the substrate outer layer is associated with the layer whose attribute is the substrate outer layer among the layers of the manufacturing panel. If the third line of the example of the automatic connection rule information shown in FIG. 5B is “3, physical layer, 1, 2”, the additional rule I
In the example of the additional rule information illustrated in FIG. 5B in which D is “2”, the second line “2, layer name, user layer 12” is searched. In other words, if “correspondence is such that the corresponding physical layer is 1 and the layer name is the user layer 12”, the substrate layer whose attribute is the wiring layer and the corresponding physical layer number is 1 is assigned to the manufacturing panel. Among the layers, the layer name is the user layer 12 and the corresponding physical layer number is associated with the layer of 1.

The details of the processing in step S606 are shown in the flowchart of FIG.
Hereinafter, the processing of the flowchart illustrated in FIG. 8 will be described in detail. Step S802: Read the automatic connection rule information and the additional rule information, and create an automatic connection rule. Here, the automatic connection rules are organized as internal data.

Step S804: The first layer of the manufacturing panel is read, and the manufacturing panel layer configuration information is read.

Step S806: The read manufacturing panel layer configuration information (that is, the corresponding physical layer number, layer attribute, and layer name) is compared with the automatic connection rule to find a matching rule.

Step S808: One layer of the substrate is read.

Step S810: Determine what the substrate layer configuration information is and whether the substrate layer configuration information is necessary.

Step S812: Obtain the corresponding physical layer number.

Step S814: Obtain a layer attribute.

Step S816: The layer name is obtained.

Step S818: It is determined whether or not layer configuration information still exists.

Step S820: Do the manufacturing panel layer configuration information and the substrate layer configuration information match the automatic connection rules?

Step S822: The related ID is acquired, and the substrate layer ID and the manufacturing panel layer ID are stored in the layer configuration related information table.

Step S824: It is determined whether there are any more layers of the substrate.

Step S826: One layer of the substrate is read.

Step S828: It is determined whether or not there is still a manufacturing panel layer.

Step S830: The next layer of the manufacturing panel is read, and the manufacturing panel layer configuration information is read.

Next, a dialog is displayed for determining whether or not the association between the manufacturing panel layer and the substrate layer automatically processed in step S606 is insufficient and needs to be manually corrected (step S606). S608).
Here, if it is determined that it is necessary to make a manual correction, the association between the manufacturing panel layer and the substrate layer is manually changed, and for the unassociated layer, it is determined by the user. Association is made as needed (step S610). Specifically, from the layer related information in which the information of the automatically associated layers is stored, the board layer structure information, and the manufacturing panel layer structure information, FIG.
Is displayed on the display device 14 as shown in FIG.

Here, the substrate outer layer of the production panel and the substrate 1
When a line whose layers are associated with each other is selected by the input device 16 and the cutting button is pressed, information indicating the relationship between the substrate outer layer of the manufacturing panel and the substrate outer layer of the substrate 1 is obtained. Deleted from the layer configuration related information shown in FIG. 4,
Update the layer configuration related information. In addition, the connection button is pressed by the input device 16 and any of the layers of the manufacturing panel and the substrate 1 are pressed.
When one of the layers is selected, connection information is created from the layer IDs of the two selected layers (the substrate layer ID and the manufacturing panel layer ID), added to the layer configuration related information, and the layer configuration related information is updated. I do. When the process of step S610 ends, the process proceeds to step S612.

On the other hand, if it is determined in step S608 that there is no need for manual correction, step S610 is skipped and the flow advances to step S612.

In step S612, step S612
Based on the relationship between the layers 606 and the layers set in step S610, the input device 16 specifies the layer configuration information on the manufacturing panel side, and refers to the created layer configuration related information to enable display on the display device 14, Create display data for each layer of the manufacturing panel. That is, the associated layer is displayed by the layer name of the manufacturing panel.

Next, it is determined whether or not there is another substrate to be placed (step S614). If it is determined that there is another substrate to be placed, the process returns to step S604, and the flow returns to steps S604 to S614. Repeat the process.

On the other hand, if it is determined in step S614 that there is no other substrate to be arranged, a manufacturing panel is designed (step S616). That is, data not related to the board design such as alignment marks and guide holes (data necessary for manufacturing a manufacturing panel) is arranged outside the board, and the designing of the manufacturing panel is completed.

Then, manufacturing data is output based on the layer configuration of the manufacturing panel (step S618). That is, the manufacturing data is output from the data for which the design has been completed by using the associated layer configuration. Specifically, the production data is output to the output device 18, and the drawing of the production panel is created.

FIG. 9 shows an example of the association of the layer configurations realized by the flowchart shown in FIG.

As described above, the layer configuration of each substrate is associated with the layer configuration of the manufacturing panel. Therefore, according to the association between the layer configuration of the manufacturing panel and the layer configuration of each substrate, the layer configuration of each substrate corresponding to the layer configuration of the manufacturing panel can be read out, and different layer configurations whose layer names or layer numbers do not match Can be arranged on the same manufacturing panel.

The flowchart shown in FIG. 10 is a modified example of the flowchart shown in FIG. 8, and differs from the flowchart shown in FIG. 8 only in that additional rule information processing is added. That is, the process of the flowchart of FIG. 10 is different from the process of the flowchart of FIG. 8 in that a negative / positive attribute is added to the manufacturing panel layer configuration information and the substrate layer configuration information, and the rules of the automatic connection rule information and the additional rule information are added. "Negative / Positive" is added as a type.

Hereinafter, the flow chart shown in FIG. 10 will be described in detail. Regarding the processing similar to the processing of the flow chart shown in FIG. 8, the same step numbers as those in FIG. Description is omitted.

Step S1006: The read manufacturing panel layer configuration information (that is, the corresponding physical layer number, layer attribute, layer name, and negative / positive attribute) is compared with the automatic connection rule to find a matching rule.

Step S1017: A negative / positive attribute is obtained.

[0063]

Since the present invention is configured as described above, when arranging substrates having different layer configurations in which the layer names or layer numbers do not match on the same manufacturing panel, it is necessary to change the layer names or change the layer names. This provides an excellent effect that a proper panel structure can be constructed and a manufacturing panel can be designed and manufacturing data can be created without moving each data between layers.

[Brief description of the drawings]

FIG. 1 is a block diagram of a manufacturing panel design system according to the present invention.

FIG. 2 is an explanatory diagram relating to substrate layer configuration information,
(A) is an explanatory view of a data format, (b)
FIG. 4 is an explanatory diagram illustrating an example of substrate layer configuration information.

3A and 3B are explanatory diagrams relating to manufacturing panel layer configuration information, wherein FIG. 3A is an explanatory diagram of a data format,
(B) is an explanatory view showing an example of manufacturing panel layer configuration information.

FIG. 4 is an explanatory diagram relating to layer configuration related information,
(A) is an explanatory view of a data format, (b)
FIG. 4 is an explanatory diagram showing an example of layer configuration related information.

5A and 5B are explanatory diagrams relating to automatic connection rule information and additional rule information, wherein FIG. 5A is an explanatory diagram of a data format, and FIG. 5B is an explanatory diagram illustrating an example of automatic connection rule information and additional rule information; It is.

FIG. 6 is a flowchart showing an outline of a processing flow in the manufacturing panel design system according to the present invention.

FIG. 7 is an explanatory diagram illustrating an example of a layer configuration of a manufacturing panel.

FIG. 8 is a step S606 in the flowchart shown in FIG. 6;
3 is a flowchart showing details of the processing of FIG.

FIG. 9 is an explanatory diagram illustrating an example of association of a layer configuration.

FIG. 10 is a flowchart showing a modification of the flowchart shown in FIG. 8;

FIG. 11 is an explanatory diagram showing a display example at the time of a process of changing the relationship between the manufacturing panel layer configuration and the substrate layer configuration.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Microcomputer 12 Storage device 14 Display device 16 Input device 18 Output device

Claims (8)

(57) [Claims] 1. A board information reading means for reading board information, a manufacturing panel information reading means for reading manufacturing panel information, and the manufacturing information read from the board information and the manufacturing panel information reading means read by the board information reading means. An associating means for associating the panel information with the panel information. 2. A board information reading means for reading board information including board layer configuration information and board outer shape information; a manufacturing panel information reading means for reading manufacturing panel information including manufacturing panel layer configuration information; Display means for displaying the read board information and the manufacturing panel information read by the manufacturing panel information reading means; a board arranging means for arranging the board information read by the board information reading means on a manufacturing panel; Comparing the production panel layer configuration information in the production panel information read by the production panel information reading means with the substrate layer configuration information in the substrate information read by the substrate information reading means, and comparing the substrate information with the production Associating means for associating with panel information; Production panel design system and having a manufacturing data generating means for generating manufacturing data from said substrate information and the production panel information associated with. 3. The manufacturing panel design system according to claim 2, wherein said manufacturing panel layer configuration information in said manufacturing panel information and said substrate layer configuration information in said substrate information have different layer configurations. Manufacturing panel design system. 4. A board information reading means for reading board information including board layer configuration information and board outer shape information; a manufacturing panel information reading means for reading manufacturing panel information including manufacturing panel layer configuration information; Display means for displaying the read board information and the manufacturing panel information read by the manufacturing panel information reading means; a board arranging means for arranging the board information read by the board information reading means on a manufacturing panel; Comparing the production panel layer configuration information in the production panel information read by the production panel information reading means with the substrate layer configuration information in the substrate information read by the substrate information reading means, and comparing the substrate information with the production Associating means for associating with panel information; Changing means for selectively changing the association between the board information and the manufacturing panel information associated with each other, and associating the board information and the manufacturing panel information not changed by the changing means with the associating means Generating the manufacturing data from the obtained substrate information and the manufacturing panel information, and associating the substrate information changed by the changing unit with the manufacturing panel information, the board associated by the change by the changing unit; A manufacturing panel design system, comprising: manufacturing data generating means for generating manufacturing data from information and the manufacturing panel information. 5. The manufacturing panel design system according to claim 2, further comprising a designating means for designating a layer of said substrate layer configuration information and said production panel layer configuration information. The manufacturing panel design system, wherein the display unit displays the substrate information and the manufacturing panel information corresponding to the layer specified by the specifying unit. 6. The manufacturing panel design system according to claim 2, further comprising a designating means for designating a layer of said substrate layer configuration information and said production panel layer configuration information. The manufacturing panel design system, wherein the manufacturing data generating means generates manufacturing data for each layer specified by the specifying means. 7. The manufacturing panel design system according to claim 4, wherein correspondence information reading means for reading correspondence information for associating the substrate layer configuration information with the manufacturing panel layer configuration information; An automatic associating means for automatically associating and storing the substrate information and the manufacturing panel information from the manufacturing panel layer configuration information and the correspondence information; 8. The manufacturing panel design system according to claim 7, wherein the correspondence information includes a physical layer number, a layer attribute, and a layer name.