JP2005072466A - Package for housing semiconductor element and semiconductor device - Google Patents

Package for housing semiconductor element and semiconductor device Download PDF

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Publication number
JP2005072466A
JP2005072466A JP2003303013A JP2003303013A JP2005072466A JP 2005072466 A JP2005072466 A JP 2005072466A JP 2003303013 A JP2003303013 A JP 2003303013A JP 2003303013 A JP2003303013 A JP 2003303013A JP 2005072466 A JP2005072466 A JP 2005072466A
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coaxial connector
fixing member
conductor
cylindrical fixing
semiconductor element
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Japanese (ja)
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Nobuyuki Tanaka
信幸 田中
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Kyocera Corp
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Kyocera Corp
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Priority to JP2003303013A priority Critical patent/JP2005072466A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Abstract

<P>PROBLEM TO BE SOLVED: To improve the high-frequency signal transmitting efficiency of a package for housing semiconductor element having a coaxial connector connected with a coaxial cable. <P>SOLUTION: The package for housing semiconductor element is provided with a substrate 1 having a placing section 1a for placing a semiconductor element 5, a frame body 2 having a through hole in its side section, and the coaxial connector 3 fitted in the through hole. The through hole has a small-diameter section in which the coaxial connector 3 is fitted on the internal surface side of the frame body 2 and a large-diameter section 2d which is coaxially connected to the small-diameter section 2a and into which a metallic cylindrical fixing member 9 which fixes the coaxial cable 10 electrically connected to the connector 3 is inserted and fixed on the external surface side of the frame body 2. The cylindrical fixing member 9 and the outer peripheral conductor 3a of the connector 3 are connected to each other through a conductive annular member 30 coaxially set up in the through hole. The central part of the outer peripheral surface of the annular member 30 is recessed over the whole circumference and, at the same time, the diameter of the end face of the member 30 on the fixing member 9 side is larger than that of the end face of the member 30 on the outer peripheral conductor 3a side. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、半導体素子を収容するための半導体素子収納用パッケージおよび半導体装置に関するものである。   The present invention relates to a semiconductor element housing package and a semiconductor device for housing a semiconductor element.

従来より、半導体素子、特に高周波で作動する半導体素子を収容するための半導体素子収納用パッケージ（以下、単にパッケージともいう）には、内部の半導体素子と外部の同軸ケーブルとを電気的に接続するための同軸コネクタが設けられている。この同軸コネクタが設けられたパッケージを図面に基づき詳細に説明する。図３，図４は従来のパッケージを示し、11は基体、12は枠体、13は同軸コネクタである。基体11は、鉄（Ｆｅ）−ニッケル（Ｎｉ）−コバルト（Ｃｏ）合金や銅（Ｃｕ）−タングステン（Ｗ）等の金属から成る四角形状の板体である。   2. Description of the Related Art Conventionally, an internal semiconductor element and an external coaxial cable are electrically connected to a semiconductor element housing package (hereinafter also simply referred to as a package) for housing semiconductor elements, particularly semiconductor elements that operate at high frequencies. A coaxial connector is provided. The package provided with the coaxial connector will be described in detail with reference to the drawings. 3 and 4 show a conventional package, 11 is a base, 12 is a frame, and 13 is a coaxial connector. The substrate 11 is a rectangular plate made of a metal such as iron (Fe) -nickel (Ni) -cobalt (Co) alloy or copper (Cu) -tungsten (W).

基体11の上面中央部には、半導体素子15を載置するための載置部11ａが形成されている。この載置部11ａには、半導体素子15が、例えば上面に線路導体16ａを有するアルミナ（Ａｌ２Ｏ３）質焼結体から成る回路基板16等に実装されその電極が線路導体16ａにボンディングワイヤ17を介して電気的に接続された状態で載置固定される。 A mounting portion 11 a for mounting the semiconductor element 15 is formed at the center of the upper surface of the base 11. On this mounting portion 11a, a semiconductor element 15 is mounted on a circuit board 16 made of an alumina (Al 2 O 3 ) sintered body having a line conductor 16a on the upper surface, for example, and an electrode thereof is bonded to the line conductor 16a with a bonding wire. It is placed and fixed in an electrically connected state via 17.

また基体11の上面外周部には載置部11ａを囲繞するようにして枠体12が取着されており、枠体12は基体11とともに半導体素子15を収容する空所を形成する作用をなす。   A frame body 12 is attached to the outer peripheral portion of the upper surface of the base body 11 so as to surround the mounting portion 11a. The frame body 12 forms an empty space for housing the semiconductor element 15 together with the base body 11. .

枠体12は、基体11と同様にＦｅ−Ｎｉ−Ｃｏ合金やＣｕ−Ｗ等の金属から成り、基体11と一体成形されることによって、あるいは基体11に銀（Ａｇ）ロウ，Ａｇ−Ｃｕロウ等のロウ材を介してロウ付けされたり、シーム溶接法等の溶接法により溶接されることによって基体11の上面外周部に取着される。   The frame body 12 is made of a metal such as an Fe—Ni—Co alloy or Cu—W, like the base body 11, and is integrally formed with the base body 11, or silver (Ag) solder, Ag—Cu solder is formed on the base body 11. It is attached to the outer periphery of the upper surface of the base 11 by brazing via a brazing material such as seam or welding by a welding method such as a seam welding method.

また、枠体12はその一部に同軸コネクタ13が挿入固定される貫通孔12ａが形成されている。そして、貫通孔12ａには同軸コネクタ13が挿入されるとともに同軸コネクタ13の外周面と貫通孔12ａの内面とが金（Ａｕ）−錫（Ｓｎ）半田，鉛（Ｐｂ）−Ｓｎ半田等の半田から成る封着材18を介して固定されている。   The frame body 12 is formed with a through-hole 12a into which a coaxial connector 13 is inserted and fixed. The coaxial connector 13 is inserted into the through hole 12a, and the outer peripheral surface of the coaxial connector 13 and the inner surface of the through hole 12a are solders such as gold (Au) -tin (Sn) solder, lead (Pb) -Sn solder, or the like. It is fixed via a sealing material 18 made of

更に枠体12に形成された貫通孔12ａは、図４に示すように、その直径が枠体12の外面に向けて全周にわたり段状に広がった封着材挿入部12ｂを有している。これにより、同軸コネクタ13が全周にわたって封着材挿入部12ｂに広がる封着材18によって保持されることから、枠体12の内外が完全に気密に仕切られる。   Furthermore, as shown in FIG. 4, the through-hole 12a formed in the frame body 12 has a sealing material insertion portion 12b whose diameter expands stepwise over the entire circumference toward the outer surface of the frame body 12. . As a result, the coaxial connector 13 is held by the sealing material 18 spreading over the entire circumference of the sealing material insertion portion 12b, so that the inside and outside of the frame body 12 are partitioned completely and airtightly.

貫通孔12ａ内に挿入固定される同軸コネクタ13は、内部に収容する半導体素子15を外部電気回路基板に接続された同軸ケーブルに電気的に接続する作用をなし、Ｆｅ−Ｎｉ−Ｃｏ合金等の金属から成る円筒状の外周導体13ａの中心部に同じくＦｅ−Ｎｉ−Ｃｏ合金等の金属から成る中心導体13ｂが絶縁体13ｃを介して固定された構造をしており、外周導体13ａが枠体12に封着材18を介して、中心導体13ｂが回路基板16の線路導体16ａにＡｕ−Ｓｎ半田、Ｐｂ−Ｓｎ半田等の導電性接着剤を介してそれぞれ電気的に接続されている。   The coaxial connector 13 inserted and fixed in the through hole 12a serves to electrically connect the semiconductor element 15 accommodated therein to the coaxial cable connected to the external electric circuit board, and is made of Fe-Ni-Co alloy or the like. Similarly, a central conductor 13b made of metal such as Fe-Ni-Co alloy is fixed to the center of a cylindrical outer conductor 13a made of metal via an insulator 13c, and the outer conductor 13a is a frame. The central conductor 13b is electrically connected to the line conductor 16a of the circuit board 16 via a conductive adhesive such as Au-Sn solder and Pb-Sn solder.

このような同軸コネクタ13を有するパッケージに同軸ケーブルを接続するため、枠体12の外面側に同軸コネクタ13に同軸状に連なるとともに同軸コネクタ13に電気的に接続される同軸ケーブルを固定する円筒状固定部材（ランチャー）がネジ込まれることによって固定される。   In order to connect the coaxial cable to the package having such a coaxial connector 13, a cylindrical shape that is coaxially connected to the coaxial connector 13 on the outer surface side of the frame body 12 and fixes the coaxial cable electrically connected to the coaxial connector 13 The fixing member (launcher) is fixed by being screwed.

そして、このようなパッケージの載置部11ａに、半導体素子15がその電極を線路導体16ａに電気的に接続した状態で実装された回路基板16を載置固定し、しかる後、回路基板16の線路導体16ａと同軸コネクタ13の中心導体13ｂとを半田を介して電気的に接続し、そして枠体12の上面にＦｅ−Ｎｉ−Ｃｏ合金等の金属から成る蓋体14を半田付け法やシームウエルド法により接合することにより製品としての半導体装置となる。そして、この半導体装置に円筒状固定部材を介して外部電気回路基板に接続された同軸ケーブルを接続することにより、内部に収容された半導体素子15が外部電気回路に電気的に接続されることとなる（例えば、下記の特許文献１参照）。
特開平９−64219号公報 Then, the circuit board 16 on which the semiconductor element 15 is mounted in a state where the electrodes thereof are electrically connected to the line conductor 16a is mounted and fixed on the mounting part 11a of such a package. The line conductor 16a and the central conductor 13b of the coaxial connector 13 are electrically connected via solder, and a lid 14 made of a metal such as Fe-Ni-Co alloy is soldered to the upper surface of the frame 12 by a soldering method or a seam. A semiconductor device as a product is obtained by bonding by the weld method. And, by connecting a coaxial cable connected to the external electric circuit board via a cylindrical fixing member to the semiconductor device, the semiconductor element 15 housed inside is electrically connected to the external electric circuit; (For example, refer to Patent Document 1 below).
JP 9-64219 A

しかしながら、この従来の半導体素子収納用パッケージは、円筒状固定部材がネジ込まれることにより円筒状固定部材の先端と同軸コネクタ13とが接触することにより電気的な接続が得られるが、同軸コネクタ13および円筒状固定部材の加工形状の精度に少しでもばらつきが生じると、円筒状固定部材と同軸コネクタ13の外周導体13ａとが全周にわたって接触することができなくなってそれらの間に隙間が生じ、その結果、円筒状固定部材の接地電位と外周導体13ａとの接地電位が同一でなくなり、中心導体13ｂを伝送する高周波信号に反射損失等の伝送損失が発生し易くなるという問題点を有していた。   However, in this conventional package for housing semiconductor elements, electrical connection can be obtained by contacting the tip of the cylindrical fixing member and the coaxial connector 13 by screwing the cylindrical fixing member. When the accuracy of the processing shape of the cylindrical fixing member varies even a little, the cylindrical fixing member and the outer peripheral conductor 13a of the coaxial connector 13 cannot contact over the entire circumference, and a gap is generated between them, As a result, the ground potential of the cylindrical fixing member and the ground potential of the outer peripheral conductor 13a are not the same, and there is a problem that transmission loss such as reflection loss is likely to occur in the high-frequency signal transmitted through the center conductor 13b. It was.

また、時間が経つにつれて円筒状固定部材が緩み易くなり、円筒状固定部材と同軸コネクタ13の外周導体13ａとの間に接触不良が生じ、その結果、パッケージに高周波信号を効率よく入出力できなくなり、内部に収容する半導体素子15を長期間にわたり正常、かつ安定に作動させることができないという問題点を有していた。   Also, as time passes, the cylindrical fixing member is likely to loosen, and contact failure occurs between the cylindrical fixing member and the outer peripheral conductor 13a of the coaxial connector 13, and as a result, high-frequency signals cannot be input and output efficiently to the package. However, there is a problem that the semiconductor element 15 accommodated therein cannot be operated normally and stably over a long period of time.

従って、本発明は上記問題点に鑑み完成されたものであり、その目的は、同軸ケーブルが接続される同軸コネクタを有する半導体素子収納用パッケージにおいて高周波信号の伝送効率を向上することである。   Accordingly, the present invention has been completed in view of the above problems, and an object thereof is to improve the transmission efficiency of high-frequency signals in a package for housing semiconductor elements having a coaxial connector to which a coaxial cable is connected.

本発明の半導体素子収納用パッケージは、上面に半導体素子が載置される載置部を有する基体と、該基体の上面の外周部に前記載置部を囲繞するように取着され、側部に断面が円形状の貫通孔が形成された枠体と、前記貫通孔に嵌着された、円筒状の外周導体および該外周導体の中心軸に設置された中心導体ならびにそれらの間に介在させた絶縁体から成る同軸コネクタとを具備しており、前記貫通孔は、前記同軸コネクタが嵌着された前記枠体の内面側の小径部と、それに同軸状に連なるとともに前記同軸コネクタに電気的に接続される同軸ケーブルを固定する金属製の円筒状固定部材が挿入固定される前記枠体の外面側の大径部とを有し、前記円筒状固定部材と前記外周導体とが、前記貫通孔に同軸状に設置された導電性の環状部材を介して接続されており、該環状部材は、外周面の中央部が全周にわたって凹んでいるとともに、前記円筒状固定部材側の端面の直径が前記外周導体側の端面の直径よりも大きいことを特徴とする。   The package for housing a semiconductor element of the present invention includes a base having a mounting portion on which a semiconductor element is mounted on an upper surface, and an outer peripheral portion of the upper surface of the base so as to surround the mounting portion. A frame having a circular through-hole formed in the cross-section, a cylindrical outer conductor fitted in the through-hole, a central conductor installed on the central axis of the outer conductor, and interposed therebetween A coaxial connector made of an insulating material, and the through hole is coaxially connected to a small diameter portion on the inner surface side of the frame body to which the coaxial connector is fitted and electrically connected to the coaxial connector. A metal cylindrical fixing member that fixes a coaxial cable connected to the outer peripheral side of the frame body into which a metal cylindrical fixing member is inserted and fixed, and the cylindrical fixing member and the outer peripheral conductor pass through the through-hole Through a conductive annular member placed coaxially in the hole The annular member is characterized in that the central portion of the outer peripheral surface is recessed over the entire periphery, and the diameter of the end surface on the cylindrical fixing member side is larger than the diameter of the end surface on the outer peripheral conductor side. And

本発明の半導体装置は、上記構成の半導体素子収納用パッケージと、前記載置部に載置されるとともに前記同軸コネクタに電気的に接続された半導体素子と、前記枠体の上面に取着された蓋体とを具備していることを特徴とする。   The semiconductor device of the present invention is attached to the upper surface of the frame body, the semiconductor element storage package having the above-described configuration, the semiconductor element mounted on the mounting portion and electrically connected to the coaxial connector. And a lid.

本発明の半導体素子収納用パッケージは、貫通孔が、同軸コネクタが嵌着された枠体の内面側の小径部と、それに同軸状に連なるとともに同軸コネクタに電気的に接続される同軸ケーブルを固定する金属製の円筒状固定部材が挿入固定される枠体の外面側の大径部とを有し、円筒状固定部材と外周導体とが、貫通孔に同軸状に設置された導電性の環状部材を介して接続されており、環状部材は、外周面の中央部が全周にわたって凹んでいるとともに、円筒状固定部材側の端面の直径が外周導体側の端面の直径よりも大きいことから、枠体の外面側に円筒状固定部材をネジ込んで固定した場合に、円筒状固定部材の先端と同軸コネクタの外周導体とを圧力が加わった状態で確実に接触させることができ、円筒状固定部材の先端の接地電位を同軸コネクタの外周導体の接地電位と同一電位として、円筒状固定部材と同軸コネクタを伝送する高周波信号のインピーダンス値を整合させることができる。その結果、円筒状固定部材と同軸コネクタを伝送する高周波信号に反射損失等の伝送損失が生じるのを有効に抑制して高周波信号を効率よく伝送させることができる。   In the package for housing a semiconductor element of the present invention, the through hole fixes the small diameter portion on the inner surface side of the frame body on which the coaxial connector is fitted, and the coaxial cable that is connected to the coaxial connector and is electrically connected to the coaxial connector. A conductive annular ring having a cylindrical fixing member and an outer peripheral conductor coaxially installed in the through hole. The annular member is connected through the member, and the central portion of the outer peripheral surface is recessed over the entire circumference, and the diameter of the end surface on the cylindrical fixing member side is larger than the diameter of the end surface on the outer peripheral conductor side, When the cylindrical fixing member is screwed and fixed to the outer surface side of the frame, the tip of the cylindrical fixing member and the outer peripheral conductor of the coaxial connector can be reliably brought into contact with each other in a state where pressure is applied. Coaxial ground potential at the tip of the member As the ground potential and the same potential of the outer peripheral conductor connector, the impedance value of the high frequency signal transmitted through the cylindrical fixing member and the coaxial connector can be matched. As a result, it is possible to effectively suppress the occurrence of transmission loss such as reflection loss in the high-frequency signal transmitted through the cylindrical fixing member and the coaxial connector, and to efficiently transmit the high-frequency signal.

また、円筒状固定部材の先端と同軸コネクタの外周導体とを圧力が加わった状態で確実に接触させることができるため、時間の経過とともに筒状固定部材が緩んで円筒状固定部材の先端と同軸コネクタの外周導体とに加わっている圧力が低下したとしても、環状部材が復元するように円筒状固定部材の緩みに追従するので、円筒状固定部材の先端と同軸コネクタの外周導体との接触を維持することができ、半導体素子に入出力される高周波信号の伝送効率を維持して半導体素子を長期間にわたり正常かつ安定に作動させることができる。   In addition, since the tip of the cylindrical fixing member and the outer peripheral conductor of the coaxial connector can be reliably brought into contact with pressure, the cylindrical fixing member loosens with time and is coaxial with the tip of the cylindrical fixing member. Even if the pressure applied to the outer peripheral conductor of the connector decreases, it follows the looseness of the cylindrical fixing member so that the annular member recovers, so that the tip of the cylindrical fixing member and the outer peripheral conductor of the coaxial connector are not in contact with each other. It is possible to maintain the transmission efficiency of the high-frequency signal input / output to / from the semiconductor element, and to operate the semiconductor element normally and stably over a long period of time.

さらに、環状部材は、円筒状固定部材側の端面の直径が外周導体側の端面の直径よりも大きいことから、環状部材の円筒状固定部材側の端面を円筒状固定部材の端面に広い面積で当接させることができ、環状部材を傾けることなく取り付けることが可能となり接続信頼性を向上させることができる。また、円筒状固定部材側で変形させやすくすることができるため、円筒状固定部材を締め付けた際や、温度変化によって発生した応力を緩和して半導体素子収納用パッケージが破損するのを有効に防止できる。さらに、外周導体側で環状部材の端面は剛性を維持して変形し難くいため、環状部材が変形して同軸コネクタの絶縁体に接触するのを防止できる。従って、絶縁体にクラック等の破損が発生するのを有効に防止でき、半導体素子収納用パッケージ内を確実に気密に保持できる信頼性の高いものとなる。   Furthermore, since the diameter of the end face on the cylindrical fixing member side of the annular member is larger than the diameter of the end face on the outer peripheral conductor side, the end face on the cylindrical fixing member side of the annular member has a wide area on the end face of the cylindrical fixing member. The ring member can be brought into contact with each other, and the annular member can be attached without being inclined, and the connection reliability can be improved. In addition, since it can be easily deformed on the cylindrical fixing member side, it is possible to effectively prevent the semiconductor element housing package from being damaged when the cylindrical fixing member is tightened or stress generated by temperature change is relaxed. it can. Furthermore, since the end face of the annular member is difficult to be deformed while maintaining rigidity on the outer peripheral conductor side, the annular member can be prevented from being deformed and coming into contact with the insulator of the coaxial connector. Accordingly, the occurrence of breakage such as cracks in the insulator can be effectively prevented, and the inside of the semiconductor element storage package can be reliably and airtightly maintained with high reliability.

本発明の半導体装置は、上記構成の半導体素子収納用パッケージと、載置部に載置されるとともに同軸コネクタに電気的に接続された半導体素子と、枠体の上面に取着された蓋体とを具備していることにより、上記本発明の半導体素子収納用パッケージを用いた高周波信号の伝送特性の優れたものとなる。   A semiconductor device according to the present invention includes a semiconductor element storage package having the above-described configuration, a semiconductor element placed on the placement portion and electrically connected to the coaxial connector, and a lid attached to the upper surface of the frame body With this, the high frequency signal transmission characteristics using the semiconductor element housing package of the present invention are excellent.

本発明の半導体素子収納用パッケージについて以下に詳細に説明する。図１は本発明のパッケージについて実施の形態の一例を示す断面図、図２（ａ）は図１のパッケージの要部拡大断面図である。これらの図において、１は基体、２は枠体、３は同軸コネクタ、９は円筒状固定部材である。   The semiconductor element storage package of the present invention will be described in detail below. FIG. 1 is a cross-sectional view showing an example of an embodiment of the package of the present invention, and FIG. In these drawings, 1 is a base, 2 is a frame, 3 is a coaxial connector, and 9 is a cylindrical fixing member.

基体１は、Ｆｅ−Ｎｉ−Ｃｏ合金，Ｃｕ−Ｗ等の金属やＡｌ２Ｏ３質焼結体，窒化アルミニウム（ＡｌＮ）質焼結体等のセラミックスから成る四角形状等の板体であり、金属から成る場合、そのインゴットに圧延加工や打ち抜き加工等の従来周知の金属加工法を施すことによって所定形状に製作される。また、基体１が、例えばＡｌ２Ｏ３質焼結体から成る場合、以下のようにして作製される。Ａｌ２Ｏ３，酸化珪素（ＳｉＯ２），酸化カルシウム（ＣａＯ），酸化マグネシウム（ＭｇＯ）等の原料粉末に適当な有機バインダや可塑剤，分散剤，溶剤等を添加混合して泥漿状となす。これを従来周知のドクターブレード法でシート状となすことによって複数枚のセラミックグリーンシートを得る。しかる後、これらのセラミックグリーンシートに適当な打ち抜き加工を施し、積層した後、還元雰囲気中で約1600℃の温度で焼成することによって製作される。 The substrate 1 is a rectangular plate or the like made of a ceramic such as a metal such as Fe—Ni—Co alloy, Cu—W, an Al 2 O 3 sintered body, an aluminum nitride (AlN) sintered body, When made of metal, the ingot is manufactured into a predetermined shape by applying a conventionally known metal processing method such as rolling or punching. Further, when the substrate 1 is made of, for example, an Al 2 O 3 sintered material, it is manufactured as follows. Add appropriate organic binder, plasticizer, dispersant, solvent, etc. to raw powder such as Al 2 O 3 , silicon oxide (SiO 2 ), calcium oxide (CaO), magnesium oxide (MgO), etc. . A plurality of ceramic green sheets are obtained by making this into a sheet by a conventionally known doctor blade method. Thereafter, these ceramic green sheets are appropriately punched, laminated, and fired at a temperature of about 1600 ° C. in a reducing atmosphere.

基体１の上面中央部には、半導体素子５を載置するための載置部１ａが形成されており、この載置部１ａには、半導体素子５が、例えば上面に線路導体６ａを有するＡｌ２Ｏ３質焼結体，ＡｌＮ質焼結体等から成る回路基板６等に実装されるとともに、その電極が線路導体６ａにボンディングワイヤ７等を介して電気的に接続された状態で載置固定される。 A mounting portion 1a for mounting the semiconductor element 5 is formed at the center of the upper surface of the base 1, and the semiconductor device 5 includes, for example, an Al having a line conductor 6a on the upper surface. It is mounted on a circuit board 6 or the like made of a 2 O 3 sintered body, an AlN sintered body, etc., and the electrode is placed in a state of being electrically connected to the line conductor 6a via a bonding wire 7 or the like. Fixed.

このような回路基板６は以下のようにして作製される。例えば、セラミックグリーンシートに、Ｗやモリブデン（Ｍｏ）等の高融点金属粉末に適当な有機バインダ、可塑剤、溶剤等を添加混合して得た金属ペーストを、スクリーン印刷法等の厚膜形成技術により印刷塗布して、線路導体６ａとなるメタライズ層を所定パターンに形成する。しかる後、セラミックグリーンシートを複数枚積層し、これを還元雰囲気中、約1600℃の温度で焼成することにより製作される。   Such a circuit board 6 is manufactured as follows. For example, thick film formation technology such as screen printing using a metal paste obtained by adding an appropriate organic binder, plasticizer, solvent, etc. to a high melting point metal powder such as W or molybdenum (Mo) to a ceramic green sheet Then, a metallized layer to be the line conductor 6a is formed in a predetermined pattern. Thereafter, a plurality of ceramic green sheets are laminated and fired at a temperature of about 1600 ° C. in a reducing atmosphere.

また線路導体６ａは薄膜形成法によって形成されていてもよく、その場合、線路導体６ａは窒化タンタル（Ｔａ２Ｎ）、ニクロム（Ｎｉ−Ｃｒ合金）、チタン（Ｔｉ）、パラジウム（Ｐｄ）、白金（Ｐｔ）等から形成され、セラミックグリーンシートを焼成した後に形成される。 Further, the line conductor 6a may be formed by a thin film forming method. In this case, the line conductor 6a is made of tantalum nitride (Ta 2 N), nichrome (Ni—Cr alloy), titanium (Ti), palladium (Pd), platinum. It is formed from (Pt) or the like and is formed after firing the ceramic green sheet.

なお、線路導体６ａは、その露出表面にＮｉやＡｕから成るメッキ金属層を１〜20μｍ程度の厚みに被着させておくのが好ましい。これにより、線路導体６ａの酸化腐食を有効に防止することができるとともに線路導体６ａとボンディングワイヤ７や同軸コネクタ３の中心導体３ｂとの接続性を良好なものとすることができる。   The line conductor 6a is preferably coated with a plated metal layer made of Ni or Au on its exposed surface to a thickness of about 1 to 20 μm. Thereby, the oxidative corrosion of the line conductor 6a can be effectively prevented and the connectivity between the line conductor 6a and the bonding wire 7 or the central conductor 3b of the coaxial connector 3 can be improved.

また基体１の上面外周部には載置部１ａを囲繞するようにして枠体２が取着されており、枠体２は基体１とともに半導体素子５を収容する空所を形成する作用をなす。   A frame body 2 is attached to the outer peripheral portion of the upper surface of the base body 1 so as to surround the mounting portion 1 a, and the frame body 2 forms an empty space for housing the semiconductor element 5 together with the base body 1. .

枠体２は、基体１と同様にＦｅ−Ｎｉ−Ｃｏ合金やＣｕ−Ｗ合金等の金属から成り、基体１と一体成形されることによって、あるいは基体１にＡｇロウ等のロウ材を介してロウ付けされたり、シーム溶接法等の溶接法により溶接されることによって基体１の上面外周部に取着される。   The frame body 2 is made of a metal such as an Fe—Ni—Co alloy or a Cu—W alloy like the base body 1 and is formed integrally with the base body 1 or via a brazing material such as Ag brazing on the base body 1. It is attached to the outer peripheral portion of the upper surface of the substrate 1 by brazing or welding by a welding method such as a seam welding method.

枠体２は、その一部に同軸コネクタ３、および同軸ケーブル10を固定する円筒状固定部材９を固定するための貫通孔が形成されており、この貫通孔は、同軸コネクタ３が嵌着された枠体２の内面側の小径部２ａと、それに同軸状に連なるとともに同軸コネクタ３に電気的に接続される同軸ケーブル10を固定する金属製の円筒状固定部材９が挿入固定される枠体２の外面側の大径部２ｄとを有している。   A through hole for fixing the coaxial connector 3 and the cylindrical fixing member 9 for fixing the coaxial cable 10 is formed in a part of the frame body 2, and the coaxial connector 3 is fitted into the through hole. A frame body in which a metal cylindrical fixing member 9 for fixing a small diameter portion 2a on the inner surface side of the frame body 2 and a coaxial cable 10 connected coaxially and electrically connected to the coaxial connector 3 is inserted and fixed. 2 and a large-diameter portion 2d on the outer surface side.

小径部２ａ内には同軸コネクタ３が挿入されるとともに同軸コネクタ３と小径部２ａ内面とがＡｕ−Ｓｎ半田、Ｐｂ−Ｓｎ半田等の半田から成る封着材８を介して固定されている。   The coaxial connector 3 is inserted into the small-diameter portion 2a, and the coaxial connector 3 and the inner surface of the small-diameter portion 2a are fixed via a sealing material 8 made of solder such as Au—Sn solder or Pb—Sn solder.

好ましくは、小径部２ａの大径部２ｄ側の開口部に全周にわたって形成された段差２ｂを有しているのがよく、この構成により、段差２ｂに同軸コネクタ３を固定するための封着材８のメニスカスを形成でき、同軸コネクタ３を小径部２ａに強固に嵌着固定することができる。   Preferably, the small-diameter portion 2a has a step 2b formed over the entire circumference in the opening on the large-diameter portion 2d side. With this configuration, sealing for fixing the coaxial connector 3 to the step 2b is preferable. A meniscus of the material 8 can be formed, and the coaxial connector 3 can be firmly fitted and fixed to the small diameter portion 2a.

このような同軸コネクタ３は、パッケージ内部に収容する半導体素子５を外部の同軸ケーブル10に電気的に接続するためのものであり、Ｆｅ−Ｎｉ−Ｃｏ合金等の金属から成る円筒状の外周導体３ａの中心軸に同じくＦｅ−Ｎｉ−Ｃｏ合金等の金属から成る中心導体３ｂが絶縁体３ｃを介して固定された構造をしている。なお、同軸ケーブル10は、貫通孔の大径部２ｄにネジ込まれて固定された円筒状固定部材９を介して、同軸コネクタ３に接続される。   Such a coaxial connector 3 is for electrically connecting the semiconductor element 5 accommodated in the package to an external coaxial cable 10, and is a cylindrical outer conductor made of a metal such as an Fe-Ni-Co alloy. Similarly, a central conductor 3b made of a metal such as Fe-Ni-Co alloy is fixed to the central axis of 3a via an insulator 3c. The coaxial cable 10 is connected to the coaxial connector 3 via a cylindrical fixing member 9 that is screwed and fixed into the large-diameter portion 2d of the through hole.

中心導体３ｂを伝送する高周波信号は、枠体２の内部にある中心導体３ｂの部分では同軸線路のモードで伝送し、特性インピーダンス値に整合されている。そして枠体２の内側では回路基板６の上面に被着形成された線路導体６ａに接続されて線路導体６ａ上を伝送することとなる。   The high-frequency signal transmitted through the center conductor 3b is transmitted in the coaxial line mode in the portion of the center conductor 3b inside the frame 2 and is matched to the characteristic impedance value. And inside the frame body 2, it is connected to the line conductor 6 a formed on the upper surface of the circuit board 6 and transmitted on the line conductor 6 a.

段差２ｂを有している場合、同軸コネクタ３は、図２（ａ）に示すように段差２ｂ内に突出しているのがよい。これにより、同軸コネクタ３が全周にわたって段差２ｂに広がる封着材８によって保持されることから、枠体２の内外がより完全に気密に仕切られる。   When it has the level | step difference 2b, it is good for the coaxial connector 3 to protrude in the level | step difference 2b, as shown to Fig.2 (a). As a result, the coaxial connector 3 is held by the sealing material 8 that spreads over the entire step 2b, so that the inside and outside of the frame 2 are more completely and airtightly partitioned.

円筒状固定部材９は、中心軸に絶縁体を介して中心導体を有するＦｅ−Ｎｉ−Ｃｏ合金，ステンレス鋼（ＳＵＳ）等の金属であり、一端部から同軸ケーブル10が挿入され電気的に接続されるとともに他端部が貫通孔の大径部２ｄにネジ込まれることにより固定される。この円筒状固定部材９の外周部は接地導体となっており、その先端が外周導体３ａと電気的に接続されることによって円筒状固定部材９の外周部の接地電位が同軸コネクタ３の外周導体３ａの接地電位と同一電位となり、円筒状固定部材９の中心導体を伝送する高周波信号と、同軸コネクタ３の中心導体３ｂを伝送する高周波信号のインピーダンス値を整合させることができる。その結果、円筒状固定部材９と同軸コネクタ３を伝送する高周波信号に反射損失等の伝送損失を発生させることなく効率よく伝送させることができる。   The cylindrical fixing member 9 is a metal such as Fe-Ni-Co alloy or stainless steel (SUS) having a central conductor through an insulator on the central axis, and a coaxial cable 10 is inserted from one end to be electrically connected. The other end is fixed by being screwed into the large-diameter portion 2d of the through hole. The outer peripheral portion of the cylindrical fixing member 9 is a ground conductor, and the tip of the cylindrical fixing member 9 is electrically connected to the outer peripheral conductor 3a, so that the ground potential of the outer peripheral portion of the cylindrical fixing member 9 is the outer peripheral conductor of the coaxial connector 3. The impedance of the high-frequency signal transmitted through the central conductor of the cylindrical fixing member 9 and the high-frequency signal transmitted through the central conductor 3b of the coaxial connector 3 can be matched with the ground potential of 3a. As a result, the high-frequency signal transmitted through the cylindrical fixing member 9 and the coaxial connector 3 can be efficiently transmitted without causing transmission loss such as reflection loss.

本発明では、大径部２ｄの小径部２ａ側の先端に円筒状固定部材９と外周導体３ａとで挟み込むようにして、大径部２ｄおよび小径部２ａに同軸状に導電性の環状部材30が配置されている。この環状部材30は外周面の中央部が全周にわたって凹んだ凹部30ｂが形成されているとともに、円筒状固定部材９側の端面の直径が外周導体３ａ側の端面の直径よりも大きい。   In the present invention, an annular conductive member 30 is formed coaxially with the large diameter portion 2d and the small diameter portion 2a so as to be sandwiched between the cylindrical fixing member 9 and the outer peripheral conductor 3a at the tip of the large diameter portion 2d on the small diameter portion 2a side. Is arranged. The annular member 30 has a concave portion 30b in which the central portion of the outer peripheral surface is recessed over the entire periphery, and the diameter of the end surface on the cylindrical fixing member 9 side is larger than the diameter of the end surface on the outer peripheral conductor 3a side.

これにより、枠体２の外面側に円筒状固定部材９をネジ込み固定した場合に、円筒状固定部材９の先端と同軸コネクタ３の外周導体３ａとを圧力が加わった状態で確実に接触させることができ、円筒状固定部材９の先端の接地電位を同軸コネクタ３の外周導体３ａの接地電位と同一電位として、円筒状固定部材９と同軸コネクタ３を伝送する高周波信号のインピーダンス値を整合させることができる。その結果、円筒状固定部材９と同軸コネクタ３を伝送する高周波信号に反射損失等の伝送損失が生じるのを有効に抑制して高周波信号を効率よく伝送させることができる。   Thereby, when the cylindrical fixing member 9 is screwed and fixed to the outer surface side of the frame body 2, the tip of the cylindrical fixing member 9 and the outer peripheral conductor 3 a of the coaxial connector 3 are reliably brought into contact with each other in a state where pressure is applied. The ground potential at the tip of the cylindrical fixing member 9 is set to the same potential as the ground potential of the outer peripheral conductor 3a of the coaxial connector 3, and the impedance value of the high-frequency signal transmitted through the cylindrical fixing member 9 and the coaxial connector 3 is matched. be able to. As a result, it is possible to effectively suppress the occurrence of transmission loss such as reflection loss in the high-frequency signal transmitted through the cylindrical fixing member 9 and the coaxial connector 3 and efficiently transmit the high-frequency signal.

また、円筒状固定部材９の先端と同軸コネクタ３の外周導体３ａとを圧力が加わった状態で確実に接触させることができるため、時間の経過とともに筒状固定部材９が緩んで円筒状固定部材９の先端と同軸コネクタ３の外周導体３ａとに加わっている圧力が低下したとしても、環状部材30が復元するように円筒状固定部材９の緩みに追従するので、円筒状固定部材９の先端と同軸コネクタ３の外周導体３ａとの接触を維持することができ、半導体素子５に入出力される高周波信号の伝送効率を維持して半導体素子５を長期間にわたり正常かつ安定に作動させることができる。外周部に凹部30ｂが形成されることにより、環状部材30を弾性変形させ易くでき、外周導体３ａに大きな力が加わるのを有効に防止し、絶縁体３ｃにクラック等の破損が生じるのを確実に防止することができる。   In addition, since the tip of the cylindrical fixing member 9 and the outer peripheral conductor 3a of the coaxial connector 3 can be reliably brought into contact with each other with pressure applied, the cylindrical fixing member 9 is loosened with time and the cylindrical fixing member Even if the pressure applied to the distal end of 9 and the outer peripheral conductor 3a of the coaxial connector 3 decreases, the annular member 30 follows the looseness of the cylindrical fixing member 9 so that the annular member 30 is restored. And the outer peripheral conductor 3a of the coaxial connector 3 can be maintained, the transmission efficiency of the high-frequency signal inputted to and outputted from the semiconductor element 5 can be maintained, and the semiconductor element 5 can be operated normally and stably over a long period of time. it can. By forming the concave portion 30b on the outer peripheral portion, the annular member 30 can be easily elastically deformed, and it is possible to effectively prevent a large force from being applied to the outer peripheral conductor 3a, and to ensure that the insulator 3c is damaged such as a crack. Can be prevented.

さらに、環状部材30は、円筒状固定部材９側の端面の直径が外周導体３ａ側の端面の直径よりも大きいことから、環状部材30の円筒状固定部材９側の端面を円筒状固定部材９の端面に広い面積で当接させることができ、環状部材30を傾けることなく取り付けることが可能となり接続信頼性を向上させることができる。また、円筒状固定部材30側で変形させやすくすることができるため、円筒状固定部材30を締め付けた際や、温度変化によって発生した応力を緩和してパッケージが破損するのを有効に防止できる。さらに、外周導体３ａ側で環状部材30の端面は剛性を維持して変形し難くいため、環状部材30が変形して同軸コネクタの絶縁体３ｃに接触するのを防止できる。従って、絶縁体３ｃにクラック等の破損が発生するのを有効に防止でき、パッケージ内を確実に気密に保持できる信頼性の高いものとなる。   Further, since the diameter of the end face on the cylindrical fixing member 9 side of the annular member 30 is larger than the diameter of the end face on the outer peripheral conductor 3 a side, the end face on the cylindrical fixing member 9 side of the annular member 30 is the cylindrical fixing member 9. The ring member 30 can be attached without being inclined, and the connection reliability can be improved. In addition, since the cylindrical fixing member 30 can be easily deformed, it is possible to effectively prevent the package from being damaged when the cylindrical fixing member 30 is tightened or stress generated by a temperature change is relaxed. Furthermore, since the end face of the annular member 30 is hard to be deformed while maintaining rigidity on the outer peripheral conductor 3a side, the annular member 30 can be prevented from being deformed and coming into contact with the insulator 3c of the coaxial connector. Therefore, it is possible to effectively prevent the insulator 3c from being damaged such as a crack, and it is possible to reliably keep the inside of the package airtight with high reliability.

このような環状部材30は、Ｆｅ−Ｎｉ−Ｃｏ合金，ＳＵＳ，Ｃｕ等の金属やＡｇエポキシ等の導電性樹脂等の導電性部材からなり、中央の貫通孔に同軸コネクタ３の中心導体３ｂが挿通される。また、環状部材30は外径が外周導体３ａの直径よりも大きくなっている。これにより、外周導体３ａとより確実に接続することができ、環状部材30を介して円筒状固定部材９の先端と外周導体３ａとの電気的接続をより向上させることができる。   Such an annular member 30 is made of a conductive member such as a metal such as Fe—Ni—Co alloy, SUS, or Cu, or a conductive resin such as Ag epoxy, and the central conductor 3b of the coaxial connector 3 is formed in the central through hole. It is inserted. The annular member 30 has an outer diameter larger than the diameter of the outer conductor 3a. Thereby, it can connect more reliably with the outer periphery conductor 3a, and can improve the electrical connection of the front-end | tip of the cylindrical fixing member 9 and the outer periphery conductor 3a via the annular member 30 more.

また好ましくは、環状部材30は円筒状固定部材９よりも縦弾性係数が低い材料であるのがよい。例えば円筒状固定部材９がＦｅ−Ｎｉ−Ｃｏ合金やＳＵＳの場合、Ｃｕ，Ａｇ，アルミニウム（Ａｌ）等の金属材料やＡｇエポキシ等の導電性樹脂等の変形し易い材料であるのがよい。これにより、環状部材30を応力緩衝部材としても機能させることができ、円筒状固定部材９を大径部２ｄにネジ込んだ際、外周導体３ａに加わる応力を緩和することができ、絶縁体３ｃにクラック等の破損を生じるのを有効に抑制できる。   Preferably, the annular member 30 is made of a material having a lower longitudinal elastic modulus than the cylindrical fixing member 9. For example, when the cylindrical fixing member 9 is an Fe—Ni—Co alloy or SUS, it is preferable that the material is easily deformable, such as a metal material such as Cu, Ag, aluminum (Al), or a conductive resin such as Ag epoxy. Thereby, the annular member 30 can also function as a stress buffer member, and when the cylindrical fixing member 9 is screwed into the large diameter portion 2d, the stress applied to the outer peripheral conductor 3a can be relaxed, and the insulator 3c. It is possible to effectively suppress the occurrence of breakage such as cracks.

さらに好ましくは、図２（ｂ）に示すように、環状部材30の円筒状固定部材９側の外周部が、大径部２ｄの内周面に接しているのがよい。さらに、この大径部２ｄの内周面に接触した環状部材30の外周部の先端には大径部２ｄの内周面に沿って突出部30ｃが形成されており、この突出部30ｃが大径部２ｄの小径部２ａ側の端面に接しているのがよい。これにより、環状部材30の中央部に設けられた貫通孔を所定の位置に容易に配置することができるとともに、環状部材30に加わる応力を分散させることができる。従って、外周導体３ａに加わる応力を大幅に緩和することができ、絶縁体３ｃにクラック等の破損を生じるのをより確実に防止できる。また、環状部材30の貫通孔に挿通される中心導体３ｂが貫通孔の中心に精度よく配置されるので、中心導体３ｂの環状部材30内部を伝送する高周波信号のインピーダンス値を容易に所望の値とすることができ、中心導体３ｂを伝送する高周波信号に反射損失等の伝送損失が発生するのを有効に抑制し、高周波信号を効率よく伝送させることができる。   More preferably, as shown in FIG. 2B, the outer peripheral portion of the annular member 30 on the cylindrical fixing member 9 side is in contact with the inner peripheral surface of the large-diameter portion 2d. Further, a protruding portion 30c is formed along the inner peripheral surface of the large diameter portion 2d at the tip of the outer peripheral portion of the annular member 30 in contact with the inner peripheral surface of the large diameter portion 2d. It is good to be in contact with the end face of the diameter part 2d on the small diameter part 2a side. Thereby, the through-hole provided in the central portion of the annular member 30 can be easily arranged at a predetermined position, and the stress applied to the annular member 30 can be dispersed. Therefore, the stress applied to the outer conductor 3a can be greatly relieved, and it is possible to more reliably prevent the insulator 3c from being damaged such as a crack. Further, since the center conductor 3b inserted through the through hole of the annular member 30 is accurately arranged at the center of the through hole, the impedance value of the high frequency signal transmitted through the annular member 30 of the center conductor 3b can be easily set to a desired value. It is possible to effectively suppress the occurrence of transmission loss such as reflection loss in the high-frequency signal transmitted through the center conductor 3b, and to efficiently transmit the high-frequency signal.

また好ましくは、図２（ｂ）に示すように突出部30ｃの内側に凹部が形成されているのがよく、この構成により、枠体２の外面側に円筒状固定部材９をネジ込み固定した場合に、円筒状固定部材９の先端と同軸コネクタ３の外周導体３ａとを圧力が加わった状態で確実に接触させることができ、環状部材30に加わる圧力を突出部30ｃにも分散させるとともに弾性変形し易くして、より外周導体３ａに加わる応力を低減させることができる。その結果、円筒状固定部材９をネジ込み固定した場合に同軸コネクタ３の外周導体３ａに圧力が加わりすぎるのを防止して、同軸コネクタ３の絶縁体３ｃにクラック等の破損が生ずるのをさらに有効に抑制できる。   Further, preferably, as shown in FIG. 2 (b), a recess is formed inside the protrusion 30c. With this configuration, the cylindrical fixing member 9 is screwed and fixed to the outer surface side of the frame 2. In this case, the tip of the cylindrical fixing member 9 and the outer peripheral conductor 3a of the coaxial connector 3 can be reliably brought into contact with each other in a state where pressure is applied, and the pressure applied to the annular member 30 is distributed to the protrusion 30c and is elastic. The stress applied to the outer conductor 3a can be further reduced by facilitating deformation. As a result, when the cylindrical fixing member 9 is fixed by screwing, it is possible to prevent excessive pressure from being applied to the outer peripheral conductor 3a of the coaxial connector 3 and to further cause damage such as cracks in the insulator 3c of the coaxial connector 3. It can be effectively suppressed.

また、環状部材30の凹部30ｂの底面は、外周導体３ａの内周面よりも中心導体３ｂ側にあるのがよい。これにより、外周導体３ａと環状部材30との接触により加わる応力を、環状部材30が適度に変形することにより有効に緩和することができるとともに、外周導体３ａと環状部材30との接触の圧力が多少低下しても環状部材30が追従して電気的な接続をより維持し易くなる。   The bottom surface of the recess 30b of the annular member 30 is preferably located closer to the central conductor 3b than the inner peripheral surface of the outer peripheral conductor 3a. Accordingly, the stress applied by the contact between the outer conductor 3a and the annular member 30 can be effectively reduced by appropriately deforming the annular member 30, and the pressure of the contact between the outer conductor 3a and the annular member 30 can be reduced. Even if it is somewhat lowered, the annular member 30 follows to make it easier to maintain the electrical connection.

これらの構成により、枠体２の外面側から円筒状固定部材９をネジ込んでも同軸コネクタ３の絶縁体３ｃにクラック等の破損を生じさせることなく、円筒状固定部材９と同軸コネクタ３の外周導体３ａとを環状部材30を介して確実に電気的接続させることができ、円筒状固定部材９の接地電位を同軸コネクタ３の外周導体３ａの接地電位と同一電位とすることができ、さらに中心導体３ｂを伝送する高周波信号のインピーダンス値を所望の値とすることができる。その結果、中心導体３ｂを伝送する高周波信号に反射損失等の伝送損失が発生するのをより有効に抑制し、半導体素子５に高周波信号を良好に入出力させることができる。   With these configurations, even if the cylindrical fixing member 9 is screwed from the outer surface side of the frame body 2, the outer periphery of the cylindrical fixing member 9 and the coaxial connector 3 is not caused to cause damage such as cracks in the insulator 3 c of the coaxial connector 3. The conductor 3a can be securely connected to the conductor 3a through the annular member 30, the ground potential of the cylindrical fixing member 9 can be made equal to the ground potential of the outer peripheral conductor 3a of the coaxial connector 3, and the center The impedance value of the high-frequency signal transmitted through the conductor 3b can be set to a desired value. As a result, it is possible to more effectively suppress the occurrence of transmission loss such as reflection loss in the high-frequency signal transmitted through the center conductor 3b, and to input / output the high-frequency signal to the semiconductor element 5 satisfactorily.

このような本発明のパッケージの載置部１ａに、半導体素子５を、回路基板６等に実装されるとともにその電極が線路導体６ａにボンディングワイヤ７等を介して電気的に接続された状態で載置固定し、しかる後、回路基板６の線路導体６ａと同軸コネクタ３の中心導体３ｂとを半田等を介して電気的に接続し、枠体２の大径部２ｄに筒状固定部材９をネジ込んで固定し、最後に枠体２の上面にＦｅ−Ｎｉ−Ｃｏ合金等の金属等から成る蓋体４を半田付け法やシームウエルド法等により取着することにより製品としての半導体装置となる。   In such a state that the semiconductor element 5 is mounted on the circuit board 6 or the like on the mounting portion 1a of the package of the present invention and the electrode thereof is electrically connected to the line conductor 6a via the bonding wire 7 or the like. After mounting and fixing, the line conductor 6a of the circuit board 6 and the center conductor 3b of the coaxial connector 3 are electrically connected via solder or the like, and the cylindrical fixing member 9 is attached to the large-diameter portion 2d of the frame 2. And finally, a lid 4 made of a metal such as an Fe-Ni-Co alloy is attached to the upper surface of the frame 2 by a soldering method, a seam weld method, or the like. It becomes.

このような半導体装置は、円筒状固定部材９と外部電気回路に接続される同軸ケーブル10とを嵌合させることにより内部に収容する半導体素子５が外部電気回路に電気的に接続されることとなる。   In such a semiconductor device, the semiconductor element 5 accommodated therein is electrically connected to the external electric circuit by fitting the cylindrical fixing member 9 and the coaxial cable 10 connected to the external electric circuit. Become.

尚、本発明は以上の実施の形態の例に限定されるものではなく、本発明の要旨を逸脱しない範囲であれば種々の変更は可能である。   It should be noted that the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the present invention.

本発明は、半導体素子を収容するための半導体素子収納用パッケージおよび半導体装置に利用できる。   INDUSTRIAL APPLICABILITY The present invention can be used for a semiconductor element housing package and a semiconductor device for housing semiconductor elements.

本発明の半導体素子収納用パッケージについて実施の形態の一例を示す断面図である。It is sectional drawing which shows an example of embodiment about the package for semiconductor element accommodation of this invention. （ａ）は図１の半導体素子収納用パッケージにおける同軸コネクタ部の要部拡大断面図、（ｂ）は本発明の半導体素子収納用パッケージの実施の形態の他の例を示す同軸コネクタ部の要部拡大断面図である。1A is an enlarged cross-sectional view of a main part of a coaxial connector part in the semiconductor element housing package of FIG. 1, and FIG. 2B is a main part of a coaxial connector part showing another example of the embodiment of the semiconductor element housing package of the present invention. FIG. 従来の半導体素子収納用パッケージを示す断面図である。It is sectional drawing which shows the conventional package for semiconductor element accommodation. 図３の半導体素子収納用パッケージにおける同軸コネクタ部の要部拡大断面図である。FIG. 4 is an enlarged cross-sectional view of a main part of a coaxial connector portion in the semiconductor element storage package of FIG. 3.

符号の説明Explanation of symbols

１：基体
１ａ：載置部
２：枠体
２ａ：小径部
２ｄ：大径部
３：同軸コネクタ
３ａ：外周導体
３ｂ：中心導体
３ｃ：絶縁体
４：蓋体
５：半導体素子
９：円筒状固定部材
10：同軸ケーブル
30：環状部材 1: Base 1a: Placement part 2: Frame 2a: Small diameter part 2d: Large diameter part 3: Coaxial connector 3a: Outer conductor 3b: Center conductor 3c: Insulator 4: Lid 5: Semiconductor element 9: Cylindrical fixing Element
10: Coaxial cable
30: Ring member

Claims (2)

上面に半導体素子が載置される載置部を有する基体と、該基体の上面の外周部に前記載置部を囲繞するように取着され、側部に断面が円形状の貫通孔が形成された枠体と、前記貫通孔に嵌着された、円筒状の外周導体および該外周導体の中心軸に設置された中心導体ならびにそれらの間に介在させた絶縁体から成る同軸コネクタとを具備しており、前記貫通孔は、前記同軸コネクタが嵌着された前記枠体の内面側の小径部と、それに同軸状に連なるとともに前記同軸コネクタに電気的に接続される同軸ケーブルを固定する金属製の円筒状固定部材が挿入固定される前記枠体の外面側の大径部とを有し、前記円筒状固定部材と前記外周導体とが、前記貫通孔に同軸状に設置された導電性の環状部材を介して接続されており、該環状部材は、外周面の中央部が全周にわたって凹んでいるとともに、前記円筒状固定部材側の端面の直径が前記外周導体側の端面の直径よりも大きいことを特徴とする半導体素子収納用パッケージ。 A base having a mounting portion on which the semiconductor element is mounted on the upper surface, and a through-hole having a circular cross section formed on the side portion so as to surround the mounting portion on the outer periphery of the upper surface of the base And a coaxial connector made up of a cylindrical outer conductor, a central conductor installed on the central axis of the outer conductor, and an insulator interposed between them. The through hole is a metal that fixes a small-diameter portion on the inner surface side of the frame body to which the coaxial connector is fitted, and a coaxial cable that is coaxially connected to the coaxial connector and is electrically connected to the coaxial connector. A cylindrical fixing member made of metal and having a large-diameter portion on the outer surface side of the frame body, into which the cylindrical fixing member is inserted and fixed, and the cylindrical fixing member and the outer peripheral conductor are installed coaxially in the through hole Are connected via an annular member of the outer periphery. Together with the central portion is recessed over the entire circumference, the semiconductor device package for housing a diameter of the end face of the cylindrical stationary member side being greater than the diameter of the end face of the outer peripheral conductor side. 請求項１記載の半導体素子収納用パッケージと、前記載置部に載置されるとともに前記同軸コネクタに電気的に接続された半導体素子と、前記枠体の上面に取着された蓋体とを具備していることを特徴とする半導体装置。 A package for housing a semiconductor element according to claim 1, a semiconductor element mounted on the mounting portion and electrically connected to the coaxial connector, and a lid attached to the upper surface of the frame body A semiconductor device comprising the semiconductor device.
JP2003303013A 2003-08-27 2003-08-27 Package for housing semiconductor element and semiconductor device Pending JP2005072466A (en)

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JP2005072466A true JP2005072466A (en) 2005-03-17

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