JP2005072404A - Aligner and manufacturing method of semiconductor device - Google Patents

Aligner and manufacturing method of semiconductor device Download PDF

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JP2005072404A
JP2005072404A JP2003302290A JP2003302290A JP2005072404A JP 2005072404 A JP2005072404 A JP 2005072404A JP 2003302290 A JP2003302290 A JP 2003302290A JP 2003302290 A JP2003302290 A JP 2003302290A JP 2005072404 A JP2005072404 A JP 2005072404A
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exposure
light emitting
emitting end
optical lens
liquid
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Hideo Shimizu
秀夫 清水
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Sony Corp
ソニー株式会社
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70216Systems for imaging mask onto workpiece
    • G03F7/70341Immersion

Abstract

<P>PROBLEM TO BE SOLVED: To realize high precision exposure by preventing the contamination of a lens due to liquid in a liquid immersion aligner. <P>SOLUTION: In the aligner 1 for performing exposure in a state where liquid L is filled between a light exit end 2a of an optical lens 2 and a wafer W as an exposure object; there are provided, below the light exit end 2a freely to go forward and backward, a cleaning nozzle 10 for injecting a cleaning solution LC toward the light exit end 2a of the optical lens 2, a gas nozzle 11 for injecting gas toward the light exit end 2a, and a brush 12 for removing the contamination of the light exit end 2a. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、光学レンズ部の光出射端と基板上の露光領域との間に液体を介在させた状態で露光を行う液侵式の露光装置およびこの露光を用いる半導体装置の製造方法に関する。 The present invention relates to a method of manufacturing a semiconductor device using the exposure apparatus and the exposure of an immersion type performs exposure while interposing the liquid between the light emitting end and the exposure area on the substrate of the optical lens portion.

液浸型の露光装置は半導体露光装置の解像限界、焦点深度を向上させる技術として実用化の検討が進められている。 Liquid immersion type exposure apparatus resolution limit of a semiconductor exposure device, the study of practical use as a technique for improving the depth of focus has been promoted. 具体的には通常空気(屈折率:n=1)で満たされているレンズと露光対象物の間を、周りに水槽を設けるなどして液体で満たして露光するものである。 Specifically normal air (refractive index: n = 1) is between the filled in and the lens and the exposure object in are those with such provision of the water tank is exposed is filled with liquid around. 一般に液体の屈折率は1よりも大きく、空気中に比べて波長は実質的に短くなるため、解像限界,焦点深度が向上する(例えば、特許文献1、2参照。)。 In general the refractive index of the liquid is greater than 1, the wavelength than in the air to become substantially shorter, the resolution limit, the focal depth is improved (e.g., see Patent Documents 1 and 2.).

従来、顕微鏡の解像度向上技術として応用されてきた本技術を露光装置に応用する場合、ウエハ等の露光対象とそれを載せたステージおよびレンズを液体で満たして露光を行うことになるが、例えばデバイスを量産する場合には1時間に数十から百数十枚のレベルでウエハを交換して露光する必要があり、交換時には液体を排出し、再び満たす必要がある。 Conventionally, when applying this technique has been applied as a resolution enhancement technique of the microscope to the exposure apparatus, an exposure object and the stage, and the lens was placed it such as a wafer so that the exposure is performed filled with a liquid, for example, the device in the case of mass production must be exposed to replace the wafer from several tens to 1 hour at a hundred and several tens of levels, will discharge the liquid during replacement, it is necessary to replenish.

特開平10−303114号公報 JP 10-303114 discloses 国際公開第99/49504号パンフレット International Publication No. WO 99/49504

ところが種々の加工工程を経てレジストを塗布したウエハを液体に浸すと、付着物が液中に溶け出し、液体を排出した際にレンズに付着した汚染液がレンズを汚す可能性がある。 However, when immersing the various processing steps were coated with a resist through the wafer to the liquid, there is a possibility that the deposit melts into a liquid, contaminated liquid adhered to the lens when the liquid drained is dirty lens. ここで、次々に露光を行い、液体が頻繁に交換されているときは大きな問題とはならないが、待機時間が長い場合には液体が乾燥し、汚染物がレンズに付着して露光の妨げになるという問題を発生させる。 Here, exposure successively, but not a serious problem when the liquid is changed frequently, the liquid is dried when long standby time, hinder the exposure contaminants may adhere to the lens causing the problem that.

本発明はこのような課題を解決するために成されたものである。 The present invention has been made in order to solve such problems. すなわち、本発明は、光学レンズ部における光出射端と露光対象となる基板との間に液体を満たしておいた状態で露光を行う露光装置において、光学レンズ部の光出射端に向けて洗浄液を噴出する洗浄ノズルが光出射端の下方部分に進退可能に設けられているものである。 That is, the present invention is an exposure apparatus that performs exposure in a state that has been filled with liquid between a substrate serving as a light emitting end subject to exposure in the optical lens unit, a cleaning solution toward the light emitting end of the optical lens portion cleaning nozzle for jetting is one that is provided to be moved in the lower portion of the light emitting end. また、光学レンズ部における光出射端と露光対象となる基板との間に液体を満たしておいた状態で露光を行う工程を備える半導体装置の製造方法において、露光を行った後、光学レンズ部の光出射端に向けて洗浄液を噴出して光学レンズ部における光出射端を洗浄する処理を行う方法である。 In the method for manufacturing a semiconductor device comprising a step of performing exposure in a state that has been filled with liquid between the substrate as a light emitting end of the optical lens unit and the exposure target, after exposure, the optical lens portion a method of performing a process for cleaning the light emitting end of the optical lens portion by ejecting the cleaning liquid toward the light emitting end.

このような本発明では、液浸式の露光装置および露光方法において、光学レンズ部の光出射端が液体に触れることでこの液体を介在して汚染物が付着した場合でも、洗浄液の噴出によって確実に除去できるようになる。 In the present invention, an exposure apparatus and an exposure method of immersion, even when contaminants interposed the liquid by the light emitting end of the optical lens portion touches the liquid adheres securely by jetting the washing liquid so it can be removed. つまり、露光後の所定のタイミングで光出射端の下方に洗浄ノズルが延出し、光出射端に液体を噴出する。 That is, the cleaning nozzle below the light emitting end at a predetermined timing after exposure extending to eject liquid to the light emitting end. これにより光出射端の表面に付着している汚染物を除去できる。 Thus contaminants adhering on the surface of the light emitting end can be removed. また、露光の前には洗浄ノズルが光出射端の下方から退去して露光時の邪魔にならないようにできる。 Further, before the exposure it can wash nozzle to leave the lower light emitting end so as not to interfere with the time of exposure.

本発明によれば次のような効果がある。 According to the present invention has the following effects. すなわち、液浸式の露光装置において、光学レンズ部の光出射端に汚染物が付着しても、洗浄液の噴出等によって汚染物を除去でき、常に綺麗な状態で高精度な露光処理を行うことが可能となる。 That is, in the exposure apparatus of an immersion type, even if adhered contaminants light emitting end of the optical lens unit, can remove contaminants by spouting the like of the cleaning liquid is always possible to perform high-accuracy exposure process in clean state it is possible. また、この露光によって信頼性の高い半導体装置を歩留まり良く製造することが可能となる。 Further, it is possible with high yield a highly reliable semiconductor device by this exposure.

以下、本発明の実施の形態を図に基づき説明する。 Hereinafter will be described with reference to FIG. Embodiments of the present invention. 本発明は、この汚染水によりレンズが汚染されるのを防ぐものである。 The present invention prevents the lens from being contaminated by the polluted water. ここでは露光装置としてKrFエキシマレーザを光源とするスキャナ、露光対象としてはデバイスの製造に使用する半導体ウエハを例に説明する。 Here, a light source of KrF excimer laser as an exposure device scanner, the exposure target illustrating a semiconductor wafer for use in the manufacture of a device as an example. ただし露光機はi線やArFエキシマレーザなど各種光源でも使用可能であり、また露光対象もディスプレイ用のガラス基板などに応用可能であり、この例に限定されるものではない。 However exposure machine is also available in various light sources such as i-ray or ArF excimer laser, also be exposed is also applicable, such as a glass substrate for a display, but is not limited to this example.

図1は、本実施形態に係る露光装置を説明する模式図で、(a)は露光時の状態、(b)は洗浄時の状態を示すものである。 Figure 1 is a schematic view for explaining an exposure apparatus according to this embodiment, showing (a) shows the state at the time of exposure, (b) is at wash conditions. すなわち、この露光装置1は、光学レンズ部2における光出射端2aと露光対象となる基板(ウエハW)との間に液体を満たしておいた状態で露光を行う液浸式の露光装置である。 That is, the exposure apparatus 1 is an immersion type exposure apparatus that performs exposure in a state that has been filled with liquid between a substrate serving as a light emitting end 2a of the optical lens portion 2 and the exposure target (wafer W) .

したがって、図1(a)に示すように、ウエハWを載置する移動可能なステージSの周辺には水槽3が設けられており、この水槽3内に純水等の液体Lを入れて光出射端2aとウエハWとの間に液体Lを満たすようにしている。 Accordingly, as shown in FIG. 1 (a), around the movable stage S for placing the wafer W is provided with a water tank 3, put the liquid L such as pure water in this water tank 3 Light and to meet the liquid L between the exit end 2a and the wafer W. 露光を行う際には、この状態で光学レンズ部2の光出射端2aから図示しないマスクを介した光をウエハWに照射しつつ、ステージSを所定方向へ移動して例えばスキャン露光を行う。 When performing exposure is performed while irradiating with light through a mask (not shown) from the light emitting end 2a of the optical lens unit 2 to the wafer W, the moving stage S to a predetermined direction, for example scanning exposure in this condition.

露光を行った後、所定のタイミングで光学レンズ部2の光出射端2aに付着した汚染物の洗浄を行う。 After exposure, to clean the contaminants adhering to the light emitting end 2a of the optical lens portion 2 at a predetermined timing. 本実施形態の露光装置1では、露光後に水槽3から液体Lを排出し、ステージSおよび水槽3を光学レンズ部2の位置から外側に移動させた状態で、図1(b)に示すような洗浄ノズル10等が光出射端2aの下方部分に延出してここから洗浄液CLを光出射端2aの表面へ吹き付けるようになっている。 In the exposure apparatus 1 of this embodiment, in a state in which the liquid L is discharged from the water tank 3 after exposure, is moved to the outside of the stage S and water tank 3 from the position of the optical lens portion 2, as shown in FIG. 1 (b) like cleaning nozzle 10 is adapted to blow from here extends in the lower portion of the light emitting end 2a of the cleaning liquid CL to the surface of the light emitting end 2a.

したがって、洗浄ノズル10等は、光出射端2aの下方部分に進退可能に設けられており、洗浄を行うときだけ延出し、洗浄後は退去できる構成となっている。 Therefore, like the washing nozzle 10 is provided to be movable forward and backward in the lower portion of the light emitting end 2a, it extends only when cleaned, after washing has a configuration that can leave. これにより、水槽3と干渉することなく光学レンズ部2の光出射端2aを洗浄できるようになっている。 Thus, so that can clean the light exit end 2a of the optical lens portion 2 without interfering with the water tank 3.

また、本実施形態の露光装置1では、洗浄ノズル10とともに、光出射端2aに向けて気体を噴出するガスノズル11および光出射端2aの表面を直接磨くことのできるブラシ12も進退可能に設けられている。 Further, the exposure apparatus 1 of this embodiment, the washing nozzle 10, a brush 12 which can polish gas nozzle 11 and the surface of the light emitting end 2a for ejecting a gas toward the light emitting end 2a also directly provided to be movable forward and backward ing. なお、これら洗浄ノズル10、ガスノズル11、ブラシ12は、全て設けられていても、いずれか1つ以上が設けられていてもよい。 Note that these cleaning nozzles 10, the gas nozzle 11, the brush 12 may be provided all or may be any one or more are provided.

光学レンズ部2の光出射端2aを洗浄するには、次のような手順となる。 To clean the light exit end 2a of the optical lens unit 2 becomes the following procedure. すなわち、ウエハWは露光が終わるたびに頻繁に交換されるが、クリーニングのタイミングは各ウエハWの交換時や、所定枚数の露光後、所定時間露光後など、適宜タイミングを設定して行う。 That is, the wafer W is being frequently exchanged each time the exposure is completed, the timing of cleaning and during replacement of each wafer W, after the exposure of a predetermined number, such as after a predetermined time exposure is performed by setting the appropriate timing. なお、好ましくは1ロット分の露光が完了した時が適当である。 Incidentally, and preferably when the exposure of one lot has been completed.

露光後は、図1(a)に示す水槽3から液体Lを排出した後、水槽3およびステージSがレンズ直下からウエハ受け渡しのポジションに移動する。 After exposure, after discharging the liquid L from the water tank 3 shown in FIG. 1 (a), water tank 3 and the stage S is moved to the position of the wafer transfer from just below the lens. その後、ステージSの移動範囲や光学系に干渉しない位置に取り付けられた洗浄ノズル10が光出射端2aの下方へ延出し、洗浄ノズル10から光出射端2aに向けて洗浄液CLを吹き付ける。 Then, extended washing nozzle 10 which is mounted at a position not interfering with the movement range and the optical system of the stage S is below the light emitting end 2a, spraying a cleaning liquid CL toward the cleaning nozzle 10 to the light emitting end 2a. 洗浄液CLは液浸に使用する液体Lに寄るが、例えば液浸に用いる液体Lと同じもの(例えば、純水)を使用する。 Cleaning liquid CL is due to the liquid L to be used for immersion, but using for example, the same as the liquid L to be used in immersion (e.g., pure water).

通常の汚染液であれば洗浄ノズル10から洗浄液CLを吹き付けることでほぼ除去することができる。 Can be substantially removed by blowing a cleaning solution CL from the cleaning nozzle 10 would normally contaminated liquid. しかし液浸に使用する液体Lとして例えば揮発性の高い液体を用いた場合や装置トラブルによりある程度の時間洗浄されずに放置された場合など、液体Lが揮発して光出射端2aに強力に汚染物質が付着している場合には、洗浄液CLによる洗浄のみでは取りきれない可能性もある。 However such when left without being cleaned some time optionally and device trouble using as the liquid L to be used in immersion example highly volatile liquid, the liquid L is volatilized strongly contaminated light emitting end 2a If the material is adhered, it is only cleaned by the cleaning solution CL is possible that not be taken.

そのような場合に備えるために、ブラシ12もしくはそれに類した洗浄器具を取り付け、ノズルと同様に洗浄を行う際に光出射端2aの下方へ延出させ、光出射端2aの表面を直接クリーニングしてもよい。 To provide for such cases, mounting the brush 12 or the cleaning instrument Ruishi thereto, is extended downward of the light emitting end 2a when performing washed as nozzles, to clean the surface of the light emitting end 2a directly it may be.

さらに、洗浄後の液滴を乾燥させる目的で、ドライエアー、N 2などを吹き付けるガスノズル11を、洗浄ノズル10と同様に進退可能に取り付けることもできる。 Further, for the purpose of drying the droplets after washing, dry air, a gas nozzle 11 to blow such N 2, it can be attached to be movable forward and backward in the same manner as the cleaning nozzle 10. 洗浄のための装置としては、洗浄液CLを吹き付ける洗浄ノズル10が最も効果的で、ブラシ12や気体を吹き付けるガスノズル11は、使用する液体の性質やウエハWの構造により、洗浄液CLのみで汚染が除去されない場合などに取り付けるようにしてもよい。 The device for cleaning the most effective cleaning nozzle 10 for spraying a cleaning solution CL, a gas nozzle 11 which blows the brush 12 and the gas, the structure of the nature and the wafer W of the liquid to be used, only contaminated cleaning solution CL removed it may be attached to a case where not.

図2は、各ノズルおよびブラシの配置を説明する模式平面図である。 Figure 2 is a schematic plan view illustrating an arrangement of nozzles and brushes. すなわち、露光時にはステージSはレンズ下方に配置され、図中破線で示すステージ稼働範囲内を移動する。 That is, the stage S is upon exposure is disposed on the lens downward, it moves in stage operating range indicated by a broken line in FIG. したがって、洗浄ノズル10やガスノズル11、ブラシ12はステージ稼働範囲の外側に配置され、待機する状態となる。 Accordingly, the cleaning nozzle 10 and the gas nozzle 11, the brush 12 is arranged outside the stage operating range, it is queued.

一方、露光が終了してウエハWの交換を行う際にはステージSがレンズ下方から外側へ移動する状態となる。 On the other hand, a state in which the stage S is moved from the lens downward to outside when performing replacement of the wafer W exposure is finished. これによりレンズの下方にスペースができ、洗浄ノズル10やガスノズル11、ブラシ12をレンズの下方へ延出できる状態となる。 Thus there is a space beneath the lens, the cleaning nozzle 10 and gas nozzle 11, a state in which the brush 12 can extend below the lens.

図3は、ブラシの進退機構を説明する模式図である。 Figure 3 is a schematic diagram illustrating the forward and reverse mechanism of the brush. 図3(a)に示すように、ブラシ12のアーム12aは折り畳み可能となっており、洗浄時にはアーム12aを伸ばすことでレンズの下方まで延出できるようになる。 As shown in FIG. 3 (a), the arm 12a of the brush 12 has a foldable, it becomes possible to extend up to below the lens by extending the arm 12a at the time of cleaning. 一方、図3(b)に示すように待機時にはアーム12aが折り畳まれ、ステージ稼働範囲の外へ逃げて露光時のステージ移動の邪魔にならないようにする。 On the other hand, the arm 12a is folded in the standby state as shown in FIG. 3 (b), of the way of the stage movement during the exposure escaping out of the stage operating range. なお、この進退機構は洗浄ノズル、ガスノズルであっても同様である。 Incidentally, the advancing and retracting mechanism is similar cleaning nozzle, even gas nozzle.

図4は、各ノズル、ブラシのアームが伸びた状態を示す模式平面図である。 Figure 4 is a schematic plan view showing the nozzle, a state in which the arm is extended brush. 洗浄時にはウエハWを載置したステージSがステージ稼働範囲から外側へ移動しているため、洗浄ノズル10、ガスノズル11、ブラシ12の各アームを伸ばしてレンズの下方へ洗浄ノズル10の先端、ガスノズル11の先端およびブラシ12を配置することが可能となる。 Since the stage mounting the wafer W when flushing S is moving outward from the stage operation range, the washing nozzle 10, the gas nozzle 11, the tip of the washing nozzle 10 below the lens by extending each arm of the brush 12, the gas nozzle 11 it is possible to place the tip and the brush 12.

また、洗浄を完了した後は、洗浄ノズル10、ガスノズル11、ブラシ12の各アームを折り畳むことでステージ稼働範囲外に退避させることができ、次のウエハWを載置したステージSや水槽3をレンズ下方へ戻すことが可能となる。 Further, after completing the washing, the washing nozzle 10, the gas nozzle 11, to fold the arms of the brush 12 can be retracted from the stage operation range, the stage S and a water tank 3 mounted with the next wafer W It can be returned to the lens downward.

なお、洗浄を行うタイミングとして、先に説明したような所定枚数の露光後に行う場合のほか、照度センサ等によって光学レンズ部の光出射端から出射される光を照度を検出し、所定の照度以下になった場合に洗浄を行うようにしてもよい。 Incidentally, as the timing of cleaning, in addition to the case performed after the exposure of the predetermined number as described above, the light emitted from the light emitting end of the optical lens unit detects the illuminance by the illuminance sensor or the like, following predetermined illuminance it may be carried out cleaning if it becomes.

この場合、各ノズル10、11やブラシ12と同様な折り畳み可能なアームによって照度センサを進退可能に設けておき、照度を検出する際にアームを伸ばして光出射端2aから出射される光の照度を検出するようにしておけばよい。 In this case, by a similar foldable arm and the nozzles 10, 11 and brushes 12 may be provided to be movable forward and backward the illuminance sensor, the illuminance of the light emitted from the light emitting end 2a extending the arm when detecting the illuminance the it is sufficient to be detected. これにより、露光に影響が出るような汚れが付着した場合のみ洗浄を行うことができ、効率の良い洗浄作業を行うことが可能となる。 Thus, only can be cleaned if soiled as affecting the exposure exits is attached, it is possible to perform an efficient cleaning operation.

次に、他の実施形態を説明する。 Next, another embodiment will be described. 図5は他の実施形態を説明する模式図である。 Figure 5 is a schematic diagram for explaining another embodiment. この実施携帯では、光学レンズ部2の光出射端2aにカバー4を取り付けたものである。 In the present mobile, it is prepared by attaching the cover 4 to the light output end 2a of the optical lens portion 2. 先に説明した実施形態では、液中に溶け出した物質によるレンズ(光出射端2a)の汚染は防止できる。 In the embodiments described above, contamination of the lens by substances eluted into the liquid (light emitting end 2a) can be prevented. しかしながら、レンズに直接気体、洗浄液を吹き付けたり、ブラシでこすったりすることで、レンズに傷をつけてしまうことも懸念される。 However, the lens directly gas, or spraying a cleaning liquid, by rub with a brush, is also a concern that would damage the lens. これらはブラシの材質や圧力(気体、液体も含む)を調整することで、影響を最低限にすることは出来るが、汚染物質の種類によっては、さらに圧力を必要とする可能性もある。 These by adjusting the brush material and the pressure (gas, including liquid), but may be to minimize the effect, depending on the type of contaminants, further there is a possibility that requires pressure. そのような場合に対応するため、図5(a)に示す例ではレンズ先端に露光光に対して透明なカバーガラス4aを備えるカバー4を取り付けるようにしている。 To accommodate such cases, so that attachment of the cover 4 with a transparent cover glass 4a to exposure light on the front of the lens in the example shown in Figure 5 (a).

このカバー4は、例えばKrFやArFスキャナなら石英から成るカバーガラス4aを使用し、図5(b)に示すような金属のカバー枠4bに取り付けて使用する。 The cover 4, for example, using a cover glass 4a consisting If quartz KrF or ArF scanner used is attached to the metal of the cover frame 4b as shown in Figure 5 (b). 内部に液体が入り込むと光学系の汚染等の可能性があるため、光出射端2aとの間にはゴムのOリング4cなどでシールする構造になっている。 Because of the potential for contamination of the optical system when the liquid enters the inside, between the light emitting end 2a has a structure to seal the like O-ring 4c of the rubber.

カバー4の光出射端2aへの取り付けは、例えばカバー枠4bの内面にねじ山4dを設けてねじ込む方式を取る。 Attachment to the light emitting end 2a of the cover 4, for example, take the system screwed to the screw thread 4d provided on the inner surface of the cover frame 4b. このカバー4を取り付けた後の洗浄に関しては、先に説明した実施形態と同様に、洗浄ノズルからの洗浄液噴出、ガスノズルからのガス噴出、ブラシによる汚れ除去等の洗浄処理を行う。 For the cleaning after attaching the cover 4, as in the embodiment described above, it performs the cleaning liquid ejected from the cleaning nozzle, the gas ejection from the nozzle, a cleaning process, such as stain removal by a brush.

また、カバーガラス4aに傷が付いた場合や除去できないほどの汚れが付着した場合にはカバー4を光出射端2aから取り外して新しいカバー4を取り付けることもできる。 It is also possible if the dirt that can not be the case and removing scratches attached to the cover glass 4a is attached by removing the cover 4 from the light emitting end 2a installing a new cover 4.

また、カバー4はねじ山4dによるねじ込み方式以外にも、図6に示すような可動爪方式で着脱を容易に行えるようにしてもよい。 The cover 4 is other than screwing method by threads 4d also may be performed easily detachable movable pawl system as shown in FIG. この場合、図6(a)に示すような板バネ4eによる付勢で爪4fをカバー枠4bの内面から突出させておき、光学レンズ部の光出射端の外面にはこの爪4fを嵌合できる穴を設けておく。 In this case, advance to protrude from the inner surface of the cover frame 4b the pawl 4f at the urging of the leaf spring 4e as shown in FIG. 6 (a), fitting the pawl 4f on the outer surface of the light emitting end of the optical lens portion leave a hole that can be.

着脱を行う際には、図6(b)に示すような着脱工具5を用いる。 When removing or inserting uses removable tool 5 as shown in Figure 6 (b). すなわち、着脱工具5の先端は開閉可動するアーム5aとなっており、アーム5aを開いた状態でカバー4のカバー枠4bをアーム5a内に配置し、アーム5aを閉じることでカバー枠4bを外側から挟むようにして保持する。 That is, the tip of the detachable tool 5 has become an arm 5a for opening and closing a movable, cover frame 4b of the cover 4 is disposed in the arm 5a with open arms 5a, the cover frame 4b by closing the arm 5a outer to hold so as to sandwich from.

また、このアーム5aによるカバー枠4bの保持とともにアーム5aの内側に設けられた突起5bがカバー枠4bの穴4gに入り込み、板バネ4eの一端を押圧する状態となる。 Moreover, the projections 5b provided inside the arm 5a together with the holding of the cover frame 4b by the arm 5a enters the hole 4g ​​of the cover frame 4b, in a state of pressing the one end of the plate spring 4e. この板バネ4eの押圧によって爪4fが開き、カバー4の着脱が可能となる。 It opens pawl 4f by the pressing of the plate spring 4e, thereby enabling attachment and detachment of the cover 4.

一方、カバー4を光出射端2aに取り付けた状態でアーム5aを開くと突起5bによる板バネ4eの押圧が解除され、爪4fが閉じて光出射端2aに設けられた穴に爪4fが嵌合し、固定される状態となる。 On the other hand, opening the arms 5a in a state of attaching the cover 4 to the light emitting end 2a and is released presses the plate spring 4e of the projections 5b is closed claws 4f pawl 4f is fitted into a hole provided on the light emitting end 2a combined, a state of being fixed.

なお、この着脱工具5による交換作業は手動で行っても、また可動式のアームを持つロボットを用いて自動で行ってもよい。 Incidentally, even if the detachable replacement by the tool 5 is manually, or may be performed automatically using a robot having an arm movable. このカバー4においても先と同様にOリング4cなどで防水対策が施されている。 Etc. In waterproof previously as well as O-ring 4c is applied in this cover 4.

なお、光出射端2aにカバー4を取り付ける例では、光出射端2aとカバーガラス4aとの間に空間が生じるが、必要に応じてこの空間に液体を封入しておいてもよい。 In the example of attaching the cover 4 to the light emitting end 2a, but the space between the light emitting end 2a and the cover glass 4a occurs, the liquid in the space may have been sealed as necessary.

上記説明したこれらの機構を採用することにより、液浸式の露光装置1におけるレンズ(光出射端2a)の汚染を防止することが可能となる。 By employing these mechanisms described above, it is possible to prevent contamination of immersion of the lens in the exposure apparatus 1 (light emitting end 2a).

本実施形態に係る露光装置1で行う洗浄のタイミングとしては、連続して露光する際にはカバー交換やクリーニングを毎回行う必要はないが、少なくとも1ロットの露光が完了して次の露光までに装置が稼動しない時間がある場合には行うことが望ましい。 The timing of washing performed at an exposure apparatus 1 according to this embodiment, there is no need to perform every time a cover replacement or cleaning when exposing sequentially, by exposing at least one lot is completed before the next exposure apparatus is preferably performed when there is a time that does not operate.

また、 Also,
レンズに直接洗浄液を吹き付けてクリーニングする方法が最も効果的であるが、対象とする露光物、レジストなどによっては洗浄液を吹き付けただけではとれない汚染が生じる可能性もある。 A method of cleaning directly spraying a cleaning liquid to the lens is most effective, exposure object of interest, there is a possibility that take no contamination occurs only blowing cleaning liquid resist or the like. その際にはブラシでのクリーニングが有効である。 At that time is effective cleaning with a brush.

さらに、露光後しばらく放置されるような場合には、空気中のごみ(クリーンルームでも0ではない)が濡れたレンズ表面に付着して、乾燥後強力に付着することもありうる。 Further, when the post-exposure as a while is left is attached to the dust (non-zero even in a clean room) is wet lens surface in the air, there may be to strongly adhere after drying. そのためにはガスノズルから気体を吹き付けることで強制的に乾燥させる機能も有効である。 For that function for forcibly drying by blowing a gas from the gas nozzle is also effective. また気体を吹き付けることで異物を吹き飛ばすことも可能である。 The blowing off foreign matter by blowing gas is also possible.

以上の動作、特にブラシクリーニングは繰り返し行うことでレンズ表面を傷つける可能性もある。 The above operation, in particular the brush cleaning possibly damaging the lens surfaces by repeated. それを防ぐためには先に説明したようにレンズ先端に露光光に透明なカバー4をつけ、これをクリーニングすることで対応できる。 With a transparent cover 4 to the front of the lens to the exposure light as described above in order to prevent it, it may be dealt with by cleaning it. また、カバー4の場合は万一傷がつけば交換することも可能である。 In addition, it is also possible to replace if worn Should flaws in the case of the cover 4. さらに、カバー4に傷が頻繁につくことが心配であれば、カバー4の着脱を容易にして、さらに同じカバー4をいくつか準備してストックしておき、定期的に交換すればよい。 In addition, if the worry is that to get to scratch the cover 4 is frequently, to facilitate the attachment and detachment of the cover 4, stocked to prepare some further the same cover 4 may be replaced periodically.

このような本実施形態の露光装置1は、主として半導体装置の製造方法における露光工程で適用するのが望ましい。 Such exposure apparatus 1 of this embodiment, it is desirable to apply in the exposure process mainly in the method of manufacturing a semiconductor device. すなわち、露光工程で液浸式の露光装置を用いる場合、本実施形態に係る露光装置1を用いることで、光学レンズ部2の光出射端2aに付着する汚染物を効果的に除去でき、精度の高い露光によって半導体装置の微細加工、信頼性向上等を図ることが可能となる。 Specifically, when using an immersion exposure apparatus in the exposure process, by using the exposure apparatus 1 according to this embodiment, it can effectively remove contaminants adhered to the light emitting end 2a of the optical lens portion 2, precision fine processing of a semiconductor device by a high exposure, it is possible to improve the reliability and the like.

また、上記説明では、洗浄を行うにあたりステージSとともに水槽3もレンズ下方から外側へ移動する例を示したが、ステージSのみが移動する露光装置であっても適用可能である。 In the above description, the example of moving the water tank 3 from the lens down to the outside together with the stage S carrying out the washing, which can be applied an exposure apparatus in which only the stage S is moved. この場合、水槽3が下方へ移動、もしくはレンズが上方へ移動して、各ノズルやブラシが伸びる際に水槽3と干渉しないよう、レンズ下方にスペースを確保できるようにすればよい。 In this case, the mobile water tank 3 is downward, or the lens moves upward, so as not to interfere with the water tank 3 in the nozzle or brush extends, may be so as to ensure a space in the lens downward.

本実施形態に係る露光装置を説明する模式図である。 Is a schematic view illustrating an exposure apparatus according to this embodiment. 各ノズルおよびブラシの配置を説明する模式平面図である。 It is a schematic plan view illustrating an arrangement of nozzles and brushes. ブラシの進退機構を説明する模式図である。 It is a schematic view illustrating the forward and reverse mechanism of the brush. 各ノズル、ブラシのアームが伸びた状態を示す模式平面図である。 Each nozzle is a schematic plan view showing a state in which the arm is extended brush. 他の実施形態を説明する模式図である。 It is a schematic view illustrating another embodiment. 可動爪方式の例を説明する模式図である。 It is a schematic diagram illustrating an example of a movable claw type.

符号の説明 DESCRIPTION OF SYMBOLS

1…露光装置、2…光学レンズ部、2a…光出射端、3…水槽、4…カバー、5…着脱工具、CL…洗浄液、L…液体、S…ステージ、W…ウエハ 1 ... exposure apparatus, 2 ... optical lens unit, 2a ... light exit end, 3 ... water tank, 4 ... cover, 5 ... detachable tool, CL ... cleaning liquid, L ... liquid, S ... stage, W ... wafer

Claims (7)

  1. 光学レンズ部における光出射端と露光対象となる基板との間に液体を満たしておいた状態で露光を行う露光装置において、 In the exposure apparatus which performs exposure in a state that has been filled with liquid between a substrate serving as a light emitting end subject to exposure in the optical lens unit,
    前記光学レンズ部の光出射端に向けて洗浄液を噴出する洗浄ノズルが前記光出射端の下方部分に進退可能に設けられている ことを特徴とする露光装置。 Exposure apparatus characterized by washing nozzle for ejecting a cleaning liquid toward the light emitting end of the optical lens portion is disposed so as to be moved in the lower portion of the light emitting end.
  2. 光学レンズ部における光出射端と露光対象となる基板との間に液体を満たしておいた状態で露光を行う露光装置において、 In the exposure apparatus which performs exposure in a state that has been filled with liquid between a substrate serving as a light emitting end subject to exposure in the optical lens unit,
    前記光学レンズ部の光出射端に向けて気体を噴出するガスノズルが前記光出射端の下方部分に進退可能に設けられている ことを特徴とする露光装置。 Exposure apparatus characterized by a gas nozzle for ejecting a gas toward the light emitting end of the optical lens portion is disposed so as to be moved in the lower portion of the light emitting end.
  3. 光学レンズ部における光出射端と露光対象となる基板との間に液体を満たしておいた状態で露光を行う露光装置において、 In the exposure apparatus which performs exposure in a state that has been filled with liquid between a substrate serving as a light emitting end subject to exposure in the optical lens unit,
    前記光学レンズ部の光出射端の汚れを除去するブラシが前記光出射端の下方部分に進退可能に設けられている ことを特徴とする露光装置。 Exposure apparatus characterized by brush to remove dirt of the light emitting end of the optical lens portion is disposed so as to be moved in the lower portion of the light emitting end.
  4. 光学レンズ部における光出射端と露光対象となる基板との間に液体を満たしておいた状態で露光を行う露光装置において、 In the exposure apparatus which performs exposure in a state that has been filled with liquid between a substrate serving as a light emitting end subject to exposure in the optical lens unit,
    前記光学レンズ部の光出射端に交換可能なカバーが設けられている ことを特徴とする露光装置。 Exposure apparatus characterized by exchangeable cover is provided on the light emitting end of the optical lens portion.
  5. 光学レンズ部における光出射端と露光対象となる基板との間に液体を満たしておいた状態で露光を行う工程を備える半導体装置の製造方法において、 The method of manufacturing a semiconductor device comprising a step of performing exposure in a state that has been filled with liquid between the substrate as a light emitting end of the optical lens unit and the exposure target,
    前記露光を行った後、前記光学レンズ部の光出射端に向けて洗浄液を噴出して前記光学レンズ部における光出射端を洗浄する処理を行う ことを特徴とする半導体装置の製造方法。 After the exposure, the method of manufacturing a semiconductor device, which comprises carrying out the process of the by ejecting the cleaning liquid toward the light emitting end of the optical lens unit for cleaning the light emitting end of the optical lens portion.
  6. 前記洗浄液を噴出して前記光学レンズ部における光出射端を洗浄した後、所定のガスを吹き付けて前記洗浄液を吹き飛ばす ことを特徴とする請求項5記載の半導体装置の製造方法。 After by ejecting the cleaning liquid to wash the light emitting end of the optical lens unit, a method of manufacturing a semiconductor device according to claim 5, wherein the blowing the cleaning liquid by blowing a predetermined gas.
  7. 前記洗浄液を噴出して前記光学レンズ部における光出射端を洗浄した後、前記光出射端の表面をブラシによって洗浄する ことを特徴とする請求項5記載の半導体装置の製造方法。 After by ejecting the cleaning liquid to wash the light emitting end of the optical lens unit, a method of manufacturing a semiconductor device according to claim 5, wherein the cleaning the surface of the light emitting end by the brush.
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