JP2005072304A - Via plug and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a via plug having no long process and long construction period and lowering a manufacture cost, by having no irregular height of a via-plug and simplifying a formation method of the via plug in the manufacturing method of the via plug used as input and output terminals with a semiconductor device in a wiring board for the semiconductor device, and to provide the via plug for improving connection with a soldering ball during packaging. <P>SOLUTION: The method for manufacturing the via plug comprises a process for manufacturing a via hole in an insulation base material consisting of an insulating material, a process for manufacturing a projection-shaped via structure by using a photo-etching method of a photo-process on a semiconductor base material consisting of a conductive material, and a process for fitting and sticking the conductor base material consisting of the conductive material forming the projection-shaped via structure and the insulation base material consisting of the insulating material molding the via-hole with the via-structure and the via hole. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a via plug formed on a wiring board for a semiconductor device and a manufacturing method thereof.

  As a conventional via plug manufacturing method, there are a method of manufacturing a plug of a conductive layer by copper plating or nickel plating, and a method of manufacturing a plug by embedding a conductive paste in a recess formed in advance.

  3A to 3E are process diagrams for explaining a conventional method for forming a via plug by plating, and FIGS. 3A to 3E are side sectional views. A method for manufacturing via plugs by plating shown in FIG. 3 (hereinafter referred to as a plating method) will be described in order.

  In FIG. 3A, via holes are formed in an insulating base material of a film made of an insulating material such as polyimide. The insulating base material (1) has a via hole in which the via shape (8) is formed in the insulating base material (9) having the adhesive. In FIG.3 (b), the lower-layer conductor layer (4) which consists of copper foil is bonded together and formed on the one side of the said insulating base material (1).

  In FIG. 3 (c), a resist layer (13) is applied to the lower conductor layer (4), electrolytic plating is performed on the lower conductor layer (4) from the surface of the insulating base (1), and the via hole is formed. A plating material is deposited in the concave part of (8) to form a via (3). In FIG. 3 (d), after forming the resist layer (13) using the photo process method, the pattern of the photo mask is exposed and transferred, and the development process, the etching process, and the film removal process are performed. The wiring layer (4a) of (4) is formed.

  Finally, after forming a plating surface layer made of nickel, silver, gold, or the like on the surface of the via (3), a substrate protection layer such as a solder resist is applied to protect the substrate, thereby completing the substrate.

  Another method of manufacturing a plug for embedding a conductive paste (hereinafter referred to as a conductive paste method) is a method in which a liquid conductive paste is applied to the inside of a via and then completely embedded in the hole. To manufacture. The coating method is generally a silk screen printing method.

  In the plating method, there is a problem of deterioration of interfacial strength due to deterioration over time, and further local peeling or interfacial peeling at the bonding surface between the copper conductor layer and the plating conductor layer, and at the time of mounting, the bonding with the solder ball to be used There is a risk of variation in sex. Further, in the plating method, the height of the via plug varies due to the variation in current density, and variations in quality may occur (see Patent Document 1). Furthermore, the process becomes longer, the construction period becomes longer, and the manufacturing cost also increases. In the conductive paste method, there is a problem that the quality becomes unstable when a long-term reliability test is performed.

The known literature is shown below.
Japanese Patent Laid-Open No. 2002-9198

An object of the present invention is to provide a via plug manufacturing method in which the height of the via plug does not vary or the method for forming the via plug is simplified, so that the process is not lengthened, the construction period is not prolonged, and the manufacturing cost is reduced. Is to provide. Another object of the present invention is to provide a via plug that improves the bondability with a solder ball during mounting.

  According to a first aspect of the present invention, in a via plug formed on a wiring board for a semiconductor device and used as an input / output terminal for the semiconductor device, a lower conductor layer, an insulating layer, and a surface conductor layer are sequentially formed. A via plug having a structure in which layers are stacked and electrically connected via vias is formed into a convex shape from the same material as the underlying conductor layer, and an insulating layer base material in which via holes are formed A via plug in which the convex via and the via hole are fitted.

The invention according to claim 2 of the present invention is a method of manufacturing a via plug formed on a wiring board for a semiconductor device and used as an input / output terminal for the semiconductor device, and comprises at least the following manufacturing steps. 1 is a manufacturing method of a via plug according to 1;
(A) A step of providing a via hole in an insulating base material made of an adhesive and an insulating material.
(B) The process of manufacturing a convex-shaped via | veer using the photo-etching method of a photo process for the conductor base material which consists of an electroconductive material.
(C) A conductor base material made of a conductive material formed with a convex-shaped via, and an insulating base material made of an adhesive and an insulating material formed with a via hole are fitted into the via and the via hole. And bonding.

  The invention according to claim 3 of the present invention is the method of manufacturing a via plug according to claim 2, wherein the insulating base material made of the adhesive and the insulating material is a base material made of a resin film.

  The invention according to claim 4 of the present invention is the via plug manufacturing method according to claim 2 or 3, wherein the conductive base material made of the conductive material is a base material made of copper foil.

  By using the method for manufacturing a via plug according to the present invention, a via plug having no heightwise separation and no interface peeling can be provided. Furthermore, in the manufacturing method of the present invention, the manufacturing process is simplified, so that there is an effect that it is possible to deal with a via having a high aspect ratio and a diameter of the via. Further, the use of the via plug of the present invention at the time of mounting also has an effect of improving the bondability with the solder ball. Furthermore, there is an effect that it is possible to solve problems such as a long process, a long construction period, and a high manufacturing cost.

  Embodiments of the present invention will be described below. FIG. 1 is a process diagram for explaining a method of manufacturing a via plug according to the present invention, wherein (a) to (i) are side sectional views.

  In FIG. 1A, via holes are formed in an insulating base material of a film made of an insulating material such as polyimide. The insulating base material (1) having a via hole in which the via shape (8) is formed in the insulating base material (9) having an adhesive is obtained. In FIG.1 (b), the resist layer (12) which forms a via is formed in the single side | surface of a conductor base material (11) using the conductor base material (11) which consists of copper etc. FIG. As a resist forming method, a spin coating method, a roll coating method or the like is generally employed.

  In FIG. 1C, a via mask pattern is exposed and transferred to the resist layer 12 using a photomask. Thereafter, the development process is terminated, and after the resist pattern is formed on the conductor base material (11), the etching prevention layer (22) is formed on the other side surface of the conductor base material (11). In FIG.1 (d), the one side etching is performed from the exposed surface of a conductor base material (11) by making the said resist pattern into a resist. The etching depth is standard up to about half the thickness of the conductor base material (11). It is important to optimize the depth depending on the case.

  In FIG. 1 (e), after stripping the resist, a convex via made of the via (3) and the lower conductor layer (4) of the conductor base (11) having a thickness of about half other than that is formed. The conductor base material (10) which has is completed. In FIG. 1 (f), the insulating base material (1) having the via hole of (a) and the conductive base material (10) having the convex-shaped via of (e) are bonded together. At the time of pasting, it is important to align by the method of fitting the convex via and the via hole.

  In FIG. 1G, a photomask pattern is exposed and transferred after forming a resist (13) using a photo process method. In FIG. 1H, development processing and etching processing are performed. In FIG. 1 (i), a film removal process is performed to form a wiring layer (4a) of the lower conductor layer (4).

  Finally, after forming a plating surface layer made of nickel, silver, gold, or the like on the surface of the via (3), a substrate protective layer such as a solder resist is applied to protect the substrate, and the manufacturing method of the present invention is used. The completed via plug was completed.

Next, the present invention will be described with reference to specific examples. 2A to 2C are process diagrams for explaining a method of manufacturing a via plug according to the first embodiment of the present invention, and FIGS. 2A to 2C are side sectional views.
<Example 1>
In FIG. 2 (a), a via hole (8) was formed by punching a 50 μm thick polyimide film with a 12 μm thick adhesive. The via hole shape was formed by a press punching method using a punching die of 200 μmφ. An insulating substrate (1) having via holes was completed.

  In FIG.2 (b), 50 micrometer-thick copper foil was made into the conductor base material (11). A convex via (3) and a lower conductor layer (4) are formed on the conductor base material using a photo-etching process of a photo process, and a conductive base material (10) having a convex via is completed. did.

  In FIG. 2C, a conductor base material (10) having a convex-shaped via and an insulating base material (1) having a via hole are bonded at a bonding temperature of 115 ° C. The use hole (8) was fitted and bonded together. The via hole (8) was formed with an inner diameter of 200 μmφ, and the via (3) was formed with an outer diameter of 180 μm due to the influence of side etching.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a process diagram for explaining a method of manufacturing a via plug according to the present invention, wherein (a) to (i) are side sectional views. BRIEF DESCRIPTION OF THE DRAWINGS It is process drawing explaining the manufacturing method of the via plug of Example 1 of this invention, (a)-(c) is a sectional side view. It is process drawing explaining the manufacturing method of the via plug by the conventional plating, (a)-(e) is a sectional side view.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Insulating base material 3 which has a hole for vias ... Via 4 ... Lower layer conductor layer 4a ... Wiring layer 5 ... Conductor 8 ... Via hole 9 ... Insulating base material 10 ... Conductive base material 11 which has a convex-shaped via ... Conductor Base material 12 ... resist layer 13 ... resist layer 22 ... etching prevention layer 23 ... etching prevention layer

Claims (4)

  In a via plug formed on a wiring board for a semiconductor device and used as an input / output terminal for the semiconductor device, a lower conductor layer, an insulating layer, and a surface conductor layer are laminated in order and are electrically connected through a via. A via plug having a structure formed by using a conductive layer of a via formed from the same material as the lower conductive layer into a convex shape and an insulating layer base material formed with a via hole; A via plug having a via hole fitted therein. 2. The method of manufacturing a via plug according to claim 1, wherein the method of manufacturing a via plug formed on a wiring board for a semiconductor device and used as an input / output terminal for the semiconductor device comprises at least the following manufacturing steps.
(A) A step of providing a via hole in an insulating base material made of an adhesive and an insulating material.
(B) The process of manufacturing a convex-shaped via | veer using the photo-etching method of a photo process for the conductor base material which consists of an electroconductive material.
(C) A conductor base material made of a conductive material formed with a convex-shaped via, and an insulating base material made of an adhesive and an insulating material formed with a via hole are fitted into the via and the via hole. And bonding.   3. The method of manufacturing a via plug according to claim 2, wherein the insulating base material made of the adhesive and the insulating material is a base material made of a resin film.   4. The method of manufacturing a via plug according to claim 2, wherein the conductive base material made of the conductive material is a base material made of copper foil.

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