KR20070007406A - Printed circuit board with embedded coaxial cable and manufacturing method thereof - Google Patents

Abstract

A printed circuit board with an embedded coaxial cable and a method for manufacturing the same are provided to easily embed the coaxial cable in the board by performing a metal bump build-up process. A first conductive film is formed on a first insulation(90), and a first metal bump is formed on the first conductive film. A second insulation film(120) is formed on a substrate with the first metal bump. Then, a second conductive film is formed on the second insulation film, and is subjected to a pattern process to form a second conductive circuit. A second metal bump is selectively formed on the second conductive film circuit, and a third insulation film(160) is formed on the substrate with the second metal bump. A third conductive film is formed on the third insulation film, and is processed by a pattern process to form a third conductive film circuit(180).

Description

Printed circuit board with embedded coaxial line and manufacturing method {PRINTED CIRCUIT BOARD WITH EMBEDDED COAXIAL CABLE AND MANUFACTURING METHOD THEREOF}

Figures 1a and 1b is a view showing a coaxial line manufacturing method according to the prior art.

2A-2I illustrate a manufacturing method for embedding a coaxial line in a printed circuit board in accordance with the present invention.

<Explanation of symbols for main parts of the drawings>

10: central axis conductive layer

20, 30: outer conductive layer

30: via

100: copper foil

110: metal bump

160: resin

170: copper plating

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of embedding a coaxial cable in a printed circuit board, and more particularly, to a method of manufacturing a coaxial line embedded printed circuit board using a bump build up method.

As the frequency of the signal applied to the printed circuit board increases, the need for embedding a transmission line in the form of a coaxial cable in a high speed printed circuit board is on the rise. To this end, conventionally, a technique of manufacturing a coaxial line by forming both side circuits of a coaxial line using a laser or a photo via method on a number having a laminated structure, forming a slot-shaped valley, and copper plating is used. have.

Figures 1a and 1b is a view showing a coaxial line manufacturing method according to the prior art. As shown in FIG. 1A, the circuit 10 is patterned and pressed on a resin coated copper (RCC) resin to form a central axis conductive layer 10 and an outer conductive layer 20 of a coaxial line. .

Subsequently, vias 30 are formed between the upper and lower copper foils through pattern formation (not shown), and the outer conductive layers 20 and 30 are completed through copper plating. At this time, laser processing or a photo via method may be employed to form the vias 30.

However, in the prior art illustrated in FIGS. 1A and 1B, a residue may remain when the via 30 is formed, and a defect may be caused as the size of the via is finely reduced.

Accordingly, the present invention is to provide a new method for manufacturing a highly reliable coaxial line embedded printed circuit board which does not use a via method for embedding a coaxial line in a printed circuit board.

In order to achieve the above object, the present invention discloses a technique for embedding a coaxial line in a printed circuit board by applying a metal bump buildup process.

Hereinafter, with reference to the accompanying drawings Figures 2a to 2i will be described in detail the built-in coaxial line manufacturing method according to the present invention.

2A to 2I are views showing a manufacturing method for embedding a coaxial line in a printed circuit board according to the present invention. Referring to FIG. 2A, a circuit is first formed on a copper foil (RCC) coated with resin. Herein, the resin is a material 90 in which epoxy is added to glass fiber, and a pattern is formed on the copper foil 100 coated thereon.

In addition, referring to FIG. 2B, a metal bump 110 is formed on the copper foil 100 on which the circuit is formed. At this time, in the method of forming the metal bumps 110, the metal bumps 110 may be formed by etching, printing, and plating on the substrate of FIG. 2A.

Subsequently, referring to FIG. 2C, the resin 120 is stacked to fill the metal bumps 110 formed in FIG. 2B, and the copper foil 130 is formed on the stacked resin 120 through electroless plating and electrolytic copper plating. (See FIG. 2D).

Then, the circuit 140 is patterned as shown in FIG. 2E and the metal bumps 150 are formed again as shown in FIG. 2F. Subsequently, referring to FIG. 2G, the resin 160 is further compressed on the formed metal bumps 150 to form electroless and electrolytic copper plating 170 (see FIG. 2H). Finally, referring to FIG. 2I, a coaxial line is completed by forming a circuit on the copper foil 170 through a pattern process.

The foregoing has outlined rather broadly the features and technical advantages of the present invention to better understand the claims of the invention which will be described later. Additional features and advantages that make up the claims of the present invention will be described below. It should be appreciated by those skilled in the art that the conception and specific embodiments of the invention disclosed can be readily used as a basis for designing or modifying other structures for carrying out similar purposes to the invention.

In addition, the inventive concepts and embodiments disclosed herein may be used by those skilled in the art as a basis for modifying or designing other structures for carrying out the same purposes of the present invention. In addition, such modifications or altered equivalent structures by those skilled in the art may be variously changed, substituted, and changed without departing from the spirit or scope of the invention described in the claims.

As described above, the present invention has an advantage of easily embedding a coaxial line in a printed circuit board by applying a metal bump build-up process, which has a relatively high yield and ensures reliability in manufacturing a printed circuit board.

Claims (2)

In the method of forming a coaxial line on a printed circuit board, (a) forming a first conductive film circuit 100 on the first insulating layer 90; (b) forming a first metal bump (110) on the first conductive film circuit (100); (c) forming a second insulating film 120 on the substrate on which the first metal bumps are formed; (d) forming a second conductive film on the second insulating film and forming a second conductive film circuit 140 through a pattern process; (e) selectively forming a second metal bump (150) on the second conductive film circuit (140); (f) forming a third insulating film 160 on the substrate on which the second metal bumps 150 are formed; And (g) forming a third conductive film on the third insulating film 160 and forming a third conductive film circuit 180 through a pattern process Printed circuit board embedded coaxial line manufacturing method comprising a. Printed circuit board containing the coaxial line manufactured according to claim 1.

Images