JP2005056885A - Method of manufacturing semiconductor light emitting device - Google Patents

Method of manufacturing semiconductor light emitting device Download PDF

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JP2005056885A
JP2005056885A JP2003205662A JP2003205662A JP2005056885A JP 2005056885 A JP2005056885 A JP 2005056885A JP 2003205662 A JP2003205662 A JP 2003205662A JP 2003205662 A JP2003205662 A JP 2003205662A JP 2005056885 A JP2005056885 A JP 2005056885A
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light emitting
semiconductor light
color tone
sealing resin
emitting element
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JP4799809B2 (en
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Tsutomu Odaki
勉 小田喜
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Fine Rubber Kenkyusho KK
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

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Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor light emitting device which produces little color irregularities and is kept high in color tone stability with time, which is capable of manufacturing it with high reproducibility of color tone at a low cost. <P>SOLUTION: A wiring conductor, a semiconductor element, and bonding wires are sealed up with first resin, an electric power is applied to the semiconductor element sealed up with the first sealing resin to enable the semiconductor element to emit light rays, the wavelength of the light rays is measured, then a color tone changing layer is formed of a polymer molded material where a proper amount of color tone changing material is dispersed so as to give a desired color tone to the emitted light rays whose wavelength is measured, the color tone changing layer is formed on the surface of the first sealing resin, and then the color tone changing layer is sealed up with second sealing resin for the formation of the semiconductor light emitting device. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【０００１】
【発明の属する技術分野】
本発明は、半導体発光素子から発光する光の波長を変換することによって所望の色調の光を発光させる半導体発光装置の製造方法に関するものである。
【０００２】
【従来の技術】
発光ダイオード（ＬＥＤ）は半導体素子であるため、信頼性が高く、また寿命も長く、光源として用いた場合にはその交換作業も軽減されることから、携帯通信機、パーソナルコンピュータ周辺機器、ＯＡ機器、家庭用電気機器、オーディオ機器、各種スイッチ等の表示部、バックライト用光源、表示板等の各種表示装置の構成部品として広く使用されている。
【０００３】
従来の発光ダイオードは、図３（Ａ）に示されるようないわゆる砲弾型の発光ダイオードの場合、通常、配線導体（カソードリード）１と配線導体（アノードリード）２とからなる１対の配線導体１，２と、カソードリード１頂部に形成された凹部内に電気的に接続された例えば窒化ガリウム系化合物半導体等の半導体発光素子３と、半導体発光素子３に形成された電極（図示せず）とアノードリード２の頂部とを電気的に接続するボンディングワイヤ４とが、カソードリード１及びアノードリード２の一端側で光透過性の封止樹脂５で封止された構造となっている。また、図３（Ｂ）に示されるようないわゆるチップ型の発光ダイオードの場合は、上面が開口した箱形の発光体収容部材６の内底からカソードリード１及びアノードリード２を発光体収容部材６の外部へ延出し、この発光体収容部材６の内部に半導体発光素子３やボンディングワイヤ４，４を収容し、これらを接続して発光体収容部材６内を封止樹脂５で封止した構造となっている。
【０００４】
現在、このようなＬＥＤとしては、例えば、青色を発光する半導体発光素子上にＹＡＧ系蛍光体を塗布し、又はＹＡＧ系蛍光体を封止樹脂中に分散させて、この蛍光体により青色光を白色光に変換した白色ＬＥＤが市販されている。また、高輝度発光が可能な紫外発光素子等の長波長紫外線又は短波長可視光線（３５０〜４２０ｎｍ）を発光する素子も開発され、ＲＢＧ蛍光体を組み合わせることによって、白色や中間色を所望の色調で得ることも検討されている。この方法では、蛍光体として、発光色が青色のＢａＭｇＡｌ１６Ｏ２７：Ｅｕ、（Ｓｒ，Ｃａ，Ｂａ）５（ＰＯ４）３Ｃｌ：Ｅｕ、発光色が緑色のＢａＭｇ２Ａｌ１６Ｏ２７：Ｅｕ，Ｍｎ、Ｚｎ２ＧｅＯ４：Ｍｎ、発光色が赤色のＹ２Ｏ２Ｓ：Ｅｕ、３．５ＭｇＯ・０．５ＭｇＦ２・ＧｅＯ２：Ｍｎなどを任意の割合で混合することによって長波長紫外線又は短波長可視光線で様々な発光色を高輝度で得ることが期待されている。
【０００５】
また、最近では、上記各種表示装置の需要者の色彩に対する要求が高まり、各種表示装置において微妙な色合いをより高精細に再現できる機能が要求されている。更に、１個の発光ダイオードによって白色乃至各種の中間色を再現できる機能も強く求められている。
【０００６】
このような発光ダイオードの半導体発光素子としては、ＧａＮ系やＩｎＧａＮ系などの発光素子が、高輝度発光が期待できることから注目されているが、このような発光素子、特に、ＩｎＧａＮ系の発光素子ではＩｎ含有量が変化すると発光波長が大きくシフトしてしまうという性質があり、素子毎の発光波長のばらつきが大きいのが実情である。そのため、このような発光素子を用いる場合に、例えば、発光素子が与える平均的な発光波長に合わせて蛍光体の使用量や混合比を設定してこれを一様に用いると、発光波長が設定値からずれている発光素子が与える色調は目的とする色調とは異なるものとなってしまう。このような問題が、青色発光素子や紫外発光素子を用いて白色乃至中間色を発光させるＬＥＤが高価となる原因となっていた。
【０００７】
また、蛍光体を用いた半導体発光装置を製造する場合、蛍光体を塗布する方法では、塗布した蛍光層の厚さが一定しないため塗布量がばらついてしまう。一方、蛍光体を封止樹脂中に分散させる方法でも、成形中に蛍光体が沈んでしまって偏在してしまい、特にＲＢＧ蛍光体を封止樹脂に分散させて使用する場合のように、複数の色調変換材料を用いる場合には、それらの比重がそれぞれ異なるために、分散が均一にならず、いずれの場合でも色むらが発生することが問題となっていた。
【０００８】
更に、このような蛍光体は、空気中の水分により加水分解されやすいものが多く、蛍光体の発光特性が変化してしまうという問題もある。例えば、封止樹脂中に分散させた蛍光体も大気との界面付近に位置するものは経時的に発光特性が変化してしまう。また、紫外発光素子等の短波長の光を発光する素子を用いる場合、蛍光体を分散させた樹脂が素子からの発光光により劣化し、これにより色調の変化を引き起こす問題もある。
【０００９】
なお、この発明に関連する先行技術文献情報としては以下のものがある。
【００１０】
【特許文献１】
特開平１１−８７７８４号公報
【００１１】
【発明が解決しようとする課題】
本発明は、上記問題点を解決するためになされたものであり、色むらが少なく、色調の経時安定性が高い半導体発光装置を、安価に、色調の再現性よく製造する方法を提供することを目的とする。
【００１２】
【課題を解決するための手段及び発明の実施の形態】
本発明者は、上記問題を解決するため鋭意検討を重ねた結果、一対の配線導体と、上記配線導体の一方の配線導体に電気的に接続された半導体発光素子と、この半導体発光素子と上記配線導体の他方の配線導体とを電気的に接続するボンディングワイヤと、上記半導体発光素子の発光光路上に設けられた色調変換層とを、上記配線導体の上記半導体発光素子及びボンディングワイヤが接続された一端側で封止樹脂により封止してなる半導体発光装置を上記配線導体、半導体発光素子及びボンディングワイヤを第１の封止樹脂で封止し、次いで上記第１の封止樹脂で封止された半導体発光素子に通電することにより半導体発光素子を発光させてその発光波長を測定し、次いでこの測定された発光波長の光で所望の色調を与えるように色調変換材料を高分子材料に適量分散させた高分子成形体からなる色調変換層を上記第１の封止樹脂上に積層し、次いでこの色調変換層を第２の封止樹脂で封止する方法により製造すれば、色むらが少なく、色調の経時安定性が高い半導体発光装置を、安価に、色調の再現性よく製造することができることを見出した。
【００１３】
また、本発明者は、上面が開口した発光体収容部を有する箱形の発光体収容部材の内底から一対の配線導体を上記発光体収容部の外側に延出すると共に、上記発光体収容部内に、半導体発光素子と、この半導体発光素子と上記配線導体の各々とを電気的に接続するボンディングワイヤと、上記半導体発光素子の発光光路上に設けられた色調変換層とを封止樹脂により封止してなる半導体発光装置を、上記配線導体、半導体発光素子及びボンディングワイヤを第１の封止樹脂で封止し、次いで上記第１の封止樹脂で封止された半導体発光素子に通電することにより半導体発光素子を発光させてその発光波長を測定し、次いでこの測定された発光波長の光で所望の色調を与えるように色調変換材料を高分子材料に適量分散させた高分子成形体からなる色調変換層を上記第１の封止樹脂上に積層し、次いでこの色調変換層を第２の封止樹脂で封止する方法により製造すれば、色むらが少なく、色調の経時安定性が高い半導体発光装置を、安価に、色調の再現性よく製造することができることを見出し、本発明をなすに至った。
【００１４】
即ち、本発明は、
［１］一対の配線導体と、上記配線導体の一方の配線導体に電気的に接続された半導体発光素子と、この半導体発光素子と上記配線導体の他方の配線導体とを電気的に接続するボンディングワイヤと、上記半導体発光素子の発光光路上に設けられた色調変換層とを、上記配線導体の上記半導体発光素子及びボンディングワイヤが接続された一端側で封止樹脂により封止してなる半導体発光装置の製造方法であって、
上記配線導体、半導体発光素子及びボンディングワイヤを第１の封止樹脂で封止し、次いで上記第１の封止樹脂で封止された半導体発光素子に通電することにより半導体発光素子を発光させてその発光波長を測定し、次いでこの測定された発光波長の光で所望の色調を与えるように色調変換材料を高分子材料に適量分散させた高分子成形体からなる色調変換層を上記第１の封止樹脂上に積層し、次いでこの色調変換層を第２の封止樹脂で封止することを特徴とする半導体発光装置の製造方法、
［２］上面が開口した発光体収容部を有する箱形の発光体収容部材の内底から一対の配線導体を上記発光体収容部の外側に延出すると共に、上記発光体収容部内に、半導体発光素子と、この半導体発光素子と上記配線導体の各々とを電気的に接続するボンディングワイヤと、上記半導体発光素子の発光光路上に設けられた色調変換層とを封止樹脂により封止してなる半導体発光装置の製造方法であって、
上記配線導体、半導体発光素子及びボンディングワイヤを第１の封止樹脂で封止し、次いで上記第１の封止樹脂で封止された半導体発光素子に通電することにより半導体発光素子を発光させてその発光波長を測定し、次いでこの測定された発光波長の光で所望の色調を与えるように色調変換材料を高分子材料に適量分散させた高分子成形体からなる色調変換層を上記第１の封止樹脂上に積層し、次いでこの色調変換層を第２の封止樹脂で封止することを特徴とする半導体発光装置の製造方法、
［３］上記第１の封止樹脂が上記第２の封止樹脂より低硬度であることを特徴とする［１］又は［２］記載の半導体発光装置の製造方法、
［４］上記半導体発光素子が青色光を発光するものであり、上記色調変換材料が青色光を白色光に変換する蛍光体を含むことを特徴とする［１］乃至［３］のいずれかに記載の半導体発光装置の製造方法、
［５］上記半導体発光素子が、長波長紫外光又は短波長可視光を発光するものであり、上記色調変換材料が、赤色発光蛍光体、緑色発光蛍光体及び青色発光蛍光体から選ばれる１種又は２種以上を含むことを特徴とする［１］乃至［３］のいずれかに記載の半導体発光装置の製造方法、及び
［６］上記高分子材料がシリコーン樹脂又はシリコーンゴムであることを特徴とする［１］乃至［５］のいずれかに記載の半導体発光装置の製造方法を提供する。
【００１５】
以下、本発明について更に詳述する。
まず、本発明の半導体発光装置の製造方法の第１の態様は、一対の配線導体と、上記配線導体の一方の配線導体に電気的に接続された半導体発光素子と、この半導体発光素子と上記配線導体の他方の配線導体とを電気的に接続するボンディングワイヤと、上記半導体発光素子の発光光路上に設けられた色調変換層とを、上記配線導体の上記半導体発光素子及びボンディングワイヤが接続された一端側で封止樹脂により封止してなる半導体発光装置の製造方法であり、上記配線導体、半導体発光素子及びボンディングワイヤを第１の封止樹脂で封止し、次いで上記第１の封止樹脂で封止された半導体発光素子に通電することにより半導体発光素子を発光させてその発光波長を測定し、次いでこの測定された発光波長の光で所望の色調を与えるように色調変換材料を高分子材料に適量分散させた高分子成形体からなる色調変換層を上記第１の封止樹脂上に積層し、次いでこの色調変換層を第２の封止樹脂で封止するものである。
【００１６】
この第１の態様の方法は、例えば、図１（Ａ）に示されるような、配線導体（カソードリード）１と配線導体（アノードリード）２とからなる１対の配線導体１，２と、カソードリード１頂部に形成された凹部内にカソードリード１と電気的に接続された半導体発光素子３と、半導体発光素子３に形成された電極（図示せず）とカソードリード２の頂部とを電気的に接続するボンディングワイヤ４と、半導体発光素子３の発光光路上に設けられた色調変換層７とが、カソードリード１及びアノードリード２の一端側で封止樹脂５で封止された構造のいわゆる砲弾型の発光ダイオードの製造方法として好適に用いることができる。
【００１７】
また、本発明の半導体発光装置の製造方法の第２の態様は、上面が開口した発光体収容部を有する箱形の発光体収容部材の内底から一対の配線導体を上記発光体収容部の外側に延出すると共に、上記発光体収容部内に、半導体発光素子と、この半導体発光素子と上記配線導体の各々とを電気的に接続するボンディングワイヤと、上記半導体発光素子の発光光路上に設けられた色調変換層とを封止樹脂により封止してなる半導体発光装置の製造方法であり、上記配線導体、半導体発光素子及びボンディングワイヤを第１の封止樹脂で封止し、次いで上記第１の封止樹脂で封止された半導体発光素子に通電することにより半導体発光素子を発光させてその発光波長を測定し、次いでこの測定された発光波長の光で所望の色調を与えるように色調変換材料を高分子材料に適量分散させた高分子成形体からなる色調変換層を上記第１の封止樹脂上に積層し、次いでこの色調変換層を第２の封止樹脂で封止するものである。
【００１８】
この第２の態様の方法は、例えば、図２（Ｂ）に示されるような、上面が開口した発光体収容部を有する箱形の発光体収容部材６の内底から配線導体（カソードリード）１と配線導体（アノードリード）２とからなる１対の配線導体１，２を上記発光体収容部の外側に延出すると共に、発光体収容部内に、半導体発光素子３と、この半導体発光素子３と配線導体１，２の各々とを電気的に接続する２本のボンディングワイヤ４，４と、半導体発光素子の発光光路上に設けられた色調変換層７とが封止樹脂５により封止された構造のいわゆるチップ型の発光ダイオードの製造方法として好適に用いることができる。
【００１９】
本発明においては、上記第１の態様及び第２の態様いずれの場合においても、まず、半導体発光素子並びにこれに通電するための導電体である配線導体及びボンディングワイヤを第１の封止樹脂で封止する。配線導体、半導体素子及びボンディングワイヤを封止する第１の封止樹脂としてはエポキシ樹脂、シリコーン樹脂等の従来公知の透光性樹脂を用いることができる。
【００２０】
第１の態様の場合、配線導体１，２、半導体発光素子３及びボンディングワイヤ４を電気的に接続し、これらを封止樹脂により封止するための成形型内に配置し、この型内に未硬化の封止樹脂を注入して硬化成形させることにより、例えば図２（Ａ−１）に示されるような、配線導体１，２、半導体発光素子３及びボンディングワイヤ４が第１の封止樹脂５ａにより封止された半製品を作製する。なお、このような半製品として、一旦砲弾型に成形された発光ダイオードの頭頂部を切り取って用いることも可能である。
【００２１】
一方、第２の態様の場合は、配線導体１，２、半導体発光素子３及びボンディングワイヤ４，４を発光体収容部材６の発光体収容部内で電気的に接続し、この発光体収容部内に未硬化の封止樹脂を注入して硬化させることにより、例えば図２（Ｂ−１）に示されるような、配線導体１，２、半導体発光素子３及びボンディングワイヤ４が第１の封止樹脂５ａにより発光体収容部材６内に封止された半製品を作製する。なお、発光体収容部材６としては、一対の配線導体１，２を金型内に保持しつつ樹脂を注入するインサート成形によって成形したものを用い得る。また、この樹脂としては一般に変性ポリイミドを用いることができる。
【００２２】
いずれの場合においても、半導体発光素子３は、配線導体１，２と電気的に接続された状態で固定された半製品となり、これにより、次の工程で実施する半導体発光素子に通電してその発光波長を測定する操作が容易となる。
【００２３】
次に、図２（Ａ−２），（Ｂ−２）に示されるように、半導体発光素子３等を第１の封止樹脂５ａで封止した半製品の半導体発光素子に通電することにより半導体発光素子を発光させてその発光波長を測定する。発光波長の測定は、半導体発光装置の発光波長を測定する従来公知の装置により測定可能である。この場合、半導体発光素子は配線導体及びボンディングワイヤと共に封止樹脂に封止されて一定の形状をなす半製品となっているため、従来、半導体発光装置製品の検査に用いられている測定装置をそのまま適用することが可能である。なお、図２（Ａ−２），（Ｂ−２）中、８は電源、９は光度計である。
【００２４】
次に、図２（Ａ−３），（Ｂ−３）に示されるように、上記測定により測定された発光波長の光で所望の色調を与えるように色調変換材料を高分子材料に適量分散させた高分子成形体からなる色調変換層７を第１の封止樹脂５ａ上に積層する。本発明において、色調変換層は、色調変換材料を高分子材料に分散させた高分子成形体であり、色調変換層中の色調変換材料の種類及び配合量は、色調変換層を積層する上記半製品の半導体発光素子の発光波長の測定結果に基づき変換後の色調が所望の色調となるように決定される。
【００２５】
色調変換材料としては、無機蛍光体、顔料、有機蛍光染料、擬似顔料などが挙げられ、無機蛍光体としては、Ｙ３−ｘＧａｘＡｌ５Ｏ１２：Ｃｅ（０≦ｘ≦３）、ＢａＭｇＡｌ１６Ｏ２７：Ｅｕ、（Ｓｒ，Ｃａ，Ｂａ）５（ＰＯ４）３Ｃｌ：Ｅｕ、ＢａＭｇ２Ａｌ１６Ｏ２７：Ｅｕ，Ｍｎ、Ｚｎ２ＧｅＯ４：Ｍｎ、Ｙ２Ｏ２Ｓ：Ｅｕ、３．５ＭｇＯ・０．５ＭｇＦ２・ＧｅＯ２：Ｍｎ、Ｌａ２Ｏ２Ｓ：Ｅｕ、ＣａＳ：Ｅｕ、ＬｉＥｕＷ２Ｏ８など、顔料としてはフタロシアニン系、アゾ系、イソインドリノン系、キナクリドン系、レーキ顔料などの有機顔料やコバルトブルー、群青、酸化鉄などの無機顔料、有機蛍光染料としてはペリレン系、ナフタルイミド系、クマリン系、シアニン系、フラビン系、ローダミン系など、擬似顔料としてはプラスチックの粉末を蛍光性のある染料で着色した蛍光顔料などを好適に用いることができる。
【００２６】
一方、高分子材料としては、例えば、シリコーン樹脂、エポキシ樹脂、ポリカーボネート等の透光性樹脂、シリコーンゴム等の透明性ゴムを用いることができ、耐熱性及び透過率の点からシリコーン樹脂又はシリコーンゴムが好ましい。特に、３５０〜４５０ｎｍの近紫外から短波長可視光を発光する半導体発光素子を用いる場合、シリコーン樹脂やシリコーンゴムはこれらの波長を吸収しないため、高輝度、長寿命の発光装置となり好適である。また、色調変換層に接着成分を添加することもでき、これにより封止樹脂上への強固な固定が可能となる。
【００２７】
本発明においては、色調変換層として、上述したような色調変換材料を高分子材料に混合分散させて成形することにより得た高分子成形体を用いるが、このような高分子成形体は、未硬化の樹脂に色調変換材料を添加混合し、圧縮成形等の従来公知の方法で成形硬化させることにより得ることができる。このように、本発明においては、色調変換機能を有する色調変換材料を高分子成形体からなる色調変換層として封止樹脂とは別に作製して半導体発光素子からの発光光の光路上に設けるため、色調変換材料を封止樹脂中に分散させる場合と異なり、色調変換層の硬化において色調変換材料の偏在を防止するように分散、硬化条件を設定することが可能となり、色調変換材料の偏在による色むらを低減することができると共に、層厚を所定厚さで一定とすることが可能であるため、色調変換材料を塗布する方法のような層厚のばらつきによる色むらの発生も低減することができる。
【００２８】
また、特に複数の色調変換材料を用いる場合には、色調変換材料を添加した未硬化の樹脂の粘度を増加させることにより、比重の重い色調変換材料の沈降を防止することができる。粘度増加方法としては、例えば、未硬化の樹脂の加熱、充填材の添加、チキソトロピー付与剤の添加などが挙げられる。
【００２９】
なお、色調変換層の作製及び積層は、上記発光波長の測定結果を得てから、その波長に合わせて色調変換層を作製して積層する方法を採用し得ることは勿論のこと、予想される半導体発光素子の波長の振れ幅（個体差）に合わせて予め色調変換層を多種作製しておき、これらの中から最適なものを選択して積層する方法も採用し得る。
【００３０】
最後に、図２（Ａ−４），（Ｂ−４）に示されるように、第１の封止樹脂上に積層した色調変換層７を第２の封止樹脂５ｂで封止する。これにより、色調変換材料は、大気との接触が遮断され、空気による色調変換材料の劣化が防止される。この色調変換層を封止する第２の封止樹脂としてはエポキシ樹脂、シリコーン樹脂等の従来公知の透光性樹脂を用いることができる。
【００３１】
この第２の封止樹脂により、色調変換層を封止する際、第１の態様においては、色調変換層を積層した上述の半製品を成形型内に配置し、この型内に未硬化の封止樹脂を注入して硬化成形させることにより封止が可能である。
【００３２】
一方、第２の態様においては、色調変換層を積層した上述の半製品の発光体収容部内に更に未硬化の封止樹脂を注入して硬化させることにより封止が可能である。
【００３３】
本発明においては、上述したとおり、配線導体、半導体発光素子及びボンディングワイヤを封止する第１の封止樹脂と第１の封止樹脂上に色調変換層を封止する第２の封止樹脂は、いずれもエポキシ樹脂、シリコーン樹脂等の従来公知の透光性樹脂を用いることができ、第１の封止樹脂と第２の封止樹脂とは同一の樹脂を用いても、異なる樹脂を用いてもよいが、特に、第１の封止樹脂として第２の封止樹脂より低硬度のものを用いることが好ましく、半導体発光装置が受ける外部からの衝撃を緩和しボンディングワイヤ等が切断することを防止することができる。
【００３４】
本発明によれば、微細な色調を高精細に安定的に再現することが要求される半導体発光装置、例えば、半導体発光素子としてＧａＮ系等の青色光を発光する素子を用い、色調変換材料としてＹＡＧ：Ｃｅ等の青色光を白色光に変換する蛍光体を用いた白色発光ダイオード、半導体発光素子としてＩｎＧａＮ系等の長波長紫外光又は短波長可視光を発光する素子を用い、色調変換材料として赤色発光蛍光体、緑色発光蛍光体及び青色発光蛍光体から選ばれる１種又は２種以上を用いた白色光乃至中間色光を発光する発光ダイオード等の半導体発光装置の製造方法として好適である。
【００３５】
【実施例】
以下、実施例及び比較例を挙げて本発明を具体的に説明するが、本発明は下記実施例に限定されるものではない。
【００３６】
［実施例］
配線導体、半導体発光素子（ＧａＮ系青色発光素子）及びボンディングワイヤを、封止樹脂で封止した市販青色ＬＥＤの封止樹脂の頭頂部を削り、図２（Ａ−１）に示されるような砲弾型の発光ダイオードの半製品を１７個（ａ−１〜１７）製造し、これらをＡ群とした。
【００３７】
Ａ群の１７個（ａ−１〜１７）は、まず、積分球中において２０ｍＡの電流を流して点灯し、その発光色を分光放射輝度計ＰＲ−７０４（Ｐｈｏｔｏ Ｒｅｓｅａｒｃｈ社製）で測定した。得られた発光色をＣＩＥ色度座標で表した結果を表１に示す。次に、この結果に基づいて、未硬化のシリコーンゴム１００質量部に、ＹＡＧ：Ｃｅ蛍光体を表１に示す量添加して混合し、加熱プレスを用いて厚さ０．５ｍｍのシート状に成形した色調変換層（ｃ−１〜１７）を作製し、この１７種の色調変換層を半製品（ａ−１〜１７）の封止樹脂上に、図２（Ａ−３）に示されるように積層し、更にこの色調変換層（ｃ−１〜１７）をエポキシ樹脂（Ｃｒａｆｔ Ｒｅｓｉｎ Ｚ−１ 日新レジン製）で封止して、図２（Ａ−４）に示されるような発光ダイオード（Ａ−１〜１７）を得た。
【００３８】
次に、これら得られた発光ダイオードについて、積分球中において各発光装置に２０ｍＡの電流を流して点灯し、その発光色を分光放射輝度計ＰＲ−７０４（Ｐｈｏｔｏ Ｒｅｓｅａｒｃｈ社製）で測定した。得られた発光色をＣＩＥ色度座標で表した結果を表１及び図４に示す。
【００３９】
【表１】

Figure 2005056885
【００４０】
［比較例］
配線導体、半導体発光素子（ＧａＮ系青色発光素子）及びボンディングワイヤを、封止樹脂で封止した市販青色ＬＥＤの封止樹脂の頭頂部を削り、図２（Ａ−１）に示されるような砲弾型の発光ダイオードの半製品をＡ群とは別に新たに１７個（ｂ−１〜１７）製造し、これらをＢ群とした。
【００４１】
Ｂ群の１７個（ｂ−１〜１７）には、未硬化のシリコーンゴム１００質量部に、ＹＡＧ：Ｃｅ蛍光体（Ｙ１．８Ｇｄ１．２Ａｌ５Ｏ１２：Ｃｅ）１４質量部を添加して混合し、加熱プレスを用いて厚さ０．５ｍｍのシート状に成形した色調変換層（ｃ−０）を１７個全ての半製品（ｂ−１〜１７）の封止樹脂上に、図２（Ａ−３）に示されるように積層し、更にこの色調変換層（ｃ−０）をエポキシ樹脂（Ｃｒａｆｔ Ｒｅｓｉｎ Ｚ−１ 日新レジン製）で封止して、図２（Ａ−４）に示されるような発光ダイオード（Ｂ−１〜１７）を得た。
【００４２】
次に、これら得られた発光ダイオードについて、積分球中において各発光装置に２０ｍＡの電流を流して点灯し、その発光色を分光放射輝度計ＰＲ−７０４（Ｐｈｏｔｏ Ｒｅｓｅａｒｃｈ社製）で測定した。得られた発光色をＣＩＥ色度座標で表した結果を表２及び図５に示す。
【００４３】
【表２】
Figure 2005056885
【００４４】
色調変換層の最適化がなされていないＢ群の発光ダイオードのＣＩＥ色度座標がばらついているのに対し、Ａ群の発光ダイオードは、いずれもＣＩＥ色度座標でｘ＝０．３０、ｙ＝０．３０付近の座標を示す白色光を発光するものとなっており、発光色のばらつきが低減できていることがわかる。
【００４５】
【発明の効果】
以上のように、本発明によれば、色むらが少なく、色調の経時安定性が高い半導体発光装置を、安価に、色調の再現性よく製造することができる。
【図面の簡単な説明】
【図１】本発明の製造方法により得られる半導体発光装置の一例を示す図であり、（Ａ）は砲弾型の発光ダイオード、（Ｂ）はチップ型の発光ダイオードを示す断面図である。
【図２】本発明の製造方法の一例の工程を説明する断面図であり（Ａ−１）〜（Ａ−４）は砲弾型の発光ダイオード、（Ｂ−１）〜（Ｂ−４）はチップ型の発光ダイオードの製造工程を説明する図である。
【図３】従来の半導体発光装置を示す図であり、（Ａ）は砲弾型の発光ダイオード、（Ｂ）はチップ型の発光ダイオードを示す断面図である。
【図４】実施例で得られた１７個の発光ダイオードの色調をＣＩＥ色度座標で示す図である。
【図５】比較例で得られた１７個の発光ダイオードの色調をＣＩＥ色度座標で示す図である。
【符号の説明】
１ 配線導体（アノードリード）
２ 配線導体（カソードリード）
３ 半導体発光素子
４ ボンディングワイヤ
５ 封止樹脂
５ａ 第１の封止樹脂
５ｂ 第２の封止樹脂
６ 発光体収容部材
７ 色調変換層[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for manufacturing a semiconductor light emitting device that emits light of a desired color tone by converting the wavelength of light emitted from a semiconductor light emitting element.
[0002]
[Prior art]
Since a light emitting diode (LED) is a semiconductor element, it has high reliability, has a long life, and when used as a light source, its replacement work is also reduced. Therefore, a portable communication device, a personal computer peripheral device, an OA device. It is widely used as a component part of various display devices such as home electric devices, audio devices, display units such as various switches, light sources for backlights, and display plates.
[0003]
In the case of a so-called bullet-type light emitting diode as shown in FIG. 3A, a conventional light emitting diode is usually a pair of wiring conductors composed of a wiring conductor (cathode lead) 1 and a wiring conductor (anode lead) 2. 1 and 2, a semiconductor light emitting element 3 such as a gallium nitride compound semiconductor electrically connected in a recess formed on the top of the cathode lead 1, and an electrode (not shown) formed on the semiconductor light emitting element 3. The bonding wire 4 that electrically connects the top of the anode lead 2 is sealed with a light-transmitting sealing resin 5 at one end side of the cathode lead 1 and the anode lead 2. In the case of a so-called chip-type light emitting diode as shown in FIG. 3B, the cathode lead 1 and the anode lead 2 are connected to the light emitter housing member from the inner bottom of the box-shaped light emitter housing member 6 whose upper surface is opened. 6, the semiconductor light emitting element 3 and the bonding wires 4 and 4 are accommodated inside the light emitter housing member 6, and these are connected to seal the inside of the light emitter housing member 6 with the sealing resin 5. It has a structure.
[0004]
Currently, as such an LED, for example, a YAG phosphor is applied on a semiconductor light emitting element emitting blue light, or a YAG phosphor is dispersed in a sealing resin, and blue light is emitted by the phosphor. White LEDs converted to white light are commercially available. In addition, an element that emits long-wavelength ultraviolet light or short-wavelength visible light (350 to 420 nm) such as an ultraviolet light-emitting element capable of high-luminance emission has been developed. By combining RBG phosphors, white and intermediate colors can be obtained in a desired color tone. Obtaining is also being considered. In this method, BaMgAl whose emission color is blue is used as a phosphor. 16 O 27 : Eu, (Sr, Ca, Ba) 5 (PO 4 ) 3 Cl: Eu, green color of BaMg 2 Al 16 O 27 : Eu, Mn, Zn 2 GeO 4 : Mn, Y whose emission color is red 2 O 2 S: Eu, 3.5MgO / 0.5MgF 2 ・ GeO 2 : It is expected to obtain various emission colors with high luminance by long wavelength ultraviolet light or short wavelength visible light by mixing Mn or the like at an arbitrary ratio.
[0005]
In recent years, demands on the color of consumers of the various display devices are increasing, and a function capable of reproducing subtle hues with higher definition in various display devices is required. Further, there is a strong demand for a function capable of reproducing white or various intermediate colors with a single light emitting diode.
[0006]
As light emitting diode semiconductor light emitting devices, GaN-based and InGaN-based light-emitting devices are attracting attention because they can be expected to emit light with high luminance. In such light-emitting devices, particularly InGaN-based light-emitting devices, When the In content is changed, the emission wavelength is greatly shifted, and the actual situation is that the emission wavelength varies greatly from element to element. Therefore, when using such a light-emitting element, for example, if the usage amount and mixing ratio of phosphors are set according to the average emission wavelength given by the light-emitting element and used uniformly, the emission wavelength is set. The color tone given by the light emitting element that deviates from the value is different from the target color tone. Such a problem has led to an increase in the cost of LEDs that emit white to intermediate colors using blue light emitting elements or ultraviolet light emitting elements.
[0007]
Further, when manufacturing a semiconductor light emitting device using a phosphor, the coating amount varies because the thickness of the applied phosphor layer is not constant in the method of applying the phosphor. On the other hand, even in the method of dispersing the phosphor in the sealing resin, the phosphor sinks during the molding and is unevenly distributed. Especially when the RBG phosphor is dispersed and used in the sealing resin, a plurality of phosphors are used. In the case of using these color tone conversion materials, the specific gravities thereof are different from each other, so that the dispersion is not uniform, and color unevenness occurs in any case.
[0008]
Further, many of such phosphors are easily hydrolyzed by moisture in the air, and there is a problem that the light emission characteristics of the phosphors change. For example, if the phosphor dispersed in the sealing resin is also located near the interface with the atmosphere, the light emission characteristics change over time. Further, when an element that emits light of a short wavelength, such as an ultraviolet light emitting element, is used, there is a problem that the resin in which the phosphor is dispersed is deteriorated by light emitted from the element, thereby causing a change in color tone.
[0009]
The prior art document information related to the present invention includes the following.
[0010]
[Patent Document 1]
Japanese Patent Laid-Open No. 11-87784
[0011]
[Problems to be solved by the invention]
The present invention has been made to solve the above-described problems, and provides a method for manufacturing a semiconductor light-emitting device with low color unevenness and high color tone stability over time at low cost with good color tone reproducibility. With the goal.
[0012]
Means for Solving the Problem and Embodiment of the Invention
As a result of intensive studies to solve the above problems, the present inventor has made a pair of wiring conductors, a semiconductor light emitting element electrically connected to one wiring conductor of the wiring conductor, the semiconductor light emitting element and the above A bonding wire for electrically connecting the other wiring conductor of the wiring conductor and a color tone conversion layer provided on the light emitting optical path of the semiconductor light emitting element are connected to the semiconductor light emitting element and the bonding wire of the wiring conductor. The semiconductor light emitting device that is sealed at one end side with a sealing resin is sealed with the first conductive resin, and then the wiring conductor, the semiconductor light emitting element, and the bonding wire are sealed with the first sealing resin. The semiconductor light-emitting element is made to emit light by energizing the measured semiconductor light-emitting element, the emission wavelength is measured, and then the color tone conversion material is provided so as to give a desired color tone with the light of the measured emission wavelength Manufactured by laminating a color tone conversion layer made of a polymer molded body in which an appropriate amount is dispersed in a polymer material on the first sealing resin, and then sealing the color tone conversion layer with the second sealing resin. As a result, it has been found that a semiconductor light-emitting device with little color unevenness and high color tone stability over time can be manufactured at low cost with good color tone reproducibility.
[0013]
The inventor extends a pair of wiring conductors from the inner bottom of a box-shaped light emitter housing member having a light emitter housing portion having an open top surface to the outside of the light emitter housing portion, and In the portion, a semiconductor light emitting element, a bonding wire for electrically connecting the semiconductor light emitting element and each of the wiring conductors, and a color tone conversion layer provided on the light emitting optical path of the semiconductor light emitting element are formed by a sealing resin. In the semiconductor light emitting device formed by sealing, the wiring conductor, the semiconductor light emitting element and the bonding wire are sealed with a first sealing resin, and then the semiconductor light emitting element sealed with the first sealing resin is energized. A polymer molded body in which a semiconductor light emitting element is caused to emit light, its emission wavelength is measured, and then a color tone conversion material is dispersed in a polymer material in an appropriate amount so as to give a desired color tone with light of the measured emission wavelength. From The color tone conversion layer is laminated on the first sealing resin, and the color tone conversion layer is then sealed with the second sealing resin, so that there is little color unevenness and the color tone is stable over time. It has been found that a high semiconductor light-emitting device can be manufactured at low cost with good color reproducibility, and the present invention has been made.
[0014]
That is, the present invention
[1] A pair of wiring conductors, a semiconductor light emitting element electrically connected to one wiring conductor of the wiring conductor, and bonding for electrically connecting the semiconductor light emitting element and the other wiring conductor of the wiring conductor Semiconductor light emission formed by sealing a wire and a color tone conversion layer provided on the light emission optical path of the semiconductor light emitting element with a sealing resin at one end side of the wiring conductor to which the semiconductor light emitting element and the bonding wire are connected. A device manufacturing method comprising:
The wiring conductor, the semiconductor light emitting element and the bonding wire are sealed with a first sealing resin, and then the semiconductor light emitting element energized by energizing the semiconductor light emitting element sealed with the first sealing resin. The emission wavelength is measured, and then a color tone conversion layer comprising a polymer molded body in which an appropriate amount of a color tone conversion material is dispersed in a polymer material so as to give a desired color tone with the light of the measured emission wavelength is provided as the first color conversion layer. A method for manufacturing a semiconductor light emitting device, wherein the method is laminated on a sealing resin, and then the color tone conversion layer is sealed with a second sealing resin;
[2] A pair of wiring conductors extend from the inner bottom of a box-shaped light emitter housing member having a light emitter housing portion having an open top surface, and a semiconductor is formed in the light emitter housing portion. A light emitting element, a bonding wire for electrically connecting the semiconductor light emitting element and each of the wiring conductors, and a color tone conversion layer provided on the light emitting optical path of the semiconductor light emitting element are sealed with a sealing resin. A method for manufacturing a semiconductor light emitting device comprising:
The wiring conductor, the semiconductor light emitting element and the bonding wire are sealed with a first sealing resin, and then the semiconductor light emitting element energized by energizing the semiconductor light emitting element sealed with the first sealing resin. The emission wavelength is measured, and then a color tone conversion layer comprising a polymer molded body in which an appropriate amount of a color tone conversion material is dispersed in a polymer material so as to give a desired color tone with the light of the measured emission wavelength is provided as the first color conversion layer. A method for manufacturing a semiconductor light emitting device, wherein the method is laminated on a sealing resin, and then the color tone conversion layer is sealed with a second sealing resin;
[3] The method for manufacturing a semiconductor light-emitting device according to [1] or [2], wherein the first sealing resin has a lower hardness than the second sealing resin,
[4] Any one of [1] to [3], wherein the semiconductor light emitting element emits blue light, and the color tone conversion material includes a phosphor that converts blue light into white light. A method for manufacturing the semiconductor light emitting device according to claim 1;
[5] The semiconductor light-emitting element emits long-wavelength ultraviolet light or short-wavelength visible light, and the color tone conversion material is one selected from a red light-emitting phosphor, a green light-emitting phosphor, and a blue light-emitting phosphor. Or a method of manufacturing a semiconductor light-emitting device according to any one of [1] to [3], including two or more types, and
[6] The method for manufacturing a semiconductor light-emitting device according to any one of [1] to [5], wherein the polymer material is a silicone resin or silicone rubber.
[0015]
The present invention will be described in detail below.
First, a first aspect of the method for manufacturing a semiconductor light emitting device of the present invention includes a pair of wiring conductors, a semiconductor light emitting element electrically connected to one wiring conductor of the wiring conductor, the semiconductor light emitting element and the above A bonding wire for electrically connecting the other wiring conductor of the wiring conductor and a color tone conversion layer provided on the light emission path of the semiconductor light emitting element are connected to the semiconductor light emitting element and the bonding wire of the wiring conductor. A method of manufacturing a semiconductor light emitting device in which one end side is sealed with a sealing resin, wherein the wiring conductor, the semiconductor light emitting element, and the bonding wire are sealed with a first sealing resin, and then the first sealing resin is sealed. By energizing the semiconductor light emitting device sealed with the stop resin, the semiconductor light emitting device emits light and measures its emission wavelength, and then gives the desired color tone with the light of this measured emission wavelength. A color tone conversion layer made of a polymer molded body in which an appropriate amount of a color tone conversion material is dispersed in a polymer material is laminated on the first sealing resin, and then the color tone conversion layer is sealed with a second sealing resin. To do.
[0016]
The method of the first aspect includes, for example, a pair of wiring conductors 1 and 2 including a wiring conductor (cathode lead) 1 and a wiring conductor (anode lead) 2 as shown in FIG. A semiconductor light emitting element 3 electrically connected to the cathode lead 1 in a recess formed at the top of the cathode lead 1, an electrode (not shown) formed on the semiconductor light emitting element 3, and the top of the cathode lead 2 are electrically connected. The bonding wire 4 and the color tone conversion layer 7 provided on the light emitting optical path of the semiconductor light emitting element 3 are sealed with a sealing resin 5 on one end side of the cathode lead 1 and the anode lead 2. It can be suitably used as a method for manufacturing a so-called bullet-type light emitting diode.
[0017]
According to a second aspect of the method for manufacturing a semiconductor light emitting device of the present invention, a pair of wiring conductors are connected to the light emitter housing portion from the inner bottom of a box-shaped light emitter housing member having a light emitter housing portion having an open top surface. A semiconductor light emitting element, a bonding wire for electrically connecting the semiconductor light emitting element and each of the wiring conductors, and a light emitting optical path of the semiconductor light emitting element are provided in the light emitter housing portion. A method of manufacturing a semiconductor light emitting device, wherein the color tone conversion layer is sealed with a sealing resin, wherein the wiring conductor, the semiconductor light emitting element, and the bonding wire are sealed with a first sealing resin, and then the first sealing resin is used. The semiconductor light emitting device encapsulated with one sealing resin is energized to cause the semiconductor light emitting device to emit light and measure its emission wavelength, and then the color tone so as to give a desired color tone with the light of this measured emission wavelength. Strange A color tone conversion layer made of a polymer molded body in which an appropriate amount of material is dispersed in a polymer material is laminated on the first sealing resin, and then this color tone conversion layer is sealed with a second sealing resin. is there.
[0018]
The method according to the second aspect includes, for example, a wiring conductor (cathode lead) from the inner bottom of a box-shaped light emitter housing member 6 having a light emitter housing portion whose upper surface is open as shown in FIG. 1 and a pair of wiring conductors 1 and 2 composed of a wiring conductor (anode lead) 2 extend to the outside of the light emitter housing portion, and within the light emitter housing portion, a semiconductor light emitting element 3 and the semiconductor light emitting element 2 is electrically sealed with the bonding conductors 4 and 4 and the color tone conversion layer 7 provided on the light emitting optical path of the semiconductor light emitting device is sealed with a sealing resin 5. It can be suitably used as a method for manufacturing a so-called chip-type light emitting diode having the above structure.
[0019]
In the present invention, in both cases of the first aspect and the second aspect, first, the semiconductor light emitting element and the wiring conductor and the bonding wire, which are conductors for energizing the semiconductor light emitting element, are formed with the first sealing resin. Seal. As the first sealing resin for sealing the wiring conductor, the semiconductor element, and the bonding wire, a conventionally known translucent resin such as an epoxy resin or a silicone resin can be used.
[0020]
In the case of the first aspect, the wiring conductors 1 and 2, the semiconductor light emitting element 3 and the bonding wire 4 are electrically connected, and these are arranged in a molding die for sealing with a sealing resin. By injecting an uncured sealing resin and curing it, the wiring conductors 1, 2, the semiconductor light emitting element 3, and the bonding wire 4 are first sealed as shown in FIG. A semi-finished product sealed with the resin 5a is produced. As such a semi-finished product, it is also possible to cut and use the top of the light emitting diode once formed into a bullet shape.
[0021]
On the other hand, in the case of the second embodiment, the wiring conductors 1 and 2, the semiconductor light emitting element 3 and the bonding wires 4 and 4 are electrically connected in the light emitter housing portion of the light emitter housing member 6, By injecting and curing an uncured sealing resin, for example, the wiring conductors 1 and 2, the semiconductor light emitting element 3, and the bonding wire 4 as shown in FIG. A semi-finished product sealed in the light emitter housing member 6 is produced by 5a. In addition, as the light emitter housing member 6, one formed by insert molding in which a resin is injected while holding the pair of wiring conductors 1 and 2 in a mold can be used. Further, as this resin, generally modified polyimide can be used.
[0022]
In any case, the semiconductor light emitting element 3 becomes a semi-finished product fixed in a state of being electrically connected to the wiring conductors 1 and 2, thereby energizing the semiconductor light emitting element to be implemented in the next step and The operation of measuring the emission wavelength becomes easy.
[0023]
Next, as shown in FIGS. 2A-2 and B-2, by energizing the semi-finished semiconductor light-emitting element in which the semiconductor light-emitting element 3 and the like are sealed with the first sealing resin 5a. The semiconductor light emitting element is caused to emit light and its emission wavelength is measured. The emission wavelength can be measured by a conventionally known device that measures the emission wavelength of the semiconductor light emitting device. In this case, since the semiconductor light emitting element is a semi-finished product that is sealed with a sealing resin together with a wiring conductor and a bonding wire, and thus has a certain shape, a conventional measuring device used for inspection of semiconductor light emitting device products is used. It is possible to apply as it is. In FIGS. 2A-2 and B-2, 8 is a power source and 9 is a photometer.
[0024]
Next, as shown in FIGS. 2 (A-3) and (B-3), an appropriate amount of the color tone conversion material is dispersed in the polymer material so as to give a desired color tone with the light having the emission wavelength measured by the above measurement. A color tone conversion layer 7 made of the polymer molded body is laminated on the first sealing resin 5a. In the present invention, the color tone conversion layer is a polymer molded body in which a color tone conversion material is dispersed in a polymer material. Based on the measurement result of the emission wavelength of the semiconductor light emitting element of the product, the color tone after conversion is determined to be a desired color tone.
[0025]
Examples of the color tone conversion material include inorganic phosphors, pigments, organic fluorescent dyes, pseudo pigments, and the like. 3-x Ga x Al 5 O 12 : Ce (0 ≦ x ≦ 3), BaMgAl 16 O 27 : Eu, (Sr, Ca, Ba) 5 (PO 4 ) 3 Cl: Eu, BaMg 2 Al 16 O 27 : Eu, Mn, Zn 2 GeO 4 : Mn, Y 2 O 2 S: Eu, 3.5MgO / 0.5MgF 2 ・ GeO 2 : Mn, La 2 O 2 S: Eu, CaS: Eu, LiEuW 2 O 8 As pigments, organic pigments such as phthalocyanine, azo, isoindolinone, quinacridone, and lake pigments, inorganic pigments such as cobalt blue, ultramarine, and iron oxide, and perylene, naphthalimide, as organic fluorescent dyes, etc. As the pseudo-pigment such as coumarin, cyanine, flavin, rhodamine and the like, a fluorescent pigment obtained by coloring a plastic powder with a fluorescent dye can be suitably used.
[0026]
On the other hand, as the polymer material, for example, a transparent resin such as silicone resin, epoxy resin or polycarbonate, or transparent rubber such as silicone rubber can be used. From the viewpoint of heat resistance and transmittance, silicone resin or silicone rubber can be used. Is preferred. In particular, in the case of using a semiconductor light emitting element that emits short-wavelength visible light from the near ultraviolet of 350 to 450 nm, silicone resin and silicone rubber do not absorb these wavelengths, and thus are suitable as a light emitting device with high brightness and long life. In addition, an adhesive component can be added to the color tone conversion layer, which enables firm fixation on the sealing resin.
[0027]
In the present invention, a polymer molded body obtained by mixing and dispersing the above-described color tone conversion material in a polymer material is used as the color tone conversion layer. Such a polymer molded body is not yet used. It can be obtained by adding and mixing a color conversion material to a cured resin and molding and curing it by a conventionally known method such as compression molding. As described above, in the present invention, a color tone conversion material having a color tone conversion function is produced as a color tone conversion layer made of a polymer molded body separately from the sealing resin and provided on the optical path of the emitted light from the semiconductor light emitting element. Unlike the case where the color tone conversion material is dispersed in the sealing resin, the dispersion and curing conditions can be set so as to prevent the color tone conversion material from being unevenly distributed in the curing of the color tone conversion layer. Color unevenness can be reduced, and the layer thickness can be kept constant at a predetermined thickness, so that the occurrence of color unevenness due to variations in layer thickness as in the method of applying a color tone conversion material can be reduced. Can do.
[0028]
In particular, when a plurality of color tone conversion materials are used, sedimentation of the color tone conversion material having a high specific gravity can be prevented by increasing the viscosity of the uncured resin to which the color tone conversion material is added. Examples of the viscosity increasing method include heating an uncured resin, adding a filler, and adding a thixotropy imparting agent.
[0029]
In addition, it is anticipated that the method for producing and laminating the color tone conversion layer may employ a method of producing and laminating the color tone conversion layer in accordance with the wavelength after obtaining the measurement result of the emission wavelength. It is also possible to employ a method in which various color tone conversion layers are prepared in advance according to the wavelength fluctuation width (individual difference) of the semiconductor light emitting element, and an optimum one is selected and laminated.
[0030]
Finally, as shown in FIGS. 2 (A-4) and (B-4), the color tone conversion layer 7 laminated on the first sealing resin is sealed with the second sealing resin 5b. As a result, the color tone conversion material is blocked from contact with the atmosphere, and deterioration of the color tone conversion material due to air is prevented. As the second sealing resin for sealing the color tone conversion layer, a conventionally known translucent resin such as an epoxy resin or a silicone resin can be used.
[0031]
When the color tone conversion layer is sealed with the second sealing resin, in the first aspect, the above-mentioned semi-finished product on which the color tone conversion layer is laminated is placed in a mold, and uncured in the mold. Sealing is possible by injecting a sealing resin and curing.
[0032]
On the other hand, in the second embodiment, sealing can be performed by injecting and curing an uncured sealing resin into the light emitter housing portion of the semi-finished product on which the color tone conversion layer is laminated.
[0033]
In the present invention, as described above, the first sealing resin for sealing the wiring conductor, the semiconductor light emitting element, and the bonding wire, and the second sealing resin for sealing the color tone conversion layer on the first sealing resin. Can use conventionally known translucent resins such as epoxy resins and silicone resins, and the first sealing resin and the second sealing resin can be different from each other even if the same resin is used. Although it may be used, it is particularly preferable to use a resin having a lower hardness than the second sealing resin as the first sealing resin, so that the external impact received by the semiconductor light emitting device is reduced and the bonding wire and the like are cut. This can be prevented.
[0034]
According to the present invention, a semiconductor light-emitting device that is required to stably reproduce a fine color tone with high definition, for example, a GaN-based element that emits blue light as a semiconductor light-emitting element is used as a color-tone conversion material. White light-emitting diodes using phosphors that convert blue light, such as YAG: Ce, into white light, and semiconductor light-emitting elements that use long-wavelength ultraviolet light or short-wavelength visible light, such as InGaN, as color tone conversion materials It is suitable as a method for manufacturing a semiconductor light emitting device such as a light emitting diode that emits white light or intermediate color light using one or more selected from a red light emitting phosphor, a green light emitting phosphor and a blue light emitting phosphor.
[0035]
【Example】
EXAMPLES Hereinafter, although an Example and a comparative example are given and this invention is demonstrated concretely, this invention is not limited to the following Example.
[0036]
[Example]
The top of the sealing resin of a commercially available blue LED in which a wiring conductor, a semiconductor light-emitting element (GaN-based blue light-emitting element) and a bonding wire are sealed with a sealing resin is shaved as shown in FIG. Seventeen (a-1 to 17) semi-finished shell-type light emitting diodes were manufactured, and these were designated as Group A.
[0037]
Seventeen (a-1 to 17) members in Group A were first lit by passing a current of 20 mA in the integrating sphere, and the emission color was measured with a spectral radiance meter PR-704 (manufactured by Photo Research). Table 1 shows the result of expressing the obtained emission color with CIE chromaticity coordinates. Next, based on this result, YAG: Ce phosphor is added to 100 parts by mass of uncured silicone rubber and mixed in the amount shown in Table 1, and is formed into a sheet having a thickness of 0.5 mm using a heating press. Molded color tone conversion layers (c-1 to 17) are prepared, and these 17 types of color tone conversion layers are formed on the sealing resin of semi-finished products (a-1 to 17) as shown in FIG. 2 (A-3). Further, the color tone conversion layers (c-1 to 17) are sealed with an epoxy resin (Craft Resin Z-1 made by Nissin Resin), and light emission as shown in FIG. Diodes (A-1 to 17) were obtained.
[0038]
Next, these obtained light-emitting diodes were turned on by supplying a current of 20 mA to each light-emitting device in an integrating sphere, and the emission color was measured with a spectral radiance meter PR-704 (manufactured by Photo Research). Table 1 and FIG. 4 show the results of expressing the obtained emission color in terms of CIE chromaticity coordinates.
[0039]
[Table 1]
Figure 2005056885
[0040]
[Comparative example]
The top of the sealing resin of a commercially available blue LED in which a wiring conductor, a semiconductor light-emitting element (GaN-based blue light-emitting element) and a bonding wire are sealed with a sealing resin is shaved as shown in FIG. In addition to group A, semi-finished shell-type light emitting diodes (17) (b-1 to 17) were manufactured, and these were grouped as group B.
[0041]
In 17 pieces (b-1 to 17) of Group B, 100 parts by mass of uncured silicone rubber was added to YAG: Ce phosphor (Y 1.8 Gd 1.2 Al 5 O 12 : Ce) Add 14 parts by mass, mix and form a color tone conversion layer (c-0) formed into a 0.5 mm-thick sheet using a hot press for all 17 semi-finished products (b-1 to 17) 2) and the color tone conversion layer (c-0) is sealed with an epoxy resin (Craft Resin Z-1 made by Nissin Resin). Thus, light emitting diodes (B-1 to 17) as shown in FIG. 2 (A-4) were obtained.
[0042]
Next, these obtained light-emitting diodes were turned on by supplying a current of 20 mA to each light-emitting device in an integrating sphere, and the emission color was measured with a spectral radiance meter PR-704 (manufactured by Photo Research). Table 2 and FIG. 5 show the results of expressing the obtained emission color in CIE chromaticity coordinates.
[0043]
[Table 2]
Figure 2005056885
[0044]
While the CIE chromaticity coordinates of the light emitting diodes of the B group where the color tone conversion layer is not optimized are varied, all of the light emitting diodes of the A group have CIE chromaticity coordinates of x = 0.30, y = It can be seen that white light indicating coordinates near 0.30 is emitted, and variation in emission color can be reduced.
[0045]
【The invention's effect】
As described above, according to the present invention, a semiconductor light-emitting device with little color unevenness and high color tone stability over time can be manufactured at low cost with good color tone reproducibility.
[Brief description of the drawings]
1A and 1B are diagrams showing an example of a semiconductor light emitting device obtained by a manufacturing method of the present invention, in which FIG. 1A is a cross-sectional view showing a shell type light emitting diode, and FIG. 1B is a cross sectional view showing a chip type light emitting diode;
FIGS. 2A and 2B are cross-sectional views illustrating an example of a manufacturing method according to the present invention, wherein (A-1) to (A-4) are bullet-type light emitting diodes, and (B-1) to (B-4) are It is a figure explaining the manufacturing process of a chip-type light emitting diode.
3A and 3B are diagrams showing a conventional semiconductor light emitting device, in which FIG. 3A is a cross-sectional view showing a shell type light emitting diode, and FIG. 3B is a cross sectional view showing a chip type light emitting diode;
FIG. 4 is a diagram showing the color tone of 17 light-emitting diodes obtained in an example using CIE chromaticity coordinates.
FIG. 5 is a diagram showing the color tone of 17 light-emitting diodes obtained in a comparative example using CIE chromaticity coordinates.
[Explanation of symbols]
1 Wiring conductor (Anode lead)
2 Wiring conductor (cathode lead)
3 Semiconductor light emitting device
4 Bonding wire
5 Sealing resin
5a First sealing resin
5b Second sealing resin
6 Light emitter housing member
7 Color conversion layer

Claims (6)

一対の配線導体と、上記配線導体の一方の配線導体に電気的に接続された半導体発光素子と、この半導体発光素子と上記配線導体の他方の配線導体とを電気的に接続するボンディングワイヤと、上記半導体発光素子の発光光路上に設けられた色調変換層とを、上記配線導体の上記半導体発光素子及びボンディングワイヤが接続された一端側で封止樹脂により封止してなる半導体発光装置の製造方法であって、
上記配線導体、半導体発光素子及びボンディングワイヤを第１の封止樹脂で封止し、次いで上記第１の封止樹脂で封止された半導体発光素子に通電することにより半導体発光素子を発光させてその発光波長を測定し、次いでこの測定された発光波長の光で所望の色調を与えるように色調変換材料を高分子材料に適量分散させた高分子成形体からなる色調変換層を上記第１の封止樹脂上に積層し、次いでこの色調変換層を第２の封止樹脂で封止することを特徴とする半導体発光装置の製造方法。A pair of wiring conductors, a semiconductor light emitting element electrically connected to one wiring conductor of the wiring conductor, a bonding wire electrically connecting the semiconductor light emitting element and the other wiring conductor of the wiring conductor; Manufacturing of a semiconductor light emitting device in which a color tone conversion layer provided on a light emitting optical path of the semiconductor light emitting element is sealed with a sealing resin on one end side of the wiring conductor to which the semiconductor light emitting element and a bonding wire are connected. A method,
The wiring conductor, the semiconductor light emitting element and the bonding wire are sealed with a first sealing resin, and then the semiconductor light emitting element energized by energizing the semiconductor light emitting element sealed with the first sealing resin. The emission wavelength is measured, and then a color tone conversion layer comprising a polymer molded body in which an appropriate amount of a color tone conversion material is dispersed in a polymer material so as to give a desired color tone with the light of the measured emission wavelength is provided as the first color conversion layer. A method of manufacturing a semiconductor light emitting device, comprising: laminating on a sealing resin, and then sealing the color tone conversion layer with a second sealing resin. 上面が開口した発光体収容部を有する箱形の発光体収容部材の内底から一対の配線導体を上記発光体収容部の外側に延出すると共に、上記発光体収容部内に、半導体発光素子と、この半導体発光素子と上記配線導体の各々とを電気的に接続するボンディングワイヤと、上記半導体発光素子の発光光路上に設けられた色調変換層とを封止樹脂により封止してなる半導体発光装置の製造方法であって、
上記配線導体、半導体発光素子及びボンディングワイヤを第１の封止樹脂で封止し、次いで上記第１の封止樹脂で封止された半導体発光素子に通電することにより半導体発光素子を発光させてその発光波長を測定し、次いでこの測定された発光波長の光で所望の色調を与えるように色調変換材料を高分子材料に適量分散させた高分子成形体からなる色調変換層を上記第１の封止樹脂上に積層し、次いでこの色調変換層を第２の封止樹脂で封止することを特徴とする半導体発光装置の製造方法。A pair of wiring conductors extend from the inner bottom of a box-shaped light emitter housing member having a light emitter housing portion having an open top surface, and a semiconductor light emitting device and a light emitting device are disposed inside the light emitter housing portion. A semiconductor light emitting device in which a bonding wire for electrically connecting the semiconductor light emitting element and each of the wiring conductors and a color tone conversion layer provided on the light emitting optical path of the semiconductor light emitting element are sealed with a sealing resin. A device manufacturing method comprising:
The wiring conductor, the semiconductor light emitting element and the bonding wire are sealed with a first sealing resin, and then the semiconductor light emitting element energized by energizing the semiconductor light emitting element sealed with the first sealing resin. The emission wavelength is measured, and then a color tone conversion layer comprising a polymer molded body in which an appropriate amount of a color tone conversion material is dispersed in a polymer material so as to give a desired color tone with the light of the measured emission wavelength is provided as the first color conversion layer. A method of manufacturing a semiconductor light emitting device, comprising: laminating on a sealing resin, and then sealing the color tone conversion layer with a second sealing resin. 上記第１の封止樹脂が上記第２の封止樹脂より低硬度であることを特徴とする請求項１又は２記載の半導体発光装置の製造方法。3. The method of manufacturing a semiconductor light emitting device according to claim 1, wherein the first sealing resin has a lower hardness than the second sealing resin. 上記半導体発光素子が青色光を発光するものであり、上記色調変換材料が青色光を白色光に変換する蛍光体を含むことを特徴とする請求項１乃至３のいずれか１項記載の半導体発光装置の製造方法。4. The semiconductor light emitting device according to claim 1, wherein the semiconductor light emitting element emits blue light, and the color tone conversion material includes a phosphor that converts blue light into white light. 5. Device manufacturing method. 上記半導体発光素子が、長波長紫外光又は短波長可視光を発光するものであり、上記色調変換材料が、赤色発光蛍光体、緑色発光蛍光体及び青色発光蛍光体から選ばれる１種又は２種以上を含むことを特徴とする請求項１乃至３のいずれか１項記載の半導体発光装置の製造方法。The semiconductor light emitting element emits long wavelength ultraviolet light or short wavelength visible light, and the color tone conversion material is one or two selected from a red light emitting phosphor, a green light emitting phosphor and a blue light emitting phosphor. The method for manufacturing a semiconductor light emitting device according to claim 1, comprising the above. 上記高分子材料がシリコーン樹脂又はシリコーンゴムであることを特徴とする請求項１乃至５のいずれか１項記載の半導体発光装置の製造方法。6. The method for manufacturing a semiconductor light emitting device according to claim 1, wherein the polymer material is a silicone resin or a silicone rubber.
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Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006310136A (en) * 2005-04-28 2006-11-09 Fuji Electric Holdings Co Ltd Red conversion filter, its patterning method, multi-color conversion filter containing the red conversion filter and organic el display
EP1808903A3 (en) * 2006-01-11 2009-05-20 Shinko Electric Industries Co., Ltd. Method of manufacturing a semiconductor light emitting apparatus
JP2009272638A (en) * 2008-05-05 2009-11-19 Cree Inc Method of fabricating light emitting device by selective deposition of light conversion materials based on measured light emission characteristics
EP2226860A2 (en) * 2009-03-02 2010-09-08 LG Innotek Co., Ltd. Light emitting device
JP2011066463A (en) * 2005-03-11 2011-03-31 Seoul Semiconductor Co Ltd Light-emitting element having plurality of light-emitting cells
JP2011096936A (en) * 2009-10-30 2011-05-12 Alpha- Design Kk Semiconductor light emitting device manufacturing apparatus
WO2012032692A1 (en) * 2010-09-09 2012-03-15 パナソニック株式会社 Led-package manufacturing system
WO2012032693A1 (en) * 2010-09-09 2012-03-15 パナソニック株式会社 Resin applying device of led package manufacturing system
WO2012032691A1 (en) * 2010-09-09 2012-03-15 パナソニック株式会社 Led package manufacturing system
WO2012032694A1 (en) * 2010-09-09 2012-03-15 パナソニック株式会社 Resin application device in led package manufacturing system
KR101198245B1 (en) 2008-06-30 2012-11-07 브리지럭스 인코포레이티드 A light emitting device having a phosphor layer
WO2013038611A1 (en) * 2011-09-16 2013-03-21 パナソニック株式会社 System and method for manufacturing light emitting element, and system and method for manufacturing light emitting element package
KR101321933B1 (en) * 2011-03-30 2013-10-28 서울바이오시스 주식회사 Light emitting diode and Method of manufacturing the same

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5419660A (en) * 1977-07-15 1979-02-14 Stanley Electric Co Ltd Method of packaging optical semiconductor resin mold
JPH10242513A (en) * 1996-07-29 1998-09-11 Nichia Chem Ind Ltd Light emitting diode and display device using the same
JPH1187778A (en) * 1997-09-02 1999-03-30 Toshiba Corp Semiconductor light emitting element, semiconductor light emitting device and manufacture thereof
JP2002033517A (en) * 2000-05-09 2002-01-31 Nichia Chem Ind Ltd Light emitting element and its manufacturing method
JP2002033520A (en) * 2000-07-14 2002-01-31 Toshiba Electronic Engineering Corp Semiconductor light emitting device
JP2002185046A (en) * 2000-12-19 2002-06-28 Sharp Corp Chip-part type led and its manufacturing method
JP2002299699A (en) * 2001-03-30 2002-10-11 Sumitomo Electric Ind Ltd Light-emitting device and method of manufacturing the same
JP2003046133A (en) * 2001-07-26 2003-02-14 Matsushita Electric Works Ltd Light emitting device and method of manufacturing the same
JP2003051622A (en) * 2001-08-07 2003-02-21 Rohm Co Ltd White light emitting semiconductor device
JP2003152227A (en) * 2001-11-14 2003-05-23 Citizen Electronics Co Ltd Means and method for correcting color of led

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5419660A (en) * 1977-07-15 1979-02-14 Stanley Electric Co Ltd Method of packaging optical semiconductor resin mold
JPH10242513A (en) * 1996-07-29 1998-09-11 Nichia Chem Ind Ltd Light emitting diode and display device using the same
JPH1187778A (en) * 1997-09-02 1999-03-30 Toshiba Corp Semiconductor light emitting element, semiconductor light emitting device and manufacture thereof
JP2002033517A (en) * 2000-05-09 2002-01-31 Nichia Chem Ind Ltd Light emitting element and its manufacturing method
JP2002033520A (en) * 2000-07-14 2002-01-31 Toshiba Electronic Engineering Corp Semiconductor light emitting device
JP2002185046A (en) * 2000-12-19 2002-06-28 Sharp Corp Chip-part type led and its manufacturing method
JP2002299699A (en) * 2001-03-30 2002-10-11 Sumitomo Electric Ind Ltd Light-emitting device and method of manufacturing the same
JP2003046133A (en) * 2001-07-26 2003-02-14 Matsushita Electric Works Ltd Light emitting device and method of manufacturing the same
JP2003051622A (en) * 2001-08-07 2003-02-21 Rohm Co Ltd White light emitting semiconductor device
JP2003152227A (en) * 2001-11-14 2003-05-23 Citizen Electronics Co Ltd Means and method for correcting color of led

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011066463A (en) * 2005-03-11 2011-03-31 Seoul Semiconductor Co Ltd Light-emitting element having plurality of light-emitting cells
US8937326B2 (en) 2005-03-11 2015-01-20 Seoul Semiconductor Co., Ltd. LED package having an array of light emitting cells coupled in series
JP2006310136A (en) * 2005-04-28 2006-11-09 Fuji Electric Holdings Co Ltd Red conversion filter, its patterning method, multi-color conversion filter containing the red conversion filter and organic el display
JP4729719B2 (en) * 2005-04-28 2011-07-20 富士電機株式会社 Red conversion filter and patterning method thereof, multicolor conversion filter including the red conversion filter, and organic EL display
EP1808903A3 (en) * 2006-01-11 2009-05-20 Shinko Electric Industries Co., Ltd. Method of manufacturing a semiconductor light emitting apparatus
JP2009272638A (en) * 2008-05-05 2009-11-19 Cree Inc Method of fabricating light emitting device by selective deposition of light conversion materials based on measured light emission characteristics
KR101198245B1 (en) 2008-06-30 2012-11-07 브리지럭스 인코포레이티드 A light emitting device having a phosphor layer
EP2226860A2 (en) * 2009-03-02 2010-09-08 LG Innotek Co., Ltd. Light emitting device
US8860052B2 (en) 2009-03-02 2014-10-14 Lg Innotek Co., Ltd. Light emitting device
JP2011096936A (en) * 2009-10-30 2011-05-12 Alpha- Design Kk Semiconductor light emitting device manufacturing apparatus
WO2012032694A1 (en) * 2010-09-09 2012-03-15 パナソニック株式会社 Resin application device in led package manufacturing system
JP2012059918A (en) * 2010-09-09 2012-03-22 Panasonic Corp Resin coating apparatus in led package manufacturing system
JP2012059916A (en) * 2010-09-09 2012-03-22 Panasonic Corp Led package manufacturing system
JP2012059917A (en) * 2010-09-09 2012-03-22 Panasonic Corp Resin coating apparatus in led package manufacturing system
JP2012059915A (en) * 2010-09-09 2012-03-22 Panasonic Corp Led package manufacturing system
WO2012032691A1 (en) * 2010-09-09 2012-03-15 パナソニック株式会社 Led package manufacturing system
CN102812567A (en) * 2010-09-09 2012-12-05 松下电器产业株式会社 LED-package manufacturing system
WO2012032693A1 (en) * 2010-09-09 2012-03-15 パナソニック株式会社 Resin applying device of led package manufacturing system
WO2012032692A1 (en) * 2010-09-09 2012-03-15 パナソニック株式会社 Led-package manufacturing system
US9324906B2 (en) 2010-09-09 2016-04-26 Panasonic Intellectual Property Management Co., Ltd. LED package manufacturing system
KR101321933B1 (en) * 2011-03-30 2013-10-28 서울바이오시스 주식회사 Light emitting diode and Method of manufacturing the same
WO2013038611A1 (en) * 2011-09-16 2013-03-21 パナソニック株式会社 System and method for manufacturing light emitting element, and system and method for manufacturing light emitting element package

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