JP2011096936A - Semiconductor light emitting device manufacturing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem that an efficient semiconductor light emitting device manufacturing apparatus is desired since an LED chip subtly differs in color tone during light emission owing to disorder of a crystal structure in the manufacture, so a semiconductor light emitting device of the same color can not be manufactured because of the initial difference in color tone of the LED chip and the yield is inferior when a semiconductor light emitting device of a predetermined color is manufactured by charging a constant amount of a phosphor in an enclosure where the LED chip is bonded. <P>SOLUTION: After map data on color tones by LED chips obtained by making the LED chips emit light while stuck on a wafer ring is stored in a storage part, a predetermined white semiconductor light emitting device can be manufactured by charging a sealing material corresponding to an LED chip by a calculated amount. Consequently, no defective is discharged to greatly improve the efficiency. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a semiconductor light emitting device manufacturing apparatus that makes a blue light emitting diode (hereinafter referred to as an LED chip) a semiconductor light emitting device having a constant wavelength (same color) among semiconductor light emitting devices.

As shown in FIG. 3, a white LED used for lighting or a light bulb color and a semiconductor light-emitting device used as a backlight of a liquid crystal display device are made of a blue LED chip 201 that emits blue light as shown in FIG. , Epoxy and the like) are sealed in the envelope.
In this case, a predetermined white light is generated by the light in the wavelength range converted by exciting the phosphor with the blue light emitted from the blue LED chip 201 and the blue light that has passed through the resin (encapsulant base material) without being converted. Light is converted into light color and emitted.

A configuration of the semiconductor device will be described. As described above, the semiconductor light emitting device is configured as shown in FIG. A blue LED chip 201 is bonded to the inner bottom surface of the outer envelope (package) 10.
External terminals 18 and 19 are provided outside the envelope 10, and are connected to electrodes 202 and 203 of the LED chip 201 by wirings 16 and 17, respectively. The inside of the envelope 10 has a mortar shape, and is filled with a sealing material 12 containing phosphor particles 13. With the above configuration, when the external terminals 18 and 19 are energized, the blue LED chip 201 emits light through the wirings 16 and 17.

As described above, a predetermined light color is set by the light passing through the sealing material 12 without being converted into the light excited by the phosphor particles 13 at this time. Therefore, the color tone can be changed according to the type and amount of the phosphor particles 13.
In the present invention, there is provided a semiconductor light emitting device device relating to a method for producing a white semiconductor light emitting device 9 using a blue LED chip 11 by enclosing several kinds of sealing materials 12 having different types and contents of phosphor particles 13. It is what.

Next, the color tone of each blue LED chip is slightly different as shown in the chromaticity coordinates shown in FIG. At the stage of being attached to the wafer ring 21, the LED chip 20 does not emit light in the same color tone due to subtle crystal differences, and is surrounded by an ellipse F surrounded by a dotted line in the center of FIG. Disperse in the color tone.
Patent Document 2 (Japanese Patent Application Laid-Open No. 2002-124705) shown in FIG. 5 manufactures a semiconductor light emitting device that uniformly encapsulates a sealing resin 91 in a concave portion 92 of a collective substrate 90 and cuts at a boundary line 93 to emit white light. A method has been proposed. Further, changing the content and type of the phosphor particles 13 contained in the sealing material 10 in order to change the color tone is described in Patent Document 1 (Japanese Patent Laid-Open No. 2009-21613).
A semiconductor light emitting device manufactured in a predetermined white can be used for a backlight for liquid crystal display and the like, and can save labor and improve durability. However, since the color tone varies depending on the crystal of the LED chip 20 as described above, it is desired to further improve the yield in order to produce a predetermined white semiconductor light emitting device.

  FIG. 4 shows the emission color of the blue LED chip 201 displayed on the chromaticity coordinates of the XY chromaticity diagram. The abscissa is chromaticity X and becomes bluish as it goes to the left, and reddish as it goes to the right. The vertical axis of the dye Y becomes bluish as it goes down, and becomes green as it goes up. The broken line showing the large triangle in FIG. 5 shows the entire chromaticity diagram, and the broken line surrounded by the center ellipse F shows the white range.

As shown in FIG. 4, even if the white color is the same, due to subtle differences in crystals, there are a blue white a, a green white b, a yellow white c, and a red white d. But the difference is clear. Therefore, in order to save labor and improve durability by using it for a backlight for liquid crystal display or the like, color unevenness occurs unless the color tone of all the semiconductor devices 9 is made constant with a predetermined white w, and cannot be used.
For this purpose, it is desired that the phosphor particles 13 contained in the sealing material 12 enclosed inside the envelope 10 are slightly changed to make the color tone of all the semiconductor devices 9 constant with a predetermined white w.


JP2009-21613 JP2002-124705

As described above, the blue LED chip 201 is uneven in color due to the crystal structure. Furthermore, there is uneven distribution of the phosphor particles 13 contained in the sealing material 12 sealed inside the envelope 10, and the semiconductor light emitting device 9 manufactured by the conventional method has a poor yield for manufacturing a predetermined white w. Many defective products are discharged.
In the conventional method, the composition of the sealing material 12 is determined so that the predetermined white w is obtained based on the experience value and the experimental result so far, but the semiconductor device 9 of the predetermined white w can be provided only about 30%.
The other 70 percent is white as the color tone of a, b, c, d in the chromaticity coordinates of FIG. Or it is sold cheaply as a low-cost semiconductor device 9. Therefore, the manufacturing yield is poor and the semiconductor light emitting device having a predetermined white w color tone cannot be manufactured at low cost.

  Naturally, the semiconductor device 9 cannot be provided as a backlight for liquid crystal display or the like unless it is shipped after the semiconductor device 9 emits light in a separate process to determine whether it is a predetermined white w. If all the produced semiconductor light emitting devices 9 can be provided as a backlight for liquid crystal display, etc., the semiconductor light emitting devices 9 that can be reduced in size and weight with a long life and shock can be provided at low cost.

As described in Patent Document 2 (Japanese Patent Application Laid-Open No. 2002-124705) shown in FIG. 5, the LED chip 20 is placed at a predetermined position of the concave portion 92 on the collective substrate 90, and the sealing resin 91 is poured at once. After that, it is described that a semiconductor light emitting device is manufactured by cutting at a boundary line 93. However, in this method, variations in color tone due to the crystal structure of the LED chip 20 occur. Furthermore, the color tone varies depending on the uneven distribution of the phosphor particles 13 contained in the sealing material 12. Since all of these items are manufactured together, the yield is poor and the product is expensive.

Therefore, in a semiconductor light emitting device manufacturing apparatus configured to enclose a plurality of sealing materials containing phosphor particles by mounting an LED chip attached to a wafer ring on an envelope, the wafer ring is attached to the wafer ring. A stylus that emits light by energizing the electrodes of the LED chip in an attached state, a first camera that measures the emission wavelength of the emitted LED chip, and mapping data of the position and emission wavelength of the LED chip A storage unit that stores the same, an enclosure that includes the LED chip, an enclosure that encloses a predetermined amount of a predetermined sealing material that is calculated based on emission wavelength information of mapping data of the storage unit, the stylus, A control unit for controlling the first camera, the storage unit, and the enclosing unit is provided, and the emission wavelength of the LED chip emitted by the stylus is measured by the first camera and attached to the wafer ring. Based on the information stored in the storage unit as the emission data of the LED chip as mapping data in a state, a plurality of the encapsulating materials are enclosed in the envelope so as to emit a predetermined emission wavelength. It is an object of the present invention to provide a semiconductor light emitting device manufacturing apparatus characterized by the above.

And a device stylus that emits light by energizing an electrode of a semiconductor light emitting device encapsulating a sealing material by the enclosing portion, and a second camera that measures a light emission wavelength of the emitted semiconductor device. Controlled by the control unit to adjust the type and amount of the sealing material of the encapsulating unit based on the measurement result of, and further, a constant emission wavelength region preset by the measurement of the second camera When an external semiconductor light emitting device is produced, a semiconductor light emitting device manufacturing apparatus is provided that is controlled by the control unit so as to additionally enclose the encapsulant in accordance with the encapsulating unit. .

With the LED chip 20 attached to the wafer ring 21, the stylus 30 is energized to emit light, and the color tone is imaged and analyzed by the first camera 35, and the color tone and position of each LED chip 20 are analyzed. The data is stored in the storage unit 3 as mapping data.
Next, the suction chip 40 sucks and holds the LED chip 20, and the mount base 38 applies an adhesive to the back surface of the LED chip 20 to the mortar-shaped bottom surface inside the envelope 10 stored in the tray 22. Glue. The controller 2 controls the state so that the second camera 36 confirms the positioning. Further, the third camera 37 images and positions the state of the LED chip 20 sucked and held by the suction head 40. Since the second camera 37 checks the position of the LED chip 20 with the third camera 37, the envelope 10 can be adhered to an accurate position.
Next, after wiring 16 and 17 is performed on the external terminals 18 and 19 and the electrodes 202 and 203 of the LED chip 20 by the wiring head 42, sealing is calculated and designated based on the color tone data of the mapping data stored in the storage unit 3. The materials A, B, C, and D are encapsulated inside the envelope 10 by the calculated and specified amount.

Through the above operation, the semiconductor light emitting device 9 is manufactured by unifying the variation of light color tone due to the crystal structure of the LED chip 20 into a predetermined white w by encapsulating several kinds of sealing materials A, B, C, and D. be able to. As a result, the yield is greatly improved and the cost can be reduced.

A configuration as shown in FIG. 2 is shown as a method for further increasing the efficiency. The LED chip 20 on which the mapping data is created while being attached to the wafer ring 21 by the stylus 30 and the first camera 35 is transferred to the probe base 50 by the suction head 40.
The envelope 10 is transported from the tray 221 by the suction head 40 in advance on the probe base 50. Then, the LED chip 20 is bonded to the bottom surface of the inner surface of the envelope 10 on the probe base 50. Then, the external terminals 18 and 19 and the LED chip 20 are wired by the wiring head 42. Then, the sealing materials A, B, C, and D corresponding to the color tone are enclosed in the envelope 10 based on the mapping data in the storage unit 3.

Thereafter, the device stylus 51 and 52 come into contact with the external terminals 18 and 19 to energize, and the semiconductor light emitting device 9 is energized to emit light. The color tone at this time is imaged by the second camera 36, and it is determined whether or not the chromaticity coordinates of a predetermined white w which is a predetermined color tone.
The semiconductor light emitting device 9 is transported to the non-defective product tray 222 by the suction head 40 if the chromaticity coordinates of the predetermined white w are present. If the chromaticity coordinates of the predetermined white w are not included, an additional encapsulant is encapsulated according to the result calculated based on the tone data (including the error range), and a new encapsulant layer 141 as illustrated in FIG. Form.

The device stylus 51, 52 is brought into contact with the semiconductor light emitting device 9 whose color tone has changed due to the formation of the sealing material layer 141 and is energized, and the color tone is adjusted again by the second camera 36, and the predetermined white w is obtained. The semiconductor light emitting device 9 is manufactured and transported to the non-defective tray 222. Note that the data at this time is written in the mapping data in the storage unit 3, and this data is used for the subsequent work.
With the method described above, even if the LED chip 20 has a variation in emission color depending on the crystal structure, it is possible to manufacture the semiconductor light emitting device 9 with a high yield with a predetermined white w chromaticity coordinate (including an error range). it can.
Further, the distribution unevenness of the phosphor particles 13 contained in the sealing material 12, particularly, the phosphor particles 13 are precipitated with the passage of time, and the distribution unevenness occurs. The change in color tone due to this can be corrected. . This makes it possible to manufacture the semiconductor light emitting device 9 with higher yield and efficiency.

Further, the semiconductor light-emitting device manufacturing apparatus 1A shown in FIG. As shown in FIG. 3, the LED chip 20 emits light upward in the envelope 10. Therefore, encapsulant 12 (for example, encapsulant A ′) that does not contain phosphor particles 13 is horizontally sealed up to the vicinity of the upper surface of LED chip 20 in envelope 10 to create encapsulant layer 143. However, after that, the sealing material layers 142 and 141 are manufactured by additionally encapsulating the color tone adjusting encapsulant 12 (for example, the encapsulating material B′.D′.C ′) containing the phosphor 13. The semiconductor light emitting device 9 having a predetermined white w color tone can be efficiently manufactured at an increased cost.
It is desirable to encapsulate the sealing material A ′ using a plastic material so that the lower sealing material layer 143 is flat (horizontal with respect to the LED chip 20). For this purpose, the probe base 50 may be vibrated so that the sealing material 12 can be sealed horizontally. If the lower encapsulant layer 143 is horizontal, the encapsulant layers 141 and 142 superimposed on it can also be horizontal, and the phosphor particles 13 are excited in a uniform amount, so that all the blue LEDs manufactured Converted into a predetermined white light color by the light in the wavelength range converted by exciting the phosphor with the blue light emitted from the chip 201 and the blue light that has passed through the resin (encapsulant base material) without being converted. Thus, light can be emitted and the yield can be improved and provided at a low cost.

  In the present invention, the LED chip 20 attached to the wafer ring 21 is energized to emit light, and the color tone at that time is measured by the first camera 35 and stored in the storage unit 3 as map data. By encapsulating the calculated amount of encapsulant 12 (ABCD) containing different phosphor particles 13 calculated in the above, it is intended to provide a semiconductor light emitting device manufacturing apparatus that manufactures a predetermined white w semiconductor light emitting device 9 with high yield Is.

1 and 2 show a semiconductor light emitting device manufacturing apparatus according to the present invention. First, the semiconductor light emitting device manufacturing apparatus of FIG. 1 will be described. In the apparatus according to the present invention, a working device is placed on a table that is a main body 1 or 1A, and a control unit 2 and a storage unit 3 are installed inside the main body 1 or 1A.
The LED chip 20 provided by being stuck to the wafer ring 21 is transferred to the wafer ring case 15 and inserted from the upper trend. The wafer ring case 15 can be moved in the X and Y directions by the wafer ring XY table 25.

  There are electrodes 202 and 203 on the upper surface of the provided LED chip 20, and the LED chip 20 attached to the wafer ring 21 emits light when the stylus 30 comes into contact with the terminals and energizes. The color tone emitted by the LED chip 20 is imaged by the first camera 35, and the color tone and position of each LED chip 20 are stored in the storage unit 3 as map data.

The stylus 30 is configured such that when the stylus motor 301 is driven, the screw shaft 302 is rotated so that the stylus 30 fixed to the screw bearing 303 moves up and down to contact the electrodes 202 and 203 of the LED chip 20. Yes.
After the color tones of all the LED chips 20 attached to the wafer ring 21 are imaged and stored as mapping data in the storage unit 3, the suction head 40 moves onto each LED chip 20 and holds the LED chips 20 by suction. And move in the X direction.

At this time, when the head motor 49 is driven, the screw shaft 491 rotates and the suction head 40, the wiring head 42, and the enclosing heads 45, 46, 47, 48 fixed to the screw bearing 492 move in the X direction. ing.
Similarly, when the suction head motor 401 is driven, the screw shaft 402 rotates and the suction head 40 fixed to the screw bearing 404 moves up and down.

A suction device for holding and releasing the LED chip 20 is attached to the tip of the suction head 40, and the controller 2 controls the suction and release of the LED chip 20.
The LED chip 20 sucked and held by the suction head 40 is configured such that an adhesive is applied to the back surface of the LED chip 20 above the mount base 38.

The LED chip 20 that has been applied with adhesive and sucked and held at the tip of the suction head 40 is imaged from below by the third camera 37, and how the suction head 40 is sucked and held is imaged and corrected. Control is performed by the control unit 2 as described above.
When the angle between the suction head 40 and the sucked LED chip 20 is shifted, the suction head 40 can be rotated by driving the suction head rotating motor 403.
As described above, the control unit 2 controls the head 40 and the LED chip 20 so as to be corrected by the imaging of the third camera 37 even if the positional deviation between the head 40 and the LED chip 20 occurs.

Next, the LED chip 20 is adsorbed to the adsorption head 40 and bonded and fixed to a predetermined position of the envelope 10 accommodated in the tray 22.
As the adhesive, a thermosetting adhesive or an adhesive curable by ultraviolet irradiation is used, and a heater for thermosetting the adhesive is provided at the tip of the suction head 40. In the case of curing by ultraviolet irradiation, ultraviolet rays are irradiated from the vicinity of the tray XY table 26.

  The tray 22 is configured to be movable and rotated in the XY direction and, if necessary, in the θ direction by a tray XY table 26. As a result, the control unit 2 controls the LED chip 20 to be adhered by imaging with the second camera 36 so that the LED chip 20 is accurately adhered to a predetermined position of the envelope 10 in the tray 22. Since the second camera 36 checks the position of the LED chip 20 with the third camera 37, the envelope 10 can be adhered to an accurate position.

When the LED chip 20 is bonded to the envelope 10, the suction head 40 moves up, and then the wiring head 42 is lowered by driving the wiring head motor 421 to perform wirings 16 and 17 in FIG. As a result, current can be supplied from the external terminals 18 and 19 to the electrodes 202 and 203 of the LED chip 20.
If necessary, the state of wiring can also be imaged by the second camera 36 to confirm whether the wiring is correctly performed.

When the LED chip 20 is bonded to the envelope 10 in the tray 22 and the wirings 16 and 17 are connected, one of the sealing materials ABCD selected by the calculation in the envelope is calculated. The semiconductor light emitting device 9 is formed in a state as shown in FIG.
The sealing material 12 may be sealed after wiring is completed, or may be sealed at once after wiring of all the envelopes 10 stored in the tray 22 is completed.
In any case, the encapsulating material 12 often causes uneven distribution of the phosphor particles 13 over time, and it is desirable to complete the enclosing operation in as short a time as possible.

When the sealing material 12 is sealed with the sealing heads 45, 46, 47, and 48, the color tone of the LED chip 20 adhered to the envelope 10 of the tray 22 is determined according to the mapping data stored in the storage unit 3. The control unit 2 and the storage unit 3 recognize that there is uneven color as shown in FIG.
If the color tone of the LED chip 20 adhered to the envelope 10 of the tray 22 is blue white a, green white b, yellow white c, red white d, the data is stored in the storage unit 3. The control unit 2 controls the encapsulating heads 45, 46, 47, and 48 with the prescribed amounts calculated from the mapping data information for the different sealing materials A, B, C, and D of the phosphor particles 13 according to the mapping data Then, the inside of the envelope 10 stored in the tray 22 is sealed.

By completing the sealing operation of the sealing material 12 with the above-described configuration, the white white a, the green white b, the yellow white c, and the red white d approximate to the predetermined white w The semiconductor device 9 having the above-described color tone can be manufactured, and the yield can be improved and the efficiency can be greatly improved.
The semiconductor light emitting device 9 completed in this way is conveyed along with the tray 22 in the downstream process.

A further improvement of the semiconductor light emitting device manufacturing apparatus of FIG. 1 is the embodiment shown in FIG. As in the above-described embodiment, the wafer ring case XY table 25 is moved in the X direction and the Y direction, and the stylus 30 is moved up and down by driving the stylus motor 301 so that the LED chip 20 attached to the wafer ring 21 emits light. .
The color tone is imaged by the first camera 35 and mapping data is created by combining with the position calculated from the moving distance of the wafer ring case XY table 25 and stored in the storage unit 3. The above is the same as the above-described embodiment.

In FIG. 2, there is a probe XY table 27 at the center, which moves the probe base 50 in the X and Y directions, and rotates in the θ direction if necessary.
The suction head 40 sucks and holds one envelope 10 from the tray 221 placed on the tray table 28 and places it on the probe base 50. If necessary, the state is imaged by the second camera 36 to confirm the position.

  Next, the LED chip 20 affixed to the wafer ring 21 is sucked and held, an adhesive is applied with the mounting material 38, and the state of the LED chip 20 sucked and held by the suction head 40 is imaged with a third camera, and the suction head The motor 401 is driven to adjust the rotational misalignment and adhere to the probe table 50 at the designated position of the envelope 10 placed from the tray 221 as described above. Since the second camera 36 checks the position of the LED chip 20 with the third camera 37, the envelope 10 can be adhered to an accurate position.

The state at this time is controlled by the control unit 2 so that the state of the LED chip 20 picked up by the second camera 36 and picked up by the third camera matches the state of the envelope 10 picked up by the second camera. And glued.
Next, the wiring head 40 descends to the probe base 50 and wiring work for the wirings 16 and 17 is performed.

Next, based on the information of the mapping data stored in the storage unit 3 as in the above-described embodiment, for example, if the chip 20 placed on the probe base 50 has the color tone of bluish white a in FIG. The encapsulant A containing the phosphor particles 13 so that the white a approaches the predetermined white w is enclosed in the envelope 10 in the calculated amount.
Similarly, if the LED chip 20 mounted on the probe base 50 by the suction head 40 has a color tone of greenish white b according to the mapping data information, the greenish white b approaches the predetermined white w. The sealing material B containing the body particles 13 is sealed in the envelope 10 in the calculated amount.
Similarly, in the case of the LED chip 20 of yellow white c and red white d, the calculated amount of the sealing materials C and D containing the phosphor particles 13 approaching the predetermined white w, the envelope 10 Enclose in.

As a result, the semiconductor light emitting device 9 manufactured on the probe base 50 is manufactured as close as possible to the predetermined white w (including the error range).
As described above, when the device stylus 51, 52 contacts the external terminals 18, 19 of the semiconductor light emitting device 9 manufactured on the probe base 50 and is energized, the LED chip 20 is caused to emit light and the color tone is adjusted to the second camera. It is determined whether or not it is a predetermined white w after picking up an image at 36.

In the embodiment as described above, by adjusting the adjustment function in the semiconductor light emitting device manufacturing apparatus 1A of FIG. 2, it is possible to adjust the color tone due to the difference in the crystal structure of the LED chip 20, and to the sealing material 12 over time Differences in color tone due to uneven distribution due to precipitation of the phosphor particles 13 contained can also be adjusted.
Note that the data at this time is written in the mapping data of the storage unit 3, and the subsequent work can be made more efficiently if this data is used.

If a semiconductor light emitting device 9 with a color tone different from the predetermined white w is created even if it is adjusted as described above, the color tone is measured with the second camera 36 and further calculated, and any of the sealing materials ABCD 3 is added so that the predetermined white w can be manufactured by adding the sealing material layer 141 of FIG. The data at this time is also written in the mapping data in the storage unit 3, and the subsequent work can be made more efficiently if this data is used.

The semiconductor light emitting device manufacturing apparatus 1A shown in FIG. 2 can perform various processes as described above.
If the predetermined white w cannot be produced even after the above processing, it may be conveyed by the suction head 40 so as to be discarded in the disposal tray 223.
The semiconductor light emitting device 9 having a predetermined white w can be manufactured at a low yield with a high yield by the method described above.

Still another embodiment will be described.
As described above, the semiconductor light emitting device 9 illustrated in FIG. 3 is converted into light in the wavelength region converted by exciting the phosphor particles 13 contained in the sealing material 12 enclosed in the envelope 10. Instead, the blue light that has passed through the resin (encapsulant base material) is converted into a predetermined white w light color to emit light.

Therefore, the phosphor particles 13 that are excited at the time of light emission are excited by the phosphor particles 13 that are above the LED chip 20. The phosphor particles 13 below the LED chip 20 do not act.
Therefore, an inexpensive and efficient semiconductor light emitting device can be manufactured by using the sealing material 12 containing no phosphor particles in the sealing material layer 143.

If the sealing material does not contain phosphor particles 13, it is only necessary to consider viscosity and curability, and it is not necessary to consider particle mass and viscosity so as to prevent uneven distribution of phosphor particles 13. The range of materials selection is greatly expanded.
As a result, it is possible to use an encapsulant that is encapsulated in the encapsulant layer 143 and cured horizontally (in parallel with the LED chip 20). Alternatively, it can be vibrated so as to be cured in a horizontal state, heated, or irradiated with ultraviolet rays. That is, since a sealing material with good workability can be used, a semiconductor light emitting device can be manufactured at low cost.

If the encapsulant layer 143 is encapsulated so as to be parallel to the LED chip 20, the encapsulant layer 142 containing the phosphor particles 13 stacked thereon is formed on the encapsulant layer 143 with the same thickness. When applied in an overlapping manner, the predetermined white w is emitted uniformly without changing the color tone depending on the emission angle. Further, as described above, the probe base 50 may be vibrated, heated, or irradiated with ultraviolet rays so that the sealing material layer 141.142.143 is sealed in parallel with the LED chip 20.

For example, after the sealing material A ′ of the sealing material layer 143 is horizontally enclosed and distributed, the other sealing material selected by calculation based on the information of the mapping data stored in the storage unit 3 in the sealing material layer 142 B ', C', and D 'are selected and calculated.
Next, the device stylus 51.52 of the probe base 50 is energized by contacting the external terminal 18.19, causing the semiconductor light emitting device 9 to emit light, inspecting the color tone with the second camera 36, and if necessary, further selected by calculation. Other sealing materials B ′, C ′, D ′ are sealed in the sealing material layer 141.

According to the above method, the sealing material A ′ that does not consider the phosphor particles 13 can be used. In addition, it is possible to select a sealing material A ′ that is easy to set at the height of the LED chip 20 and is easy to control so as to be parallel to the LED chip 20.
As a result, the encapsulant layer 141.142 can also be encapsulated easily (easily parallel to the LED chip 20), and a change in color tone due to uneven thickness of the encapsulant layer can be prevented.

In order to achieve the above, the encapsulating head 45 of FIG. 2 does not contain the phosphor particles 13 to be encapsulated in the encapsulant layer 143 and uses the encapsulant A ′ that is easily leveled, and the LED chip 20 By filling the sealing material A ′ up to the vicinity of the upper surface, it is possible to maintain the level and improve the work efficiency and suppress the generation of defective products.

After using the sealing material A ′ used for the sealing material layer 143 to the vicinity of the upper surface of the LED chip 20 as described above, the sealing materials B ′, C ′, housed in the sealing head 46.47.48 A sealing material layer 142 is formed by encapsulating D ′.
Thereafter, the semiconductor light emitting device 9 is caused to emit light, and calibration (color adjustment) is performed again to encapsulate the selected encapsulant B ′, C ′, D ′ calculated and selected in the encapsulant layer 141. This time, three layers of 141.142.143 are described as the sealing material layer, but there may be many layers.

With such a manufacturing method, the encapsulant 12 can be encapsulated horizontally and the phosphor particles 13 can be encapsulated uniformly, and the semiconductor light emitting device 9 can be manufactured so that the phosphor particles are not unevenly distributed. it can.
Also, in order to make the sealing material 12 horizontal, the probe base 50 vibrates finely so that the first sealing material 143 is filled horizontally, and then it is cured by applying heat or irradiating ultraviolet rays. You can also

With the semiconductor light emitting device manufacturing apparatus as described above, the sealing material layer 14 having a horizontal and uniform thickness is completed, and the semiconductor light emitting device 9 can be manufactured with a uniform and high yield without changing the color tone of the semiconductor light emitting device 9. .

According to the first embodiment, a semiconductor light emitting device 9 of a predetermined white w is manufactured by encapsulating several kinds of sealing materials A, B, C, and D with variations in light color tone due to the crystal structure of the LED chip 20 can do. As a result, the yield can be greatly improved and the cost can be reduced.

According to the second embodiment, uneven distribution of the phosphor particles 13 contained in the sealing material 12, particularly uneven distribution over time, occurs, and the change in color tone can be corrected. This makes it possible to manufacture the semiconductor light emitting device 9 with higher yield and efficiency.
Further, according to the third embodiment, the following can be manufactured with the semiconductor light emitting device manufacturing apparatus 1A of FIG. As shown in FIG. 3, the LED chip 20 emits light upward in the envelope 10.

Therefore, the sealing material layer 143 is formed by enclosing the sealing material 12 (for example, the sealing material A 45) that does not contain the phosphor particles 13 horizontally until the upper surface of the LED chip 20 in the envelope 10 is near. After that, the encapsulant 12 for color tone adjustment containing the phosphor 13 (for example, the encapsulant BDC, 45, 46, 47) is additionally encapsulated to produce the encapsulant layers 142, 141, thereby further reducing the cost. The semiconductor light emitting device 9 having a predetermined white w color tone can be manufactured efficiently.

The sealing material 12 is preferably made of a plastic material, and the lower sealing material layer 143 is preferably sealed so as to be flat (horizontal with respect to the LED chip 20). For this purpose, the probe base 50 may be vibrated so that the sealing material 12 can be sealed horizontally.

If the lower encapsulant layer 143 is horizontal, the encapsulant layers 141 and 142 superimposed thereon can also be made horizontal, and the phosphor particles 13 are excited in a uniform amount, so that the blue LED chip 201 emits light. The light of the wavelength range converted by exciting the phosphor with the blue light and the blue light that has passed through the resin (encapsulant base material) without being converted, and converted into a predetermined white w light color Can be produced with good yield.

The present invention can be applied not only to a device for sealing an LED chip, but also to a device for sealing a semiconductor device with a plurality of resins or the like.

It is a figure which shows the semiconductor light-emitting device manufacturing apparatus of the 1st Example which concerns on this invention. It is a figure which shows the semiconductor light-emitting device manufacturing apparatus of 2nd Example which concerns on this invention. It is sectional drawing of a semiconductor light-emitting device. It is a graph which shows XY chromaticity diagram. It is a figure of the aggregate substrate used for manufacture of the conventional semiconductor light-emitting device.

1
Body
1A body
2
Control unit
Three
Storage
9
Semiconductor light emitting device
Ten
Envelope (package)
12 Encapsulant
13
Phosphor particles
14
Sealing material layer
141
Sealing material layer
142
Sealing material layer
143
Sealing material layer
15 Wafer ring case
16 Wiring
17
wiring
18
External terminal
19
External terminal
20
LED chip
201
Blue LED chip
202
electrode
203
electrode
twenty one
Wafer ring
twenty two
tray
221
tray
222
Good product tray
223
Waste tray
twenty five
Wafer ring XY table
26
Tray XY table
27
Probe XY table
28
Tray table
30
Stylus
301
Stylus motor
302
Screw shaft
303
Screw bearing
35
First camera
36
Second camera
37
Third camera
38
Mount stand
40 Suction head
401
Suction head motor
402
Screw shaft
403
Rotating motor
404
Screw bearing
42
Wiring head
421 Wiring head motor
45
Encapsulation head
46
Encapsulation head
47
Encapsulation head
48
Encapsulation head
49
Head motor
491
Screw shaft
492
Screw bearing
50
Probe base 50
51
Device stylus
52
Device stylus
90
Assembly board
91
Sealing resin
92
Recess
93
border
a Blue white
b Greenish white
c Yellowish white
d reddish white
w Predetermined white

Claims (5)

In a semiconductor light emitting device manufacturing apparatus configured to enclose a plurality of sealing materials containing phosphor particles by mounting an LED chip provided by being attached to a wafer ring on an envelope,
A stylus that emits light by energizing the electrodes of the LED chip in a state of being attached to the wafer ring;
A first camera for measuring the emission wavelength of the LED chip that has been made to emit light;
A storage unit that stores the position and emission wavelength of the LED chip as mapping data;
An enclosing unit that encloses a predetermined amount of a predetermined sealing material calculated based on emission wavelength information of mapping data of the storage unit in the envelope on which the LED chip is mounted, the stylus, the first camera, and the memory And a control unit for controlling the enclosing unit,
Based on the information stored in the storage unit as mapping data of the emission wavelength of the LED chip measured with the first camera and attached to the wafer ring, the emission wavelength of the LED chip emitted by the stylus A semiconductor light emitting device manufacturing apparatus characterized in that a plurality of the encapsulating materials are enclosed in the envelope so as to emit a predetermined emission wavelength.
A device stylus that emits light by energizing an electrode of a semiconductor light emitting device encapsulating a sealing material by the enclosing portion; and
A second camera for measuring the emission wavelength of the semiconductor device that has been made to emit light;
2. The semiconductor light emitting device manufacturing apparatus according to claim 1, wherein the control unit controls the type and amount of the sealing material of the encapsulating unit based on a measurement result of the second camera.
When a semiconductor light emitting device outside the predetermined light emission wavelength region set in advance by the measurement of the second camera is produced, the control unit controls the enclosure so as to additionally enclose the encapsulant corresponding thereto. 3. The semiconductor light emitting device manufacturing apparatus according to claim 1, wherein the device is a semiconductor light emitting device manufacturing apparatus.
When encapsulating the encapsulant, after encapsulating the encapsulant containing no phosphor particles horizontally up to the vicinity of the upper surface of the LED chip, the encapsulant containing the phosphor particles is additionally encapsulated 2. The semiconductor light emitting device manufacturing apparatus according to claim 1, wherein:
4. The semiconductor light-emitting device manufacturing apparatus according to claim 1, wherein the envelope is vibrated when the encapsulant is encapsulated so that the surface of the encapsulant is horizontal.