JP2005049163A - Test jig and probe for test apparatus of device for high frequency and high speed - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a test jig for a test apparatus of devices for high frequencies and high speeds etc. capable of facilitating the insertion of a capacity loaded probe for a power source and a probe for grounding in a metal block and securing electric connection to the metal block. <P>SOLUTION: A plurality of probes such as a probe 3 for signals, a probe 4 for the power source, and a probe 5 for grounding are provided in such a way as to pass through the metal block 1 so that tip parts of movable pins 11 may protrude to one surface side of the metal block 1. A device to be tested 20 is pressed against the one surface side of the metal block 1 to bring electrode terminals 21-24 of the device to be tested 20 each into contact with tip parts of the probes 3-5 to test the characteristics of the device to be tested 20. At least part of the probes among the plurality of the probes 3-5 are provided in such a way that ground potential layers in their periphery may be in contact with the metal block 1 via contact parts of a metal sleeves 9. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention is, for example, an amplifier circuit or a mixer circuit incorporated in a mobile phone, for high frequency / high speed (analog having a high frequency is called high frequency, and digital having a very small pulse width and pulse interval is called high speed, The present invention relates to an inspection jig for inspecting a high-frequency / high-speed device for inspecting a semiconductor wafer, IC, module, etc. More specifically, high-frequency and high-speed devices can be inspected accurately by removing external noise on the power supply line and grounding the earth line without being affected by noise. The present invention relates to a jig and an inspection probe.
[0002]
[Prior art]
For example, when a high-frequency or high-speed device such as a semiconductor wafer, IC, or module is inspected, it is easy to pick up noise at the exposed portion of the lead or the like. For example, as shown in FIG. Each of the devices 20 to be inspected through an inspection jig having a spring-loaded RF signal (used to include both high-frequency and high-speed) probes 3, a power supply probe 4 and a grounding probe 5 provided in the block 1. It is comprised so that it may connect with the electrode terminals 21-23 (for example, refer patent document 1). With such an inspection jig, the RF signal is connected to the RF signal probe 3 via the coaxial cable 7, and a gap is formed between the device under test 20 and the thin presser plate 8 on the metal block 1 due to the contraction of the spring. In addition, the signal is input / output while the contact between the RF signal probe 3 and the electrode terminal of the device under test 20 is ensured by a spring so that noise is not picked up as much as possible. . In FIG. 6A, reference numeral 6 denotes a wiring board made of a printed board or the like and forming the input side power supply wiring.
[0003]
Further, a structure in which the RF signal probe 3 has a coaxial structure to make it difficult to pick up noise has been considered. On the other hand, even if high frequency or high speed noise is applied to the power supply terminal 23, the power supply voltage is shaken by the noise, and the amplifier or the like oscillates and cannot perform accurate measurement. Therefore, for example, a low-pass filter 61 composed of an LC circuit of a coil L and a capacitor C as shown in FIG. 6B is formed on a wiring board (printed board) 6 on the input side of the power probe 4, By connecting a chip capacitor (bypass capacitor) between the input side of the probe 4 and the ground on the wiring board (printed circuit board) 6, a method of removing high-frequency and high-speed noise on the power wiring is used. Yes.
[0004]
However, with the progress of high frequency and high speed in recent years, high integration of circuits and miniaturization of packages are remarkable, and metal blocks are used due to increase in the number of terminals (number of electrodes) and reduction in pitch between terminals. Of course, it is easy to be affected by the structure that is not connected to the power supply probe in the metal block, and it is very easy for noise to be superimposed on the input side to the power supply probe in the metal block. In the structure in which the chip capacitor is provided, there is a problem that an accurate inspection that is not affected by noise cannot be performed completely.
[0005]
Further, in a high-frequency / high-speed device, it is not necessary that the ground terminal is located anywhere, and an accurate inspection cannot be performed unless it is provided in a state where a current can be reliably flowed near the signal terminal. Therefore, the inspection jig having the structure shown in FIG. 6 uses a structure in which the contact probe 5 for grounding is penetrated into the metal block 1.
[0006]
[Patent Document 1]
JP 2001-99889 A
[0007]
[Problems to be solved by the invention]
As described above, in order to remove the RF noise transmitted to the power probe, it is not sufficient to provide a low-pass filter or chip capacitor on the input side. By forming a dielectric layer and providing a metal film on the outside, a capacitor is formed to completely remove the noise on the power supply line and not to pick up new noise in the metal block. Developed and disclosed in PCT / JP03 / 01277. Since the capacitor formed on the outer periphery of the contact probe for power supply must be connected between the power supply line and the ground, the metal film provided on the outer periphery of the dielectric cylinder (layer) is a through hole of the metal block. Must be firmly and electrically connected to the inner wall of the building.
[0008]
Therefore, it needs to be formed in a dimensional relationship such that it is press-fitted into a through-hole provided in the metal block. However, since the dielectric cylinder is a capacitor, it is necessary to use ceramics with a high dielectric constant, and the material may be brittle. There is a problem that ceramics are damaged when press-fitting into the through hole. In addition, if the dielectric cylinder is not straight, and there is even a slight warp, there is a problem that it will not be inserted into the through-hole and will be damaged if it is forced to press-fit.
[0009]
Furthermore, even with a contact probe for grounding, if the press-fit dimension is such that the contact probe is deformed, the metal pipe of the contact probe is deformed and the spring provided therein does not function. Although the dimensions are formed, the connection by contact between metals is very unstable. If there is even a slight contact unstable part, the current characteristics become very unstable and stable in high-frequency / high-speed devices. The inventors have found that they cannot be examined. However, the contact probe has to move up and down due to the load, and it is necessary to replace the contact probe itself when the movable pin is consumed. Cannot be glued.
[0010]
The present invention has been made to solve such a problem. When inspecting the electrical characteristics of a high-frequency / high-speed device, an electrode terminal of the device to be inspected is formed by penetrating a contact probe into the metal block. A high-speed, high-speed structure that makes it easy to insert a capacitive load type power supply probe or grounding probe into a metal block, and ensure electrical connection with the metal block. An object is to provide an inspection jig for an inspection apparatus such as a device.
[0011]
Another object of the present invention is when a capacitor is loaded on a power probe that is brought into contact with the power supply terminal of the device under test in order to suppress the influence of noise on the power supply line when inspecting a high-frequency / high-speed device. Another object of the present invention is to provide a capacity-loading type inspection probe having a structure that can be easily inserted into a through-hole of a metal block and can reliably make electrical contact with the metal block.
[0012]
[Means for Solving the Problems]
An inspection jig for a high-frequency / high-speed device according to the present invention has a metal block and a movable pin whose tip length is movable, so that the tip of the movable pin protrudes on one side of the metal block. A plurality of probes for power supply, grounding and signal provided through the metal block, and the device under test is pressed against the one surface side of the metal block, and each electrode terminal of the device under test An inspection jig for inspecting characteristics of the device to be inspected by bringing the probe into contact with the tip of the probe, wherein at least a part of the plurality of probes has a metal sleeve having an outer peripheral ground potential layer It is provided so as to come into contact with the metal block via The metal sleeve is preferably provided with a contact portion such as a protrusion or a convex portion that easily comes into partial contact with the inner surface and the outer surface.
[0013]
Here, the movable pin means a pin whose tip can move along the axial direction such that the tip of the pin is contracted by the spring or the like when held and pressed by the spring or the like.
[0014]
With this configuration, a probe in which the outermost layer of the probe is formed as a ground potential layer, such as a probe with a capacity loading type, a probe for grounding, and a signal probe with a coaxial structure is used as a metal block. Even when it is inserted into the through-hole of the device and connected to the electrode terminal of the device under test, it is inserted into the through-hole through the metal sleeve, so that it is not necessary to press-fit the probe directly into the through-hole of the metal block. What is necessary is just to insert in the metal sleeve which has spring property. As a result, the probe can be inserted without being damaged or bent. In addition, the metal sleeve and the outermost layer of the probe can be electrically connected by deforming the perfect circle of the metal sleeve into an ellipse or by forming partial contact portions such as protrusions on the inner and outer surfaces. When the inner surface of the metal sleeve is deformed, such as protrusions, the metal sleeve protrudes to the outside of the metal sleeve, and the protruding portion is electrically connected to the inner wall of the through hole of the metal block. Connection can be ensured.
[0015]
As a result, it is possible not only to eliminate troubles during insertion into the through hole of the metal block, but also to ensure electrical connection between the metal block and the probe outermost layer.
[0016]
The power supply probe is a capacitance loaded probe in which a capacitor is formed by providing a dielectric layer and a metal film on the outer periphery of a contact probe, and the metal film contacts the metal block via the metal sleeve. This structure is particularly preferable because it can be inserted into the through hole of the metal block without damaging the ceramic forming the capacitor when inserted into the through hole of the metal block. That is, in a capacitance loaded type probe, it is easier to remove even low-frequency noise when the capacitance (capacitance) is increased. Therefore, ceramics having a large relative dielectric constant are used to increase the capacitance with a small probe. Ceramics are fragile and are easily damaged by slight external forces, and may be bent due to the characteristics of the molding process. An attempt is made to press-fit a contact probe with a dielectric cylinder made of these ceramics into the through hole of a metal block. Then, it is easy to break. However, such a problem is eliminated by adopting the configuration of the present invention.
[0017]
A capacity-loading type inspection probe according to the present invention is provided with a metal pipe, and is electrically connected to the metal pipe in the metal pipe, and at least a protrusion length protruding from one end of the metal pipe can be made variable. A movable pin, a dielectric layer provided on the outer periphery of the metal pipe, a first metal film provided on the outer peripheral surface of the dielectric layer, and provided around the first metal film, partially in the first The metal sleeve is formed with a contact portion that easily contacts one metal film, and a capacitance is formed between the movable pin and the metal sleeve.
[0018]
DETAILED DESCRIPTION OF THE INVENTION
Next, the inspection jig and inspection probe of the high-frequency / high-speed device of the present invention will be described with reference to the drawings. The inspection jig according to the present invention connects the device 20 to be inspected and an inspection apparatus (not shown), and FIGS. 1 (a) and 1 (b) show an explanatory sectional view and a partially enlarged explanatory sectional view. The signal probe 3, the power supply probe 4, and the grounding probe 5 have a movable pin 11 having a movable protrusion length at the tip, and the tip of the movable pin 11 protrudes on one side of the metal block 1. A plurality of probes are provided through the metal block 1. Then, the device to be inspected 20 is pressed against one surface side of the metal block 1, and the characteristics of the device to be inspected 20 are brought into contact with the electrode terminals 21 to 24 of the device under inspection 20 and the tips of the probes 3 to 5, respectively. Inspection is done. In the present invention, among the plurality of probes 3 to 5, at least a part of the probes is provided such that the ground potential layer on the outer periphery contacts the metal block 1 through the metal sleeve 9.
[0019]
A capacity loading type inspection probe (electrode probe) 4 provided with the metal sleeve 9 is shown in FIG. 2 (a) as a longitudinal sectional view of one embodiment thereof, and in FIG. As shown in the cross-sectional explanatory diagrams of −B, the dielectric layer 15 is provided on the outer periphery of the contact probe 10 via the second metal film 16, and the first metal film 17 is provided on the outer peripheral surface of the dielectric layer 15. As a result, a capacitor 18 is formed between the second metal film 16 (movable pins 11 and 12) and the first metal film 17 (metal sleeve 9), as shown in the equivalent circuit diagram of FIG. The capacitor 18 is connected between the power supply line and the ground. Further, a metal sleeve 9 is inserted on the outer periphery thereof. The metal sleeve 9 may be inserted into the through hole of the metal block 1 first, and the contact probe 10 provided with the dielectric layer 15 or the like may be inserted into the metal sleeve 9 later.
[0020]
The contact probe 10 has movable pins (plungers) 11 and 12 so that the protruding length of the tip portion can be varied from at least one end of the metal pipe 13 and is electrically connected to the metal pipe 13 without coming out to the outside. Is formed in the metal pipe 13. That is, for example, if the movable pins 11, 12 are pushed outward by the spring 14 provided in the metal pipe 13 and the tips of the movable pins 11, 12 are pushed by an external force, the spring 14 is contracted to move the movable pins 11, 12. 12 is configured to retract. The movable pins 11 and 12 do not need to be provided at both ends of the metal pipe 13, and only one of them may be used depending on the application. The structure of the contact probe (contact portion) is the same for the grounding probe 5 and the signal probe 3.
[0021]
In the example shown in FIG. 2, a dielectric cylinder 15 in which a dielectric is formed in a cylindrical shape is used as the dielectric layer for forming the capacitor 18. The capacitor 18 is formed by providing the second and first metal films 16 and 17 on the inner and outer peripheral walls of the dielectric cylinder 15 by electroless plating or the like. By providing the first and second metal films 17 and 16 on both surfaces of the dielectric cylinder 15, no voids are formed on both surfaces of the dielectric, so that the capacitor functions sufficiently. The second metal film 16 is electrically connected to the metal pipe 13.
[0022]
The dielectric cylinder 15 is formed, for example, in a size having an inner diameter of about 0.3 mm, an outer diameter of about 0.6 mm, and a length of about 6 mm. This is because the number of electrode terminals has increased with the integration of ICs and the like, and recently, electrode terminals are not provided only around the chip, but are formed on the entire surface of the chip by a BGA (ball grid array) package. If the number of electrode terminals is large, 1 cm ² This is because about 400 electrode terminals are provided for each probe, so that the probe interval is very small.
[0023]
The metal sleeve 9 is made of an elastic material, for example, a copper-based material such as phosphor bronze or brass, and is gold-plated. The inner diameter is slightly larger than the outer diameter of the first metal film 17 described above, is about 0.7 mm, and the outer diameter is about 0.83 mm. As a result, even a highly integrated IC in which electrode terminals are provided at a pitch of 1 mm can sufficiently cope. As shown in FIG. 2 (b), the metal sleeve 9 has projections 9a as contact portions to the inside of the sleeve at about three locations along the circumferential direction, as shown in FIG. 2 (b). However, it is formed to a depth of, for example, about 0.05 mm (the diameter of the inscribed circle at the tip of the protrusion 9a is about 0.6 mm). The number of protrusions 9a along the circumferential direction is not limited to three, and may be two or four or may be continuously formed (rolled) along the circumferential direction.
[0024]
However, considering the electrical contact with the first metal film 17 on the outer periphery of the dielectric layer 15, the three points are preferable because electrical contact can be obtained most reliably. In other words, any surface has irregularities on the surface, and the surfaces cannot be brought into full contact with each other, and when viewed microscopically, they always come into contact at a pointed part and are not in contact with other parts. . Therefore, if the pointed part contacts at three points, the other part does not contact. Therefore, if a protrusion is provided on the entire circumference, the contact tends to be unstable. However, according to the present invention, the contact probe is pressed into the protrusion made of an elastic material. Even if the portion is provided, the protruding portion is easily deformed and reliable contact is easily obtained.
[0025]
The number of the axial projections 9a may be one or a plurality of locations. However, if the length of the contact probe is about 6 mm, about two locations on the top and bottom may be provided. It is preferable because it is easy to prevent. On the other hand, even if three or more protrusions are formed in the axial direction, if they contact at two locations, the shallow protrusion cannot contact the contact probe, and the meaning of the protrusion disappears. Is optimal.
[0026]
For example, when forming the protrusion 9a having the above-described depth, a pin gauge of 0.59 mmφ is inserted into the metal sleeve 9 and a punch or the like is used from the outer periphery of the metal sleeve 9 to form the protrusion 9a. For example, it can form in the exact depth by pressing simultaneously 3 places.
[0027]
When such a protrusion 9a is formed by, for example, a punch, the metal sleeve 9 is partially deformed, and the reaction of forming the protrusion 9a is deformed so that the outer diameter of the metal sleeve 9 is increased. To do. As a result, a portion having a partially increased outer diameter is formed, and when the probe is inserted into the through hole of the metal block 1, it becomes a contact portion between the metal sleeve 9 and the inner wall of the through hole, and electrical connection is achieved. It is definitely obtained.
[0028]
A structure in which a metal sleeve 9 is provided on the outer periphery of the grounding probe 5 is shown in FIG. 3 by a cross-sectional explanatory view similar to FIG. That is, the portion of the contact probe 10 is the same as the contact probe used for the power supply probe 4 shown in FIG. 2, and if the metal sleeve 9 is formed to have a size having an inner diameter slightly larger than the outer diameter of the contact probe 10, A protrusion having the same structure as that shown in FIG. 2 can be used. However, in the example shown in FIG. 3, a structure in which the opposing portion is crushed and formed into an elliptical shape at the center of the metal sleeve 9. An example of is shown. That is, the contact portion with the contact probe side inside the metal sleeve 9 is not limited to the above-described protrusion, and may be such an elliptical deformation. That is, since it is partially formed into an elliptical shape, it reliably contacts the internal contact probe 10 at the concave portion, and the direction perpendicular to the concave portion 9b extends to the outside. When inserted into the through hole, it can be reliably brought into contact with the inner wall of the through hole.
[0029]
Specifically, when the outer diameter of the contact probe 10 is 0.3 mm, the metal sleeve 9 is formed with an inner diameter of 0.32 mm and an outer diameter of 0.38 mm, and the inner diameter d of the crushed portion is slightly smaller than 0.3 mm. The contact probe 10 is inserted and is in contact with the outer periphery of the contact probe 10. The outer diameter D in the direction perpendicular to the crushed portion is about 0.41 mm, which is larger than the outer diameter dimension 0.38 mm of the metal sleeve 9, and is slightly larger than the inner diameter of the through hole of the metal block 1, for example, 0.4 mm. become. Such a recessed portion 9b also forms a recessed portion 9b in an opposing portion of the metal sleeve 9 by inserting a pin gauge having a diameter of about 0.29 mm into the metal sleeve 9 and sandwiching it at one location from the outer periphery. Can do.
[0030]
In the example shown in FIGS. 1 and 3, the length of the metal sleeve 9 is formed to be approximately the same as the length of the contact probe 10, but the electrical connection between the contact probe 10 and the metal block 1 is made. Since it is only necessary to reliably obtain one connection portion, it is only necessary to form one reliable connection portion, and there is no problem even if the length of the metal sleeve 9 is about half that of the contact probe 10.
[0031]
The contact portion formed on the metal sleeve 9 includes, for example, a hole formed in the metal sleeve 9 in addition to the above-described protrusion 9a and recess 9b and the protruding portion due to the reaction thereof, and then contacted by pouring solder. A contact portion is formed by soldering with a probe or the like, and the through hole of the metal block may be a contact portion formed by a protruding portion of solder, and is not limited to the above example.
[0032]
As mentioned above, even with a contact probe for grounding, if the electrical contact with the metal block is unstable, the current characteristics become very unstable in high-frequency and high-speed devices, and stable inspection can be performed. First, the present inventors have found that a reliable contact structure needs to be provided as shown in FIG. That is, as shown in FIG. 5, the tip of the movable pin 11 is formed with an electrode applied with a certain load by a spring pressure test when the grounding probe is configured in such a structure that the conventional contact probe is in direct contact with the metal block 1. As a result of scanning the top and measuring the resistance between the electrode and the ground (metal block 1) with the low resistance meter 32, the resistance value is determined by the pin number of the contact probe 10 as shown in FIG. It shows a large average resistance value as well as variations. The measuring instrument was an automatic load tester manufactured by Nihon Keisoku System Co., Ltd., and examined by moving the load sequentially so that the contact probes formed side by side on the metal block 1 were scanned in order from the end. It is. The metal block 1 is made of aluminum and plated with gold, and the inner diameter of the through hole into which the contact probe 10 (outer diameter 0.3 mm) is inserted is 0.31 mm.
[0033]
On the other hand, FIG. 4A shows the result of measuring the resistance by the same spring pressure test using the grounding probe 5 having the structure shown in FIG. As is clear from FIG. 4A, it can be seen that a very stable contact can be obtained between the movable pin 11 and the metal block 1 by contacting the metal block 1 via the metal sleeve 9.
[0034]
The metal block 1 holds the probes 3 to 5 for signals and power supplies, and is made of a metal plate such as aluminum or brass, for example, and a through hole is formed in the metal plate, and the inside of the through hole is formed. Each of the probes described above is inserted.
[0035]
The signal probe 3 has an RF signal by using a contact probe 10 as shown in FIG. 2A as a central conductor and having a coaxial structure in which an external conductor is provided via a dielectric or hollow portion having a constant impedance. This is preferable because it is possible to prevent the RF noise from passing through the movable pin without attenuating the noise. The RF signal probe 3 is connected to a coaxial cable 7 such as a semi-rigid on the side opposite to the connection end with the device under test 20.
[0036]
The wiring board 6 supplies power to the device to be inspected 20, and wiring is formed on the substrate, and its terminals are appropriately formed at locations corresponding to the terminals of the device to be inspected. In this case, as described above, a low-pass filter is formed or a chip capacitor is connected between the power supply terminal and the ground terminal on the wiring board 6. Further, instead of connecting the coaxial cable 7 directly to the other end of the signal probe 3 described above, a signal wiring is formed on the wiring board 6 and connected to the coaxial cable via the wiring. Also good.
[0037]
The presser plate 8 is made of an acrylic plate or the like, made of a thin electrically insulating material of about 0.1 to 0.2 mm, provided with a through-hole through which the movable pin 11 of each probe protrudes, and a metal block by a screw (not shown). 1 is fixed. Thereby, the metal pipe and the insulator of each probe are fixed so as not to jump out of the metal block 1. The number and arrangement of the signal probes 3, the power supply probes 4, and the grounding probes 5 are formed in accordance with the power supply terminals of the device under test 20 to be inspected. For example, input / output RF signal probes, In some cases, a power probe and a ground probe are formed one by one.
[0038]
With the configuration described above, since the movable pin is brought into contact with the device under test, the exposed portion of the lead is not in contact with the electrode terminal of the device under test and the power electrode terminal of the device under test is contacted. Since the capacitor is formed around the power probe to be used, RF noise can be removed immediately before being input to the power supply terminal of the device to be inspected, and inspection can be performed in a noise-free state. That is, when inspecting a device for high frequency and high speed, it is easy to pick up noise even with a lead having a small length, so it is necessary to reduce noise as close as possible to the device to be inspected. Since the capacitor is formed in the immediately preceding power supply probe, noise can be eliminated very effectively, and voltage drop at the power supply terminal that occurs when a high-speed switching waveform is output can be minimized.
[0039]
Furthermore, at the signal terminal, depending on the frequency of the signal, the signal probe before input does not attenuate the signal, but a probe loaded with a capacitor having a capacity to attenuate RF noise is used to superimpose the signal component. The generated noise can be effectively removed before entering the terminal of the device under test.
[0040]
As a result, it is possible to solve the problem of not oscillating amplifiers for high frequency and high speed devices or to perform accurate device inspection, and noise can be completely removed from power supply terminals and signal terminals. Accurate inspection can be done.
[0041]
As described above, the power probe may have a structure in which only the side in contact with the device to be inspected is a movable pin and the other end is directly connected by soldering or the like, but the grounding probe is similarly inspected. The movable pin may be provided only on the contact side with the device, and the other end may be fixed. Also, no grounding probe is provided, for example, through the use of anisotropic conductive rubber that is electrically conductive only in the vertical direction and is insulated in the horizontal direction, with a number of thin fine metal wires planted in the rubber. The metal block 1 and the ground terminal of the device to be inspected can be directly connected.
[0042]
According to the present invention, even when a probe in which a dielectric layer and a metal film are formed on the outer periphery of a contact probe is inserted into the through hole of the metal block, such as a capacitively loaded power source probe, The probe is not required to be press-fitted into the through-hole of the metal block because it is a structure in which the inner wall of the through-hole is not in direct contact with the through-hole but through a metal sleeve. As a result, even a capacity-loaded probe provided with brittle ceramics or the like on the outer periphery can be assembled in the through hole without being damaged. In addition, the metal sleeve is made of an elastic material, and contact portions such as protrusions that facilitate contact with the probe and the metal block are formed instead of surface contact, thus ensuring complete contact in terms of points. be able to. Therefore, stable electrical contact can be obtained. This stable electrical contact is very important even when used for a grounding probe. In particular, a stable characteristic inspection can be performed for a high-frequency / high-speed device.
[0043]
【The invention's effect】
According to the present invention, when the inspection probe is inserted into the through hole of the metal block and the characteristic inspection of the high frequency / high speed device is performed, the outer periphery of the inspection probe is directly brought into contact with the inner wall of the through hole of the metal block. Because it is not necessary to press fit into the connector, it is very easy to assemble, and there is no need to damage the ceramics for capacitors provided on the outer periphery of the contact probe or crush and damage the contact probe. To improve. Further, since contact is made not through surface contact but through the connecting portion of the metal sleeve, reliable contact can be obtained, and stable and highly reliable characteristic inspection can be performed.
[Brief description of the drawings]
FIG. 1 is an explanatory cross-sectional view showing an embodiment of an inspection jig according to the present invention.
FIG. 2 is a cross-sectional explanatory diagram of an example of a power supply probe shown in FIG.
3 is an explanatory cross-sectional view of an example of the grounding probe shown in FIG. 1. FIG.
4 is a diagram showing the contact resistance value of the grounding probe shown in FIG. 3 in comparison with the contact resistance value of a grounding probe having a conventional structure. FIG.
FIG. 5 is a diagram showing an outline of an apparatus for examining contact resistance between a contact probe and a metal block.
FIG. 6 is a diagram showing a configuration example of a conventional inspection jig for a high-frequency / high-speed device.
[Explanation of symbols]
1 Metal block
3 Probe for signal
4 Probe for power supply
5 Probe for grounding
9 Metal sleeve
9a protrusion
9b dent
10 Contact probe
11 Movable pin
12 Movable pin
13 Metal pipe
15 Dielectric layer
18 capacitors

Claims (3)

A metal block and a movable pin having a movable protrusion at the tip, and a power supply and grounding provided through the metal block so that the tip of the movable pin protrudes on one side of the metal block A plurality of probes for signals and signals, and a device to be inspected is pressed against the one surface side of the metal block, and each electrode terminal of the device to be inspected is brought into contact with a tip portion of the probe to thereby inspect the device to be inspected An inspection jig for inspecting device characteristics, wherein at least some of the plurality of probes are provided such that a ground potential layer on an outer periphery thereof is in contact with the metal block via a metal sleeve. Inspection jig for high frequency and high speed devices. The power supply probe is a capacitance loaded probe in which a capacitor is formed by providing a dielectric layer and a metal film on the outer periphery of a contact probe, and the metal film contacts the metal block via the metal sleeve. The inspection jig according to claim 1, wherein the inspection jig is provided as described above. A metal pipe, a movable pin provided in the metal pipe and electrically connected to the metal pipe, the length of which protrudes from at least one end of the metal pipe being variable, and a dielectric provided on an outer periphery of the metal pipe A body layer, a first metal film provided on the outer peripheral surface of the dielectric layer, and a contact portion provided around the first metal film and partially in contact with the first metal film. A capacity loading type inspection probe comprising a metal sleeve and a capacity formed between the movable pin and the metal sleeve.

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