JP2005045143A - Method for manufacturing ceramic substrate with projection electrode - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a ceramic substrate with a low-cost projection electrode in a high mounting accuracy without inclining the projection electrode by a simple process. <P>SOLUTION: The method for manufacturing the ceramic substrate 10 with the protrusion electrode provides the protrusion electrode 13 on a surface. The method includes a step of preparing a resin sheet 17 for gasifying ceramic green sheets 16, 16a and 16b at a temperature of their sintering temperature or lower; a step of perforating a through hole 18 at the resin sheet 17, printing a metal conductor for a circuit wiring pattern 15 on a front surface, and filling a metal conductor for a via 14 in the through hole 18; a step of perforating a through hole 18a in the resin sheet 17; a step of superposing the ceramic green sheets 16, 16a and 16b and the resin sheet 17, thermally press bonding them, and forming a laminate 19. Further, the method also includes a step of gasifying and sintering the resin sheet 17 by baking the laminate 19, and forming the protrusion electrode 13 on a ceramic circuit substrate 12. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing a ceramic substrate with a protruding electrode provided with a protruding electrode for connection to an electronic component or the like.

  In recent years, semiconductor circuit packages for mounting electronic components such as semiconductor elements and ceramic circuit boards such as wiring boards have been connected to external connection terminals provided with higher integration of semiconductor elements and smaller electronic components. The arrangement density is increasing. In order to cope with this, external connection terminals are formed on the main surface of the substrate in a grid pattern on the ceramic circuit substrate, thereby increasing the arrangement density. Examples of the ceramic circuit board formed by arranging the external connection terminals in a grid pattern include a BGA (Ball Grid Array) type package and a wiring board, or a CS (Chip Scale) type package and a wiring board. is there. These semiconductor packages and ceramic circuit boards such as wiring boards are formed as protruding electrodes whose external connection terminals are joined to the circuit, and are connected to external circuits on the mounting board via the protruding electrodes, or flip chip. A type semiconductor element is directly bonded to the protruding electrode. The protruding electrode is formed on a ceramic circuit board on which a circuit wiring pattern is formed, for example, by arranging solder balls on a lattice-shaped circuit wiring pattern in the case of the BGA type. However, the bump electrodes made of solder balls have a problem that the cost is high, and if the sizes of the solder balls are not uniform, poor connection occurs.

Therefore, a method for manufacturing a ceramic substrate with protruding electrodes in which protruding electrodes instead of solder balls are formed on the surface of the ceramic circuit substrate will be described with reference to FIGS. First, as shown in FIG. 5A, the ceramic green sheets 51, 52, 53 for sintering to form a ceramic circuit board, and sintering at the sintering temperature of the ceramic green sheets 51, 52, 53 are sintered. Unsintered sheets 54, 55, and 56 are prepared. Next, as shown in FIG. 5B, through-holes 57 for forming protruding electrodes are formed in the unsintered sheet 55, and via holes 63 (see FIG. 5F) are formed in the ceramic green sheets 51 and 52, respectively. Through holes 58 and 59 are formed. Next, as shown in FIG. 5C, these through holes 57, 58, 59 are filled with a metal conductor 60 made of a metal conductor paste. Next, as shown in FIG. 5D, circuit wiring patterns 61 are formed on the ceramic green sheets 52 and 53. Next, as shown in FIG. 5E, these sheets are stacked and thermocompression bonded to form a laminate 62, and further fired to form a fired body. Next, as shown in FIG. 5F, the ceramic green sheets 51, 52, and 53, the circuit wiring pattern 61, the via hole 63, and the metal conductor 60 for forming the protruding electrode are sintered by firing, and each is joined. Is done. And the manufacturing method which produces the ceramic substrate 50 with a protruding electrode by removing the non-sintered sheets 54, 55, and 56 which remain in the powder form without being finally sintered has been proposed (for example, patents). Reference 1). Since the protruding electrodes are formed at the same time as the ceramic circuit board, the ceramic substrate with protruding electrodes formed in this way can be manufactured at low cost. Further, since the filling amount of the metal conductor for forming the protruding electrode can be controlled uniformly, the height of the protruding electrode can be made uniform.
JP-A-6-53655

However, the conventional method for manufacturing a ceramic substrate with protruding electrodes as described above has the following problems.
(1) The powder of the green sheet needs to be removed after sintering the ceramic conductor and the metal conductor of the bump electrode, but the ceramic substrate with the bump electrode removes the powder of the green sheet. The process increases the cost.
(2) The through-hole formed in the green sheet for forming the protruding electrode does not cause firing shrinkage in the firing step. On the other hand, the metal conductor paste, which is a metal conductor filled in the through-hole, starts firing shrinkage from the state in contact with the unsintered sheet, but the firing shrinkage does not start completely uniformly, so the column state Peeling of the green sheet is started from a part of the periphery of the metal conductor paste. As a result, a gap is formed between the fired bump electrode and the unsintered sheet, and at the same time, the center of the bump electrode is shifted or tilted in any direction. Therefore, the ceramic substrate with a bump electrode using an unsintered sheet deteriorates the accuracy of shape of the bump electrode and the positional accuracy, so that the mounting accuracy on the electronic component and the mounting substrate is lowered.
The present invention has been made in view of such circumstances, and an object thereof is to provide an inexpensive method for manufacturing a ceramic substrate with protruding electrodes, which is a simple process and has high mounting accuracy in which the protruding electrodes do not tilt. To do.

  A method for manufacturing a ceramic substrate with protruding electrodes according to the present invention that meets the above-described object is a method for manufacturing a ceramic substrate with protruding electrodes in which a protruding electrode is provided on the surface of a ceramic circuit substrate. And a process for preparing a projecting electrode forming resin sheet that gasifies at a temperature lower than the sintering temperature of the ceramic green sheet, and through holes are formed in the ceramic green sheet, and a circuit wiring pattern is formed on the surface of the ceramic green sheet. A metal conductor for printing and filling the through hole with a metal conductor for forming a via for electrically connecting the upper and lower circuit wiring patterns, and a through hole is formed in the resin sheet. And a process of filling the metal conductor for forming the protruding electrode into a plurality of ceramic green sheets, A process of superposing resin sheets on one or both main surfaces and thermocompression bonding to form a laminated body, firing the laminated body to gasify the resin sheet, and sintering the ceramic green sheet and the metal conductor Forming a protruding electrode on one or both main surfaces of a ceramic circuit board having a circuit wiring pattern and vias;

  According to another aspect of the present invention, there is provided a method of manufacturing a ceramic substrate with a protruding electrode, wherein a ceramic substrate with a protruding electrode is provided on a surface of a ceramic circuit substrate. Prepare a green sheet and bond it to the surface of the main surface of the ceramic green sheet that will be one or both of the main surfaces of the ceramic circuit board, and gasify at a temperature below the sintering temperature of the ceramic green sheet. A step of preparing a ceramic green sheet with a resin film for bonding a resin film, a step of drilling through holes in the ceramic green sheet with a resin film, and filling the through holes with metal conductors for forming protruding electrodes and vias; and ceramic Ceramic green sheet other than the ceramic green sheet that is the main surface of one or both of the circuit boards A through hole is drilled, and a metal conductor for circuit wiring pattern is printed on the surface of the ceramic green sheet, and a metal conductor for via formation for electrically connecting the upper and lower circuit wiring patterns to the through hole is filled. A step of superposing a ceramic green sheet with a resin film and another ceramic green sheet and thermocompression-bonding to form a laminated body, firing the laminated body to gasify the resin sheet, A step of forming a protruding electrode on one or both main surfaces of a ceramic circuit board provided with a circuit wiring pattern and vias by sintering a metal conductor;

  Still another method for manufacturing a ceramic substrate with a protruding electrode according to the present invention in accordance with the above object is a method for manufacturing a ceramic substrate with a protruding electrode in which a protruding electrode is provided on the surface of a ceramic circuit substrate. A step of preparing a fired ceramic circuit board on which vias for electrically connecting upper and lower circuit wiring patterns are formed, and a resin sheet for forming protruding electrodes, and through holes are formed in the resin sheet. Filling the holes with metal conductors for forming protruding electrodes, overlaying a resin sheet on one or both main surfaces of the fired ceramic circuit board, bonding them to form a laminate, and firing the laminate Gasifying the resin sheet, and sintering the metal conductor to form protruding electrodes on the surface of the fired ceramic circuit board.

  Here, in the manufacturing method of the ceramic substrate with protruding electrodes, the other manufacturing method of the ceramic substrate with protruding electrodes, or still another manufacturing method of the ceramic substrate with protruding electrodes, the resin sheet and the resin film are made of an acrylic resin. Is good.

The method for producing a ceramic substrate with protruding electrodes according to claim 1 and claim 4 dependent thereon, the step of preparing a ceramic green sheet and a resin sheet that is gasified at a temperature equal to or lower than a sintering temperature of the ceramic green sheet; A through hole is formed in the ceramic green sheet, a metal conductor for a circuit wiring pattern is printed on the surface, and a metal conductor for forming a via for electrically connecting the upper and lower circuit wiring patterns to the through hole is formed. Filling process, drilling through holes in resin sheet and filling metal conductors for bump electrode formation, stacking multiple ceramic green sheets, stacking resin sheets, and laminating by thermocompression bonding Forming the body, firing the laminate to gasify the resin sheet, and sintering the ceramic green sheet and metal conductor to circuit wiring Since it has a process of forming bump electrodes on a ceramic circuit board with turns and vias, bump electrodes can be made in a simple process without using an unsintered sheet, and the shape of the bump electrodes is not tilted. An inexpensive ceramic substrate with protruding electrodes having good accuracy and position accuracy and high mounting accuracy can be manufactured.
In particular, in the method for manufacturing a ceramic substrate with protruding electrodes according to claim 4, since the resin sheet and the resin film are made of an acrylic resin, the resin can be scattered before the metal conductor paste starts firing shrinkage in the firing step. And the occurrence of deformation such as tilting of the protruding electrode can be prevented. Further, the step of removing the unsintered sheet can be omitted.

According to a second aspect of the present invention, there is provided a method for producing a ceramic substrate with protruding electrodes, comprising preparing a ceramic green sheet, wherein the main surface side of the ceramic green sheet which is one or both main surfaces of the ceramic circuit board is prepared. A step of preparing a ceramic green sheet with a resin film for bonding a resin film for forming a protruding electrode that is bonded to the surface and gasified at a temperature equal to or lower than the sintering temperature of the ceramic green sheet; A through hole is formed in a ceramic green sheet other than the ceramic green sheet which is a main surface of one or both of the ceramic circuit board, and a surface for circuit wiring pattern is filled. A metal conductor for via formation for printing the metal conductor and electrically connecting the upper and lower circuit wiring patterns to the through hole. A step of filling, a step of stacking a ceramic green sheet with a resin film and another ceramic green sheet, thermocompression bonding to form a laminate, a firing of the laminate to gasify the resin sheet, and a ceramic green sheet And the step of forming the protruding electrode on the ceramic circuit board having the circuit wiring pattern and the via by sintering the metal conductor, so that the protruding electrode can be produced in a simple process without using an unsintered sheet. An inexpensive ceramic substrate with protruding electrodes having good shape accuracy and positional accuracy and good mounting accuracy can be produced without causing tilting of the electrodes. Further, the protruding electrode can be accurately produced on the via of the ceramic circuit board.
In particular, in the method for manufacturing a ceramic substrate with protruding electrodes according to claim 4, since the resin sheet and the resin film are made of an acrylic resin, the resin can be scattered before the metal conductor paste starts firing shrinkage in the firing step. And the occurrence of deformation such as tilting of the protruding electrode can be prevented. Further, the step of removing the unsintered sheet can be omitted.

According to a third aspect of the present invention, there is provided a method of manufacturing a ceramic substrate with a protruding electrode, wherein a circuit wiring pattern and vias for electrically connecting the upper and lower circuit wiring patterns are formed on the ceramic circuit board. A step of preparing a fired ceramic circuit board, a resin sheet for forming protruding electrodes, a step of drilling through holes in the resin sheet and filling a metal conductor for forming protruding electrodes, Overlaying and bonding resin sheets to form a laminated body, firing the laminated body to gasify the resin sheet, and sintering metal conductors to form protruding electrodes on the surface of the fired ceramic circuit board Therefore, the projecting electrode can be produced in a simple process regardless of the firing temperature of the ceramic, and the shape accuracy and position accuracy can be produced without causing the projecting electrode to tilt. Well, it is possible to produce a ceramic substrate with mounted accurate inexpensive projection electrodes.
In particular, in the method for manufacturing a ceramic substrate with a protruding electrode according to claim 4, since the resin sheet and the resin film are made of an acrylic resin, the metal conductor paste can be scattered before the firing shrinkage is started. Occurrence of deformation such as tilting can be prevented.

Subsequently, the best mode for carrying out the present invention will be described with reference to the accompanying drawings to provide an understanding of the present invention.
Here, FIG. 1 is an explanatory view of a ceramic substrate with protruding electrodes produced by the method for manufacturing a ceramic substrate with protruding electrodes according to one embodiment of the present invention, and FIGS. 2 (A) to (E) are the protruding electrodes, respectively. 3A to 3E are explanatory diagrams of other manufacturing methods of the ceramic substrate with the protruding electrodes, and FIGS. 4A to 4D are the protruding electrodes, respectively. It is explanatory drawing of the further another manufacturing method of a ceramic substrate with an attachment.

  As shown in FIG. 1, a ceramic substrate 10 with bump electrodes produced by the method for manufacturing a ceramic substrate with bump electrodes according to an embodiment of the present invention is, for example, three substantially rectangular sheet-like shapes. Ceramic green sheets 16, 16a, 16b (see FIG. 2A) are stacked and fired to form external connection terminals on the main surface of the ceramic circuit board 12 made of the ceramic substrates 11, 11a, 11b. A protruding electrode 13 made of a convex conductive metal is joined. The ceramic substrate 10 with protruding electrodes has vias 14 and circuit wiring patterns 15 formed in the ceramic substrates 11, 11 a and 11 b. The protruding electrode 13 is connected to the circuit wiring pattern 15 and / or the via 14 formed on the outermost ceramic substrate 11. This ceramic substrate 10 with protruding electrodes uses the protruding electrode 13 as an external connection terminal when mounted on a mounting substrate, or as an external connection terminal for directly bonding a semiconductor element by a flip chip method.

With reference to FIGS. 2 (A) to 2 (E), a method for manufacturing the ceramic substrate 10 with protruding electrodes according to one embodiment of the present invention will be described.
As shown in FIG. 2A, first, a plurality of ceramic green sheets for forming the ceramic circuit board 12, for example, in this embodiment, each ceramic green sheet before firing for forming three ceramic boards 11, 11a, 11b. 16, 16a, 16b are prepared. Further, a resin sheet 17 for forming the protruding electrode 13 that is gasified at a temperature equal to or lower than the sintering temperature of the ceramic green sheets 16, 16a, 16b is prepared. Here, the ceramic green sheets 16, 16 a, 16 b for forming the ceramic circuit board 12 are not limited to ceramic base materials, but generally alumina, aluminum nitride, low-temperature fired ceramics, etc. are widely used for circuit boards. It is used. In this embodiment, for example, a description will be given using a low-temperature fired ceramic. The ceramic green sheets 16, 16a, 16b are made of CaO—Al ₂ O ₃ —SiO ₂ —B ₂ O ₃ glass, which can be sintered at a low firing temperature of 800 to 1100 ° C., for example, 50 to 65, for example. A binder, a solvent, and a plasticizer are added to a ceramic powder composed of 50% by weight (preferably 60% by weight) and Al ₂ O ₃ , for example, 50 to 35% by weight (preferably 40% by weight). They are mixed, formed into a sheet having a desired thickness, for example, 0.13 mm by a doctor blade method, and then dried, and cut into a rectangular shape having a desired size. On the other hand, the resin sheet 17 for forming the protruding electrode 13 is formed of, for example, an acrylic resin in a sheet shape having a desired thickness, for example, 0.25 mm by a doctor blade method or the like.

Next, as shown in FIG. 2 (B), the ceramic green sheets 16, 16a, 16b, and the resin sheet 17 are perforated at a predetermined position by ordinary punching processing, laser processing, or the like. 18 and 18a are formed.
Next, as shown in FIG. 2C, vias 14 that are fired simultaneously with the ceramic green sheets 16, 16a, and 16b and become metal conductors are formed in the respective through holes 18 of the ceramic green sheets 16, 16a, and 16b. In order to form, for example, a conductor paste made of a low melting point metal such as Ag is filled by screen printing or the like. Further, on the surface of the ceramic green sheets 16, 16a, 16b, in order to form a circuit wiring pattern 15 that is fired simultaneously with the ceramic green sheets 16, 16a, 16b and becomes a metal conductor, for example, an Ag-based conductor paste Is printed by screen printing or the like. The via 14 is provided to electrically connect the upper and lower circuit wiring patterns 15 formed in the ceramic green sheets 16, 16 a and 16 b.
On the other hand, in the through hole 18a of the resin sheet 17, in order to form the protruding electrode 13 that becomes a metal conductor by being simultaneously fired with the ceramic green sheets 16, 16a, 16b, for example, screen printing or the like of an Ag-based conductor paste or the like Filled with.

  Next, as shown in FIG. 2 (D), the ceramic green sheets 16, 16a, 16b are overlapped in accordance with a predetermined layer and position, and the resin sheet 17 is ceramic green sheets 16, 16a, 16b. Are superimposed on a predetermined principal surface of the assembly. The aggregate of the ceramic green sheets 16, 16 a, 16 b and the resin sheet 17 is thermocompression-bonded from both sides at a temperature of 60 ° C., a pressing force of 200 N, and a pressing time of about 20 seconds to form a laminate 19. .

  Next, as shown in FIG. 2E, the laminate 19 is baked in the atmosphere at a temperature of 900 ° C. and a holding time of about 20 minutes, for example. During the firing temperature increase process, the resin sheet 17 gasifies and disappears before the firing shrinkage of the ceramic green sheets 16, 16a, 16b and the metal conductor starts, and the protruding electrode 13 made of the metal conductor before the sintering is completed. It is exposed on the ceramic green sheets 16, 16a, 16b before the completion of sintering. The ceramic green sheets 16, 16 a, 16 b and the conductor metal of the laminate 19 are contracted by about 20% to complete the sintering, whereby the ceramic circuit board 12 having the vias 14 and the circuit wiring patterns 15. A ceramic substrate 10 with a protruding electrode having a protruding electrode 13 on the surface is prepared.

Note that the protruding electrodes 13 may be formed on both main surfaces of the ceramic circuit board 12 to be the ceramic substrate with protruding electrodes 10 having the protruding electrodes 13 on both surfaces of the ceramic circuit board 12.
In the case of the ceramic green sheets 16, 16 a, and 16 b made of low-temperature fired ceramic that is sintered at about 900 ° C., firing shrinkage starts from about 700 ° C. Accordingly, the resin sheet 17 made of an acrylic resin that is completely gasified at about 500 ° C. has the metal conductors for the ceramic green sheets 16, 16 a, 16 b and the protruding electrode 13 at the time when the resin sheet 17 remains. Since the firing shrinkage is not started, it is possible to prevent the occurrence of problems such as the inclination of the protruding electrode 13 and the warpage of the substrate.

With reference to FIGS. 3A to 3E, another method for manufacturing the ceramic substrate 10 with protruding electrodes according to the embodiment of the present invention will be described.
As shown in FIG. 3A, in order to form the ceramic circuit board 12, a ceramic base material such as alumina, aluminum nitride, low-temperature fired ceramic, or the like can be used, for example, as described above. In the present embodiment, for example, for forming a plurality of ceramic substrates 11, for example, three ceramic substrates 11, 11a, 11b (the same symbols are used as above because the ceramic base material is changed). The ceramic green sheets 16, 16a, 16b before firing are prepared. Here, the ceramic green sheets 16, 16 a, 16 b made of alumina are prepared by adding a plasticizer such as dioctiphthalate to a powder obtained by adding an appropriate amount of a sintering aid such as magnesia, silica, calcia to aluminum oxide powder. In addition, a binder such as an acrylic resin and a solvent such as toluene, xylene, and alcohols are added, and the mixture is sufficiently kneaded and defoamed to prepare a slurry having a viscosity of 2000 to 40000 cps. Next, it is formed into a sheet having a desired thickness, for example, 0.13 mm by a doctor blade method, and then dried and cut into a rectangular shape having a desired size.

  In order to form the protruding electrode 13 on the surface on the main surface side of the ceramic green sheet 16 which is one main surface of the ceramic circuit board 12, a temperature equal to or lower than the sintering temperature of the ceramic green sheets 16, 16a and 16b. The ceramic green sheet 21 with a resin film formed by joining the resin film 20 to be gasified is prepared. The method for producing the ceramic green sheet 21 with a resin film can be formed by attaching a resin sheet 17 made of, for example, an acrylic resin, which is made in advance, by thermocompression bonding. Alternatively, it can be formed on the ceramic green sheet 16 by, for example, pouring a resin paste made of an acrylic resin by a doctor blade method or printing by screen printing.

  Next, as shown in FIG. 3B, the ceramic green sheet 21 with a resin film is perforated at a predetermined position by a normal punching process, a laser process or the like, and the ceramic green sheet 16 and the resin film 20 are communicated. A through hole 18b is formed. In addition, the ceramic green sheets 16a and 16b are formed with through holes 18 by punching the predetermined positions by ordinary punching or laser processing.

  Next, as shown in FIG. 3C, the via hole 14b formed in the ceramic green sheet 21 with the resin film is provided with a via 14 that is fired simultaneously with the ceramic green sheets 16, 16a, 16b and becomes a metal conductor. In order to gasify the resin film 20 and to form the protruding electrode 13 that becomes a metal conductor by simultaneous firing with the ceramic green sheets 16, 16 a, and 16 b, for example, tungsten, molybdenum, or the like is used. A conductor paste made of a melting point metal is filled by screen printing or the like. Further, in each of the through holes 18 formed in the ceramic green sheets 16a and 16b, vias 14 which are fired simultaneously with the ceramic green sheets 16, 16a and 16b to form metal conductors are formed. For example, tungsten or molybdenum Etc. are filled by screen printing or the like. Furthermore, a conductor made of tungsten, molybdenum, or the like is formed on the surface of the ceramic green sheets 16a, 16b in order to form a circuit wiring pattern 15 that becomes a metal conductor by simultaneous firing with the ceramic green sheets 16, 16a, 16b. The paste is printed by screen printing or the like.

  Next, as shown in FIG. 3D, the ceramic green sheet with resin film 21 and the ceramic green sheets 16a and 16b are overlapped in accordance with a predetermined layer and position. The assembly of the ceramic green sheet with resin film 21 and the ceramic green sheets 16a and 16b is formed by, for example, thermocompression bonding from both sides at a temperature of 120 ° C., a pressing force of 480 N, and a pressing time of about 6 seconds to form the laminate 19. Yes.

  Next, as shown in FIG. 3E, the laminate 19 is baked in a reducing atmosphere at a temperature of 1550 ° C. and a holding time of about 30 minutes, for example. In the firing temperature increasing process, the resin film 20 is gasified before the firing shrinkage of the ceramic green sheets 16, 16a, 16b and the metal conductor starts, and the protruding electrode 13 made of the metal conductor before the completion of sintering is formed. It is exposed on the ceramic green sheets 16, 16a, 16b before the completion of sintering. Further, as the temperature rises further, the ceramic green sheets 16, 16 a, 16 b and the conductor metal of the laminate 19 are contracted by about 20% to complete the sintering, and the ceramic provided with the vias 14 and the circuit wiring patterns 15. A ceramic substrate 10 with protruding electrodes having protruding electrodes 13 on the surface of the circuit board 12 is produced.

In the method of manufacturing the ceramic substrate 10 with the protruding electrode according to the present embodiment, the ceramic substrate 10 with the protruding electrode in which the protruding electrode 13 communicates with the via 14 formed in the ceramic substrate 11 can be manufactured.
Alternatively, the protruding electrodes 13 may be formed on both main surfaces of the ceramic circuit board 12 to form the ceramic substrate with protruding electrodes 10 having the protruding electrodes 13 on both surfaces of the ceramic circuit board 12.
Furthermore, in the case of a ceramic base material in which the firing temperature of the ceramic base material is relatively high, such as alumina, it is possible to obtain a degree of freedom in selecting a resin material for the resin sheet or resin film.

With reference to FIGS. 4A to 4D, still another method for manufacturing the ceramic substrate 10 with protruding electrodes according to the embodiment of the present invention will be described.
As shown in FIG. 4A, first, as in the case described above, for example, three ceramic green sheets 16, 16a, 16b made of a ceramic base material such as alumina, aluminum nitride, or low-temperature fired ceramic are used. A fired ceramic circuit formed by simultaneously firing the circuit wiring pattern 15 with metal conductors and vias 14 for electrically connecting the upper and lower circuit wiring patterns 15 together with the ceramic green sheets 16, 16a, 16b. A substrate 22 is prepared. Also, a resin sheet 17 for forming the protruding electrodes 13 on the main surface of the fired ceramic circuit board 22 is prepared. The resin sheet 17 is made of, for example, an acrylic resin in a sheet shape having a desired thickness, for example, 0.25 mm by a doctor blade method or the like.

Next, as shown in FIG. 4B, the resin sheet 17 is perforated at a predetermined position by a normal punching process, a laser process, or the like to form a through hole 18a. Then, in order to form the protruding electrode 13 that is fired and becomes a metal conductor in the through hole 18a of the resin sheet 17, for example, a conductor paste made of a low melting point metal such as Ag or a high melting point metal such as tungsten is used. Filled with screen printing.
Next, as shown in FIG. 4C, the resin sheet 17 and the fired ceramic circuit board 22 are overlaid at a predetermined position. For example, the temperature is 60 ° C., the pressing force is 200 N, and the pressing time is 20 seconds. The laminated body 19 is formed by thermocompression bonding from both sides.

  Next, as shown in FIG. 4D, for example, in the case where a low melting point metal such as Ag is used for the protruding electrode 13 that is fired to become a metal conductor, it is fired in the atmosphere at a temperature of about 900 ° C. Sintering of the metal conductor is completed, and the ceramic substrate 10 with protruding electrodes having the protruding electrodes 13 on the surface of the fired ceramic circuit board 22 provided with the vias 14 and the circuit wiring patterns 15 is produced. Further, for example, when the fired ceramic circuit board 22 is a high-temperature fired ceramic such as alumina or aluminum nitride, and the refractory metal such as tungsten is used for the protruding electrode 13 that is fired to become a metal conductor, the temperature is 1550 ° C. The ceramic substrate 10 with protruding electrodes having the protruding electrodes 13 on the surface of the fired ceramic circuit board 22 provided with the vias 14 and the circuit wiring patterns 15 is completed by baking in a reducing atmosphere of a certain degree. I am making it. In the firing temperature increasing process, the resin sheet 17 is gasified and disappears before firing contraction of the metal conductor starts, so that it is possible to form the protruding electrode 13 having no inclination and good shape accuracy and position accuracy.

The protruding electrodes 13 may be formed on both main surfaces of the fired ceramic circuit board 22 to form the ceramic substrate 10 with protruding electrodes having the protruding electrodes 13 on both surfaces of the fired ceramic circuit board 22.
In the present embodiment, the protruding electrode 13 is formed on the fired ceramic circuit board 22. However, the protruding electrode 13 can be formed on the glass substrate.

  If the present invention is applied, a substrate with a protruding dielectric can be manufactured by filling a through hole formed in a resin sheet or a ceramic green sheet with a resin film with a dielectric paste. Further, by filling the through holes with stripes and filling with a dielectric paste, a substrate with dielectric partition walls used in a plasma display panel or the like can be manufactured.

  The ceramic substrate with protruding electrodes manufactured by the present invention can form protruding electrodes with good shape accuracy and dimensional accuracy without tilting on the surface of the ceramic circuit board, and can produce semiconductor packages and wiring boards with high dimensional accuracy. Therefore, it is possible to cope with downsizing of electronic parts such as semiconductor elements, and it can be applied to downsizing of devices on which electronic parts are mounted.

It is explanatory drawing of the ceramic substrate with a projection electrode produced with the manufacturing method of the ceramic substrate with a projection electrode which concerns on one embodiment of this invention. (A)-(E) is explanatory drawing of the manufacturing method of the ceramic substrate with the said protruding electrode, respectively. (A)-(E) are explanatory drawings of the other manufacturing method of the ceramic substrate with the said protruding electrode, respectively. (A)-(D) is explanatory drawing of the further another manufacturing method of the ceramic substrate with the said projection electrode, respectively. (A)-(F) is explanatory drawing of the manufacturing method of the conventional ceramic substrate with a protruding electrode, respectively.

Explanation of symbols

  10: Ceramic substrate with protruding electrode, 11, 11a, 11b: Ceramic substrate, 12: Ceramic circuit substrate, 13: protruding electrode, 14: via, 15: circuit wiring pattern, 16, 16a, 16b: ceramic green sheet, 17: Resin sheet, 18, 18a: through-hole, 19: laminate, 20: resin film, 21: ceramic green sheet with resin film, 22: fired ceramic circuit board

Claims (4)

In the method of manufacturing a ceramic substrate with a protruding electrode in which a protruding electrode is provided on the surface of the ceramic circuit board,
Preparing a plurality of ceramic green sheets for forming the ceramic circuit board, and a resin sheet for forming protruding electrodes that gasifies at a temperature equal to or lower than a sintering temperature of the ceramic green sheets;
A through hole is formed in the ceramic green sheet, a metal conductor for a circuit wiring pattern is printed on the surface of the ceramic green sheet, and the upper and lower circuit wiring patterns are electrically connected to the through hole. Filling the metal conductor for via formation;
Drilling a through hole in the resin sheet, and filling the through hole with the metal conductor for forming the protruding electrode;
Overlaying a plurality of the ceramic green sheets, superimposing the resin sheet on one or both main surfaces, forming a laminate by thermocompression bonding,
The laminated body is fired to gasify the resin sheet, and the ceramic green sheet and the metal conductor are sintered to form one or both main surfaces of the ceramic circuit board including the circuit wiring pattern and the via. A method of manufacturing a ceramic substrate with a protruding electrode, comprising the step of forming the protruding electrode. In the method of manufacturing a ceramic substrate with a protruding electrode in which a protruding electrode is provided on the surface of the ceramic circuit board,
A plurality of ceramic green sheets for forming the ceramic circuit board are prepared and bonded to the surface on the main surface side of the ceramic green sheet which is one or both main surfaces of the ceramic circuit board. A step of preparing a ceramic green sheet with a resin film for bonding a resin film for forming a protruding electrode that is gasified at a temperature equal to or lower than a sintering temperature;
Forming a through hole in the ceramic green sheet with a resin film, and filling the through hole with the metal electrode for forming the protruding electrode and the via;
A through hole is formed in the ceramic green sheet other than the ceramic green sheet which is one or both main surfaces of the ceramic circuit board, and a metal conductor for a circuit wiring pattern is printed on the surface of the ceramic green sheet. Filling the through hole with the metal conductor for forming a via for electrically connecting the upper and lower circuit wiring patterns; and
Overlaying the ceramic green sheet with the resin film and the other ceramic green sheet, and thermocompression bonding to form a laminate,
The laminated body is fired to gasify the resin sheet, and the ceramic green sheet and the metal conductor are sintered to form one or both main surfaces of the ceramic circuit board including the circuit wiring pattern and the via. A method of manufacturing a ceramic substrate with a protruding electrode, comprising the step of forming the protruding electrode. In the method of manufacturing a ceramic substrate with a protruding electrode in which a protruding electrode is provided on the surface of the ceramic circuit board,
Preparing a circuit wiring pattern on the ceramic circuit board, a fired ceramic circuit board in which vias for electrically connecting the circuit wiring patterns on the upper and lower layers are formed, and a resin sheet for forming the protruding electrodes; ,
Forming a through hole in the resin sheet, and filling the through hole with the metal conductor for forming the protruding electrode;
A step of superposing and bonding the resin sheet on one or both main surfaces of the fired ceramic circuit board to form a laminate;
With the bump electrode characterized by comprising steps of firing the laminate to gasify the resin sheet and sintering the metal conductor to form the bump electrode on the surface of the fired ceramic circuit board. A method for manufacturing a ceramic substrate.   The method for manufacturing a ceramic substrate with protruding electrodes according to claim 1, wherein the resin sheet and the resin film are made of an acrylic resin.

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