JP2005026276A5 - - Google Patents
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- JP2005026276A5 JP2005026276A5 JP2003187115A JP2003187115A JP2005026276A5 JP 2005026276 A5 JP2005026276 A5 JP 2005026276A5 JP 2003187115 A JP2003187115 A JP 2003187115A JP 2003187115 A JP2003187115 A JP 2003187115A JP 2005026276 A5 JP2005026276 A5 JP 2005026276A5
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- JP
- Japan
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003187115A JP4085899B2 (ja) | 2003-06-30 | 2003-06-30 | 発光デバイス用基板および発光デバイス |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003187115A JP4085899B2 (ja) | 2003-06-30 | 2003-06-30 | 発光デバイス用基板および発光デバイス |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005026276A JP2005026276A (ja) | 2005-01-27 |
| JP2005026276A5 true JP2005026276A5 (ja) | 2005-06-30 |
| JP4085899B2 JP4085899B2 (ja) | 2008-05-14 |
Family
ID=34186062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003187115A Expired - Lifetime JP4085899B2 (ja) | 2003-06-30 | 2003-06-30 | 発光デバイス用基板および発光デバイス |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4085899B2 (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9142734B2 (en) | 2003-02-26 | 2015-09-22 | Cree, Inc. | Composite white light source and method for fabricating |
| US9431589B2 (en) | 2007-12-14 | 2016-08-30 | Cree, Inc. | Textured encapsulant surface in LED packages |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101148332B1 (ko) | 2003-04-30 | 2012-05-25 | 크리, 인코포레이티드 | 콤팩트 광학 특성을 지닌 높은 전력의 발광 소자 패키지 |
| KR100638868B1 (ko) * | 2005-06-20 | 2006-10-27 | 삼성전기주식회사 | 금속 반사 층을 형성한 엘이디 패키지 및 그 제조 방법 |
| JP2007035748A (ja) * | 2005-07-25 | 2007-02-08 | Nichia Chem Ind Ltd | 半導体素子搭載用の支持体および半導体装置 |
| WO2008038997A1 (en) * | 2006-09-27 | 2008-04-03 | Seoul Semiconductor Co., Ltd. | Light emitting diode package employing leadframe with plated layer of high brightness |
| KR100737822B1 (ko) | 2006-09-27 | 2007-07-10 | 서울반도체 주식회사 | 고광택 도금층을 구비하는 리드프레임을 채택한 발광다이오드 패키지 |
| KR100840208B1 (ko) * | 2006-12-29 | 2008-06-23 | 서울반도체 주식회사 | 발광 다이오드 패키지 |
| JP5114773B2 (ja) * | 2007-08-10 | 2013-01-09 | スタンレー電気株式会社 | 表面実装型発光装置 |
| JP5109620B2 (ja) * | 2007-11-26 | 2012-12-26 | 豊田合成株式会社 | 発光装置、基板装置及び発光装置の製造方法 |
| JP5532021B2 (ja) * | 2011-06-28 | 2014-06-25 | 豊田合成株式会社 | 発光装置 |
| JP2014003260A (ja) * | 2012-06-21 | 2014-01-09 | Sumitomo Electric Printed Circuit Inc | プリント配線板、プリント配線板集合体、プリント配線板の製造方法及び照明装置。 |
| KR101403640B1 (ko) * | 2012-11-20 | 2014-06-05 | 주식회사 세미콘라이트 | 반도체 발광소자 및 이를 봉지하는 방법 |
| CN104241262B (zh) | 2013-06-14 | 2020-11-06 | 惠州科锐半导体照明有限公司 | 发光装置以及显示装置 |
| TWI684835B (zh) * | 2018-12-25 | 2020-02-11 | 同泰電子科技股份有限公司 | 具有高反射率的基板結構及其製作方法 |
| CN110277378B (zh) * | 2019-04-25 | 2023-11-14 | 深圳市聚飞光电股份有限公司 | 一种集合基板、发光装置及其制造方法 |
| CN112331638B (zh) * | 2020-09-28 | 2023-06-06 | 惠州市聚飞光电有限公司 | 发光二极管及背光模组 |
| CN112331639B (zh) * | 2020-09-28 | 2023-10-20 | 惠州市聚飞光电有限公司 | 用于制作led光源的基板及制作方法、led光源组件 |
-
2003
- 2003-06-30 JP JP2003187115A patent/JP4085899B2/ja not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9142734B2 (en) | 2003-02-26 | 2015-09-22 | Cree, Inc. | Composite white light source and method for fabricating |
| US9431589B2 (en) | 2007-12-14 | 2016-08-30 | Cree, Inc. | Textured encapsulant surface in LED packages |