JP2005008926A - Aluminum alloy sheet with excellent thermal conductivity and formability, and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an aluminum alloy sheet as a material having excellent electric conductivity, thermal conductivity, formability and strength and further having superior appearance quality and suitably used for plasma displays, electronic parts, etc. <P>SOLUTION: The aluminum alloy sheet has a composition which consists of 0.2 to 1.5% Si, 0.2 to 1.5% Mg, 0.02 to 0.1% Cr, ≤0.3% Fe and the balance Al with inevitable impurities and in which Ti among the inevitable impurities is controlled to ≤0.015%. In the case where priority is put on electric conductivity, cold rolling is done without performing process annealing in the course of the cold rolling and then annealing at >180 to 300°C is carried out. In the case where priority is put on strength, solution treatment at 500 to 570°C is done in the course of cold rolling and successively cold rolling at 5 to 15% final cold rolling rate is performed and then annealing at 170 to 210°C is carried out. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【００３４】
【表２】

【００３５】
実施例２
半連続鋳造により表３および表１の一部に示す合金成分で厚さ４４ｍｍ、幅２５０ｍｍ、長さ４００ｍｍのスラブを鋳造し、５６０℃×８ｈｒの均質化処理後、面削片面５ｍｍを行なった。面削後５１０℃まで加熱を行い熱間圧延にて厚さ７．０ｍｍの板材を得、冷間圧延により厚さ１．０５〜１．２ｍｍ×幅１８０ｍｍの板材を製作した。これを加熱速度５℃／ｍｉｎ以上で昇温させ、５６０℃×４０ｓｅｃの溶体化処理後、５℃／ｓｅｃ以上の冷却速度で焼入れを行なった。再び冷間圧延により厚さ１．００ｍｍ×幅１８０ｍｍ×Ｌの板材を得た。圧延後、マッフル炉により加熱温度を変えて４ｈｒの焼鈍処理を行ない試験材とした。上記で得られた試験材についてＪＩＳＨ４０００に定める５号試験片を圧延方向と平行に採取し、引張強さ、耐力、伸び率を測定した。また、成形性については圧延方向と平行に採取した幅２０ｍｍの試験片を用い内側曲げ半径０．５ｍｍ、１８０°曲げを行い、試験後の曲げ外周面の割れ、肌荒れの状況を目視で１〜５の５段階の評価を行なった。なお、表中の数値はｎ＝２での評価の平均値で示した。導電率の測定は圧延方向と平行に板厚×幅１０ｍｍ×長さ５５０ｍｍの試験片を採取し、ダブルブリッジ法により比抵抗を測定し、純銅の比抵抗値を１００として導電率を算出した。
【００３６】
表４に示した発明例では１８０℃以上の焼鈍処理でいずれも高い導電率と耐力２００ＭＰａ以上を有し、曲げ試験により高い成形性能が確保できることを確認した。一方、比較条件によって製造された比較条件例では、導電率、強度、曲げ加工性のいずれかにおいて劣っていた。
【００３７】
【表３】

【００３８】
【表４】

【００３９】
【発明の効果】
以上説明したように、本発明の熱伝導性と成形性に優れたアルミニウム合金板によれば、質量％で、Ｓｉ：０．２〜１．５％、Ｍｇ：０．２〜１．５％、Ｃｒ：０．０２〜０．１％、Ｆｅ：０．３％以下を含有し、残部がＡｌおよび不可避不純物からなり、該不可避不純物中のＴｉが０．０１５％以下に規制され、かつ導電率が５０％ＩＡＣＳ以上、熱伝導率が２００ｗ／ｍ・Ｋ以上であるので、優れた導電率と熱伝導性ならびに高い曲げ成形性能が確保され、プラズマディスプレー、電子部品などの利用に大きく貢献することができる。
【００４０】
さらに本発明の熱伝導性と成形性に優れたアルミニウム合金板の製造方法の１つによれば、本発明のアルミニウム合金板記載の組成を有するアルミニウム合金を熱間圧延後、冷間圧延途中で中間焼鈍を行わずに最終板厚まで冷間圧延し、該冷間圧延後、１８０℃超〜３００℃に加熱する焼鈍を行うので、導電率が５３％ＩＡＣＳ以上、熱伝導率が２００ｗ／ｍ・Ｋ以上であり、特に導電性に優れるアルミニウム合金板を得ることができる。
【００４１】
また、本発明の他の熱伝導性と成形性に優れたアルミニウム合金板の製造方法によれば、本発明のアルミニウム合金板記載の組成を有するアルミニウム合金を熱間圧延後、冷間圧延途中で５００〜５７０℃の溶体化処理を行い、続いて最終冷延率５〜１５％の冷間圧延後、１７０〜２１０℃の焼鈍を行うので、導電率が５０％ＩＡＣＳ以上、熱伝導率が２００ｗ／ｍ・Ｋ以上、耐力が２００ＭＰａ以上であり、特に強度に優れるアルミニウム合金板を得ることができる。
【図面の簡単な説明】
【図１】導電率と熱伝導率との相関関係を示すグラフである。[0001]
BACKGROUND OF THE INVENTION
The present invention is suitable for electronic video parts such as plasma displays, electronic parts such as personal computers, general household electrical appliance parts, etc., and particularly suitable for use as a heat sink and a casing, and has excellent thermal conductivity and moldability. The present invention relates to an aluminum alloy plate and a method for producing the aluminum alloy plate.
[0002]
[Prior art]
The plasma display is composed of a video part that displays video and a part where electronic parts are integrated, and since it is structured to be thinly mounted on the wall from the functional side, the video part and the electronic part are close to each other. Thermal effects should be minimized. Since the light emission mechanism of the video portion that projects the video is loaded with a high voltage, it generates a large amount of heat and inevitably affects the surroundings. In addition, the heat generated by the plasma display that displays a clear image changes the conductivity of the structure that functions as an electric circuit, which not only causes noise to the precisely adjusted electronic circuit but is also used. It is likely to have a serious impact on semiconductor electronic components. For this purpose, in order to protect the electronic parts boasting high functions from the heat generated in the video part, a heat dissipation part made of a material having high electrical conductivity and heat dissipation effect is placed between the video part and the integrated part of the electronic part. There is a need for a heat dissipation mechanism that dissipates heat and avoids local heating.
[0003]
Al-Si-Mg alloys are widely used as automotive outer plate materials in accordance with required performance because they greatly affect the performance of the materials depending on the alloy components. Further, Non-Patent Document 1 and Patent Documents 1 and 2 show that high electrical conductivity can be secured by adjusting rolling conditions and heat treatment conditions as a feature of the Al—Si—Mg alloy. Focusing on such high conductivity, Al—Si—Mg alloys are used for electric wires and bus bars. More recently, Al—Si—Mg alloys have been widely used as a heat sink material for the above-mentioned plasma display because a material having a high conductivity can simultaneously ensure a high thermal conductivity. As shown in FIG. 1, the electrical conductivity and the thermal conductivity have a high correlation, and a material having a high electrical conductivity can be said to be a material having a high thermal conductivity. That is, the Al—Si—Mg alloy having a high electrical conductivity can be said to be the most suitable material as a heat radiating member for shielding and diffusing the heat generated in the video portion with respect to these electronic component integrated parts.
[0004]
[Non-Patent Document 1]
“Recent Aluminum Alloys for Conduction”, Sumitomo Electric Technical Review, issued in January 1978, No. 112 [Patent Document 1]
JP 2000-226628 A [Patent Document 2]
Japanese Patent Laid-Open No. 2000-87198
[Problems to be solved by the invention]
The heat dissipating member as described above is required to function as a structural member because it is located between the image portion and the integrated portion of the electronic component at the same time as excellent conductivity and thermal conductivity, and the heat dissipation and strength are required. This is a necessary condition for parts.
However, the heat sink materials currently used in these plasma display parts are focused on improving conductivity and ensuring strength, and are compatible with press formability with excellent mass productivity to ensure part shape. Is not sufficient, and is a major constraint in determining the shape. In particular, in the bending process after the introduction of pre-strain at the time of press forming, it was necessary to perform the bending process with a large bending radius that is inevitable to generate cracks in the outer peripheral part of the bending and is not compatible with the surrounding shape. Also, securing strength requires strength as a structure after being incorporated into electronic equipment, etc., and also functions such as scratches and prevention of deformation due to collision, etc. Even when emphasizing strength, thermal conductivity and conductivity are required. The development of a lightweight Al—Si—Mg alloy that is excellent and can secure moldability and high strength is awaited.
Conventionally, Ti or Ti-B is used as a crystal grain size refining agent at the time of casting in order to ensure the appearance quality after molding of the Ai-Si-Mg alloy. However, it has been clarified that the addition of these micronizing agents greatly affects the decrease in conductivity. However, maintenance of appearance quality is also important, and it is also required to ensure appearance quality without causing a decrease in conductivity.
[0006]
The present invention has been made against the background of the above circumstances, and provides an aluminum alloy plate excellent in press forming performance and bending workability and a method for producing the same while ensuring thermal conductivity, conductivity, and strength. Basic purpose. Furthermore, it aims at providing the aluminum alloy plate which can ensure external appearance quality, and its manufacturing method, without causing the fall of electrical conductivity.
[0007]
[Means for Solving the Problems]
Among the aluminum alloy plates excellent in thermal conductivity and formability of the present invention to solve the above problems, the invention according to claim 1 is mass%, Si: 0.2 to 1.5%, Mg: 0 2 to 1.5%, Cr: 0.02 to 0.1%, Fe: 0.3% or less, with the balance being Al and inevitable impurities, Ti in the inevitable impurities being 0.015% It is regulated as follows, and the electrical conductivity is 50% IACS or more and the thermal conductivity is 200 w / m · K or more.
[0008]
The invention of the aluminum alloy plate excellent in thermal conductivity and formability described in claim 2 is characterized in that in the invention described in claim 1, Cu: 0.01 to 1% is further contained.
[0009]
The invention of the aluminum alloy plate excellent in thermal conductivity and formability according to claim 3 is used in the heat dissipation plate or casing for electric / electronic parts in the invention according to claim 1 or 2. To do.
[0010]
The invention of the method for producing an aluminum alloy plate excellent in thermal conductivity and formability according to claim 4 is the intermediate annealing in the middle of cold rolling after hot rolling the aluminum alloy having the composition according to claim 1 or 2. The steel sheet is cold-rolled to the final thickness without being subjected to heat treatment, and after the cold-rolling, annealing is performed by heating to over 180 ° C. to 300 ° C., and the conductivity is 53% IACS or more and the heat conductivity is 200 w / m · K. The manufacturing method of the aluminum alloy plate characterized by obtaining the aluminum alloy plate which is the above.
[0011]
Invention of the manufacturing method of the aluminum alloy plate excellent in the thermal conductivity and the formability of Claim 5 is 500-500 in the middle of cold rolling after hot rolling the aluminum alloy which has the composition of Claim 1 or 2. Solution treatment at 570 ° C. is performed, followed by cold rolling at a final cold rolling rate of 5-15%, followed by annealing to 170-210 ° C., conductivity of 50% IACS or more, thermal conductivity of 200 w An aluminum alloy plate having a proof stress of 200 MPa or more is obtained.
[0012]
Inventing the aluminum alloy plate of the present invention, as a result of investigation focusing on the alloy components for ensuring the electrical conductivity and heat transfer of the Ai-Si-Mg alloy, Ti or Ti- It has been clarified that the addition of the grain refiner of B is a cause of inhibiting the conductivity. In the aluminum alloy plate of the present invention, since the refinement of the crystal grain size is a property necessary for suppressing the occurrence of rough skin during the forming process, the crystal grain size is refined by adding a small amount of Cr as an alternative to Ti. To obtain characteristics excellent in electrical conductivity, thermal conductivity, and moldability.
[0013]
In addition, the manufacturing method of the present invention is effective in improving the strength of the solution treatment load, but a decrease in conductivity is unavoidable. Therefore, by incorporating the solution treatment and the final low-temperature annealing in the intermediate process of cold rolling. It was completed by finding that high conductivity and strength could be secured. In order to ensure formability, it is possible to ensure stable forming performance by optimally adjusting the cold rolling processing rate (cold rolling rate), which has excellent high conductivity and thermal conductivity, and has excellent formability and strength. It is possible to obtain a material suitable for the equipped electronic device and the heat sink.
[0014]
In addition, since the electrical conductivity is strongly influenced by the rolling rate and heat treatment conditions, it is necessary to optimally adjust the heat treatment conditions in order to ensure strength and formability. Al-Mg with excellent workability, strength, and electrical conductivity such as press forming as a solution treatment is incorporated in the middle of the process to secure the strength and at the same time adjust the cold rolling rate after solution treatment to 15% or less. -Made it possible to produce Si-based alloys.
Note that the above two manufacturing methods can be appropriately selected between cases where the electrical conductivity is important and strength is important.
[0015]
Next, the alloy component and crystal grain size defined in the aluminum alloy sheet of the present invention and the manufacturing method thereof will be described.
[0016]
Si: 0.2 to 1.5%
Si and Mg are important components for securing the properties such as strength, formability, and conductivity of the alloy. The amount of Si secures the strength of the molded part in balance with the amount of Mg, but in the range exceeding 1.5%, the influence on the electrical conductivity is particularly large, and the bending workability is hindered. On the other hand, if the Si content is less than 0.2%, it will cause insufficient strength after molding. Therefore, the Si amount is set to be within a range of 0.2 to 1.5%. For the same reason, it is desirable to set the lower limit to 0.4% and the upper limit to 1.1%.
[0017]
Mg: 0.2 to 1.5%
Mg is an effective component for improving the tensile strength, improving the cracking limit in press molding, and ensuring the strength of the part. Improvement of the Mg content is effective for improving the strength, but in the range of more than 1.5%, it becomes a significant hindrance to the electrical conductivity. Further, when the content is less than 0.2%, it is difficult to ensure the strength. Therefore, the Mg content is within the range of 0.2 to 1.5%. For the same reason, it is desirable to set the lower limit to 0.4% and the upper limit to 0.8%.
[0018]
Cr: 0.02-0.1%
Addition of a small amount of Cr is effective for refining the crystal grain size, and an effect comparable to that of Ti and Ti-B can be expected. However, if it exceeds 0.1%, the electrical conductivity may be affected, which is an obstacle to moldability. On the other hand, if it is less than 0.02%, the effect of refining crystal grain size cannot be expected. Therefore, the Cr content is within the range of 0.02 to 0.1%. For the same reason, it is desirable that the lower limit is 0.04% and the upper limit is 0.06%.
[0019]
Ti: 0.015% or less As described above, the content of Ti is a major impediment to electrical conductivity, and it is difficult to ensure good electrical conductivity and thermal conductivity. Therefore, it is necessary to add no or reduce the content as much as possible. Yes, restricted to 0.015% or less. That is, it is desirable to avoid or minimize the use of Ti and Ti-B as a refining agent for the purpose of refining the crystal grain size during ingot casting. As a result, the Ti content can be regulated to 0.015% or less. For the same reason, the Ti content is preferably less than 0.005%. Without the refinement treatment of Ti and Ti-B, the rolling structure after hot rolling becomes rough and adversely affects the formability after cold rolling and temper annealing. Such problems are avoided.
[0020]
Fe: 0.3% or less Fe can be expected to have an effect of refining the crystal grain size. Therefore, the Fe content is 0.3% or less. In order to obtain the above effect sufficiently, the Fe content is desirably 0.2% or more.
[0021]
Cu: 0.01 to 1%
Cu is contained as desired to ensure strength and formability. However, if it exceeds 1%, the moldability and conductivity will be reduced, and if it is less than 0.01%, the above-mentioned effects cannot be obtained sufficiently. Therefore, the Cu content is set within a range of 0.01 to 1%. For the same reason, it is desirable that the lower limit is 0.02% and the upper limit is 0.2%.
[0022]
Mn: 0.1% or less Addition of Mn may generate primary crystals during casting with Fe, Cr, but can be eliminated by adequately controlling the casting conditions. Can be expected. Therefore, if desired, Mn is contained in an amount of 0.1% or less. In addition, in order to fully obtain the said effect | action, it is desirable that Mn content shall be 0.04% or more.
[0023]
Manufacturing conditions (concentration on conductivity)
1. Do not perform intermediate annealing during cold rolling.
Intermediate annealing during cold rolling may cause coarsening of crystal grain size and insufficient strength, and cold rolling when stressing strength and formability due to problems with productivity. The intermediate annealing inside shall not be performed.
[0024]
2. Annealing after cold rolling (over 180 ° C to 300 ° C)
Conducting annealing after cold rolling ensures electrical conductivity and formability. If the heating temperature at this time is 180 ° C. or less, sufficient conductivity and bending workability cannot be improved, and if it exceeds 300 ° C., the strength decreases. Therefore, the heating temperature in this annealing exceeds 180 ° C. It shall be 300 degrees C or less. For the same reason, it is desirable that the lower limit temperature is over 180 ° C. and the upper limit temperature is 240 ° C. In addition, annealing can be performed in 10 hours or less, for example.
The aluminum alloy plate obtained by the above-described manufacturing method can obtain characteristics with an electrical conductivity of 53% IACS or higher and a thermal conductivity of 200 w / m · K or higher.
[0025]
Manufacturing conditions (when strength is important)
1. Solution treatment during cold rolling (500-570 ° C)
Converted from the final thickness, a solution treatment is performed leaving a cold rolling rate of 5 to 15%. The solution treatment conditions at this time are set to a temperature range of 500 ° C to 570 ° C. When the solution treatment temperature is less than 500 ° C., a sufficient solution treatment effect cannot be obtained, and eutectic melting occurs at a temperature exceeding 570 ° C. For the same reason, it is desirable that the lower limit is 540 ° C. and the upper limit is 570 ° C. After the solution treatment, for example, quenching is performed at a cooling rate of 5 ° C./sec or more by air cooling or water cooling. If the cooling rate is less than 5 ° C./sec, a sufficient quenching effect cannot be obtained. The solution treatment increases the amount of solute atoms in the solid solution, and the strength by aging can be improved in the final annealing process.
[0026]
After the solution treatment, cold rolling with a cold rolling rate of 5 to 15% is performed. The purpose of the rolling is mainly to ensure electrical conductivity and strength. If the rolling rate is less than 5%, the electrical conductivity that has been lowered by the solution treatment cannot be sufficiently improved, and the strength is less than 200 MPa. Rolling exceeding 15% is an obstacle to formability. Therefore, the cold rolling rate after the solution treatment is set in the range of 5 to 15%.
[0027]
2. Annealing after cold rolling (170-210 ° C)
After performing cold rolling, annealing is performed to improve the strength by precipitation and at the same time ensure conductivity and formability. When the annealing temperature is less than 170 ° C., sufficient bending performance cannot be obtained, and when the temperature exceeds 210 ° C., an improvement in conductivity is obtained, but a decrease in strength is inevitable. Therefore, the heating temperature in this annealing is set to 170 to 210 ° C.
[0028]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described.
The aluminum alloy used in the present invention can be adjusted to have a predetermined component and melted by a conventional method, and the process leading to melting is not particularly limited as the present invention. However, at the time of casting, in order to refine the ingot, the addition of Ti or Ti-B crystal grain refining agent is avoided or the addition amount is reduced so that the Ti content does not exceed 0.015%.
[0029]
The aluminum alloy melted as described above is hot-rolled and further cold-rolled to obtain an aluminum alloy plate having a predetermined thickness.
The ingot obtained above is desirably subjected to a homogenization treatment prior to hot rolling. The homogenization treatment can be performed in a temperature range of 540 ° C. to 560 ° C. under conditions of 4 hr to 20 hr. The conditions are determined for the purpose of uniformly dispersing the alloy components during casting.
[0030]
In the subsequent hot rolling, the temperature during rolling can be set to 480 ° C. to 550 ° C. in order to ensure formability at the rolling temperature. If the hot rolling temperature is less than 480 ° C, the rolling load is high, causing ear cracks during rolling, and if the temperature exceeds 550 ° C, seizure occurs on the surface of the rolling roll. And in hot rolling, it is desirable to adjust and perform so that the material temperature after rolling may be 250 to 350 degreeC.
Then, it is set as predetermined plate | board thickness by cold rolling. When emphasizing strength, as described above, a solution treatment is performed at a temperature of 500 to 570 ° C. while leaving a cold rolling rate of 5 to 15% during cold rolling. In addition, when emphasizing electrical conductivity, annealing during cold rolling is not performed.
After the cold rolling, annealing is performed by a batch annealing furnace or a continuous annealing furnace in order to ensure electrical conductivity and forming processability. The heating temperature in this annealing differs depending on whether the electrical conductivity is particularly important or the strength is particularly important. When the electrical conductivity is particularly important, the annealing is performed at a temperature higher than 180 ° C. and not higher than 300 ° C. and 53% IACS or higher. Ensure conductivity and good moldability. On the other hand, when stress is particularly emphasized, annealing at 170 ° C. to 210 ° C. is performed to ensure strength of 200 MPa or more, conductivity of 50% IACS or more, and good moldability.
The obtained aluminum alloy plate is not limited to use in a specific application, but is preferably used for electronic video parts, electronic parts, general household appliance parts, etc. Suitable for use as a housing.
[0031]
【Example】
Examples of the present invention will be described below in comparison with comparative examples.
Example 1
A slab having a thickness of 44 mm, a width of 250 mm, and a length of 400 mm was cast from the alloy components shown in Table 1 by semi-continuous casting, and after a homogenization treatment at 560 ° C. × 8 hours, a face shaving piece surface of 5 mm was formed. After chamfering, heating to 510 ° C. was performed to obtain a plate material having a thickness of 7.0 mm (temperature after rolling: 300 ° C.), and further, a plate material having a thickness of 1.0 mm × width of 180 mm was produced by cold rolling. This was subjected to an annealing treatment for 4 hours while changing the heating temperature in a muffle furnace, and for the test material obtained above, No. 5 test piece defined in JISH4000 was taken in parallel with the rolling direction, and the tensile strength, yield strength, elongation rate were taken. Was measured. In addition, with respect to formability, a test piece having a width of 20 mm collected in parallel with the rolling direction was used, bent at an inner bend radius of 0.5 mm and 180 °, and the condition of the cracked outer peripheral surface and rough skin after the test was visually checked 1 A five-step evaluation of ~ 5 was performed. That is, it determined by the following evaluation criteria.
Evaluation 1: Good outer peripheral surface evaluation 2: Slightly observed rough skin on the outer peripheral surface Evaluation 3: Occurrence of rough skin (pass)
Evaluation 4: Occurrence of slight necking Evaluation 5: Occurrence of necking and cracking In addition, for the measurement of electrical conductivity, a specimen having a plate thickness × width 10 mm × length 550 mm was taken in parallel with the rolling direction, and the specific resistance was measured by the double bridge method. Was measured, and the electrical conductivity was calculated with the specific resistance value of pure copper as 100. The test results are shown in Table 2.
[0032]
In the invention examples shown in Table 2, high electrical conductivity (53% IACS or more) exceeding pure aluminum alloy 1100-H24 can be ensured by annealing treatment at 190 ° C. or higher, and excellent in strength and bending workability. Characteristics were secured. On the other hand, the test material of the comparative example is clearly inferior in any of conductivity, strength, and bending workability. Moreover, the test material of the comparative condition example manufactured by the comparative condition using the alloy for invention did not have sufficient bending workability due to the low annealing temperature in part. Further, when the annealing temperature was 350 ° C., the occurrence of skin cracks became obvious due to the coarsening of the crystal grain size.
[0033]
[Table 1]

[0034]
[Table 2]

[0035]
Example 2
A slab having a thickness of 44 mm, a width of 250 mm, and a length of 400 mm was cast with the alloy components shown in Table 3 and a part of Table 1 by semi-continuous casting. After homogenization at 560 ° C. × 8 hr, a face shaving face of 5 mm was formed. . After chamfering, the plate was heated to 510 ° C. to obtain a plate material having a thickness of 7.0 mm by hot rolling, and a plate material having a thickness of 1.05 to 1.2 mm × width of 180 mm was produced by cold rolling. This was heated at a heating rate of 5 ° C./min or more, and after a solution treatment of 560 ° C. × 40 sec, quenching was performed at a cooling rate of 5 ° C./sec or more. A plate material having a thickness of 1.00 mm × width of 180 mm × L was obtained again by cold rolling. After rolling, the heating temperature was changed in a muffle furnace, and an annealing treatment was performed for 4 hours to obtain a test material. With respect to the test material obtained above, No. 5 test piece defined in JISH4000 was taken in parallel with the rolling direction, and the tensile strength, yield strength, and elongation were measured. Further, for formability, a 20 mm wide test piece taken in parallel with the rolling direction was used to bend the inner bend radius 0.5 mm, 180 °, and the cracked outer peripheral surface after the test and the condition of rough skin were visually observed 1 to 1 Five grades of 5 were evaluated. In addition, the numerical value in a table | surface was shown by the average value of evaluation by n = 2. For the measurement of electrical conductivity, a specimen having a thickness of 10 mm and a length of 550 mm was taken in parallel with the rolling direction, the specific resistance was measured by the double bridge method, and the specific resistance value of pure copper was calculated as 100 to calculate the electrical conductivity.
[0036]
In the invention examples shown in Table 4, it was confirmed that all of the annealing treatments at 180 ° C. or higher had high electrical conductivity and proof stress of 200 MPa, and high molding performance could be secured by a bending test. On the other hand, in the comparative condition example manufactured according to the comparative condition, any one of conductivity, strength, and bending workability was inferior.
[0037]
[Table 3]

[0038]
[Table 4]

[0039]
【The invention's effect】
As described above, according to the aluminum alloy plate excellent in thermal conductivity and formability of the present invention, by mass%, Si: 0.2 to 1.5%, Mg: 0.2 to 1.5% , Cr: 0.02 to 0.1%, Fe: 0.3% or less, the balance is made of Al and unavoidable impurities, Ti in the unavoidable impurities is regulated to 0.015% or less, and conductive Since the rate is 50% IACS or higher and the thermal conductivity is 200 w / m · K or higher, excellent electrical conductivity, thermal conductivity, and high bending performance are ensured, greatly contributing to the use of plasma displays, electronic components, etc. be able to.
[0040]
Furthermore, according to one of the methods for producing an aluminum alloy plate excellent in thermal conductivity and formability of the present invention, after hot rolling an aluminum alloy having the composition described in the aluminum alloy plate of the present invention, Cold rolling to the final plate thickness without intermediate annealing, and after the cold rolling, annealing is performed to heat to over 180 ° C. to 300 ° C., so that the conductivity is 53% IACS or more and the thermal conductivity is 200 w / m. -It is K or more and can obtain the aluminum alloy plate which is excellent in especially electroconductivity.
[0041]
In addition, according to another method for producing an aluminum alloy plate excellent in heat conductivity and formability of the present invention, after hot rolling an aluminum alloy having the composition described in the aluminum alloy plate of the present invention, in the middle of cold rolling Solution treatment at 500 to 570 ° C. is performed, followed by annealing at 170 to 210 ° C. after cold rolling at a final cold rolling rate of 5 to 15%, so that the conductivity is 50% IACS or more and the thermal conductivity is 200 w. / M · K or more, proof stress is 200 MPa or more, and an aluminum alloy plate having particularly excellent strength can be obtained.
[Brief description of the drawings]
FIG. 1 is a graph showing the correlation between electrical conductivity and thermal conductivity.

Claims (5)

In mass%, Si: 0.2-1.5%, Mg: 0.2-1.5%, Cr: 0.02-0.1%, Fe: 0.3% or less, the balance being A heat characterized by comprising Al and inevitable impurities, Ti in the inevitable impurities being regulated to 0.015% or less, conductivity being 50% IACS or more, and thermal conductivity being 200 w / m · K or more. Aluminum alloy plate with excellent conductivity and formability. Furthermore, Cu: 0.01-1% is contained, The aluminum alloy plate excellent in the heat conductivity and the moldability of Claim 1 characterized by the above-mentioned. 3. The aluminum alloy plate having excellent thermal conductivity and formability according to claim 1 or 2, wherein the aluminum alloy plate is used for a heat radiating plate or a casing for electric / electronic parts. The aluminum alloy having the composition according to claim 1 or 2 is hot-rolled and then cold-rolled to the final thickness without intermediate annealing during the cold-rolling, and after the cold-rolling, more than 180 ° C to 300 ° C An aluminum alloy excellent in thermal conductivity and formability, characterized by obtaining an aluminum alloy plate having an electrical conductivity of 53% IACS or higher and a thermal conductivity of 200 w / m · K or higher by performing annealing heated to ° C. A manufacturing method of a board. After hot rolling the aluminum alloy having the composition according to claim 1 or 2, a solution treatment at 500 to 570 ° C. is performed in the middle of cold rolling, followed by cold rolling with a final cold rolling rate of 5 to 15%. , Annealing to 170-210 ° C. to obtain an aluminum alloy plate having an electrical conductivity of 50% IACS or higher, a thermal conductivity of 200 w / m · K or higher, and a proof stress of 200 MPa or higher. Method of aluminum alloy sheet with excellent properties and formability.

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