KR101822374B1 - Copper alloy strip, electronic component for heavy-current and electronic component for heat release containing the same - Google Patents

Abstract

An object of the present invention is to provide a copper alloy tank having high strength and conductivity and excellent bending workability as compared with conventional materials, a high current electronic component and a heat dissipation electronic component having the same, Of Zr and having a tensile strength of 550 MPa or more and a 0.2% proof stress / tensile strength ≥ 0.9 and a conductivity of 80% IACS or more, preferably a 0.2% proof stress after heating at 300 占 폚 for 30 min And a copper alloy bath, and an electronic component for high current and a heat dissipation electronic component.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a copper alloy tank, a copper alloy tank, a high current electronic component and a heat dissipation electronic component having the copper alloy tank. 2. Description of the Related Art COPPER ALLOY STRIP, ELECTRONIC COMPONENT FOR HEAVY-CURRENT AND ELECTRONIC COMPONENT FOR HEAT RELEASE CONTAINING THE SAME

The present invention relates to a copper alloy bath, and more particularly to a copper alloy bath which is excellent in heat radiation property, conductivity, strength and bending workability and is used for electronic parts such as terminals, connectors, relays, switches, sockets, bus bars and lead frames, And copper alloys suitable for use in heat-radiating parts used in personal computers and the like, and large-current parts used in electric vehicles, hybrid automobiles, and the like.

Electric or electronic devices such as smart phones, tablet PCs, and personal computers are provided with components for obtaining electrical connections such as terminals, connectors, switches, sockets, relays, bus bars, lead frames and the like, Respectively.

In recent years, with the miniaturization of smart phones, tablet PCs, and personal computers, there is a tendency that the heat storage when electric power is supplied to liquid crystal parts or IC chips in electric or electronic devices. In a state where the heat storage is large, thermal damage to the IC chip or the base is large, so that heat dissipation of the heat dissipation parts becomes a problem.

Conventionally, heat dissipation parts in electric and electronic devices such as smart phones, tablet PCs, personal computers and the like include austenitic stainless steels (for example, SUS304 specified in JIS G 4304 " hot rolled stainless steel sheets and strips " Aluminum and the like have been mainly used. For example, a heat dissipation component (liquid crystal frame) attached to a liquid crystal of a smart phone or a tablet PC is required to have strength as a structure and bending workability required for fixing the liquid crystal in addition to high heat dissipation.

The austenitic stainless steel (SUS304) has good bending workability, but has low thermal conductivity. To compensate for this, an expensive thermal conductive sheet or the like is used in combination. Therefore, the unit price of the heat-radiating part is increased. On the other hand, in pure aluminum and aluminum alloy, bending workability was good, but heat conductivity and strength as a structural body were not sufficient.

In electrical components such as terminals and connectors, the cross-sectional area of the copper alloy in the conductive parts tends to decrease. As the cross-sectional area becomes smaller, the heat generated from the copper alloy when energized increases. Particularly, electronic parts used in electric vehicles and hybrid electric vehicles, which have remarkable growth, have parts that flow a significantly high current such as a connector of a battery unit, and heat generation of the copper alloy in service becomes a problem. Therefore, it is required that the conductive material be excellent in electric conductivity so that the heat generation amount is reduced, and further strength (particularly high 0.2% proof stress) and excellent bending workability are demanded so as to cope with miniaturization and high performance of parts.

It is known that the thermal conductivity and the conductivity are in a proportional relationship. As an alloy having a relatively high conductivity and strength in response to the above requirements, a material in which Zr, Cr, and Ti are added to Cu is known. For example, C15100 (0.1 mass% Zr-balance Cu), C15150 (0.02 mass% Zr-balance Cu), C18140 (0.1 mass% Zr-0.3 mass% Cr- 0.02 mass% Si- 0.08 mass% Ti-0.5 mass% Cr-0.2 mass% Cr-0.2 mass% Zn-balance Cu), C18070 (0.1 mass% Ti- 0.3 mass% Cr- 0.02 mass% Si- 0.1% by mass Ag-0.08% by mass Fe-0.06% by mass Si-balance Cu) is registered in the CDA (Copper Development Association).

Although heat resistance parts and copper alloys for electronic materials are required to have some strength, for example, Cu-Zr alloys such as C15100 among the above alloys may lack strength.

On the other hand, a Cu-Cr-Zr alloy such as C18140 generally has 0.2% proof strength better than C15100, but it is very difficult to dissolve Cr in the Cu alloy. Therefore, an invention for improving the strength, the electric conductivity and the bending workability of a Cu-Zr alloy having a relatively low manufacturing difficulty has recently been carried out.

In Patent Document 1, a copper alloy containing Zr in a range of 0.05% to 0.3% by weight is subjected to first cold rolling, first heat treatment, second cold rolling, and second heat treatment while applying a tensile force after hot rolling To thereby provide a copper alloy having good balance of strength, conductivity, and bending workability.

Patent Document 2 discloses a copper alloy containing Zr in a range of 0.01 mass% to 0.5 mass%, wherein the orientation distribution density of the Brass orientation in the texture is 20 or less and the Brass orientation, the orientation distribution of the S orientation and the copper orientation Discloses a copper alloy having a strength of 10 to 50 and a good bending workability.

Patent Document 3 discloses a copper alloy containing Zr in a range of 0.05% to 0.2% by weight. The average of KAM values measured by the EBSD method using a scanning electron microscope equipped with a backscattering electron diffraction imaging system is 1.5 to 1.8 °, the minimum bending radius at which cracking does not occur in the W bending test is R, and the plate thickness is t, the strength, springiness and bending strength with R / t of 0.1 to 0.6 and spring limit of 420 to 520 N / Discloses a copper alloy excellent in workability.

Patent Document 4 discloses that a total of 0.05 to 1.0 mass% of at least one of Cr, Zr and Ti is contained in a weight ratio and the area ratio of the Cube orientation {001} < 001 > in the crystal orientation analysis in the EBSD measurement is And a Young's modulus (longitudinal elastic modulus and flexural modulus) of 5% or more and 70% or less, and Vickers hardness of 120 or more, thereby realizing strength, bending workability, and low Young's modulus.

Japanese Patent Application Laid-Open No. 2010-248592 Japanese Patent Application Laid-Open No. 2010-242177 Japanese Laid-Open Patent Publication No. 2012-172168 Japanese Patent Publication No. 5170916

However, although the inventions described in Patent Documents 1 to 4 have a certain degree of mechanical strength and good bending workability, the strength and bending workability required for copper alloys such as electronic materials in recent years are not sufficient . Specifically, in the embodiments of the invention described in Patent Documents 1 to 3, the tensile strength of the Cu-Zr alloy is 457 to 560 MPa, the 0.2% proof stress of the Cu-Zr alloy is 425 MPa in the embodiment described in Patent Document 4, Both the strength and the 0.2% proof strength may lack strength.

In addition, although the patent literature focuses on improvement of tensile strength, in practical electronic parts, a high 0.2% proof stress is often required. However, in the Cu-Zr alloy, even if the tensile strength is improved by work hardening, there is a problem that the 0.2% proof stress is not raised higher than a certain level (work hardening is saturated). In addition, Cu-Zr based copper alloys are mainly controlled in crystal orientation because precipitation hardening due to aging and work hardening due to rolling are small.

It is therefore an object of the present invention to provide a copper alloy plate having high strength and conductivity and excellent bending workability as compared with the conventional materials, a high current electronic component and a heat dissipation electronic component having the same, more specifically, Strength and 0.2% proof stress), and the balance between the conductivity and the bending workability.

The present inventors conducted the aging treatment of the Cu-Zr-based copper alloy bath at least two times and adjusted the conditions of the cold rolling between the aging temperature, the aging and the aging, and the cold rolling after the final aging, so that good strength and conductivity, . The following inventions were completed based on the above findings.

The Cu-Zr-based copper alloy bath of the present invention contains 0.04 to 0.5 mass% Zr and has a tensile strength of 550 MPa or more and a conductivity of 80% IACS or more.

In the copper alloy bath of the present invention, the ratio of the tensile strength (TS) to the 0.2% proof stress (YS) is preferably YS / TS? 0.9.

It is also preferable that the copper alloy bath of the present invention has a 0.2% proof stress of 500 MPa or more after being heated at 300 DEG C for 30 minutes.

In the copper alloy bath of the present invention, the X-ray diffraction integral intensity of the {200} plane measured in the thickness direction on the rolled surface is I {200} using the X-ray diffraction method, When the X-ray diffraction integral intensity of the {220} plane is I {220} and the X-ray diffraction integral intensity of the {311} plane is I {311}, 0.1? It is preferable that [I {200} + I {111} + I {311}] / I {220}

The copper alloy bath of the present invention preferably contains at most 0.1 mass% of at least one element selected from the group consisting of Ag, Ni, Mn, Mg, Zn, Sn, B and Ca.

The high-current electronic component and the heat-dissipating electronic component of the present invention comprise any of the above copper alloy tanks.

According to the present invention, it is possible to provide a copper alloy bath having high strength, high conductivity and excellent bending workability. This copper alloy bath can be suitably used as a material for electronic parts such as terminals, connectors, switches, sockets, relays, bus bars, lead frames and heat sinks, and can be used for heat- The present invention relates to a copper alloy tank suitable for use in electronic components for large currents used in automobiles and the like.

Hereinafter, embodiments of the present invention will be described in detail.

(characteristic)

The copper alloy bath according to one embodiment of the present invention is intended to set the conductivity of the copper alloy bath at 80% IACS or higher and the tensile strength at 550 MPa or higher. If the conductivity is 80% IACS or more, the thermal conductivity is also good, and there is no problem as a material for high-current electronic parts and heat dissipation parts. When the tensile strength is 550 MPa or more, it has the required strength as a structural material. If the 0.2% proof stress / tensile strength is 0.9 or more, it has spring characteristics required for electronic parts such as connectors, switches, sockets, and relay materials. When the 0.2% proof stress after heating at 300 占 폚 for 30 minutes is 500 MPa or more, it has heat resistance as an electronic component for a large current and a heat dissipating component. When the X-ray diffraction integrated intensity using the X-ray diffraction method is in the range of 0.1? [I {200} + I {111} + I {311}] / I {220}? 0.6, it can be said that good bending workability is obtained.

The copper alloy bath of the present invention having the above characteristics is preferable for the use of the heat dissipation electronic component and the high current electronic component.

(Alloy component concentration)

The Cu-Zr alloy bath according to the embodiment of the present invention contains Zr in an amount of 0.040 to 0.50 mass%, and the total content of Zr is preferably 0.050 to 0.30 mass%, more preferably 0.050 to 0.20 mass% do. When the sum of Zr is too small, it becomes difficult to obtain a tensile strength of 550 MPa or more. If the Zr concentration is excessively large, it becomes difficult to manufacture an alloy due to hot rolling cracks or the like.

The Cu-Zr alloy may contain at least one of Ag, Sn, Zn, Mg, Mn, B and Ca in order to improve strength and heat resistance. However, if the added amount is too large, the conductivity may be lowered to lower than 80% IACS or the alloy composition may be deteriorated. Therefore, the added amount is at most 0.1 mass% in total amount.

(thickness)

The thickness of the product, that is, the plate thickness t, is preferably 0.05 to 2.0 mm. If the thickness is too small, sufficient heat radiation property can not be obtained, which is unsuitable as a material for heat dissipation electronic parts. On the other hand, if the thickness is excessively large, bending and drawing processing become difficult. From this viewpoint, the more preferable thickness is 0.08 to 1.5 mm. When the thickness is within the above range, bending workability can be improved while suppressing the heat accumulation.

(Conductivity)

In the present invention, the conductivity measured according to JIS H 0505 is 80% IACS or more. When the conductivity is 80% IACS or more, the thermal conductivity is good and good heat radiation can be ensured. More preferably 85% IACS or higher.

(The tensile strength)

In the present invention, when the tensile strength of the copper alloy tank is 550 MPa or more, it can be said that the steel has a strength required for the material of the structural member. More preferably 570 MPa or more.

(0.2% proof)

In the present invention, the 0.2% strength / tensile strength (YS / TS) of the copper alloy bath is set to 0.9 or more, whereby the copper alloy bath has the spring properties required for the connector, the switch and the relay material.

(Heat resistance)

In the present invention, the 0.2% proof stress ≥ 500 MPa after heating at 300 캜 for 30 min makes it possible to have heat resistance as a high current electronic component and a heat dissipation component.

(Bending workability)

The evaluation of the bending workability of the present invention is carried out by a W bending test (JIS-H 3130) using a test piece having a width of 10 mm and a length of 30 mm. The direction of drawing the test pieces is the direction of rolling parallelism (GW) and the direction perpendicular to the rolling direction (BW), and the ratio (MBR / t) of the minimum bend radius (MBR) . The ratio (MBR / t) of the minimum bending radius (MBR) is preferably 2.0 or less from the viewpoint of ensuring good bendability. A more preferable range of MBR / t is 1.8 or less.

(Crystal orientation)

The X-ray diffraction integral intensity of the {200} plane obtained in the thickness direction on the surface of the rolled surface by X-ray diffractometry is I {200}, the X-ray diffraction integral intensity of the {111} I {200} + I {200} when the integral intensity of the X-ray diffraction at the {220} plane is I {220} and the intensity of X-ray diffraction at the {311} plane is I {311} 111} + I {311}] / I {220} 0.6 (that is, not less than 0.1 and not more than 0.6), the bending workability is improved. A more preferable range is 0.25 or more and 0.55 or less. On the other hand, if it is out of the above range, the bending workability is inferior. The standard sample of pure copper powder is defined as copper powder having a purity of 325 mesh (JIS Z 8801) of 99.5%.

Hereinafter, an example of a preferred method of producing a copper alloy tank according to the present invention will be described.

As the pure copper raw material, electric copper or the like is dissolved, Zr and other alloying elements are added as necessary, and the ingot is cast with a thickness of about 30 to 300 mm. This ingot is formed into a plate having a thickness of about 3 to 30 mm by, for example, hot rolling at 800 to 1000 DEG C, and then cold rolling and aging treatment at least twice are repeated, , And in some cases, stress relieving annealing is performed last. The stress relieving annealing is not particularly required.

The aging treatment is carried out at a temperature of 300 ° C to 400 ° C for at least 2 times in the range of 1 to 30 hours. Preferably 340 to 390 ° C, and more preferably 350 to 390 ° C.

By annealing under a proper condition in which the rolled structure is not recrystallized, work hardening by subsequent rolling becomes large, and a tensile strength of 550 MPa or more is obtained. If the aging temperature is higher than 400 DEG C, a strength of 550 MPa or more can not be obtained. On the other hand, if the aging temperature is lower than 300 캜, a conductivity of 80% IACS or more can not be obtained.

The final aging temperature is adjusted in the range of ± 25 ° C. with respect to the aging temperature before the last one so that the crystal orientation is 0.1 ≦ [I {200} + I {111} + I {311}] / I {220} And the bending workability is improved.

In addition, when the final aging temperature is 0 to 25 ° C lower than the aging temperature one time before the last, the 0.2% proof stress after heating at 300 ° C for 30 minutes becomes 500 MPa or more. On the other hand, if the final aging temperature is high, the 0.2% proof stress after 300 DEG C x 30 min heating becomes 500 MPa or less, and the balance between strength, electric conductivity and bending workability is excellent, but there is room for improvement from the viewpoint of heat resistance.

The tensile strength, the electric conductivity, and the 0.2% proof stress are determined by all the conditions of the processing, for example, the degree of processing between the aging treatments, the temperature of the first aging treatment, the degree of processing of the final cold rolling, And the like can be appropriately carried out.

By adjusting the cold rolling processability between aging and aging to more than 60%, YS / TS ≥ 0.9 is obtained. A more preferable processing degree is 75% or more. YS / TS ≥ 0.9 is not obtained when the cold rolling processability between aging and aging is less than 60%.

As long as the degree of cold rolling between the aging condition and the aging is adjusted, the aging may be carried out several times, but it is preferable that the aging is performed twice in consideration of the production cost.

The degree of cold rolling after the final aging is 50% to 80%. , Preferably 60 to 75%, and more preferably 60 to 70%. A tensile strength of 550 MPa is not obtained at less than 50%, and a Cu-Zr compound precipitated by aging at 80% or more is recycled to the parent phase by rolling and the electrical conductivity is lowered to less than 80% IACS.

In the case of stress relieving annealing, a continuous annealing furnace is used. The furnace temperature is set to a range of 300 to 700 ° C, preferably 350 to 650 ° C, and a range of 5 seconds to 10 minutes. It is not always necessary to perform stress relief annealing.

An embodiment of the present invention is characterized in that the Cu-Zr alloy bath has a tensile strength? 550 MPa and a conductivity? 80% IACS and a YS / TS? 0.9 characteristic and a 0.2% proof stress? 500 MPa after heating at 300 占 폚 for 30 min. , And 0.1 ≤ [I {200} + I {111} + I {311}] / I {220} ≤0.6 are given to improve the strength, conductivity and bending workability. When the manufacturing conditions for this are summarized,

(1) For tensile strength? 550 MPa,

a. The aging temperature is adjusted to less than 400 캜.

b. The finishing rolling process degree is adjusted to 50% or more.

(2) Conductivity ≥ 80% For IACS,

a. Adjust the aging temperature to 300 ° C or higher.

b. The finishing rolling process is adjusted to 80% or less.

(3) For YS / TS? 0.9,

a. The cold rolling process between aging and aging is adjusted to 60% or more.

(4) For 0.2% proof stress after heating at 300 ° C x 30 min ≥ 500 MPa,

a. Adjust the final aging temperature from 0 to 25 ° C lower than the aging temperature before the last one.

(5) For 0.1 ≤ [I {200} + I {111} + I {311}] / I {220}

a. The final aging temperature is adjusted in the range of ± 25 ° C with respect to the aging temperature one before the last.

The copper alloy bath manufactured as described above is processed into a new copper alloy product of various thicknesses (expanded copper products), and is used as a large current electronic component in electronic and electronic devices such as a smart phone, a tablet PC and a personal computer, Parts and so on.

Example

Embodiments of the present invention will now be described, but these embodiments are provided for a better understanding of the present invention and its advantages, and are not intended to limit the scope of the present invention. In the following examples, the number of times of aging is two, but there is no problem even if the aging frequency is three times or more.

The alloy element was added to molten copper and then cast into an ingot having a thickness of 200 mm. The ingot was heated at 950 占 폚 for 3 hours and hot rolled at 950 占 폚 to obtain a plate having a thickness of 15 mm. The oxide scale on the surface of the hot-rolled plate was grinded and removed by a grinder, and then the aging and the cold rolling were repeated and finished to a predetermined product thickness by final cold rolling. Finally, stress relieving annealing was performed using a continuous annealing furnace.

In the first aging, a batch furnace was used and heat treatment was performed in a furnace temperature range of 200 to 500 DEG C for 1 to 30 hours.

In the cold rolling after aging, the total processing degree was controlled.

The final aging degree batch furnace was used and heat treatment was performed in a furnace temperature range of 200 to 500 DEG C for 1 to 30 hours. Several conditions were changed for the first aging temperature.

In the final cold rolling, the total processing degree was controlled.

In the stress relieving annealing, the furnace temperature was set to 500 ° C and the heating time was adjusted between 1 second and 15 minutes. In addition, stress relieving annealing is omitted for some materials.

The production conditions of the examples are shown in Table 1 for each of Examples and Comparative Examples. Materials during manufacture and materials after stress relief annealing The following measurements were made.

(ingredient)

The alloy element concentration of the material after the final cold rolling or after the stress relieving annealing was analyzed by ICP-mass spectrometry. In addition, the analytical values of the components in the table do not include elements lower than 10 ppm.

(Tensile strength and 0.2% proof stress)

For the material after the final cold rolling and after the stress relieving annealing, the test piece No. 13B specified in JIS Z 2241 was taken so that the tensile direction was parallel to the rolling direction, and a tensile test was conducted in parallel with the rolling direction in accordance with JIS Z 2241 , And the tensile strength (TS) and the 0.2% proof stress (YS) were determined.

(Heat resistance)

The material was held for 30 minutes in a furnace set at 300 DEG C, and then taken out to sample the air-cooled sample, and the 0.2% proof stress was measured in the same manner as described in the section "tensile strength and 0.2% proof stress".

(Stretching)

The 13B test piece specified in JIS Z 2241 was taken from the material after the final cold rolling or after the stress relieving annealing so that the tensile direction was parallel to the rolling direction and the elongation was measured at a distance between the gaps of 50 mm.

(Conductivity)

A test piece was taken from the material after the final cold rolling or after the stress relieving annealing so that the longitudinal direction of the test piece became parallel to the rolling direction and the conductivity at 20 캜 was measured by the dividing method according to JIS H 0505.

(Crystal orientation)

The X-ray diffraction intensity (I) of the {200}, {111}, {311} and {220} planes was measured on the surface of the rolled surface of the material after the final cold rolling or after the stress relieving annealing. As the X-ray diffraction apparatus, RINT2500 manufactured by RIGAKU Co., Ltd. was used, and measurements were made with Cu tube at a tube voltage of 25 kV and a tube current of 20 mA.

(MBR / t)

(Goodway) direction in which the bending axis is in the direction perpendicular to the rolling direction and in the BW (Badway) direction in which the bending axis is in the same direction as the rolling direction according to JIS H 3130, and a W- , The ratio of the minimum bending radius (MBR) and the thickness (t) at which cracking did not occur (MBR / t) was obtained by changing the bending radius.

As can be seen from the results shown in Table 1, in Inventive Examples 1 to 20, Zr was contained in a total amount of 0.04 to 0.50 mass%, the first aging was carried out at 300 to 400 캜, and the subsequent cold rolling process was performed at 60 %, And the subsequent final aging was carried out at 300 to 400 DEG C, the final cold rolling process was adjusted to 50 to 80%, and finally the stress relieving annealing was performed (Example 12 was omitted). As a result, the copper alloy sheets of Inventive Examples 1 to 20 were able to achieve a tensile strength? 550 MPa, a 0.2% proof stress / tensile strength? 0.9, and a conductivity? 80% IACS.

When the temperature difference between the first time and the final aging is set within 25 占 폚, the bending workability is improved, and when the first aging temperature is lower than the final aging temperature, the heat resistance is improved. From this viewpoint, in Inventive Example 5, since the first aging temperature was lower than the final aging temperature, the heat resistance was poor. In Inventive Example 7, the temperature difference between the first aging and the final aging was 25 deg. Heat resistance and bending workability were bad.

On the other hand, in Comparative Examples 1 and 2, the electrolysis temperature was outside the range of 300 to 400 占 폚, the electric conductivity was low in Comparative Example 1 in which the aging temperature was low, and the tensile strength was low in Comparative Example 2 in which the aging temperature was high.

In Comparative Example 3, the degree of cold rolling between ages was low and the ratio of 0.2% proof stress / tensile strength was less than 0.9.

In Comparative Examples 5 and 6, the final cold rolling process was out of the range of 50 to 80%. In Comparative Example 5 in which the degree of processing was low, the tensile strength was low.

In Comparative Examples 7 and 8, it was difficult to achieve balance of tensile strength, 0.2% proof stress / tensile strength, or conductivity balance with a material produced by one aging treatment.

In Comparative Example 9, the Zr concentration was low and the tensile strength was low.

In Comparative Example 10, the conductivity was low because the concentration of the additive element was 0.1% by mass or more.

Comparative Example 11 is a copper alloy produced in the same manner as in Example 1 of Patent Document 1 (Japanese Unexamined Patent Application Publication No. 2010-248592). The ratio of tensile strength and 0.2% proof stress / tensile strength was low.

Comparative Examples 12 and 13 are copper alloys produced in the same manner as in Example 1 and Example 12 of Patent Document 2 (Japanese Unexamined Patent Application Publication No. 2010-242177). In the Cu-Zr alloy of Comparative Example 12, the ratio of tensile strength and 0.2% proof stress / tensile strength was low. On the other hand, the addition of the additional element as in Comparative Example 13 satisfied the tensile strength? 550 MPa and the conductivity? 80% IACS, but the 0.2% proof stress was low and the ratio of 0.2% proof stress / tensile strength was low.

Comparative Example 14 was prepared in the same manner as in Example 5 of Patent Document 3 (Japanese Patent Application Laid-Open No. 2012-172168) and Comparative Example 15 was prepared in the same manner as in Production Example 1-1 of Patent Document 4 (Japanese Patent Publication No. 5170916) Copper alloy, but the ratio of 0.2% proof stress / tensile strength was low.

From the above results, it is apparent that the present invention can provide a copper alloy plate having high strength, conductivity, and bending workability, a high current electronic component having the same, a heat dissipation electronic component, and a method of manufacturing a copper alloy plate .

Claims (6)

A copper alloy bath containing 0.04 to 0.5 mass% of Zr and the balance of Cu and unavoidable impurities and having a tensile strength of 550 MPa or more and a 0.2% proof stress / tensile strength ≥ 0.9 and a conductivity of 80% IACS or more. The method according to claim 1,
A copper alloy tank satisfying 0.2% proof stress ≥ 500 MPa after heating at 300 캜 for 30 min. The method according to claim 1,
The X-ray diffraction intensity from the {200} plane on the surface of the rolled surface is I {200}, the X-ray diffraction intensity from the {111} plane is I {111} I {200} + I {111} + I {311}} is obtained when I {220} is an integral intensity of X-ray diffraction and I {311} / I {220} &lt; / = 0.6. The method according to claim 1,
Wherein at least one of the elements selected from the group consisting of Ag, Ni, Mn, Mg, Zn, Sn, B and Ca is contained at most 0.1 mass%. A large current electronic component comprising the copper alloy tanks according to any one of claims 1 to 4. A heat dissipation electronic component comprising the copper alloy bath according to any one of claims 1 to 4.