JP2004534908A5 - - Google Patents

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Publication number
JP2004534908A5
JP2004534908A5 JP2003511298A JP2003511298A JP2004534908A5 JP 2004534908 A5 JP2004534908 A5 JP 2004534908A5 JP 2003511298 A JP2003511298 A JP 2003511298A JP 2003511298 A JP2003511298 A JP 2003511298A JP 2004534908 A5 JP2004534908 A5 JP 2004534908A5
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JP
Japan
Prior art keywords
recipe
process layer
plating
parameter
measured thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003511298A
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English (en)
Japanese (ja)
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JP2004534908A (ja
JP4307251B2 (ja
Filing date
Publication date
Priority claimed from US09/897,626 external-priority patent/US6444481B1/en
Application filed filed Critical
Publication of JP2004534908A publication Critical patent/JP2004534908A/ja
Publication of JP2004534908A5 publication Critical patent/JP2004534908A5/ja
Application granted granted Critical
Publication of JP4307251B2 publication Critical patent/JP4307251B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2003511298A 2001-07-02 2002-06-12 めっきプロセスを制御する方法と装置 Expired - Fee Related JP4307251B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/897,626 US6444481B1 (en) 2001-07-02 2001-07-02 Method and apparatus for controlling a plating process
PCT/US2002/018857 WO2003005430A2 (en) 2001-07-02 2002-06-12 Method and apparatus for controlling a plating process

Publications (3)

Publication Number Publication Date
JP2004534908A JP2004534908A (ja) 2004-11-18
JP2004534908A5 true JP2004534908A5 (https=) 2006-01-05
JP4307251B2 JP4307251B2 (ja) 2009-08-05

Family

ID=25408146

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003511298A Expired - Fee Related JP4307251B2 (ja) 2001-07-02 2002-06-12 めっきプロセスを制御する方法と装置

Country Status (8)

Country Link
US (1) US6444481B1 (https=)
EP (1) EP1402568A2 (https=)
JP (1) JP4307251B2 (https=)
KR (1) KR100847370B1 (https=)
CN (1) CN1261980C (https=)
AU (1) AU2002345688A1 (https=)
TW (1) TW580723B (https=)
WO (1) WO2003005430A2 (https=)

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JP3897922B2 (ja) * 1998-12-15 2007-03-28 株式会社東芝 半導体装置の製造方法、及びコンピュ−タ読取り可能な記録媒体
AU2001282879A1 (en) 2000-07-08 2002-01-21 Semitool, Inc. Methods and apparatus for processing microelectronic workpieces using metrology
US6747734B1 (en) * 2000-07-08 2004-06-08 Semitool, Inc. Apparatus and method for processing a microelectronic workpiece using metrology
US6428673B1 (en) * 2000-07-08 2002-08-06 Semitool, Inc. Apparatus and method for electrochemical processing of a microelectronic workpiece, capable of modifying processing based on metrology
US6842659B2 (en) * 2001-08-24 2005-01-11 Applied Materials Inc. Method and apparatus for providing intra-tool monitoring and control
CN1608308A (zh) 2001-11-13 2005-04-20 Fsi国际公司 微型电子基片的自动化加工用的减少占地的工具
US7068303B2 (en) * 2002-06-03 2006-06-27 Microsoft Corporation System and method for calibrating a camera with one-dimensional objects
US6773931B2 (en) * 2002-07-29 2004-08-10 Advanced Micro Devices, Inc. Dynamic targeting for a process control system
US20050021272A1 (en) * 2003-07-07 2005-01-27 Jenkins Naomi M. Method and apparatus for performing metrology dispatching based upon fault detection
US7086927B2 (en) * 2004-03-09 2006-08-08 Micron Technology, Inc. Methods and systems for planarizing workpieces, e.g., microelectronic workpieces
US6980873B2 (en) 2004-04-23 2005-12-27 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for real-time fault detection, classification, and correction in a semiconductor manufacturing environment
US7437404B2 (en) * 2004-05-20 2008-10-14 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for improving equipment communication in semiconductor manufacturing equipment
US7296103B1 (en) * 2004-10-05 2007-11-13 Advanced Micro Devices, Inc. Method and system for dynamically selecting wafer lots for metrology processing
US20070227633A1 (en) * 2006-04-04 2007-10-04 Basol Bulent M Composition control for roll-to-roll processed photovoltaic films
US7736913B2 (en) * 2006-04-04 2010-06-15 Solopower, Inc. Composition control for photovoltaic thin film manufacturing
JP5032360B2 (ja) * 2008-02-12 2012-09-26 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US8406911B2 (en) 2010-07-16 2013-03-26 HGST Netherlands B.V. Implementing sequential segmented interleaving algorithm for enhanced process control
KR101681194B1 (ko) * 2015-11-16 2016-12-12 대영엔지니어링 주식회사 전착도장 품질관리방법
CN107808250B (zh) * 2017-10-30 2021-10-08 珠海杰赛科技有限公司 一种垂直电镀投料控制方法及系统
EP3781398B1 (en) * 2018-04-17 2024-07-10 3M Innovative Properties Company Method of making electrically-conductive film
JP6959190B2 (ja) 2018-07-24 2021-11-02 旭化成エレクトロニクス株式会社 学習処理装置、学習処理方法、化合物半導体の製造方法およびプログラム
US11061382B2 (en) * 2018-12-18 2021-07-13 General Electric Company Methods of forming electroformed components and related system
KR102317993B1 (ko) * 2019-11-27 2021-10-27 한국생산기술연구원 도금 막 두께 예측 장치 및 방법
US12116686B2 (en) * 2022-02-11 2024-10-15 Applied Materials, Inc. Parameter adjustment model for semiconductor processing chambers
KR20250041087A (ko) 2022-08-26 2025-03-25 가부시키가이샤 에바라 세이사꾸쇼 기판 상태 측정 장치, 도금 장치, 및 기판 상태 측정 방법
DE102023105206A1 (de) * 2023-03-02 2024-09-05 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Verfahren und System zum Herstellen eines Substrats mittels Kupferabscheidung und entsprechendes Substrat
CN118480837A (zh) * 2024-05-08 2024-08-13 台州雅仕美医疗科技有限公司 一种个性定制式种植桥架及其制备方法

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US2895888A (en) * 1957-10-07 1959-07-21 Industrial Nucleonics Corp Electrolytic plating apparatus and process
US3984679A (en) * 1975-02-18 1976-10-05 Gte Laboratories Incorporated Coating thickness monitor for multiple layers
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US6020264A (en) * 1997-01-31 2000-02-01 International Business Machines Corporation Method and apparatus for in-line oxide thickness determination in chemical-mechanical polishing
US6238539B1 (en) * 1999-06-25 2001-05-29 Hughes Electronics Corporation Method of in-situ displacement/stress control in electroplating
US6405096B1 (en) * 1999-08-10 2002-06-11 Advanced Micro Devices, Inc. Method and apparatus for run-to-run controlling of overlay registration
US20020192944A1 (en) * 2001-06-13 2002-12-19 Sonderman Thomas J. Method and apparatus for controlling a thickness of a copper film

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