TW580723B - Method and apparatus for controlling a plating process - Google Patents

Method and apparatus for controlling a plating process Download PDF

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Publication number
TW580723B
TW580723B TW091112993A TW91112993A TW580723B TW 580723 B TW580723 B TW 580723B TW 091112993 A TW091112993 A TW 091112993A TW 91112993 A TW91112993 A TW 91112993A TW 580723 B TW580723 B TW 580723B
Authority
TW
Taiwan
Prior art keywords
processing
layer
plating
prescription
thickness
Prior art date
Application number
TW091112993A
Other languages
English (en)
Chinese (zh)
Inventor
Alexander J Pasadyn
Thomas J Sonderman
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Application granted granted Critical
Publication of TW580723B publication Critical patent/TW580723B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/238—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H10P14/47—Electrolytic deposition, i.e. electroplating; Electroless plating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/056—Manufacture or treatment of conductive parts of the interconnections by filling conductive material into holes, grooves or trenches

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electroplating Methods And Accessories (AREA)
TW091112993A 2001-07-02 2002-06-14 Method and apparatus for controlling a plating process TW580723B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/897,626 US6444481B1 (en) 2001-07-02 2001-07-02 Method and apparatus for controlling a plating process

Publications (1)

Publication Number Publication Date
TW580723B true TW580723B (en) 2004-03-21

Family

ID=25408146

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091112993A TW580723B (en) 2001-07-02 2002-06-14 Method and apparatus for controlling a plating process

Country Status (8)

Country Link
US (1) US6444481B1 (https=)
EP (1) EP1402568A2 (https=)
JP (1) JP4307251B2 (https=)
KR (1) KR100847370B1 (https=)
CN (1) CN1261980C (https=)
AU (1) AU2002345688A1 (https=)
TW (1) TW580723B (https=)
WO (1) WO2003005430A2 (https=)

Cited By (1)

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TWI858499B (zh) * 2022-02-11 2024-10-11 美商應用材料股份有限公司 調整用於半導體製程的製程配方參數的系統及方法、及其非暫態電腦可讀取媒體

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JP3897922B2 (ja) * 1998-12-15 2007-03-28 株式会社東芝 半導体装置の製造方法、及びコンピュ−タ読取り可能な記録媒体
AU2001282879A1 (en) 2000-07-08 2002-01-21 Semitool, Inc. Methods and apparatus for processing microelectronic workpieces using metrology
US6747734B1 (en) * 2000-07-08 2004-06-08 Semitool, Inc. Apparatus and method for processing a microelectronic workpiece using metrology
US6428673B1 (en) * 2000-07-08 2002-08-06 Semitool, Inc. Apparatus and method for electrochemical processing of a microelectronic workpiece, capable of modifying processing based on metrology
US6842659B2 (en) * 2001-08-24 2005-01-11 Applied Materials Inc. Method and apparatus for providing intra-tool monitoring and control
CN1608308A (zh) 2001-11-13 2005-04-20 Fsi国际公司 微型电子基片的自动化加工用的减少占地的工具
US7068303B2 (en) * 2002-06-03 2006-06-27 Microsoft Corporation System and method for calibrating a camera with one-dimensional objects
US6773931B2 (en) * 2002-07-29 2004-08-10 Advanced Micro Devices, Inc. Dynamic targeting for a process control system
US20050021272A1 (en) * 2003-07-07 2005-01-27 Jenkins Naomi M. Method and apparatus for performing metrology dispatching based upon fault detection
US7086927B2 (en) * 2004-03-09 2006-08-08 Micron Technology, Inc. Methods and systems for planarizing workpieces, e.g., microelectronic workpieces
US6980873B2 (en) 2004-04-23 2005-12-27 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for real-time fault detection, classification, and correction in a semiconductor manufacturing environment
US7437404B2 (en) * 2004-05-20 2008-10-14 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for improving equipment communication in semiconductor manufacturing equipment
US7296103B1 (en) * 2004-10-05 2007-11-13 Advanced Micro Devices, Inc. Method and system for dynamically selecting wafer lots for metrology processing
US20070227633A1 (en) * 2006-04-04 2007-10-04 Basol Bulent M Composition control for roll-to-roll processed photovoltaic films
US7736913B2 (en) * 2006-04-04 2010-06-15 Solopower, Inc. Composition control for photovoltaic thin film manufacturing
JP5032360B2 (ja) * 2008-02-12 2012-09-26 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US8406911B2 (en) 2010-07-16 2013-03-26 HGST Netherlands B.V. Implementing sequential segmented interleaving algorithm for enhanced process control
KR101681194B1 (ko) * 2015-11-16 2016-12-12 대영엔지니어링 주식회사 전착도장 품질관리방법
CN107808250B (zh) * 2017-10-30 2021-10-08 珠海杰赛科技有限公司 一种垂直电镀投料控制方法及系统
EP3781398B1 (en) * 2018-04-17 2024-07-10 3M Innovative Properties Company Method of making electrically-conductive film
JP6959190B2 (ja) 2018-07-24 2021-11-02 旭化成エレクトロニクス株式会社 学習処理装置、学習処理方法、化合物半導体の製造方法およびプログラム
US11061382B2 (en) * 2018-12-18 2021-07-13 General Electric Company Methods of forming electroformed components and related system
KR102317993B1 (ko) * 2019-11-27 2021-10-27 한국생산기술연구원 도금 막 두께 예측 장치 및 방법
KR20250041087A (ko) 2022-08-26 2025-03-25 가부시키가이샤 에바라 세이사꾸쇼 기판 상태 측정 장치, 도금 장치, 및 기판 상태 측정 방법
DE102023105206A1 (de) * 2023-03-02 2024-09-05 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Verfahren und System zum Herstellen eines Substrats mittels Kupferabscheidung und entsprechendes Substrat
CN118480837A (zh) * 2024-05-08 2024-08-13 台州雅仕美医疗科技有限公司 一种个性定制式种植桥架及其制备方法

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US2895888A (en) * 1957-10-07 1959-07-21 Industrial Nucleonics Corp Electrolytic plating apparatus and process
US3984679A (en) * 1975-02-18 1976-10-05 Gte Laboratories Incorporated Coating thickness monitor for multiple layers
US5391285A (en) * 1994-02-25 1995-02-21 Motorola, Inc. Adjustable plating cell for uniform bump plating of semiconductor wafers
KR0165470B1 (ko) * 1995-11-08 1999-02-01 김광호 반도체 소자의 박막형성 프로그램의 자동보정 시스템
US6020264A (en) * 1997-01-31 2000-02-01 International Business Machines Corporation Method and apparatus for in-line oxide thickness determination in chemical-mechanical polishing
US6238539B1 (en) * 1999-06-25 2001-05-29 Hughes Electronics Corporation Method of in-situ displacement/stress control in electroplating
US6405096B1 (en) * 1999-08-10 2002-06-11 Advanced Micro Devices, Inc. Method and apparatus for run-to-run controlling of overlay registration
US20020192944A1 (en) * 2001-06-13 2002-12-19 Sonderman Thomas J. Method and apparatus for controlling a thickness of a copper film

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI858499B (zh) * 2022-02-11 2024-10-11 美商應用材料股份有限公司 調整用於半導體製程的製程配方參數的系統及方法、及其非暫態電腦可讀取媒體
US12116686B2 (en) 2022-02-11 2024-10-15 Applied Materials, Inc. Parameter adjustment model for semiconductor processing chambers

Also Published As

Publication number Publication date
KR100847370B1 (ko) 2008-07-21
WO2003005430A2 (en) 2003-01-16
WO2003005430A3 (en) 2003-05-08
AU2002345688A1 (en) 2003-01-21
JP2004534908A (ja) 2004-11-18
EP1402568A2 (en) 2004-03-31
US6444481B1 (en) 2002-09-03
JP4307251B2 (ja) 2009-08-05
CN1522464A (zh) 2004-08-18
KR20040013014A (ko) 2004-02-11
CN1261980C (zh) 2006-06-28

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