JP2004527731A5 - - Google Patents

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Publication number
JP2004527731A5
JP2004527731A5 JP2002556581A JP2002556581A JP2004527731A5 JP 2004527731 A5 JP2004527731 A5 JP 2004527731A5 JP 2002556581 A JP2002556581 A JP 2002556581A JP 2002556581 A JP2002556581 A JP 2002556581A JP 2004527731 A5 JP2004527731 A5 JP 2004527731A5
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JP
Japan
Prior art keywords
substrate
pixel
platform body
platform
range
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002556581A
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English (en)
Japanese (ja)
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JP2004527731A (ja
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Publication date
Priority claimed from US09/751,338 external-priority patent/US6621083B2/en
Application filed filed Critical
Publication of JP2004527731A publication Critical patent/JP2004527731A/ja
Publication of JP2004527731A5 publication Critical patent/JP2004527731A5/ja
Pending legal-status Critical Current

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JP2002556581A 2000-12-29 2001-12-20 ボロメータアレイ用の高吸収広帯域ピクセル Pending JP2004527731A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/751,338 US6621083B2 (en) 2000-12-29 2000-12-29 High-absorption wide-band pixel for bolometer arrays
PCT/US2001/050465 WO2002055973A2 (en) 2000-12-29 2001-12-20 High-absorption wide-band pixel for bolometer arrays

Publications (2)

Publication Number Publication Date
JP2004527731A JP2004527731A (ja) 2004-09-09
JP2004527731A5 true JP2004527731A5 (cg-RX-API-DMAC7.html) 2005-12-22

Family

ID=25021543

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002556581A Pending JP2004527731A (ja) 2000-12-29 2001-12-20 ボロメータアレイ用の高吸収広帯域ピクセル

Country Status (8)

Country Link
US (1) US6621083B2 (cg-RX-API-DMAC7.html)
EP (1) EP1346196A2 (cg-RX-API-DMAC7.html)
JP (1) JP2004527731A (cg-RX-API-DMAC7.html)
KR (2) KR20030063489A (cg-RX-API-DMAC7.html)
CN (1) CN100397056C (cg-RX-API-DMAC7.html)
IL (2) IL156693A0 (cg-RX-API-DMAC7.html)
TW (1) TW561249B (cg-RX-API-DMAC7.html)
WO (1) WO2002055973A2 (cg-RX-API-DMAC7.html)

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FR2826725B1 (fr) * 2001-06-28 2004-02-27 Commissariat Energie Atomique Microbolometres resistants aux temperatures de scenes elevees.
EP1588136A4 (en) * 2003-01-31 2006-03-22 Mikron Infrared Inc Formerly K DEVICE FOR THE THERMAL ILLUSTRATION
US7378655B2 (en) * 2003-04-11 2008-05-27 California Institute Of Technology Apparatus and method for sensing electromagnetic radiation using a tunable device
FR2875298B1 (fr) * 2004-09-16 2007-03-02 Commissariat Energie Atomique Detecteur thermique de rayonnement electromagnetique comportant une membrane absorbante fixee en suspension
JP4721141B2 (ja) 2006-03-17 2011-07-13 日本電気株式会社 熱型赤外線固体撮像素子
KR101076666B1 (ko) * 2006-05-25 2011-10-26 파나소닉 전공 주식회사 적외선 센서
KR100785738B1 (ko) * 2006-06-19 2007-12-18 한국과학기술원 볼로미터
US9027025B2 (en) 2007-04-17 2015-05-05 Oracle International Corporation Real-time database exception monitoring tool using instance eviction data
US7825381B2 (en) * 2007-06-29 2010-11-02 Agiltron, Inc. Micromechanical device for infrared sensing
DE102007031959B4 (de) 2007-07-10 2009-11-26 Institut Für Photonische Technologien E.V. Terahertz-Videokamera
DE102008017585B4 (de) * 2008-04-07 2010-03-04 Diehl Bgt Defence Gmbh & Co. Kg Bildsensorsystem
US8123815B2 (en) 2008-11-24 2012-02-28 Biomet Manufacturing Corp. Multiple bearing acetabular prosthesis
US7842533B2 (en) * 2009-01-07 2010-11-30 Robert Bosch Gmbh Electromagnetic radiation sensor and method of manufacture
US9128895B2 (en) * 2009-02-19 2015-09-08 Oracle International Corporation Intelligent flood control management
US8308810B2 (en) 2009-07-14 2012-11-13 Biomet Manufacturing Corp. Multiple bearing acetabular prosthesis
US9165086B2 (en) 2010-01-20 2015-10-20 Oracle International Corporation Hybrid binary XML storage model for efficient XML processing
KR101713280B1 (ko) 2011-03-03 2017-03-08 삼성전자주식회사 전기 에너지 발생장치
FR2977937B1 (fr) 2011-07-15 2013-08-16 Centre Nat Rech Scient Detecteur bolometrique a performances ameliorees
EP2581721B1 (en) 2011-10-10 2019-05-08 Samsung Electronics Co., Ltd Infrared thermal detector and method of manufacturing the same
KR101861147B1 (ko) 2011-11-08 2018-05-28 삼성전자주식회사 적외선 검출기
US9274005B2 (en) * 2012-08-23 2016-03-01 Robert Bosch Gmbh Device and method for increasing infrared absorption in MEMS bolometers
US9006661B1 (en) 2012-10-31 2015-04-14 Exelis, Inc. Compact THz focal plane imaging array with integrated context imaging sensors and antennae matrix
US9297700B2 (en) * 2012-12-03 2016-03-29 Analog Devices, Inc. Photonic sensor and a method of manufacturing such a sensor
KR101902920B1 (ko) 2012-12-11 2018-10-01 삼성전자주식회사 광대역 표면 플라즈몬 공진기를 포함하는 적외선 검출기
KR102040149B1 (ko) 2013-02-01 2019-11-04 삼성전자주식회사 적외선 검출기
US9195048B1 (en) 2013-03-05 2015-11-24 Exelis, Inc. Terahertz tunable filter with microfabricated mirrors
US9234797B1 (en) 2013-03-05 2016-01-12 Exelis, Inc. Compact THz imaging detector with an integrated micro-spectrometer spectral tuning matrix
CN103263255B (zh) * 2013-05-25 2014-09-24 慈溪迈思特电子科技有限公司 人体红外温度传感器的数据处理方法
US9945729B2 (en) 2014-06-04 2018-04-17 Flir Systems, Inc. Systems and methods for enhanced bolometer response
US10222265B2 (en) * 2016-08-19 2019-03-05 Obsidian Sensors, Inc. Thermomechanical device for measuring electromagnetic radiation
KR101776027B1 (ko) * 2017-01-09 2017-09-07 ㈜시리우스 마이크로 볼로미터를 포함하는 공유 앵커 구조의 적외선 센서
FR3097047B1 (fr) * 2019-06-05 2021-05-14 Lynred Microbolomètre muni d’une fonction de filtrage
FR3097046B1 (fr) * 2019-06-05 2021-05-21 Lynred Microbolomètre ayant un pas de pixel réduit
TWI724708B (zh) 2019-12-24 2021-04-11 財團法人工業技術研究院 具有阻擋元件的微機電紅外光感測裝置

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US5286976A (en) * 1988-11-07 1994-02-15 Honeywell Inc. Microstructure design for high IR sensitivity
DE69210735T2 (de) 1991-09-27 1996-10-24 Texas Instruments Inc Ungekühlter Infrarot-Detektor und Herstellungsverfahren dazu
US5288649A (en) 1991-09-30 1994-02-22 Texas Instruments Incorporated Method for forming uncooled infrared detector
FR2736654B1 (fr) 1995-07-13 1997-08-22 Commissariat Energie Atomique Procede de fabrication d'elements de microstructures flottants rigides et dispositif equipe de tels elements
US5688699A (en) 1996-01-16 1997-11-18 Raytheon Company Microbolometer
WO2000012985A1 (en) * 1998-08-31 2000-03-09 Daewoo Electronics Co., Ltd. Bolometer including an absorber made of a material having a low deposition-temperature and a low heat-conductivity
CN1118103C (zh) * 1998-10-21 2003-08-13 李韫言 微细加工热辐射红外传感器
CN1177202C (zh) 1998-11-27 2004-11-24 株式会社大宇电子 具有氧化锌辐射热测量元件的辐射热测量器
US6144285A (en) * 1999-09-13 2000-11-07 Honeywell International Inc. Thermal sensor and method of making same

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