JP2004524665A5 - - Google Patents
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- Publication number
- JP2004524665A5 JP2004524665A5 JP2002580351A JP2002580351A JP2004524665A5 JP 2004524665 A5 JP2004524665 A5 JP 2004524665A5 JP 2002580351 A JP2002580351 A JP 2002580351A JP 2002580351 A JP2002580351 A JP 2002580351A JP 2004524665 A5 JP2004524665 A5 JP 2004524665A5
- Authority
- JP
- Japan
- Prior art keywords
- composition
- finely divided
- conductive pattern
- aluminum
- increasing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002245 particle Substances 0.000 claims 7
- 229910052782 aluminium Inorganic materials 0.000 claims 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 5
- 239000011230 binding agent Substances 0.000 claims 4
- 239000004020 conductor Substances 0.000 claims 4
- 239000007788 liquid Substances 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 1
Claims (4)
- 導電性パターンの固有抵抗を増加させる目的の基材上への導電性パターンの製造における、（ａ）導電性材料、（ｂ）１種または複数種の無機バインダー、ならびに（ｃ）アルミニウムの微細に分割された粒子を含み、構成成分（ａ）、（ｂ）および（ｃ）が液体ビヒクル中に分散されていることを特徴とする組成物の使用。
- 導電性パターンの固有抵抗を増加させる方法であって、前記導電性パターンの製造において、（ａ）導電性材料、（ｂ）１種または複数種の無機バインダー、ならびに（ｃ）アルミニウムの微細に分割された粒子を含み、構成成分（ａ）、（ｂ）および（ｃ）が液体ビヒクル中に分散されている組成物を利用することを含むことを特徴とする方法。
- アルミニウムの微細に分割された粒子の組成物中での使用であって、該組成物から製造される導電性パターンの固有抵抗を増加させる目的のために、液体ビヒクル中に分散された（ａ）導電性材料および（ｂ）１種または複数種の無機バインダーの微細に分割された粒子をさらに含むことを特徴とするアルミニウムの微細に分割された粒子の使用。
- 液体ビヒクル中に分散された（ａ）導電性材料および（ｂ）１種または複数種の無機バインダーの微細に分割された粒子を含む組成物から製造される導電性パターンの固有抵抗を増加させる方法であって、前記組成物への（ｃ）アルミニウムの微細に分割された粒子の組み込みを含むことを特徴とする方法。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GBGB0108886.3A GB0108886D0 (en) | 2001-04-09 | 2001-04-09 | Conductor composition II |
| PCT/US2002/010505 WO2002082472A2 (en) | 2001-04-09 | 2002-04-04 | The use of conductor compositions in electronic circuits |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004524665A JP2004524665A (ja) | 2004-08-12 |
| JP2004524665A5 true JP2004524665A5 (ja) | 2005-07-28 |
Family
ID=9912546
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002580351A Pending JP2004524665A (ja) | 2001-04-09 | 2002-04-04 | 電子回路での導体組成物の使用 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US7189343B2 (ja) |
| EP (1) | EP1377988A2 (ja) |
| JP (1) | JP2004524665A (ja) |
| KR (1) | KR100573327B1 (ja) |
| CN (1) | CN1608298B (ja) |
| AU (1) | AU2002248745A1 (ja) |
| GB (1) | GB0108886D0 (ja) |
| TW (1) | TWI316722B (ja) |
| WO (1) | WO2002082472A2 (ja) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040104262A1 (en) * | 2001-04-09 | 2004-06-03 | Mears Sarah Jane | Use of conductor compositions in electronic circuits |
| GB0307547D0 (en) | 2003-04-01 | 2003-05-07 | Du Pont | Conductor composition V |
| US7384577B2 (en) * | 2005-03-09 | 2008-06-10 | E.I. Du Pont De Nemours And Company | Black conductive thick film compositions, black electrodes, and methods of forming thereof |
| US20060231802A1 (en) | 2005-04-14 | 2006-10-19 | Takuya Konno | Electroconductive thick film composition, electrode, and solar cell formed therefrom |
| US7494607B2 (en) * | 2005-04-14 | 2009-02-24 | E.I. Du Pont De Nemours And Company | Electroconductive thick film composition(s), electrode(s), and semiconductor device(s) formed therefrom |
| US7611645B2 (en) * | 2005-04-25 | 2009-11-03 | E. I. Du Pont De Nemours And Company | Thick film conductor compositions and the use thereof in LTCC circuits and devices |
| US7771623B2 (en) * | 2005-06-07 | 2010-08-10 | E.I. du Pont de Nemours and Company Dupont (UK) Limited | Aluminum thick film composition(s), electrode(s), semiconductor device(s) and methods of making thereof |
| US7824579B2 (en) * | 2005-06-07 | 2010-11-02 | E. I. Du Pont De Nemours And Company | Aluminum thick film composition(s), electrode(s), semiconductor device(s) and methods of making thereof |
| US20070023388A1 (en) * | 2005-07-28 | 2007-02-01 | Nair Kumaran M | Conductor composition for use in LTCC photosensitive tape on substrate applications |
| US20100193494A1 (en) * | 2009-02-02 | 2010-08-05 | Basf Catalysts Llc | Conductive Compositions |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3583931A (en) | 1969-11-26 | 1971-06-08 | Du Pont | Oxides of cubic crystal structure containing bismuth and at least one of ruthenium and iridium |
| JPS5222596A (en) | 1975-08-15 | 1977-02-19 | Mitsui Toatsu Chem Inc | Refinement of phosphoric acid |
| US4366094A (en) | 1981-02-02 | 1982-12-28 | E. I. Du Pont De Nemours And Company | Conductor compositions |
| US4510179A (en) * | 1981-08-18 | 1985-04-09 | Matsushita Electric Industrial Co., Ltd. | Electrode on heat-resisting and isolating substrate and the manufacturing process for it |
| US4371459A (en) * | 1981-12-17 | 1983-02-01 | E. I. Du Pont De Nemours And Company | Flexible screen-printable conductor composition |
| JPS6166303A (ja) * | 1984-09-06 | 1986-04-05 | 太陽誘電株式会社 | 配線基板の製造方法 |
| US5162062A (en) | 1991-06-17 | 1992-11-10 | E. I. Du Pont De Nemours And Company | Method for making multilayer electronic circuits |
| JPH0640821A (ja) | 1992-07-24 | 1994-02-15 | Toshiba Silicone Co Ltd | 防カビ性ポリオルガノシロキサン組成物 |
| US5378408A (en) | 1993-07-29 | 1995-01-03 | E. I. Du Pont De Nemours And Company | Lead-free thick film paste composition |
| JPH0773731A (ja) * | 1993-09-06 | 1995-03-17 | Dai Ichi Kogyo Seiyaku Co Ltd | 厚膜導電性ペースト組成物 |
| US5518663A (en) | 1994-12-06 | 1996-05-21 | E. I. Du Pont De Nemours And Company | Thick film conductor compositions with improved adhesion |
| JPH09139278A (ja) | 1995-11-14 | 1997-05-27 | Dai Ichi Kogyo Seiyaku Co Ltd | ヒーター用抵抗体ペースト |
| DE19647044A1 (de) | 1996-11-14 | 1998-05-20 | Degussa | Paste für Einbrennschichten |
| EP1655742B1 (en) * | 1998-02-23 | 2010-10-13 | Murata Manufacturing Co., Ltd. | Resistor material, resistive paste and resistor using the resistor material, and multi-layered ceramic substrate |
| JP3484983B2 (ja) | 1998-07-28 | 2004-01-06 | 株式会社村田製作所 | 導電性ペースト及びガラス回路基板 |
-
2001
- 2001-04-09 GB GBGB0108886.3A patent/GB0108886D0/en not_active Ceased
-
2002
- 2002-04-04 WO PCT/US2002/010505 patent/WO2002082472A2/en active Application Filing
- 2002-04-04 US US10/472,852 patent/US7189343B2/en not_active Expired - Fee Related
- 2002-04-04 AU AU2002248745A patent/AU2002248745A1/en not_active Abandoned
- 2002-04-04 JP JP2002580351A patent/JP2004524665A/ja active Pending
- 2002-04-04 KR KR1020037013228A patent/KR100573327B1/ko not_active IP Right Cessation
- 2002-04-04 EP EP02717763A patent/EP1377988A2/en not_active Withdrawn
- 2002-04-04 CN CN028073207A patent/CN1608298B/zh not_active Expired - Fee Related
- 2002-04-09 TW TW091107083A patent/TWI316722B/zh not_active IP Right Cessation
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