JP2004523892A5 - - Google Patents
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- JP2004523892A5 JP2004523892A5 JP2002556951A JP2002556951A JP2004523892A5 JP 2004523892 A5 JP2004523892 A5 JP 2004523892A5 JP 2002556951 A JP2002556951 A JP 2002556951A JP 2002556951 A JP2002556951 A JP 2002556951A JP 2004523892 A5 JP2004523892 A5 JP 2004523892A5
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- Japan
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Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/748,801 US6888171B2 (en) | 2000-12-22 | 2000-12-22 | Light emitting diode |
PCT/US2001/050590 WO2002056386A1 (en) | 2000-12-22 | 2001-12-21 | Improved light emitting diode |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2004523892A JP2004523892A (ja) | 2004-08-05 |
JP2004523892A5 true JP2004523892A5 (ja) | 2007-03-08 |
JP3959347B2 JP3959347B2 (ja) | 2007-08-15 |
Family
ID=25010984
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002556951A Expired - Fee Related JP3959347B2 (ja) | 2000-12-22 | 2001-12-21 | 発光ダイオード |
Country Status (6)
Country | Link |
---|---|
US (1) | US6888171B2 (ja) |
EP (1) | EP1344255B1 (ja) |
JP (1) | JP3959347B2 (ja) |
KR (1) | KR100638786B1 (ja) |
CN (1) | CN100367508C (ja) |
WO (1) | WO2002056386A1 (ja) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10131276B4 (de) * | 2001-06-28 | 2007-08-02 | Infineon Technologies Ag | Feldeffekttransistor und Verfahren zu seiner Herstellung |
US7989825B2 (en) * | 2003-06-26 | 2011-08-02 | Fuji Xerox Co., Ltd. | Lens-attached light-emitting element and method for manufacturing the same |
KR100748247B1 (ko) * | 2005-07-06 | 2007-08-09 | 삼성전기주식회사 | 질화물계 반도체 발광다이오드 및 그 제조방법 |
KR100665284B1 (ko) * | 2005-11-07 | 2007-01-09 | 삼성전기주식회사 | 반도체 발광 소자 |
US8878245B2 (en) * | 2006-11-30 | 2014-11-04 | Cree, Inc. | Transistors and method for making ohmic contact to transistors |
US9484499B2 (en) * | 2007-04-20 | 2016-11-01 | Cree, Inc. | Transparent ohmic contacts on light emitting diodes with carrier substrates |
US8368100B2 (en) | 2007-11-14 | 2013-02-05 | Cree, Inc. | Semiconductor light emitting diodes having reflective structures and methods of fabricating same |
US8384115B2 (en) * | 2008-08-01 | 2013-02-26 | Cree, Inc. | Bond pad design for enhancing light extraction from LED chips |
US8741715B2 (en) * | 2009-04-29 | 2014-06-03 | Cree, Inc. | Gate electrodes for millimeter-wave operation and methods of fabrication |
US9136436B2 (en) | 2010-02-09 | 2015-09-15 | Epistar Corporation | Optoelectronic device and the manufacturing method thereof |
US9640728B2 (en) | 2010-02-09 | 2017-05-02 | Epistar Corporation | Optoelectronic device and the manufacturing method thereof |
US10205059B2 (en) | 2010-02-09 | 2019-02-12 | Epistar Corporation | Optoelectronic device and the manufacturing method thereof |
TWI513040B (zh) * | 2010-02-09 | 2015-12-11 | Epistar Corp | 光電元件及其製造方法 |
US9006774B2 (en) * | 2010-02-09 | 2015-04-14 | Epistar Corporation | Optoelectronic device and the manufacturing method thereof |
JP5197654B2 (ja) | 2010-03-09 | 2013-05-15 | 株式会社東芝 | 半導体発光装置及びその製造方法 |
KR101525913B1 (ko) * | 2010-06-22 | 2015-06-10 | 순천대학교 산학협력단 | 수직구조 발광다이오드 및 이의 제조방법 |
US9070851B2 (en) | 2010-09-24 | 2015-06-30 | Seoul Semiconductor Co., Ltd. | Wafer-level light emitting diode package and method of fabricating the same |
CN102339913B (zh) * | 2011-09-30 | 2013-06-19 | 映瑞光电科技(上海)有限公司 | 高压led器件及其制造方法 |
KR102107863B1 (ko) | 2011-11-07 | 2020-05-08 | 루미리즈 홀딩 비.브이. | 더 균일한 주입과 낮은 광손실을 갖는 개선된 p-컨택트 |
CN102593284B (zh) | 2012-03-05 | 2014-06-18 | 映瑞光电科技(上海)有限公司 | 隔离深沟槽及其高压led芯片的制造方法 |
CN108447855B (zh) | 2012-11-12 | 2020-11-24 | 晶元光电股份有限公司 | 半导体光电元件的制作方法 |
USD826871S1 (en) | 2014-12-11 | 2018-08-28 | Cree, Inc. | Light emitting diode device |
CN205944139U (zh) | 2016-03-30 | 2017-02-08 | 首尔伟傲世有限公司 | 紫外线发光二极管封装件以及包含此的发光二极管模块 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3703670A (en) * | 1969-02-28 | 1972-11-21 | Corning Glass Works | Electroluminescent diode configuration and method of forming the same |
JPS546787A (en) * | 1977-06-17 | 1979-01-19 | Matsushita Electric Ind Co Ltd | Luminous element |
US5281830A (en) * | 1990-10-27 | 1994-01-25 | Toyoda Gosei Co., Ltd. | Light-emitting semiconductor device using gallium nitride group compound |
JP2980435B2 (ja) * | 1991-09-12 | 1999-11-22 | 株式会社東芝 | 半導体装置 |
EP1313153A3 (en) * | 1992-07-23 | 2005-05-04 | Toyoda Gosei Co., Ltd. | Light-emitting device of gallium nitride compound semiconductor |
EP0622858B2 (en) * | 1993-04-28 | 2004-09-29 | Nichia Corporation | Gallium nitride-based III-V group compound semiconductor device and method of producing the same |
JP3538628B2 (ja) * | 1994-10-18 | 2004-06-14 | 豊田合成株式会社 | 3族窒化物半導体発光素子の製造方法 |
JP3165374B2 (ja) * | 1995-08-31 | 2001-05-14 | 株式会社東芝 | 化合物半導体の電極の形成方法 |
US6121638A (en) * | 1995-09-12 | 2000-09-19 | Kabushiki Kaisha Toshiba | Multi-layer structured nitride-based semiconductor devices |
EP0852817A1 (en) * | 1995-09-25 | 1998-07-15 | Nippon Sheet Glass Co., Ltd. | Surface light-emitting element and self-scanning type light-emitting device |
JP3447527B2 (ja) * | 1996-09-09 | 2003-09-16 | 株式会社東芝 | 半導体発光素子およびその製造方法 |
US6281524B1 (en) * | 1997-02-21 | 2001-08-28 | Kabushiki Kaisha Toshiba | Semiconductor light-emitting device |
JPH10294491A (ja) * | 1997-04-22 | 1998-11-04 | Toshiba Corp | 半導体発光素子およびその製造方法ならびに発光装置 |
JP3230463B2 (ja) * | 1997-07-22 | 2001-11-19 | 昭和電工株式会社 | 発光半導体素子用透光性電極の作製方法 |
JPH1140892A (ja) * | 1997-07-16 | 1999-02-12 | Fuji Electric Co Ltd | Iii 族窒化物半導体素子およびその製造方法 |
JP3582349B2 (ja) * | 1998-03-04 | 2004-10-27 | 豊田合成株式会社 | 窒化ガリウム系化合物半導体素子 |
JP4183299B2 (ja) * | 1998-03-25 | 2008-11-19 | 株式会社東芝 | 窒化ガリウム系化合物半導体発光素子 |
JP3031415B1 (ja) * | 1998-10-06 | 2000-04-10 | 日亜化学工業株式会社 | 窒化物半導体レーザ素子 |
US6287947B1 (en) * | 1999-06-08 | 2001-09-11 | Lumileds Lighting, U.S. Llc | Method of forming transparent contacts to a p-type GaN layer |
US6344665B1 (en) * | 2000-06-23 | 2002-02-05 | Arima Optoelectronics Corp. | Electrode structure of compound semiconductor device |
US6420736B1 (en) * | 2000-07-26 | 2002-07-16 | Axt, Inc. | Window for gallium nitride light emitting diode |
US6608360B2 (en) * | 2000-12-15 | 2003-08-19 | University Of Houston | One-chip micro-integrated optoelectronic sensor |
-
2000
- 2000-12-22 US US09/748,801 patent/US6888171B2/en not_active Expired - Lifetime
-
2001
- 2001-12-21 EP EP01989270.2A patent/EP1344255B1/en not_active Expired - Lifetime
- 2001-12-21 CN CNB018212816A patent/CN100367508C/zh not_active Expired - Fee Related
- 2001-12-21 WO PCT/US2001/050590 patent/WO2002056386A1/en active Application Filing
- 2001-12-21 KR KR1020037008498A patent/KR100638786B1/ko active IP Right Grant
- 2001-12-21 JP JP2002556951A patent/JP3959347B2/ja not_active Expired - Fee Related