JP2004519716A5 - - Google Patents

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Publication number
JP2004519716A5
JP2004519716A5 JP2002568415A JP2002568415A JP2004519716A5 JP 2004519716 A5 JP2004519716 A5 JP 2004519716A5 JP 2002568415 A JP2002568415 A JP 2002568415A JP 2002568415 A JP2002568415 A JP 2002568415A JP 2004519716 A5 JP2004519716 A5 JP 2004519716A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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JP2002568415A
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JP2004519716A (ja
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Priority claimed from US09/794,686 external-priority patent/US6699624B2/en
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Publication of JP2004519716A publication Critical patent/JP2004519716A/ja
Publication of JP2004519716A5 publication Critical patent/JP2004519716A5/ja
Pending legal-status Critical Current

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JP2002568415A 2001-02-27 2002-02-25 格子テストパターン及びオーバレイ計測法 Pending JP2004519716A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/794,686 US6699624B2 (en) 2001-02-27 2001-02-27 Grating test patterns and methods for overlay metrology
PCT/US2002/005648 WO2002069390A2 (en) 2001-02-27 2002-02-25 Grating test patterns and methods for overlay metrology

Publications (2)

Publication Number Publication Date
JP2004519716A JP2004519716A (ja) 2004-07-02
JP2004519716A5 true JP2004519716A5 (ja) 2005-07-21

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002568415A Pending JP2004519716A (ja) 2001-02-27 2002-02-25 格子テストパターン及びオーバレイ計測法

Country Status (5)

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US (2) US6699624B2 (ja)
EP (1) EP1379922A2 (ja)
JP (1) JP2004519716A (ja)
TW (1) TW556297B (ja)
WO (1) WO2002069390A2 (ja)

Families Citing this family (110)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003532306A (ja) * 2000-05-04 2003-10-28 ケーエルエー・テンコール・テクノロジーズ・コーポレーション リソグラフィ・プロセス制御のための方法およびシステム
US7541201B2 (en) 2000-08-30 2009-06-02 Kla-Tencor Technologies Corporation Apparatus and methods for determining overlay of structures having rotational or mirror symmetry
US7317531B2 (en) * 2002-12-05 2008-01-08 Kla-Tencor Technologies Corporation Apparatus and methods for detecting overlay errors using scatterometry
IL138552A (en) 2000-09-19 2006-08-01 Nova Measuring Instr Ltd Measurement of transverse displacement by optical method
US6891627B1 (en) 2000-09-20 2005-05-10 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension and overlay of a specimen
JP2004529330A (ja) 2001-03-02 2004-09-24 アクセント オプティカル テクノロジーズ，インク． スキャタロメトリを使用するライン・プロファイルの非対称測定
US7515279B2 (en) 2001-03-02 2009-04-07 Nanometrics Incorporated Line profile asymmetry measurement
JP3647378B2 (ja) * 2001-03-02 2005-05-11 キヤノン株式会社 マルチプローブを用いた形状測定装置及び測定方法
US20030002043A1 (en) * 2001-04-10 2003-01-02 Kla-Tencor Corporation Periodic patterns and technique to control misalignment
US20020192577A1 (en) 2001-06-15 2002-12-19 Bernard Fay Automated overlay metrology system
US7061615B1 (en) 2001-09-20 2006-06-13 Nanometrics Incorporated Spectroscopically measured overlay target
US6982793B1 (en) 2002-04-04 2006-01-03 Nanometrics Incorporated Method and apparatus for using an alignment target with designed in offset
US6958819B1 (en) 2002-04-04 2005-10-25 Nanometrics Incorporated Encoder with an alignment target
US6949462B1 (en) 2002-04-04 2005-09-27 Nanometrics Incorporated Measuring an alignment target with multiple polarization states
US7046361B1 (en) 2002-04-04 2006-05-16 Nanometrics Incorporated Positioning two elements using an alignment target with a designed offset
US6804005B2 (en) * 2002-05-02 2004-10-12 Timbre Technologies, Inc. Overlay measurements using zero-order cross polarization measurements
DE10224164B4 (de) * 2002-05-31 2007-05-10 Advanced Micro Devices, Inc., Sunnyvale Eine zweidimensionale Struktur zum Bestimmen einer Überlagerungsgenauigkeit mittels Streuungsmessung
US7170604B2 (en) * 2002-07-03 2007-01-30 Tokyo Electron Limited Overlay metrology method and apparatus using more than one grating per measurement direction
US7046376B2 (en) * 2002-07-05 2006-05-16 Therma-Wave, Inc. Overlay targets with isolated, critical-dimension features and apparatus to measure overlay
US20040066517A1 (en) * 2002-09-05 2004-04-08 Hsu-Ting Huang Interferometry-based method and apparatus for overlay metrology
EP1400855A3 (en) * 2002-09-20 2009-04-08 ASML Netherlands B.V. Device inspection
US6992764B1 (en) 2002-09-30 2006-01-31 Nanometrics Incorporated Measuring an alignment target with a single polarization state
US7440105B2 (en) * 2002-12-05 2008-10-21 Kla-Tencor Technologies Corporation Continuously varying offset mark and methods of determining overlay
AU2003298003A1 (en) * 2002-12-05 2004-06-30 Kla-Tencor Technologies Corporation Apparatus and methods for detecting overlay errors using scatterometry
US6970255B1 (en) 2003-04-23 2005-11-29 Nanometrics Incorporated Encoder measurement based on layer thickness
US7230704B2 (en) 2003-06-06 2007-06-12 Tokyo Electron Limited Diffracting, aperiodic targets for overlay metrology and method to detect gross overlay
US7230703B2 (en) 2003-07-17 2007-06-12 Tokyo Electron Limited Apparatus and method for measuring overlay by diffraction gratings
US7508976B1 (en) 2003-12-29 2009-03-24 Nanometric Incorporated Local process variation correction for overlay measurement
US6948149B2 (en) * 2004-02-19 2005-09-20 Infineon Technologies, Ag Method of determining the overlay accuracy of multiple patterns formed on a semiconductor wafer
US20080144036A1 (en) * 2006-12-19 2008-06-19 Asml Netherlands B.V. Method of measurement, an inspection apparatus and a lithographic apparatus
US7791727B2 (en) * 2004-08-16 2010-09-07 Asml Netherlands B.V. Method and apparatus for angular-resolved spectroscopic lithography characterization
US20060109463A1 (en) * 2004-11-22 2006-05-25 Asml Netherlands B.V. Latent overlay metrology
US7289214B1 (en) 2004-11-23 2007-10-30 N&K Technology, Inc. System and method for measuring overlay alignment using diffraction gratings
US7453577B2 (en) * 2004-12-14 2008-11-18 Asml Netherlands B.V. Apparatus and method for inspecting a patterned part of a sample
US7443486B2 (en) * 2005-02-25 2008-10-28 Asml Netherlands B.V. Method for predicting a critical dimension of a feature imaged by a lithographic apparatus
US7315384B2 (en) * 2005-05-10 2008-01-01 Asml Netherlands B.V. Inspection apparatus and method of inspection
US7532307B2 (en) * 2005-06-30 2009-05-12 Asml Netherlands B.V. Focus determination method, device manufacturing method, and mask
US20070002336A1 (en) * 2005-06-30 2007-01-04 Asml Netherlands B.V. Metrology apparatus, lithographic apparatus, process apparatus, metrology method and device manufacturing method
US7687925B2 (en) * 2005-09-07 2010-03-30 Infineon Technologies Ag Alignment marks for polarized light lithography and method for use thereof
US20070093044A1 (en) * 2005-10-25 2007-04-26 Asml Netherlands B.V. Method of depositing a metal layer onto a substrate and a method for measuring in three dimensions the topographical features of a substrate
US20070153274A1 (en) * 2005-12-30 2007-07-05 Asml Netherlands B.V. Optical metrology system and metrology mark characterization device
US7480050B2 (en) * 2006-02-09 2009-01-20 Asml Netherlands B.V. Lithographic system, sensor, and method of measuring properties of a substrate
US7486408B2 (en) * 2006-03-21 2009-02-03 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method with reduced scribe lane usage for substrate measurement
US7821650B2 (en) * 2006-03-21 2010-10-26 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method with reduced scribe lane usage for substrate measurement
US7532305B2 (en) * 2006-03-28 2009-05-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method using overlay measurement
US7391513B2 (en) * 2006-03-29 2008-06-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method using overlay measurement quality indication
US7247843B1 (en) * 2006-05-11 2007-07-24 Massachusetts Institute Of Technology Long-range gap detection with interferometric sensitivity using spatial phase of interference patterns
US7502103B2 (en) * 2006-05-31 2009-03-10 Asml Netherlands B.V. Metrology tool, system comprising a lithographic apparatus and a metrology tool, and a method for determining a parameter of a substrate
US7791724B2 (en) * 2006-06-13 2010-09-07 Asml Netherlands B.V. Characterization of transmission losses in an optical system
US7898662B2 (en) * 2006-06-20 2011-03-01 Asml Netherlands B.V. Method and apparatus for angular-resolved spectroscopic lithography characterization
US7692792B2 (en) * 2006-06-22 2010-04-06 Asml Netherlands B.V. Method and apparatus for angular-resolved spectroscopic lithography characterization
US7999940B2 (en) 2006-06-30 2011-08-16 Asml Netherlands B.V. Apparatus for angular-resolved spectroscopic lithography characterization
US7659988B2 (en) * 2006-06-30 2010-02-09 Asml Netherlands B.V. Apparatus for angular-resolved spectroscopic lithography characterization and device manufacturing method
US7564554B2 (en) * 2006-06-30 2009-07-21 Intel Corporation Wafer-based optical pattern recognition targets using regions of gratings
US7404725B2 (en) * 2006-07-03 2008-07-29 Hall David R Wiper for tool string direct electrical connection
US7916284B2 (en) 2006-07-18 2011-03-29 Asml Netherlands B.V. Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method
US7808613B2 (en) * 2006-08-03 2010-10-05 Asml Netherlands B.V. Individual wafer history storage for overlay corrections
US20080036984A1 (en) * 2006-08-08 2008-02-14 Asml Netherlands B.V. Method and apparatus for angular-resolved spectroscopic lithography characterization
US7643666B2 (en) * 2006-08-08 2010-01-05 Asml Netherlands B.V. Method and apparatus for angular-resolved spectroscopic lithography characterization
US7589832B2 (en) * 2006-08-10 2009-09-15 Asml Netherlands B.V. Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device method
US7564555B2 (en) * 2006-08-15 2009-07-21 Asml Netherlands B.V. Method and apparatus for angular-resolved spectroscopic lithography characterization
US7532331B2 (en) 2006-09-14 2009-05-12 Asml Netherlands B.V. Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method
US7969577B2 (en) * 2006-09-14 2011-06-28 Asml Netherlands B.V. Inspection apparatus, an apparatus for projecting an image and a method of measuring a property of a substrate
US7573584B2 (en) * 2006-09-25 2009-08-11 Asml Netherlands B.V. Method and apparatus for angular-resolved spectroscopic lithography characterization
CN1928721B (zh) * 2006-09-27 2012-05-30 上海微电子装备有限公司 移相光栅标记及利用该标记检测光刻机成像质量的方法
US8233155B2 (en) * 2006-10-13 2012-07-31 Asml Netherlands B.V. Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method
US8294907B2 (en) 2006-10-13 2012-10-23 Asml Netherlands B.V. Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method
US7522295B2 (en) * 2006-11-07 2009-04-21 Tokyo Electron Limited Consecutive measurement of structures formed on a semiconductor wafer using a polarized reflectometer
US7630087B2 (en) * 2006-11-22 2009-12-08 Asml Netherlands B.V. Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method
US7710572B2 (en) * 2006-11-30 2010-05-04 Asml Netherlands B.V. Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method
US7557934B2 (en) * 2006-12-07 2009-07-07 Asml Netherlands B.V. Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method
US20080135774A1 (en) * 2006-12-08 2008-06-12 Asml Netherlands B.V. Scatterometer, a lithographic apparatus and a focus analysis method
US20080148875A1 (en) * 2006-12-20 2008-06-26 Asml Netherlands B.V. Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method
US7916927B2 (en) * 2007-01-16 2011-03-29 Asml Netherlands B.V. Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method
US7619737B2 (en) * 2007-01-22 2009-11-17 Asml Netherlands B.V Method of measurement, an inspection apparatus and a lithographic apparatus
US7852459B2 (en) 2007-02-02 2010-12-14 Asml Netherlands B.V. Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method
US7701577B2 (en) * 2007-02-21 2010-04-20 Asml Netherlands B.V. Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method
US7724370B2 (en) * 2007-03-01 2010-05-25 Asml Netherlands B.V. Method of inspection, a method of manufacturing, an inspection apparatus, a substrate, a mask, a lithography apparatus and a lithographic cell
US7599064B2 (en) 2007-03-07 2009-10-06 Asml Netherlands B.V. Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method, substrate for use in the methods
US7605907B2 (en) * 2007-03-27 2009-10-20 Asml Netherlands B.V. Method of forming a substrate for use in calibrating a metrology tool, calibration substrate and metrology tool calibration method
US7570358B2 (en) * 2007-03-30 2009-08-04 Asml Netherlands Bv Angularly resolved scatterometer, inspection method, lithographic apparatus, lithographic processing cell device manufacturing method and alignment sensor
US7656518B2 (en) * 2007-03-30 2010-02-02 Asml Netherlands B.V. Method of measuring asymmetry in a scatterometer, a method of measuring an overlay error in a substrate and a metrology apparatus
US8189195B2 (en) * 2007-05-09 2012-05-29 Asml Netherlands B.V. Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method
US7911612B2 (en) * 2007-06-13 2011-03-22 Asml Netherlands B.V. Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method
US7460237B1 (en) 2007-08-02 2008-12-02 Asml Netherlands B.V. Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method
NL1036245A1 (nl) 2007-12-17 2009-06-18 Asml Netherlands Bv Diffraction based overlay metrology tool and method of diffraction based overlay metrology.
NL1036476A1 (nl) * 2008-02-01 2009-08-04 Asml Netherlands Bv Alignment mark and a method of aligning a substrate comprising such an alignment mark.
US8004679B2 (en) * 2008-05-09 2011-08-23 Kla-Tencor Corporation Target design and methods for scatterometry overlay determination
EP2131245A3 (en) 2008-06-02 2012-08-01 ASML Netherlands BV Lithographic apparatus and its focus determination method
US8745546B2 (en) * 2011-12-29 2014-06-03 Nanya Technology Corporation Mask overlay method, mask, and semiconductor device using the same
CN103398666B (zh) * 2013-05-27 2015-12-23 电子科技大学 一种用于双层周期性微结构的层间错位测试方法
TWI689786B (zh) * 2013-07-26 2020-04-01 美商克萊譚克公司 量測系統
US9646902B2 (en) * 2013-08-12 2017-05-09 Taiwan Semiconductor Manufacturing Company Limited Paired edge alignment
US9059102B2 (en) 2013-08-15 2015-06-16 International Business Machines Corporation Metrology marks for unidirectional grating superposition patterning processes
US9257351B2 (en) 2013-08-15 2016-02-09 Globalfoundries Inc. Metrology marks for bidirectional grating superposition patterning processes
CN104111120B (zh) * 2014-07-25 2017-05-31 中国科学院上海光学精密机械研究所 基于朗奇剪切干涉仪的相位提取方法
CN111948239B (zh) * 2015-04-28 2024-01-12 科磊股份有限公司 计算上高效的基于x射线的叠盖测量系统与方法
NL2017466A (en) * 2015-09-30 2017-04-05 Asml Netherlands Bv Metrology method, target and substrate
US10451412B2 (en) 2016-04-22 2019-10-22 Kla-Tencor Corporation Apparatus and methods for detecting overlay errors using scatterometry
KR102640173B1 (ko) 2016-06-14 2024-02-26 삼성전자주식회사 회절 기반 오버레이 마크 및 오버레이 계측방법
US9653404B1 (en) 2016-08-23 2017-05-16 United Microelectronics Corp. Overlay target for optically measuring overlay alignment of layers formed on semiconductor wafer
JP2021511532A (ja) * 2018-01-12 2021-05-06 ケーエルエー コーポレイション 傾斜周期構造を有する計測ターゲット及び方法
EP3611567A3 (en) * 2019-07-23 2020-05-13 ASML Netherlands B.V. Improvements in metrology targets
US11182892B2 (en) * 2019-09-16 2021-11-23 Kla Corporation Periodic semiconductor device misregistration metrology system and method
WO2021072743A1 (en) 2019-10-18 2021-04-22 Yangtze Memory Technologies Co., Ltd. Systems and methods for evaluating critical dimensions based on diffraction-based overlay metrology
US11874102B2 (en) * 2019-12-30 2024-01-16 Kla Corporation Thick photo resist layer metrology target
WO2021158255A1 (en) * 2020-02-07 2021-08-12 Kla Corporation Non-orthogonal target and method for using the same in measuring misregistration of semiconductor devices
CN113539867A (zh) * 2020-04-14 2021-10-22 中国科学院微电子研究所 半导体器件套刻精度的测量方法
CN112435936B (zh) * 2020-11-23 2022-03-15 长江存储科技有限责任公司 一种套刻精度检测方法及半导体结构
CN113270392B (zh) * 2021-06-22 2022-08-19 福建省晋华集成电路有限公司 一种对准标记结构以及半导体器件

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4422763A (en) * 1978-12-08 1983-12-27 Rca Corporation Automatic photomask alignment system for projection printing
US4332473A (en) * 1979-01-31 1982-06-01 Tokyo Shibaura Denki Kabushiki Kaisha Apparatus for detecting a mutual positional relationship of two sample members
US4929083A (en) * 1986-06-19 1990-05-29 Xerox Corporation Focus and overlay characterization and optimization for photolithographic exposure
US4757207A (en) * 1987-03-03 1988-07-12 International Business Machines Corporation Measurement of registration of overlaid test patterns by the use of reflected light
US5087537A (en) * 1989-10-11 1992-02-11 International Business Machines Corporation Lithography imaging tool and related photolithographic processes
JP2893823B2 (ja) * 1990-03-20 1999-05-24 株式会社ニコン 位置合わせ方法及び装置
US5545593A (en) * 1993-09-30 1996-08-13 Texas Instruments Incorporated Method of aligning layers in an integrated circuit device
JP3824639B2 (ja) * 1994-08-02 2006-09-20 エイエスエムエル ネザランドズ ベスローテン フエンノートシャップ 基板上にマスクパターンを繰り返し写像する方法
JP2669391B2 (ja) * 1995-03-30 1997-10-27 日本電気株式会社 半導体装置
US6023338A (en) * 1996-07-12 2000-02-08 Bareket; Noah Overlay alignment measurement of wafers
US6498640B1 (en) * 1999-12-30 2002-12-24 Koninklijke Philips Electronics N.V. Method to measure alignment using latent image grating structures
US6383888B1 (en) * 2001-04-18 2002-05-07 Advanced Micro Devices, Inc. Method and apparatus for selecting wafer alignment marks based on film thickness variation

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