JP2004363304A - 半導体装置の検査方法及び検査装置 - Google Patents

半導体装置の検査方法及び検査装置 Download PDF

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Publication number
JP2004363304A
JP2004363304A JP2003159576A JP2003159576A JP2004363304A JP 2004363304 A JP2004363304 A JP 2004363304A JP 2003159576 A JP2003159576 A JP 2003159576A JP 2003159576 A JP2003159576 A JP 2003159576A JP 2004363304 A JP2004363304 A JP 2004363304A
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JP
Japan
Prior art keywords
inspection
chip
semiconductor device
defect
electrical characteristic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
JP2003159576A
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English (en)
Japanese (ja)
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JP2004363304A5 (enExample
Inventor
Takashi Kunihiro
隆志 國弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
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Toshiba Corp
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Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP2003159576A priority Critical patent/JP2004363304A/ja
Priority to US10/859,189 priority patent/US6992499B2/en
Publication of JP2004363304A publication Critical patent/JP2004363304A/ja
Publication of JP2004363304A5 publication Critical patent/JP2004363304A5/ja
Abandoned legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2894—Aspects of quality control [QC]

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2003159576A 2003-06-04 2003-06-04 半導体装置の検査方法及び検査装置 Abandoned JP2004363304A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2003159576A JP2004363304A (ja) 2003-06-04 2003-06-04 半導体装置の検査方法及び検査装置
US10/859,189 US6992499B2 (en) 2003-06-04 2004-06-03 Test method and test apparatus for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003159576A JP2004363304A (ja) 2003-06-04 2003-06-04 半導体装置の検査方法及び検査装置

Publications (2)

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JP2004363304A true JP2004363304A (ja) 2004-12-24
JP2004363304A5 JP2004363304A5 (enExample) 2005-06-23

Family

ID=33562194

Family Applications (1)

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JP2003159576A Abandoned JP2004363304A (ja) 2003-06-04 2003-06-04 半導体装置の検査方法及び検査装置

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US (1) US6992499B2 (enExample)
JP (1) JP2004363304A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017062263A (ja) * 2012-03-16 2017-03-30 株式会社堀場製作所 試料分析装置及び試料分析プログラム
KR101972745B1 (ko) * 2017-12-15 2019-04-25 남정훈 반도체칩 카운팅 방법
CN109712912A (zh) * 2018-12-06 2019-05-03 通富微电子股份有限公司 一种芯片倒装设备及方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040082859A1 (en) 2002-07-01 2004-04-29 Alan Schaer Method and apparatus employing ultrasound energy to treat body sphincters
US9981108B2 (en) 2009-10-30 2018-05-29 Recor Medical, Inc. Method and apparatus for treatment of hypertension through percutaneous ultrasound renal denervation
US10156512B2 (en) * 2013-03-01 2018-12-18 Futurewei Technologies, Inc. System and method for measuring thermal reliability of multi-chip modules
JP6322696B2 (ja) 2013-03-14 2018-05-09 リコール メディカル インコーポレイテッドＲｅＣｏｒ Ｍｅｄｉｃａｌ， Ｉｎｃ． 超音波による神経調節システム
JP6337080B2 (ja) 2013-03-14 2018-06-06 リコール メディカル インコーポレイテッドＲｅＣｏｒ Ｍｅｄｉｃａｌ， Ｉｎｃ． 超音波トランスデューサーをめっき又はコーティングする方法
JP2014229635A (ja) * 2013-05-17 2014-12-08 株式会社東芝 半導体検査方法および半導体検査装置
CN108169651B (zh) * 2017-11-22 2021-05-11 北京无线电计量测试研究所 一种时钟晶体振荡器检测方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MX9704632A (es) 1994-12-23 1998-02-28 Digirad Camara semiconductora de rayos gama y sistema medico de formacion de imagenes.
US5793650A (en) * 1995-10-19 1998-08-11 Analog Devices, Inc. System and method of identifying the number of chip failures on a wafer attributed to cluster failures
JPH10214870A (ja) 1997-01-29 1998-08-11 Hitachi Ltd 半導体装置の製造方法
JPH10313026A (ja) 1997-05-13 1998-11-24 Seiko Epson Corp 半導体装置の異物検査装置および異物検査方法
JP2000243795A (ja) * 1999-02-22 2000-09-08 Ando Electric Co Ltd バーンインテスタにおける電源電流測定回路
JP3802716B2 (ja) * 1999-09-17 2006-07-26 株式会社日立製作所 試料の検査方法及びその装置
JP2002026102A (ja) 2000-06-30 2002-01-25 Hitachi Ltd 検査情報処理方法及びその検査システム
US6657453B2 (en) * 2002-03-15 2003-12-02 Infineon Technologies Ag Semiconductor wafer testing system and method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017062263A (ja) * 2012-03-16 2017-03-30 株式会社堀場製作所 試料分析装置及び試料分析プログラム
KR101972745B1 (ko) * 2017-12-15 2019-04-25 남정훈 반도체칩 카운팅 방법
CN109712912A (zh) * 2018-12-06 2019-05-03 通富微电子股份有限公司 一种芯片倒装设备及方法

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Publication number Publication date
US20050009218A1 (en) 2005-01-13
US6992499B2 (en) 2006-01-31

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