JP2004363239A - Method of sealing package for electronic part - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of sealing by an electron beam capable of realizing a reduction of size of a package for electronic parts. <P>SOLUTION: The method of selling the package for the electronic part includes a step of placing a lid 1 on the outer peripheral frame of a ceramic case 2 for housing the electronic part via a brazing material, imparting the electronic beam in a vacuum atmosphere along the peripheral edge of the lead, melting the brazing material and fixing the lid to the ceramic case. The method also includes a first step of irradiating the periphery of the lid exposed from the opening of a tool with the electron beam, by bringing the lid into pressure close contact with the outer peripheral frame of the ceramic case by a first tool having an opening at a part of the position corresponding to the outer peripheral frame of the ceramic case; and a second step of irradiating the peripheral edge of the lid exposed from the opening of the tool with the electron beam, by bringing the lid into pressure close contact with the outer peripheral frame of the ceramic case by a second tool having an opening corresponding to the peripheral edge of the lit not irradiated with the electron beam in the first step. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for sealing a package for an electronic component that hermetically stores a crystal oscillator, an IC, and the like.
[0002]
[Prior art]
2. Description of the Related Art In recent years, electronic components such as a quartz oscillator and a SAW filter are generally hermetically sealed in a container formed of a ceramic case and a metal lid for closing the ceramic case by a surface mounting wave. Methods of hermetic sealing include low-melting glass sealing, seam welding sealing, electron beam sealing, and the like. In particular, sealing with an electron beam is increasing due to market demands for small size and low profile. (For example, see Patent Document 1)
[0003]
Sealing with an electron beam requires that the ceramic case and the lid be in close contact with each other when irradiating the electron beam. For this reason, conventionally, a ceramic case and a lid are brought into close contact with each other by pressing the outer peripheral edge of the lid with a sealing jig, and a beam is irradiated inside the sealing jig. (For example, see Patent Document 2)
[0004]
[Patent Document 1]
JP-A-8-46075 [Patent Document 2]
JP-A-11-41050 [0005]
FIG. 1 is a perspective view showing a conventional sealing jig for an electronic component package. FIG. 2 is a perspective view showing a lid holding portion of a conventional sealing jig. FIG. 3 is a partially omitted sectional view of a conventional sealing jig. A jig used for electron beam sealing of an electronic component package includes a base plate 35 provided with a pressing portion 34 for pressing a ceramic case 32 for storing electronic components from below, and positions and fixes the ceramic case 32 and the lid 31. And a lid holding guide 33 that is formed. The lid pressing guide 33 has a beam irradiation opening 33a smaller than the outer dimension of the lid 31 for irradiating the lid 31 with a beam, and the outer dimensions of the lid 31 and the ceramic case 32 for positioning the lid 31 and the ceramic case 32. A slightly larger positioning groove 33b is provided. The base plate 35 is provided with a positioning projection 35a at a position corresponding to the frame guide hole 33c of the lid pressing guide 33. Further, the base plate 35 and the lid holding guide 33 are provided with positioning grooves 35b and 33d for a welding machine when the entire sealing jig is mounted on the beam welding machine, respectively.
[0006]
When the ceramic case 32 and the lid 31 are attached to the sealing jig in the arrangement shown in FIG. 3, the pressing portion 34 including the coil spring 34 a and the pressing body 34 b and the beam irradiation opening 33 a of the lid pressing guide 33 are positioned. The ceramic case 32 and the lid 31 are sandwiched by the step formed by the groove 33b, and both are brought into pressure contact with each other. In this state, the sealing is performed by irradiating the electron beam 36 over the entire periphery along the inner peripheral edge of the beam irradiation opening 33a from above the beam irradiation opening 33a.
[0007]
[Problems to be solved by the invention]
In such a conventional method, a pressing margin is required to press the outer peripheral edge of the lid with a sealing jig in order to press the lid in close contact with the ceramic case. This part is necessary for manufacturing, but it is unnecessary for the final product because the brazing material and the metallized layer formed on the upper surface of the outer peripheral frame of the ceramic case hardly adhere to each other. This is an obstacle to miniaturization.
Therefore, an object of the present invention is to provide a sealing method using an electron beam, which can realize the miniaturization of a package for an electronic component.
[0008]
[Means for Solving the Problems]
A ceramic case for storing electronic components, a lid is placed on the outer peripheral frame via a brazing material, and an electron beam is applied along a peripheral edge of the lid in a vacuum atmosphere to melt the brazing material. In the method for sealing an electronic component package in which the lid is fixed to the ceramic case, at least a first jig having an opening at a part of a position corresponding to an outer peripheral frame of the ceramic case includes the lid. A step of pressing and adhering on an outer peripheral frame of the ceramic case, a first processing step of irradiating an electron beam to a periphery of the lid exposed from an opening of the first jig, and an electron in the first processing step. The lid is pressed onto the outer peripheral frame of the ceramic case by a second jig having an opening corresponding to the peripheral edge of the lid to which the beam has not been applied. And degree, the sealing method of the electronic component package and a second processing step of irradiating a peripheral to the electron beam of the lid that is exposed from the opening of the second jig.
[0009]
A method of sealing an electronic component package in which the first jig and the second jig are the same.
[0010]
BEST MODE FOR CARRYING OUT THE INVENTION
In the method of sealing an electronic component package by an electron beam according to the present invention, the ceramic case and the metal lid are brought into close contact with each other under pressure by a sealing jig. This is the same as the conventional technique in that sealing is performed by irradiating a beam. Various means can be considered as a means for pressing and adhering the ceramic case and the lid, but here, for convenience, similarly to the sealing jig introduced in the conventional technology, the pressing portion provided on the base plate and the lid holder are provided. With reference to the drawings, the points that are different from those of the prior art will be described with reference to the drawings. FIG. 4 is a diagram showing a first processing step of the first embodiment of the present invention. (A) is a top view and (b) is a cross-sectional view. FIG. 5 is a view showing a second processing step of the first embodiment of the present invention. (A) is a top view and (b) is a cross-sectional view. 4 and 5 both show an enlargement of the vicinity of the beam irradiation opening of the lid holding guide in the conventional sealing jig. The lid pressing guide 3 is provided with beam irradiation openings 3 a at positions corresponding to the four corners of the lid 1. Further, a positioning groove 3b slightly larger than the outer shapes of the lid 1 and the ceramic case 2 is provided. To seal the lid 1 and the ceramic case 2, first, the lid 1 and the ceramic case 2 are inserted into the positioning grooves 3 b, and the lid 1 and the ceramic case 2 are pressed and adhered by the pressing portion 5 of the base plate 4 and the lid pressing guide 3. In this state, the electron beam 6 is irradiated from the beam irradiation opening 3a (hereinafter, first beam processing). Here, the lid 1 and the ceramic case 2 at the portion irradiated with the electron beam 6 from the beam irradiation opening 3a are welded through a brazing material. At the time of the first beam processing, the lid 1 and the ceramic case 2 are pressed by a portion other than the beam irradiation opening 3 a of the lid pressing guide 3 and the pressing portion 5 of the base plate 4. No pressing margin is required at the outer peripheral edge.
[0011]
Next, a lid holding guide 7 having four beam irradiation openings 7a is prepared. When the lid holding guide 7, the lid 1, and the ceramic case 2 are respectively positioned, the beam irradiation openings 7 a are formed by four outer peripheral edges of the lid 1 that are not sealed during the first beam processing. It is set to correspond within. Actually, the beam irradiation opening 7a is preferably set to be slightly larger than the outer peripheral edge of the lid 1 that is not sealed at the time of the first beam processing, in consideration of the processing accuracy of the jig, the accuracy of the beam processing, and the like. . Like the beam holding guide 3, the beam holding guide 7 is provided with a positioning groove 7b slightly larger than the outer shape of the lid 1 and the ceramic case 2. The lid 1 and the ceramic case 2 are inserted into this, and the base plate 4 is mounted. The pressure portion 5 and the lid pressing guide 7 bring the pressure into close contact. In this state, the electron beam 6 is irradiated from the beam irradiation opening 7a similarly to the above (hereinafter, the second beam processing). Here, the lid 1 and the ceramic case 2 where the electron beam 6 is irradiated from the beam irradiation opening 7a are welded through a brazing material. Also, at the time of the second beam processing, sealing is performed without requiring a pressing margin at the outer peripheral edge of the lid 1 to which the electron beam 6 is irradiated for the same reason as at the time of the first beam processing.
[0012]
By the way, the beam irradiation opening 3a of the lid holding guide 3 and the beam irradiation opening 7a of the lid holding guide 7 correspond to the entire outer peripheral edge of the lid 1 when their respective opening areas are added. Therefore, by performing the first beam processing and the second beam processing twice, the lid 1 and the ceramic case 2 are hermetically sealed without requiring a pressing margin on the outer peripheral edge of the lid 1.
[0013]
FIG. 6 is a diagram showing a second embodiment of the present invention. (A) is a top view of a first processing step, (b) is a top view of a second processing step, and (c) is a cross-sectional view of the second processing step. The lid pressing guide 8 is provided with beam irradiation openings 8 a corresponding to two opposite sides of the lid 1. The beam irradiation opening 8a is set to a size corresponding to two sides other than the above-described two sides when the lid holding guide 8 is rotated by 90 ° with reference to the center of the lid 1. The base plate 9 is provided with a positioning groove 9 a slightly larger than the outer shapes of the lid 1 and the ceramic case 2. The lid 1 and the ceramic case 2 are inserted into the positioning grooves 9 a of the base plate 9, and are brought into pressure contact with the lid holding guide 8. Here, the electron beam 6 is irradiated from the beam irradiation opening 8a. Next, the lid holding guide 8 is rotated by 90 °, and the electron beam 6 is irradiated from the beam irradiation opening 8a. Thus, the electron beam 6 is irradiated over the entire outer peripheral edge of the lid 1, and the lid 1 and the ceramic case 2 are sealed. By adopting a structure like the lid pressing guide 8, it is possible to seal the lid and the ceramic case with the same sealing jig without requiring a pressing margin on the outer peripheral edge of the lid. By the way, the beam irradiation aperture of the lid holding guide is not limited to the shapes of the first and second embodiments, and may have any shape as long as a similar effect can be obtained.
[0014]
【The invention's effect】
ADVANTAGE OF THE INVENTION According to this invention, the holding | maintenance margin of the outer peripheral edge part of the lid which was required at the time of hermetically sealing a ceramic case and a lid with an electron beam becomes unnecessary, and a more compact package for electronic components can be implement | achieved.
[0015]
Further, according to the second embodiment of the present invention, the number of jigs required for sealing can be reduced, and the above-mentioned effects can be realized while suppressing the manufacturing cost.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a conventional electronic component package sealing jig.
FIG. 2 is a perspective view showing a lid pressing portion of a conventional sealing jig.
FIG. 3 is a partially omitted cross-sectional view of a conventional sealing jig.
FIG. 4 is a view showing a first processing step of the first embodiment of the present invention.
FIG. 5 is a view showing a second processing step of the first embodiment of the present invention.
FIG. 6 is a diagram showing a second embodiment of the present invention.
[Explanation of symbols]
REFERENCE SIGNS LIST 1 lid 2 ceramic case 3 lid holding guide 3a beam irradiation opening 3b positioning groove 4 base plate 5 pressing unit 6 electron beam 7 lid holding guide 7a beam irradiation opening 7b positioning groove 8 lid holding guide 8a beam irradiation opening 9 base plate 9a positioning Groove 10 Pressing portion 31 Lid 32 Ceramic case 33 Lid holding guide 33a Beam irradiation opening 33b Positioning groove 34 Pressing portion 34a Coil spring 34b Pressing body 35 Base plate 36 Electron beam

Claims (2)

A ceramic case for housing electronic components and a lid placed on the outer peripheral frame thereof via a brazing material, and by irradiating an electron beam in a vacuum atmosphere along the periphery of the lid, the brazing material is melted. In a method for sealing an electronic component package in which the lid is fixed to the ceramic case,
By a first jig having an opening at a part of a position corresponding to the outer peripheral frame of the ceramic case, a step of pressing and contacting the lid on the outer peripheral frame of the ceramic case,
A first processing step of irradiating the periphery of the lid exposed from the opening of the first jig with an electron beam,
A second jig having an opening corresponding to the peripheral edge of the lid that was not irradiated with the electron beam in the first processing step, and a step of pressing and attaching the lid on the outer peripheral frame of the ceramic case,
A second processing step of irradiating the periphery of the lid exposed from the opening of the second jig with an electron beam. The method for sealing an electronic component package according to claim 1, wherein the first jig and the second jig are the same.

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