JP3856912B2 - Jig for sealing electronic component packages - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a sealing jig used when a lid of an electronic component package is sealed to a ceramic case.
[0002]
[Prior art]
Conventionally, as a package for electronic components, for example, a metallized layer is formed on the upper surface of an outer peripheral frame of a ceramic case, and a metal lid is sealed to the ceramic case by beam welding using an electron beam or the like. (JP-A-8-46075). When irradiating an electron beam, it is necessary to bring the ceramic case and the lid into close contact with each other. Conventionally, several places are temporarily bonded together with an adhesive or the like along the irradiated portion of the electron beam.
[0003]
[Problems to be solved by the invention]
However, when several places of the lid are temporarily bonded as in the conventional case, there is a problem in the molding accuracy of the ceramic case or the lid, and it cannot be adhered over the entire circumference. There was a gap. When beam welding is performed in such a state with a gap, an incompletely welded portion is generated between the metallized layer and the lid, and the inside of the package may not be completely hermetically sealed. There was a drop in product yield.
[0004]
Accordingly, the present invention provides an electronic component package that can completely hermetically seal the inside of the package by preventing a gap from being formed in the welded portion when the lid is beam welded to the ceramic case. An object is to provide a fixing jig.
[0005]
[Means for Solving the Problems]
In order to solve the above-mentioned problems, a sealing jig for an electronic component package according to claim 1 of the present invention is characterized in that it is sealed by beam welding to a ceramic case for storing an electronic component and an upper surface of an outer peripheral frame thereof. A jig for sealing an electronic component package comprising a lid body, wherein the outer periphery of the lid body is pressed outside the beam irradiation position of the lid body, and the lid body is press-fitted to the upper surface of the outer peripheral frame of the ceramic case. There is to wear.
[0006]
According to a second aspect of the present invention, there is provided a sealing jig for an electronic component package according to the present invention, characterized in that a base portion provided with a pressing portion for elastically pressing the ceramic case is provided on the upper surface of the base portion. A frame provided with an adhesive sheet that is disposed at a predetermined position to fix the ceramic case at a predetermined position, and a lid presser guide that is disposed on the frame and has a positioning portion for the lid.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of a sealing jig for an electronic component package according to the present invention will be described in detail with reference to the accompanying drawings. 1 to 3 show a first embodiment of a sealing jig 1 according to the present invention. In this embodiment, the sealing jig 1 includes a base portion 4 provided with a pressurizing portion 3 that pressurizes a ceramic case 2 for storing electronic components from below, and a ceramic case 2 disposed on the base portion 4. The frame 6 includes an adhesive sheet 5 that is positioned and fixed at a predetermined position, and a lid presser guide 8 that is disposed on the frame 6 and positions and fixes the lid 7 at a predetermined position.
[0008]
The base portion 4 includes a rectangular base plate 9, a plurality of pressing portions 3 arranged at the center of the upper surface of the base plate 9, and positioning protrusions 10 that protrude from the four corners of the base plate 9. A plurality of pressurizing sections 3 are provided at equal intervals in the vertical and horizontal directions corresponding to the electronic component package governed by the sealing jig 1. Further, as shown in FIG. 2, the structure of the pressurizing unit 3 includes a cylindrical pressurizing body 11 that can slide in the base plate 9 in the vertical direction, the inside of the pressurizing body 11, and the base plate 9. And a coil spring 12 provided between the two. The pressing body 11 has a top portion protruding from the upper surface of the base plate 9 and elastically pressurizes the ceramic case 2 by the elastic force of the coil spring 12. The positioning projection 10 is a cylindrical body having a constricted central portion, and when the frame 6 and the lid pressing guide 8 are combined with the base portion 4, the positioning projection 10 is positioned at an appropriate position. In addition, on both the left and right sides of the base plate 9, base guide holes 13 are formed through the base plate 9 in the vertical direction so as to be guided by the lid presser guide 8. Further, a sealing portion is provided on one side of the outer periphery. A pair of welding machine positioning grooves 14a is provided in the front-rear direction so that the jig 1 can be positioned when the entire jig 1 is set on a beam welding machine (not shown).
[0009]
On the other hand, the frame 6 is made of a thin plate having the same planar shape as the base plate 9, and its thickness is set to the same height as the ceramic case 2. A substantially square-shaped opening 6 a is provided near the center of the frame 6, and a flexible adhesive sheet 5 is stretched on the lower surface of the frame 6 so as to cover the entire opening 6 a. The pressure-sensitive adhesive sheet 5 has a pressure-sensitive adhesive surface on the upper surface side, and temporarily fixes and fixes the lower surfaces of the plurality of ceramic cases 2 positioned and placed so as to correspond to the pressurizing unit 3. Four frame positioning holes 15 to be inserted into the positioning protrusions 10 of the base portion 4 are provided at the four corners of the frame 6, and frame guide holes 16 are opened on both the left and right sides so as to be guided by the lid presser guide 8. ing. Further, a pair of positioning grooves 14b for the welding machine when the entire sealing jig 1 is set on the beam welding machine is provided on one side surface of the outer periphery of the frame 6 in the front-rear direction.
[0010]
Further, the lid presser guide 8 includes a guide plate 17 having the same planar shape as the base portion 4 and guide pins 18 projecting from the lower surface of the guide plate 17. A concave portion 19 is formed near the center of the guide plate 17, and a beam irradiation opening 20 for positioning the lid body 7 and irradiating the lid body 7 with a beam from above is formed on the bottom surface 19 a of the concave portion 19 in the vertical and horizontal directions. Several have been established. As shown in FIGS. 2 and 3, the beam irradiation opening 20 is a rectangular opening slightly smaller than the outer dimension of the lid body 7, and positioning grooves having the same outer dimension as the lid body 7 are provided around the four circumferences thereof. 21 is formed on the lower surface side of the bottom surface 19a. A step is formed by the positioning groove 21 so that the lid body 7 is accommodated in the positioning groove 21 and the outer peripheral edge portion of the lid body 7 is pressed by the inner peripheral edge of the beam irradiation opening 20. The depth of the positioning groove 21 is set slightly shallower than the thickness of the lid body 7.
[0011]
The guide pins 18 of the lid presser guide 8 are for guiding the frame 6 to an appropriate position when the frame 6 is set on the lid presser guide 8. Further, guide plate positioning holes 22 to be inserted into the positioning protrusions 10 of the base portion 4 are formed at the four corners of the guide plate 17, and a pair of welding machine positioning grooves 14c are provided in the front-rear direction on one side surface of the outer periphery. ing. The portion of the bottom surface 19a of the guide plate 17 is made of a high melting point material such as tungsten or molybdenum so as not to be damaged by the heat generated by the beam irradiation.
[0012]
Next, a method of using the sealing jig 1 having the above configuration will be described. First, the ceramic case 2 is temporarily fixed at a predetermined position on the adhesive sheet 5 provided on the frame 6. The arrangement position is set so as to correspond to the beam irradiation opening 20 formed in the lid presser guide 8. Next, the lid presser guide 8 is reversed, and the metal lids 7 are set in the positioning grooves 21 one by one. Next, the frame 6 to which the ceramic case 2 is adhered is reversed and set on the lid presser guide 8. The frame 6 is set at an approximate position while being guided in the left-right direction by the guide pins 18 of the lid presser guide 8. Further, the base portion 4 is inverted and set on the frame 6. The base portion 4 is also set at a rough position by the guide pin 18 of the lid presser guide 8, and positioning protrusions 10 provided on the base portion 4 are inserted into the positioning holes 15 and 22 of the frame 6 and the lid presser guide 8. By doing so, the mutual positional relationship among the base portion 4, the frame 6, and the lid presser guide 8 is finally determined. In this way, after the three parties are integrated, the entire sealing jig 1 is inverted again, and is set in a beam welding machine (not shown) with reference to the positioning groove 14 for the welding machine.
[0013]
FIG. 2 is a cross-sectional view showing a state in which the lid 7 and the ceramic case 2 are pressed and adhered with the sealing jig 1. The electron beam 23 is irradiated from above the beam irradiation opening 20 where the outer peripheral edge of the upper surface of the lid body 7 is pressed, and is irradiated along the inner periphery of the beam irradiation opening 20 over the entire circumference. The pressurizing unit 3 pressurizes the ceramic case 2 from below with the elastic force of the coil spring 12 via the adhesive sheet 5. Therefore, the lid 7 and the entire outer peripheral frame of the ceramic case 2 can be pressed and adhered while the irradiation position 23a of the electron beam 23 on the lid 7 is secured. The pressurizing unit 3 is provided independently according to the number of the ceramic cases 2, and the ceramic cases 2 are arranged on the flexible adhesive sheet 5, so even if the height of the ceramic cases 2 is uneven. The individual ceramic cases 2 can be pressed and adhered with an appropriate pressure.
[0014]
In this embodiment, since the ceramic case 2 is positioned and fixed on the adhesive sheet 5, the ceramic case 2 itself can be positioned regardless of the molding dimensional accuracy.
[0015]
FIG. 4 is a cross-sectional view showing the electronic component package P after the lid 7 and the ceramic case 2 are beam-welded using the sealing jig 1 having the above-described configuration. As shown in this figure, the metallized layer 24 formed on the upper surface of the outer peripheral frame of the ceramic case 2 and the metal brazing material layer 25 clad on the lower surface of the lid 7 are pressed and adhered over the entire periphery. Since it can be welded, the metal brazing material 25 and the metallized layer 24 are reliably welded, and a completely hermetically sealed package P can be obtained with a high yield. The electronic component 26 housed in the package P includes a crystal resonator, a crystal oscillator, a crystal filter, a surface acoustic wave filter, various semiconductors, and the like.
[0016]
5 to 7 show a second embodiment of the sealing jig according to the present invention, and the base portion 4 and the frame 6 have the same configuration as that of the above-described embodiment. The detailed explanation is omitted. In this embodiment, the lid body 7 is formed in a half-cut state without being completely separated from the lid body material plate 27 during press molding. On the other hand, a number of beam irradiation openings 20a for irradiating the lid 7 with a beam are opened in the lid pressing guide 8, and each lid 7 is positioned in the beam irradiation opening 20a. This is different from the above-described embodiment in that no positioning groove is formed. As shown in FIG. 5, a plurality of positioning guide holes 28 are provided in the lid body material plate 27 along the longitudinal direction, and pins (not shown) provided with the guide holes 28 in the lid holding guide 8. The individual lids 7 are positioned at the beam irradiation openings 20a. The shape of the beam irradiation opening 20a is slightly larger than the outer dimensions of the lids 7.
[0017]
Even in this embodiment, by assembling the base part 4, the frame 6 and the lid holding guide 8, beam welding can be performed while the lid 7 and the ceramic case 2 are in pressure contact. As shown in FIG. 6, since the outer peripheral portion of the lid 7 where the lid material plate 27 is not half-extracted is pressed by the periphery of the beam irradiation opening 20a, the position where the lid 7 is pressed and the electron beam 23 Can be separated from the irradiation position 23a. Therefore, the influence of heat caused by the electron beam irradiation applied to the lid pressing guide 8 can be suppressed as much as possible, and the life of the jig can be extended accordingly. Further, since a plurality of lids 7 are simultaneously positioned at a time in a half-extracted state, they can be positioned efficiently. As shown in FIG. 7, the lid material plate 27 cannot be easily separated even if a force is applied from the A direction, but can be easily pulled out if a force is applied from the opposite B direction. be able to. For this reason, the whole package can be extracted from the lid material plate 27 by applying force from the B direction after beam welding.
[0018]
8 and 9 show a third embodiment of the sealing jig according to the present invention. In this embodiment, a positioning groove 21b provided at the inner peripheral edge of the beam irradiation opening 20b provided in the lid presser guide 8 is formed deeper, and the ceramic case 2 can be positioned together with the lid 7 by the lid presser guide 8. It is what I did. Therefore, unlike the previous embodiment, there is no need to provide the frame 6. In this embodiment, after the lid presser guide 8 is reversed and the lid body 7 is positioned using the positioning groove 21a, the ceramic case 2 is also positioned in the positioning groove 21a. As shown in FIG. 9, in this embodiment as well, since beam welding can be performed with pressure contact, complete hermetic sealing can be achieved, and the parts of the sealing jig 1 can be reduced.
[0019]
【The invention's effect】
As described above, according to the sealing jig for an electronic component package according to the present invention, the outer periphery of the upper surface of the cover body is pressed outside the beam irradiation position of the cover body, and the cover body is surrounded by the outer peripheral frame of the ceramic case. Since pressure contact is made on the upper surface, no gap is generated in the welded portion between the lid and the ceramic case when the two are beam-welded. As a result, sealing of the lid and the ceramic case by beam welding is ensured, and a completely airtight package product can be obtained with a high yield.
[0020]
Further, the sealing jig of the present invention has a base portion provided on the upper surface with a pressurizing portion that elastically pressurizes the ceramic case, and is disposed on the base portion and fixes the ceramic case at a predetermined position. Since the frame is provided with a pressure-sensitive adhesive sheet and a lid presser guide that is arranged on the frame and has a positioning groove for the lid, the dimensional accuracy of the ceramic case itself is not high or an external burr is generated. Even in this case, positioning can be performed accurately, and a highly accurate package product can be obtained.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view showing a first embodiment of a sealing jig according to the present invention.
FIG. 2 is a cross-sectional view showing a pressure contact state with the sealing jig.
FIG. 3 is an enlarged perspective view showing a main part of a lid pressing guide of the sealing jig.
FIG. 4 is a cross-sectional view showing an example of a package sealed using the sealing jig of the present invention.
FIG. 5 is an exploded perspective view showing a second embodiment of a sealing jig according to the present invention.
FIG. 6 is a cross-sectional view showing a pressure contact state using the sealing jig according to the second embodiment.
FIG. 7 is a cross-sectional view showing a lid material plate and a ceramic case according to the second embodiment.
FIG. 8 is an exploded perspective view showing a third embodiment of a sealing jig according to the present invention.
FIG. 9 is a cross-sectional view showing a pressure contact state using the sealing jig according to the third embodiment.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Sealing jig | tool 2 Ceramic case 3 Pressure part 4 Base part 5 Adhesive sheet 6 Frame 7 Lid body 8 Lid pressing guide 20 Beam irradiation opening (positioning part of lid)
23 Electron beam 25 Metal brazing material 26 Electronic parts

Claims (2)

A jig for sealing an electronic component package comprising a ceramic case for storing an electronic component and a lid sealed by beam welding to the upper surface of the outer peripheral frame,
A sealing jig for an electronic component package, wherein the outer periphery of the upper surface of the lid is pressed outside the beam irradiation position of the lid, and the lid is pressed and adhered to the upper surface of the outer peripheral frame of the ceramic case. A base part provided on the upper surface with a pressurizing part that elastically presses the ceramic case, a frame including an adhesive sheet that is disposed on the base part and fixes the ceramic case at a predetermined position, and on the frame The electronic device package sealing jig according to claim 1, further comprising: a lid pressing guide disposed and formed with a positioning portion of the lid.

Images