JP2004337744A - Stage apparatus and apparatus and method for applying paste by using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a stage apparatus by which a liquid crystal substrate can be prevented from being warped by its own weight or its own warp can be corrected in a paste applying apparatus to be adopted when the liquid crystal substrate is assembled. <P>SOLUTION: This stage apparatus has a receiving surface 4A3 on which the substrate 2 to be held and carried in on a conveying arm 3 is placed and an approach space 4A2 which is formed below the surface 4A3 and into which a substrate holding part of the arm 3 for holding the substrate 2 can go. A movable supporting pin 10 is arranged in the space 4A2 so that the pin 10 is located at the position that the pin 10 is retreated from the approach route of the substrate holding part when the substrate holding part of the arm 3 goes into the space 4A2 and located at the height almost similar to that of the surface 4A3 to support the substrate 2 from below when the substrate holding part is retreated from the space 4A2. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a stage device on which a substrate such as a glass substrate is placed, a paste application device using the same, and an improvement in a paste application method.
[0002]
[Prior art]
In a manufacturing process of a liquid crystal display panel or the like, two glass substrates sandwiching liquid crystal are bonded. To perform the bonding, a paste such as a sealant is applied to a bonding surface of at least one of the glass substrates. You.
[0003]
FIG. 4 is a structural layout of a conventional paste application apparatus, FIG. 5 is a perspective view of the paste application apparatus shown in FIG. 4, and FIG. 6 is a schematic perspective view of a stage device and a transfer arm of the paste application apparatus shown in FIG. Is shown.
[0004]
That is, as shown in FIG. 4, the substrate 2 sequentially conveyed and supplied onto the supply table 1 is sucked and held by the transfer arm 3 on the opposite side of the paste application surface, and the four paste application devices 41 to 44 The paste is sequentially conveyed and supplied onto each stage 4A with the paste application surface facing upward. The transport is performed in this manner to prevent the dust or the like from adhering to the paste-applied surface of the substrate and causing a product defect.
[0005]
The transfer arm 3 receives the substrate 2 from the supply table 1, and transfers the substrate 2 to the paste application devices 41 to 44 which are arranged two by two toward the transfer line while transferring the substrate 2 in the direction of the arrow X shown in the drawing. .
[0006]
The reason why the four paste application devices 41 to 44 are arranged toward the transport line in this manner is that a throughput time that is consistent with other processes is required, and the number of paste application devices 41 to 44 is relatively large. By operating a plurality of paste application apparatuses that require a long operation time in parallel, the throughput time in the paste application step is increased, and the productivity of the entire assembly manufacturing is increased.
[0007]
Note that FIG. 4 shows a main part configuration of only one paste application device 41, and the other three paste application devices 42 to 44 have the same configuration, so that the main configuration is omitted.
[0008]
As shown in FIG. 6, a plurality of suction plates 4A1 are provided on the stage 4A, and are connected to the pneumatic control unit 6 via a pipe 8B so that the substrate 2 can be vacuum-sucked at the same time. Further, a plurality of recesses 4A2 are formed on the stage 4A at predetermined intervals in the direction of arrow Y in FIG. 5 so as to correspond to the arm 7 of the transfer arm 3. The arm 7 is provided with a suction board 7A, which is connected to the pneumatic control unit 6 via a pipe 8A.
[0009]
The stage 4A is fixed to the θ (turn) axis of the XY-θ moving mechanism 4B, the θ axis is fixed to the Y axis 4B1, the Y axis is fixed to the X axis 4B2, and the X- The entire Y-θ moving mechanism 4B is installed on a table (stand) 4C.
[0010]
The stage 4A moves to a transfer position advanced near the transfer arm 3 when transferring the substrate 2, and moves to a coating operation position retracted away from the transfer arm 3 when performing paste application of the substrate 2.
[0011]
Prior to the start of the paste application operation, the substrate 2 sucked and held on the stage 4A is aligned with an application head (head mechanism) 4D. The substrate 2 itself is also transferred from the transfer arm 3 to the stage 4A. Above, there is often a displacement in the XY-θ direction. Therefore, as shown in FIG. 4, the alignment marks of the substrate 2 are formed by the CCD cameras 4D3 and 4D4 attached to the two syringes 4D1 and 4D2 of the head mechanism 4D, or by a separately provided recognition camera or the like. Photographing is performed, and positional deviation correction is performed in advance by correction control based on the video pattern.
[0012]
Prior to the start of the paste application operation, the pair of syringes 4D1 and 4D2 of the head mechanism 4D is arranged such that the interval between the syringes 4D1 and 4D2 is set to a plurality of application pattern intervals (pitch) in the direction of arrow X on the substrate 2. The members are individually moved and adjusted in the direction of the arrow X so as to coincide with each other, and are positioned and fixed.
[0013]
That is, the paste pattern is formed on the surface of the substrate 2 by the program control of the controller 4E. This corresponds to the arrangement pitch in the X direction of the plurality of sub-substrates arranged on the (substrate) 2.
[0014]
As shown in FIGS. 4 and 5, a monitor 4F and a keyboard 4G are connected to the controller 4E, and the operator can operate the keyboard 4G to paste the paste on the substrate 2. The coating operation can be adjusted.
[0015]
The substrate 2 on which the paste pattern is formed by the paste application moves forward toward the transfer position to the transfer arm 3 and is transferred to the transfer arm 3, and the received transfer arm 3 transfers the substrate 2 to the next step. Are supplied to the carry-out table 5 shown in FIG.
[0016]
[Problems to be solved by the invention]
In recent years, as display devices such as personal computers and televisions, liquid crystal displays and plasma displays that can be made thinner have been increasingly used, and at the same time, these displays are required to have large screens. It has become. In addition, in order to increase the productivity of the display, the size of the substrate is increasing so that a larger number of displays can be obtained from one substrate, and from this viewpoint, the size of the substrate tends to increase. On the other hand, the thickness of the substrate tends to be reduced due to a demand for a lightweight display. However, when the substrate is made larger and thinner as described above, the conventional stage device as described above has the following problems.
[0017]
That is, the thinned substrate 2 has low rigidity, so that a portion corresponding to the concave portion 4A2 is bent by its own weight as shown in FIG.
[0018]
On the other hand, in the paste application devices 41 to 44 described above, in order to keep the amount of the paste applied onto the substrate 2 constant, a distance sensor that moves integrally with the nozzle of the head mechanism when applying the paste. The height of the surface of the substrate 2 is measured at a set time interval, and the height of the nozzle is feedback-controlled based on the measured value to keep the distance between the nozzle and the substrate 2 constant.
[0019]
However, when the nozzle passes across the above-mentioned bent portion, the height control of the nozzle against the change in the height of the surface of the substrate 2 cannot be performed in time, and the distance between the nozzle and the substrate 2 increases. As a result, the coating accuracy deteriorates.
[0020]
Therefore, an object of the present invention is to provide a stage device that can prevent bending of a substrate due to its own weight, a paste application device that can form a highly accurate application pattern, and a paste application method.
[0021]
[Means for Solving the Problems]
In order to solve the above-mentioned problems, a stage device according to the present invention includes a receiving surface on which a substrate held and carried in on a transfer arm is placed, and a substrate formed at a level lower than the height of the receiving surface. A stage member having an entrance space for allowing a substrate holding part for holding the substrate to enter, a supporting member movable in the entrance space, and the supporting member is provided with When entering the space, it is positioned at a retreat position where it retreats from the entry path, and when the substrate holding portion is retracted from the entry space, the substrate support portion is positioned at a height position substantially coinciding with the receiving surface, and Can be supported from below.
[0022]
In addition, it is preferable to further include a drive unit that moves the support member between a retracted position retracted from the approach path and a height position substantially coinciding with the receiving surface.
[0023]
Further, it is preferable that the distal end of the support member is formed in a curved shape.
[0024]
It is preferable that the receiving surface has a plurality of suction disks.
[0025]
A paste coating apparatus according to the present invention is a paste application device, comprising: a receiving surface on which a substrate held and carried in on a transfer arm is placed; and a substrate holding unit formed below the height of the receiving surface and holding the substrate in the transfer arm. A paste apparatus for applying a paste to the substrate by providing a stage device having an entry space allowing entry of the paste, and a coating head for applying the paste to the substrate, by applying a relative movement between the coating head and the stage device. In the above, a supporting member movable in the approach space is provided, and the support member is located at a retreat position where the substrate holding unit of the transfer arm retreats from the approach path when the substrate holding unit enters the approach space. When the substrate holding part is retracted from the entrance space, the substrate supporting part is positioned at a height position substantially coincident with the receiving surface, and Characterized in that it possible to support from below.
[0026]
The paste application method according to the present invention includes a step of entering a carry-in arm into an entrance space formed on a receiving surface, and placing a substrate held by the carry-in arm on the receiving surface, and placing the substrate on the receiving surface. Thereafter, a step of retracting the carry-in arm from the entrance space, and a step of supporting the lower surface of the substrate with a support member movable in the entrance space after the carry-in arm retracts from the entrance space, A step of applying paste to the substrate placed on the receiving surface; a step of retracting the support member from the entrance space of the loading arm after applying the paste; and a step of transporting the support arm to the entrance space after the support member retracts. And taking out the substrate from the receiving surface by the carry-out arm.
[0027]
According to the stage device of the present invention, the support member movable in the entry space formed below the height position of the receiving surface is retracted from the entry space when the substrate is transferred to the stage, and is transferred. After that, the transferred substrate is supported from below. Therefore, the substrate can be prevented from being bent into the entry space formed on the stage by its own weight, and the substrate can be held with good flatness.
[0028]
Further, according to the paste application device and the paste application method according to the present invention, the support member movable in the entry space formed below the height position of the receiving surface moves from the entry space when the substrate is transferred to the stage. After being evacuated and transferred, the transferred substrate is supported from below. Therefore, the substrate can be prevented from being bent into the entry space formed on the stage by its own weight, and the substrate can be held with good flatness, so that the paste can be applied to the substrate with high accuracy.
[0029]
BEST MODE FOR CARRYING OUT THE INVENTION
An embodiment of the present invention will be described with reference to FIGS. The same components as those of the conventional paste application device shown in FIGS. 4 and 5 are denoted by the same reference numerals, and detailed description is omitted.
[0030]
1 is a schematic perspective view of a stage device and a transfer arm to which the present invention is applied, FIG. 2 is a cross-sectional view taken along the line AA of FIG. 1, and FIG. 3 is a cross-sectional view taken along the line BB of FIG. It is.
[0031]
The stage device and the transfer arm of the paste application device shown in FIG. 1 have the same configuration as the conventional paste application device shown in FIGS. 4 and 5, and only the structure of the stage device is different.
[0032]
That is, as in the conventional case, the substrate 2 sequentially conveyed and supplied onto the supply table 1 is suction-held on the arm 7 of the transfer arm 3 on the side opposite to the paste application surface, and rotated in the θ (rotation) axis direction. Then, by moving in the direction of the transport line (arrow X), the paste is sequentially transported and supplied to the stages of the four paste application devices 41 to 44 with the paste application surface facing upward.
[0033]
Each of the paste coating devices 41 to 44 includes a stage 4A for receiving and mounting the substrate 2, and a head mechanism 4D. The transfer arm 3 receives the substrate 2 from the supply table 1, and transfers the substrate 2 to the paste application devices 41 to 44 which are arranged two by two toward the transfer line while transferring the substrate 2 in the direction of the arrow X shown in the drawing. .
[0034]
The stage 4A is fixed to the θ (rotation) axis of the XY-θ moving mechanism 4B, the θ axis is fixed to the Y axis 4B1, the Y axis is fixed to the X axis 4B2, and the XY- The entire θ moving mechanism 4B is installed on a table (stand) 4C.
[0035]
The stage 4A moves to a transfer position advanced near the transfer arm 3 when transferring the substrate 2, and moves to a coating operation position retracted away from the transfer arm 3 when performing paste application of the substrate 2.
[0036]
Prior to the start of the paste application operation, the substrate 2 sucked and held on the stage 4A is aligned with the head mechanism 4D. In many cases, a displacement occurs in the Y-θ direction. Therefore, as shown in FIG. 4, the alignment marks of the substrate 2 are formed by the CCD cameras 4D3 and 4D4 attached to the two syringes 4D1 and 4D2 of the head mechanism 4D, or by a separately provided recognition camera or the like. Photographing is performed, and positional deviation correction is performed in advance by correction control based on the video pattern.
[0037]
Prior to the start of the paste application operation, the pair of syringes 4D1 and 4D2 of the head mechanism 4D is arranged such that the interval between the syringes 4D1 and 4D2 is set to a plurality of application pattern intervals (pitch) in the direction of arrow X on the substrate 2. The members are individually moved and adjusted in the direction of the arrow X so as to coincide with each other, and are positioned and fixed.
[0038]
That is, the paste pattern is formed on the surface of the substrate 2 by the program control of the controller 4E. This corresponds to the arrangement pitch in the X direction of the plurality of sub-substrates arranged on the (substrate) 2.
[0039]
As shown in FIGS. 4 and 5, a monitor 4F and a keyboard 4G are connected to the controller 4E, and the operator can operate the keyboard 4G to paste the paste on the substrate 2. The coating operation can be adjusted.
[0040]
The substrate 2 on which the paste pattern is formed by the paste application moves forward toward the transfer position to the transfer arm 3 and is transferred to the transfer arm 3, and the received transfer arm 3 transfers the substrate 2 to the next step. Are supplied to the carry-out table 5 shown in FIG.
[0041]
Here, the stage device will be described in detail with reference to FIGS.
[0042]
As shown in FIG. 1, the transfer arm 3 transfers the substrate 2 to the receiving surface 4A3 of the stage device. The substrate 2 is sucked and held by the receiving surface 4A3. After the paste is applied, the substrate 2 is again taken out of the receiving surface 4A3 by the transfer arm 3. It is.
[0043]
The transfer arm 3 is provided with a plurality of suction disks 7A on the upper surface of a bifurcated fork-shaped arm 7, and the suction disks 7A are connected to the pneumatic control unit 6 via a pipe 8A.
[0044]
The stage device is schematically composed of a stage 4A and a driving device 9.
[0045]
The stage 4A includes a receiving surface 4A3 on which the substrate 2 is placed, a plurality of suction plates 4A1 for suction-holding the substrate 2 on which the paste is applied to the receiving surface 4A3, and a substrate while preventing interference between the receiving surface 4A3 and the arm 7. 2 has two recesses 4A2 of the transfer arm 3 for transferring to the receiving surface 4A3, a support pin 10 as a support member, and a through hole 4A4 provided on the bottom surface of the recess 4A2 for passing through the support pin 10. It is composed.
[0046]
On the other hand, the driving device 9 includes an elevating plate 11 on which a support pin 10 having a substantially spherical tip portion 10A is installed, and an air cylinder 12 that supports the elevating plate 11 so as to be able to move up and down.
[0047]
Here, the two recesses 4A2 correspond to the interval between the arms 7, and the suction plate 4A1 is connected to the pneumatic control unit 6 via a pipe 8B. The support pins 10 and the through holes 4A4 through which the support pins 10 pass are provided at three equal intervals for each recess 4A2. Further, the support pin 10 is driven by the air cylinder 12 to move between a support position where the distal end portion 10A substantially coincides with the height position of the receiving surface 4A3 and a retracted position where the distal end portion 10A retreats and sinks below the bottom surface of the recess 4A2. It can be moved.
[0048]
Next, an operation in which the stage 4A receives the substrate 2 from the transfer arm 3 will be described.
[0049]
First, the substrate 2 placed on the supply table 1 is suction-held by the suction plate 7A on the upper surface of the arm 7 of the transfer arm 3. The arm 7 moves in the arrow X direction of FIG. 4 which is a transfer line, moves in the arrow Y direction, the θ-axis rotation direction, and the vertical direction based on a command from the controller 4E to position the substrate 2 and paste. It is positioned on the stage 4A of the coating device 41. At this time, the arm 7 is positioned so as to face the two recesses 4A2.
[0050]
Next, the arm 7 descends in the vertical direction, and causes the arm 7 to enter the recess 4A2. During this lowering process, the substrate 2 is placed on the receiving surface 4A3. Then, the vacuum suction of the substrate 2 by the suction disk 7A is released when the substrate 2 comes into contact with the receiving surface 4A3. Thus, the substrate 2 is placed on the receiving surface 4A3. That is, the concave portion 4A2 forms an entry space that allows the substrate holding portion of the transfer arm 3 to enter, and the substrate 2 is received by the substrate holding portion of the arm 7 entering this entry space. 4A3.
[0051]
Next, the arm 7 is moved in the direction of the arrow -Y in FIG. 1 after descending to a position where the suction plate 7A on the upper surface does not contact the lower surface of the substrate 2 and the lower surface does not contact the bottom surface of the concave portion. To escape from the entrance space of the stage 4A.
[0052]
When the arm 7 separates from the stage 4A, the stage 4A starts moving to the coating operation position. Along with this movement, compressed air is supplied to the air cylinder 12 in the stage 4A via a pipe (not shown), and the cylinder rod of the air cylinder 12 rises, so that the tip of the support pin 10 installed on the elevating plate 11 receives the receiving surface. It rises to a height position substantially coincident with 4A3, that is, a supporting position on the lower surface of the substrate, and supports the substrate 2 from below. As a result, the substrate 2 is supported in the recess 4A2 of the stage 4A shown in FIG. 7 without being bent by its own weight. Thereafter, the substrate 2 is vacuum-sucked by the suction plate 4A1 provided on the receiving surface 4A3 of the stage 4A.
[0053]
When the movement of the stage 4A is completed, the alignment marks on the substrate 2 are imaged by the cameras 4D3 and 4D4. Then, based on the imaging patterns of the cameras 4D3 and 4D4, the controller 4E calculates the positional shift of the substrate 2, corrects the movement of the stage 4A in the XYθ directions, and applies the paste accurately to a predetermined position.
[0054]
Next, an operation of taking out the transfer arm 3 from the receiving surface 4A3 of the substrate 2 coated with the paste will be described.
[0055]
First, the stage 4A is moved from the application position to the substrate delivery position. Then, during this movement, the tip 10A of the support pin 10 supporting the substrate 2 is lowered by the air cylinder 12 to the retracted position.
[0056]
Next, the transfer arm 3 is moved based on a command from the controller 4E so that the tip of the arm 7 faces the side surface of the recess 4A2 of the stage 4A. At this time, in the height direction, the height position of the arm 7 forms a gap between the suction plate 7A on the upper surface and the lower surface of the substrate 2 on the stage 4A, and the lower surface of the arm 7 and the concave portion 4A2 of the stage 4A. It is positioned so as to be at a height position that forms a gap with the bottom surface.
[0057]
Next, the arm 7 is moved in the direction of arrow Y in FIG. 1 to position the suction cup 7A at a position below the substrate 2 held on the stage 4A. Then, after the vacuum suction of the suction board 4A1 on the receiving surface 4A3 is released, the arm 7 is raised and the substrate 2 is picked up from the receiving surface 4A3. At this time, the substrate 2 is suction-held by the arm 7 by the vacuum suction of the suction board 7A. Next, by raising the arm 7, the substrate 2 is raised to a position where it does not come into contact with the receiving surface 4A3, and then retracts in the direction of the arrow -Y in FIG. 1 to take out the substrate 2 from the stage 4A.
[0058]
Next, the arm 7 rotates about the arrow θ axis in FIG. 4 to position the substrate 2 sucked and held on the transfer line. Then, the arm 7 moves in the X direction, and positions the substrate 2 at the unloading position. Here, the arm 7 descends, and the substrate 2 is placed on the unloading table 5.
[0059]
By the above operation, the substrate 2 is unloaded from the stage 4A to the unloading table 5. In the other paste coating devices 42 to 44, the loading and unloading of the substrate 2 are performed by the same operation.
[0060]
In the embodiment described above, the portion corresponding to the concave portion 4A2 of the substrate 2 carried into the stage 4A is supported by the support pins 10 from below, so that the substrate 2 is placed in the concave portion 4A2 of the stage 4A by its own weight. It is possible to prevent bending due to its own weight in a U-shaped state. When used in a paste application device, a phenomenon in which the distance between the nozzle and the substrate 2 is increased, unlike the related art, can be prevented, and the paste can be applied onto the substrate 2 with high accuracy. For the same reason, the substrate 2 supplied to the stage 4A can be reliably held by the suction plate 4A1 on the receiving surface 4A3 prior to the paste application operation, so that the paste application operation can be performed with higher precision. Can be.
[0061]
When the arm 7 of the transfer arm 3 enters the concave portion 4A2 forming the entry space, the support pin 10 is positioned at a lower position retracted from the entry path, so that the support pin 10 can be smoothly inserted without obstructing the entry of the arm 7. It is possible to carry out substrate transfer.
[0062]
Further, in the case where the position shift correction of the substrate 2 conveyed to the stage 4A is performed using a camera, even when the alignment mark on the substrate 2 is located on or near the recess 4A2 of the stage 4A, an image is taken by the camera. Since the part is not bent, the reflected light of the alignment mark surely enters the cameras 4D3 and 4D4, so that the alignment mark can be read well, and the apparatus can be prevented from being stopped without being detected, thereby improving productivity. And labor saving can be achieved.
[0063]
Further, according to the present embodiment, when the portion corresponding to the concave portion 4A2 of the stage 4A is bent in a downwardly convex shape due to the warpage inherent to the substrate, the bending is corrected by the upward movement of the support pin 10. can do. Therefore, even in such a case, the paste can be applied onto the substrate 2 with high accuracy.
[0064]
Further, according to the present embodiment, the support pins 10 are raised during the movement of the stage 4A to the coating operation position, and the support pins 10 are lowered during the movement of the stage 4A to the substrate transfer position. As a result, it is possible to prevent the throughput time for raising and lowering the support pins 10 from increasing.
[0065]
In addition, according to the present embodiment, the lower end of the substrate 2 is supported by the spherical support pins 10 at the distal end 10A. Therefore, when adjusting the height of the support pins 10 at the support position, the distal end 10A is used. It is only necessary to make an adjustment so as to make contact with the lower surface of the substrate 2, and there is no need to adjust the inclination of the support pins 10 in the vertical direction, and it is only necessary to adjust the height in the height direction. This effect is sufficient if the tip of the support pin 10 is curved.
[0066]
In the above-described embodiment, a paste application apparatus for applying a paste to a substrate has been described. However, the present invention is not limited to this embodiment, and various semiconductor manufacturing apparatuses that handle substrates such as a liquid crystal substrate, for example, projection exposure The present invention may be applied to a substrate supporting device such as a device, a spin coater, a film forming device, and a bonding device.
[0067]
Further, in the embodiment of the present invention, two paste application heads are provided for one paste application device, but the number may be one, three or more, and four paste application devices may be transported. Although two units are arranged in opposition to the line, the arrangement is not limited to this embodiment, and may be arranged freely by matching with other processes.
[0068]
Further, in the embodiment of the present invention, three support pins are provided on the same elevating plate and this elevating plate is moved up and down by one air cylinder. Alternatively, it may be driven by an air cylinder. Here, the drive timings for raising the support pins by the air cylinder need not always be the same.
[0069]
In the embodiment of the present invention, an air cylinder is used as a drive unit for supporting the substrate 2 or moving the support pins 10 up and down in order to avoid interference with the arm 7. For example, the support pin 10 is urged upward to the substantially lower surface position of the substrate 2 by a spring in the concave portion, and the arm 7 enters the concave portion 4A2 from above to urge the support pin 10 to the lower surface of the arm 7. The support pin 10 may be configured to move up and down so as to cause the movement.
[0070]
Although the number of the support pins 10 for supporting the substrate is set to three per recess, the number of support pins 10 may be changed according to the size of the recess, and may be two or less or four or more.
[0071]
Further, in the embodiment of the present invention, the substrate is supported by the plurality of pin members having the end portions of the support pins having a substantially spherical shape. However, the present invention is not limited to the pin members, and for example, a plurality of support pins may be connected. It may be changed to a single kamaboko shape and supported. In this case, since the substrate is supported in a linear shape, the effect of correcting the deflection of the substrate and correcting the inherent warpage of the substrate is further improved as compared with a support member having a point-like supporting end having a curved surface.
[0072]
Further, in the embodiment of the present invention, the case where the substrate on the stage is held by vacuum pressure has been described, but it may be held by another holding method, for example, an electrostatic chuck.
[0073]
Further, in the embodiment of the present invention, two recesses 4A2 are provided in stage 4A as an entry space, but the number is not limited to this, and one or three or more recesses may be provided. The number of recesses may be determined according to the number of arms 7.
[0074]
In the embodiment of the present invention, the loading and unloading of the substrate 2 to and from the stage 4A is performed by the same transfer arm 3, but the loading and unloading of the substrate 2 is performed by separate arms. Is also good.
[0075]
Further, in the embodiment of the present invention, the support pin 10 is moved up and down to support the substrate 2 or to avoid interference with the arm 7, but the movement of the support pin 10 is However, the structure is not limited to this, and the support pin 10 may be slid or rotated in a substantially horizontal direction to retract and enter the recess 4A2.
[0076]
Further, in the above-described embodiment, the recess 4A2, that is, the recess with the bottom is described as the entrance space of the transfer arm 3, but the present invention can be applied to the case without the bottom.
[0077]
【The invention's effect】
As described above, according to the present invention, it is possible to prevent the substrate from bending due to its own weight, and it is possible to form a highly accurate application pattern when used in a paste application operation.
[0078]
[Brief description of the drawings]
FIG. 1 is a schematic perspective view of a stage device and a transfer arm to which the present invention is applied.
FIG. 2 is a sectional view taken along the line AA of FIG. 1;
FIG. 3 is a sectional view taken along the line BB of FIG. 1;
FIG. 4 is a configuration layout diagram of a conventional paste application device.
FIG. 5 is a perspective view of the paste application device shown in FIG.
6 is a schematic perspective view of a stage device and a transfer arm of the paste application device shown in FIG.
FIG. 7 is a schematic cross-sectional view of the stage device taken along the line CC of FIG. 6;
[Explanation of symbols]
1 Supply stand
2 substrate
3 Transfer arm
41 Paste coating device
42 paste application equipment
43 Paste coating device
44 paste application equipment
4A stage
4A1 suction cup
4A2 recess (entrance space)
4A3 receiving surface
4A4 Through hole
4B XY-θ moving mechanism
4B1 Y axis
4B2 X axis
4C table (stand)
4D head mechanism (coating head)
4D1 syringe
4D2 syringe
4D3 CCD camera
4D4 CCD camera
4E controller
4F monitor display
4G keyboard
5 delivery platform
6 Pneumatic control section
7 Arm (substrate holder)
7A suction cup
8A piping
8B piping
9 Drive
10 Support pins (support members)
10A Tip (substrate support)
11 Lifting plate
12 Air cylinder

Claims (6)

A receiving surface on which a substrate held and carried in on the transfer arm is placed, and an entry space formed below a height position of the receiving surface and capable of entering a substrate holding portion for holding the substrate in the transfer arm; In the stage device having
Providing a support member movable in the entrance space,
The support member is located at a retreat position where the substrate holding portion of the transfer arm retreats from the approach path when the substrate holding portion enters the approach space, and the substrate support portion is retracted when the substrate holding portion retreats from the approach space. A stage device positioned at a height position substantially coinciding with the receiving surface and capable of supporting the substrate from below. 2. The stage device according to claim 1, further comprising a drive unit for moving the support member between a retracted position retracted from the approach path and a height position substantially coincident with the receiving surface. The stage device according to claim 1, wherein a tip portion of the support member is formed in a curved shape. The stage device according to any one of claims 1 to 3, wherein the receiving surface includes a plurality of suction plates. A receiving surface on which a substrate held and carried in on the transfer arm is placed, and an entry space formed below a height position of the receiving surface and capable of entering a substrate holding portion for holding the substrate in the transfer arm; A stage device having
An application head for applying paste to the substrate,
By a relative movement between the coating head and the stage device, a paste coating device that applies a paste to the substrate,
Providing a support member movable in the entrance space,
The support member is located at a retreat position where the substrate holding portion of the transfer arm retreats from the approach path when the substrate holding portion enters the approach space, and the substrate support portion is retracted when the substrate holding portion retreats from the approach space. A paste coating device which is positioned at a height position substantially coinciding with the receiving surface and is capable of supporting the substrate from below. A step of moving a carry-in arm into an entrance space formed on a receiving surface and placing a substrate held by the carry-in arm on the receiving surface;
After placing the substrate on the receiving surface, retracting the carry-in arm from the entrance space,
A step of supporting the lower surface of the substrate by a support member movable in the approach space after the carry-in arm has retreated from the approach space;
Applying a paste to the substrate placed on the receiving surface,
Retreating the support member from the entrance space of the carry-in arm after applying the paste,
After the support member is retracted, a step of allowing a carry-out arm to enter the entrance space, and removing the substrate from the receiving surface by the carry-out arm;
A paste application method, comprising:

Images