JP2004319822A

JP2004319822A - Packaging structure of semiconductor

Info

Publication number: JP2004319822A
Application number: JP2003112738A
Authority: JP
Inventors: Yoshiaki Shimizu; 義明清水
Original assignee: Cosel Co Ltd
Current assignee: Cosel Co Ltd
Priority date: 2003-04-17
Filing date: 2003-04-17
Publication date: 2004-11-11
Anticipated expiration: 2023-04-17
Also published as: JP3935100B2

Abstract

<P>PROBLEM TO BE SOLVED: To provide a packaging structure having a large heat radiation effect, easy-to-assemble performance, space saving performance, and small resistance loss or the like. <P>SOLUTION: The packaging structure has a pair of heat radiators 12, 22 having attachments 14, 24 on one-end side of which the heat radiating fins 16, 24 are provided. One or a plurality of semiconductors 32, 36 for a power circuit or the like are installed on the other sides of the attachments 14, 24. The attachments 14, 24 are opposed at predetermined intervals by positioning the fins 16, 24 in an inverse direction, and connection fixed each other by projections 18, 28 for fixing projecting in a direction inverse to the fins 16, 26. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【０００１】
【発明の属する技術分野】
この発明は、電子機器に搭載される比較的発熱の大きい半導体の実装構造に関する。
【０００２】
【従来の技術】
【特許文献１】特開平１１−８９２４８号公報
例えば、電源用の大電力の半導体は、大電流または高電圧がかかるため発熱し、高温となる。そこで、この熱を放散するために、この種の半導体には放熱器が取り付けられている。従来の放熱器は、断面形状が一定のアルミ押出し形材で形成され、例えば図５（ａ），（ｂ）に示すような放熱器１があった。この放熱器１は、複数枚の放熱フィン２が一側面に設けられた板状の取付部３を備えている。そして取付部３には、複数個ここでは２個の半導体４が、ネジ５で取り付けられている。
【０００３】
この他に、一対の取付部がコの字形に一体に形成された放熱器もある。この放熱器は互いに平行な取付部の外側面に、半導体が各々取り付けられているものである。この放熱器は、構造が簡単であるが、放熱フィンがないため放熱性が良くなかった。
【０００４】
また、放熱性に優れ、占有スペースも小さいものとして、図６（ａ），（ｂ）に示すように、放熱器１を一対設ける場合がある。一対の放熱器１は、放熱フィン２が互いに他方の放熱フィン２の隙間に挿入され、一端部でネジ６により固定されている。そして各放熱器１の取付部３に、半導体４が取り付けられている。この一対の放熱器１を組み合わせる構造によれば、占有スペースが小さくしかも放熱効果も高いものとすることができる。
【０００５】
【発明が解決しようとする課題】
上記従来の技術の場合、図５に示す放熱器１は、表面積が広く放熱性が良好であるが、スペースを取り、たくさんの半導体４を取り付ける構造の場合、装置が大きくなるという問題がある。また、強度上プリント基板への機械的固定が難しかった。しかも、放熱フィン２の長さは、ある程度以上長くしても熱の伝速が悪くなり、放熱効果が低くなる。このため放熱効果に限界があった。
【０００６】
また、図６に示すように一対の放熱器１を設けた場合は、取付用の床面を同じにする際、一対の放熱器１の放熱フィン２が互いにぶつからないように互い違いに設ける必要があり、異形状となる。このため、部品管理が面倒であり、コストがかかる。また、放熱フィン２が互いに重ねられている部分に発熱が集中するため、熱の伝速が悪くなり、放熱効果が低くなる。また、電源回路の各半導体４は短距離で接続することがのぞましいが、放熱性を考慮して放熱フィン２を長くすると、半導体４間の距離が長くなり、不要な寄生インダクタンスや漏れインダクタンスが大きくなり、また占有スペースも大きくなる。また半導体４からの出力電流経路も大きくなり、抵抗成分が増加する。
【０００７】
この発明は、上記従来の問題点に鑑みてなされたものであり、組み立てが容易であり、放熱効果が大きく、省スペースであり、抵抗損失等も少ない半導体の実装構造を提供することを目的とする。
【０００８】
【課題を解決するための手段】
この発明は、放熱フィンが一側面に設けられた取付部を有するアルミ押出形材による一対の放熱器を有し、上記取付部の他方の側面に電源回路用等の半導体が各々一または複数取り付けられ、上記放熱フィンを互いに反対方向に位置させて上記取付部同士を所定間隔空けて対面させて互いに連結して成る半導体の実装構造である。
【０００９】
また、上記一対の放熱器は、上記取付部の上記放熱フィンと反対の側面に上記放熱フィンとは反対方向に突出した固定用突起が形成され、上記固定用突起同士を重ねて連結手段で連結されている半導体の実装構造である。
【００１０】
さらに、上記放熱器の上記取付部には、上記放熱フィンと反対の側面に断面Ｌ字形の銅板等の保持部材が取り付けられ、上記保持部材の折れ目から一方は上記取付部に重ねて取り付け固定される固定部であり、他方は上記取付部から略直角に立設される連結部であり、上記一対の保持部材の上記連結部同士が連結手段により連結されている半導体の実装構造である。
【００１１】
【発明の実施の形態】
以下、この発明の実施形態について図面に基づいて説明する。図１（ａ），（ｂ）、図２は、この発明の第一実施形態を示すものであり、この実施形態の半導体の実装構造１０は、図１に示す第一放熱器１２を備えている。第一放熱器１２はアルミ押出形材であり、後述する第一半導体３２が取り付けられる平坦な板状の取付部１４が設けられている。取付部１４の一方の側面１４ａには、取付部１４に対してほぼ直角に側方へ突出する放熱フィン１６が一体に設けられている。放熱フィン１６は、複数枚、ここでは５枚設けられ、互いに平行に位置して設けられている。取付部１４の放熱フィン１６と反対側の側面１４ｂには、第一放熱器１２の上端部１２ａの延長上に、放熱フィン１６とは反対側に突出する板状のネジ固定用突起１８が設けられている。ネジ固定用突起１８は、放熱フィン１６とほぼ平行であり、中央に透孔２０が形成されている。
【００１２】
第一放熱器１２に対向して第二放熱器２２が設けられている。第二放熱器２２は、図２に示すように、第一放熱器１２と同様に取付部２４と、取付部２４の一方の面２４ａに対してほぼ直角に側方へ突出する放熱フィン２６が設けられている。放熱フィン２６は、複数枚、ここでは５枚設けられ、互いに平行に位置して設けられている。取付部２４の放熱フィン２６と反対側の側面２４ｂには、取付部２４の上端部２２ａより少し内側に、放熱フィン２６とは反対側に突出する板状のネジ固定用突起２８が設けられている。ネジ固定用突起２８は、放熱フィン２６とほぼ平行であり、中央に雌ねじのネジ穴３０が形成されている。
【００１３】
第一放熱器１２の取付部１４のほぼ中央部にはネジ穴１５が形成され、側面１４ｂには、第一半導体３２がネジ穴１５にネジ３４で固定されている。第二放熱器２２の取付部２４のほぼ中央部にはネジ穴２５が形成され、側面２４ｂにも、第二半導体３６がネジ穴２５にネジ３８で固定されている。
【００１４】
この実施形態の半導体の実装構造１０の組み立ては、先ず、第一放熱器１２と第二放熱器２２に、各第一半導体３２と第二半導体３６を、ネジ３４，３６で各々取り付ける。そして、第一放熱器１２のネジ固定用突起１８と、第二放熱器２２のネジ固定用突起２８を重ね、透孔２０とネジ穴３０を一致させる。このとき、第二放熱器２２のネジ固定用突起２８は、取付部２４の上端部２４ａよりも内側に位置しているため、第一放熱器１２と第二放熱器２２の上端１２ａ，２２ａは同じ高さに位置する。そして、第一放熱器１２のネジ固定用突起１８の外側に、銅板で作られた出力端子４０が重ねられる。出力端子４０には、ネジ用の透孔４２が設けられ、透孔４２にネジ４４を入れて、さらに透孔２０を経てネジ穴３０にネジ４４を螺合し固定される。
【００１５】
この実施形態の半導体の実装構造１０によれば、一対の放熱フィン１６，２６が設けられ表面積が広く、互いに外側を向いているため、効率よく放熱することができる。また、第一半導体３２と第二半導体３６の間隔が短く、漏れインダクタンス等を押さえ電源装置としての効率が良好となる。さらに、スペースを大きく取らずに、放熱性を向上させることができ、製品の小型化にも寄与する。また、組立や機械的固定が容易である。また、回路の電流経路が短くなり、電流ラインの等価直列抵抗による電力ロスを低減することができる。回路がスイッチ動作したとき、寄生インダクタンスによるサージ電圧・電流の発生を防ぎ、ノイズ、損失を低減することができる。
【００１６】
次にこの発明の第二実施形態について図３に基づいて説明する。ここで、上記実施形態と同様の構成は同一符号を付して説明を省略する。この実施形態の半導体の実装構造４６は、第一放熱器４８、第二放熱器６２を備えている。第一放熱器４８は、アルミ押出し形材であり、第一半導体３２が取り付けられる平坦な板状の取付部５０が設けられている。取付部５０の一方の側面５０ａには、板状の放熱フィン５４が複数枚、ここでは５枚設けられ、互いに平行に位置して設けられている。取付部５０の放熱フィン５４が位置しない所定位置にはネジ穴５２が設けられている。
【００１７】
取付部５０の、放熱フィン５４と反対側の側面５０ｂには、銅板をＬ字形に折り曲げた保持部材５６が樹脂製の絶縁シート５１を介して設けられている。保持部材５６の折れ目から一方は、取付部５０の側面５０ｂに重ねて取り付けられる固定部５６ａである。固定部５６ａには、第一放熱器４８の透孔５２に一致する透孔５８が形成されている。保持部材５６の折れ目から他方は、取付部５０の側面５０ｂから略直角に立設される連結部５６ｂである。連結面５６ｂには、透孔６０が形成されている。
【００１８】
保持部材５６の取付面５６ａの内側には第一半導体３２が取り付けられている。このとき、第一半導体３２にネジ６１が挿し込まれてネジ６１は透孔５８を通過してネジ穴５２に螺合され固定されている。このとき、保持部材５６の連結部５６ｂは、第一放熱器４８の上端部４８ａよりも少し内側に位置している。
【００１９】
さらに、第一放熱器４８に対向して、第二放熱器６２が設けられている。第二放熱器６２は、第一放熱器４８と同じ形状であり、取付部６４と放熱フィン６６が設けられている。取付部６４の所定位置には、ネジ穴６８が設けられている。
【００２０】
取付部６４の、放熱フィン６６と反対側の側面６４ｂには、銅板をＬ字形に折り曲げた保持部材７０が樹脂製の絶縁シート７１を介して設けられている。保持部材７０の折れ目から一方は、取付部６４の側面６４ｂに重ねて取り付けられる固定部７０ａである。固定部７０ａには、第二放熱器６２の透孔６８に一致する透孔７２が形成されている。保持部材７０の折れ目から他方は、取付部６４の側面６４ｂから略直角に立設される連結部７０ｂである。連結部７０ｂには、透孔７４が形成されている。
【００２１】
保持部材７０の固定部７０ａの内側には第二半導体３６が取り付けられている。このとき、第二半導体３６にネジ７５が挿し込まれてネジ７５は透孔７２を通過してネジ穴６８に螺合されている。このとき、保持部材７０の固定部７０ａは、第二放熱器６２の上端部４６ａのほぼ延長線上に設けられている。
【００２２】
この実施形態の半導体の実装構造４６の組み立ては、先ず、保持部材５６，７０に、各々第一半導体３２と第二半導体３６を、絶縁シート５１，７１を介してネジ６１，７５で各々取り付ける。この後、第一放熱器４８の保持部材５６の連結部５６ｂと、第二放熱器６２の保持部材７０の連結部７０ｂが重ねられ、透孔６０，７４を一致させる。このとき、第一放熱器４８の保持部材５６の連結部５６ｂは、第二放熱器６２の保持部材７０の連結部７０ｂよりも内側に位置しているため、第一放熱器４８と第二放熱器６２は同じ高さに位置する。なお、保持部材５６，７０を共通にしても良い。そして、第一放熱器４８の保持部材５６の連結部５６ｂの内側には、銅板で作られた出力端子７６が重ねられる。出力端子７６には、透孔６０，７４に一致するネジ穴７８が設けられ、透孔６０，７４にネジ８０を入れて出力端子４０のネジ穴７８に螺合して、一体に固定する。
【００２３】
この実施形態の半導体の実装構造４６によれば、上記実施の形態と同様の効果を有するものである。第一放熱器４８と第二放熱器６２、及び保持部材５６，７０が同じ形状でも良いため、部品を共有することができ、部品管理が容易となる。また、組み立てにおいても、第一放熱器４８、保持部材５６及び第一半導体３２を組み立て、さらに、第二放熱器６２、保持部材７０及び第二半導体３６を組み立てた後、この組み立てたもの同士を連結部５６ｂ，７０ｂを重ねてネジ８０で固定するれば良く、機械的固定を比較的簡単に行うことができる。
【００２４】
なお、この実施形態の半導体の実装構造４６は、第一放熱器４８、第二放熱器６２と、それぞれに取り付けられる保持部５６，７０との各取り付け方向を、設置場所の高さの制限などに合わせて変更する事もできる。例えば、図４（ａ），（ｂ）に示すように、保持部５６，７０の連結部５６ｂ，７０ｂが、放熱フィン５４，６６の面に対してほぼ直角に位置する向きに取り付けても良い。これにより、高さを抑えた配置に組み上げることができる。
【００２５】
また、この発明は上記各実施形態に限定されるものではなく、各放熱器に取り付けられる半導体の数や種類、出力端子の素材など自由に変更可能である。放熱器の放熱フィンの数や大きさ、厚みなど、自由に変更可能である。
【００２６】
【発明の効果】
この発明の半導体の実装構造によれば、放熱効果が大きく、しかも装置の小型化に寄与し、各部材の組立が容易である。また、半導体同士の間隔を狭くすることができ、等価直列抵抗による電力ロスを抑えることができる。
【００２７】
従って、この実装構造を電源装置に用いた場合、電源効率を高めることができる。さらに、電源回路の寄生インダクタンスやサージ電圧・電流の発生を抑え、ノイズや損失の低減にも寄与する。
【図面の簡単な説明】
【図１】この発明の第一実施形態の半導体の実装構造の正面図（ａ）と右側面図（ｂ）である。
【図２】この実施形態の半導体の実装構造の放熱器の斜視図である。
【図３】この発明の第二実施形態の半導体の実装構造の正面図（ａ）と右側面図（ｂ）である。
【図４】この実施形態の半導体の実装構造の変形例を示す上面図（ａ）と正面図（ｂ）である。
【図５】従来の技術の半導体の実装構造の正面図（ａ）と右側面図（ｂ）である。
【図６】従来の技術の半導体の実装構造の正面図（ａ）と右側面図（ｂ）である。
【符号の説明】
１０半導体の実装構造
１２第一放熱器
１４，２４取付部
１６，２６放熱フィン
１８，２８ネジ固定用突起
２０透孔
１５，２５，３０ネジ穴
２２第二放熱器
３２第一半導体
３４，３８，４４ネジ
３６第二半導体
４０出力端子[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a mounting structure of a semiconductor which generates relatively large heat and is mounted on an electronic device.
[0002]
[Prior art]
[Patent Document 1] Japanese Patent Application Laid-Open No. H11-89248 For example, a high-power semiconductor for a power supply generates heat due to a large current or a high voltage applied thereto, resulting in high temperature. In order to dissipate this heat, a radiator is attached to this type of semiconductor. A conventional radiator is formed of an extruded aluminum material having a constant cross-sectional shape. For example, there is a radiator 1 as shown in FIGS. 5 (a) and 5 (b). The radiator 1 includes a plate-shaped mounting portion 3 in which a plurality of radiating fins 2 are provided on one side. A plurality of semiconductors 4, here two semiconductors 4, are attached to the attachment portion 3 with screws 5.
[0003]
In addition, there is a radiator in which a pair of mounting portions are integrally formed in a U-shape. In this radiator, semiconductors are mounted on outer surfaces of mounting portions parallel to each other. Although this radiator has a simple structure, it does not have good heat radiation because of no radiating fins.
[0004]
Further, as shown in FIGS. 6A and 6B, a pair of radiators 1 may be provided, assuming that the radiator 1 is excellent in heat radiation and occupies a small space. In the pair of radiators 1, the radiating fins 2 are inserted into gaps between the other radiating fins 2, and are fixed at one end by screws 6. The semiconductor 4 is attached to the attachment portion 3 of each radiator 1. According to the structure in which the pair of radiators 1 are combined, the occupied space is small and the heat radiation effect is high.
[0005]
[Problems to be solved by the invention]
In the case of the above-mentioned conventional technique, the radiator 1 shown in FIG. 5 has a large surface area and good heat dissipation, but in the case of a structure in which space is taken and many semiconductors 4 are attached, there is a problem that the device becomes large. In addition, mechanical fixing to the printed circuit board was difficult due to its strength. Moreover, even if the length of the radiating fins 2 is increased to a certain extent or more, the heat transmission becomes poor, and the heat radiation effect is reduced. For this reason, the heat radiation effect has a limit.
[0006]
When a pair of radiators 1 are provided as shown in FIG. 6, when the mounting floor surfaces are the same, the radiator fins 2 of the pair of radiators 1 need to be provided alternately so as not to hit each other. Yes, it has a different shape. Therefore, parts management is troublesome and costly. In addition, since heat is concentrated on the portion where the radiating fins 2 are overlapped with each other, the heat transfer speed is deteriorated, and the heat radiation effect is reduced. It is desirable that the semiconductors 4 in the power supply circuit be connected in a short distance. However, if the heat radiation fins 2 are made longer in consideration of heat radiation, the distance between the semiconductors 4 becomes longer, and unnecessary parasitic inductance and leakage inductance increase. And the occupied space also increases. In addition, the output current path from the semiconductor 4 also increases, and the resistance component increases.
[0007]
The present invention has been made in view of the above-mentioned conventional problems, and has as its object to provide a semiconductor mounting structure that is easy to assemble, has a large heat dissipation effect, is space-saving, and has low resistance loss and the like. I do.
[0008]
[Means for Solving the Problems]
The present invention has a pair of radiators made of extruded aluminum having a mounting portion provided with a radiating fin on one side, and one or more semiconductors for a power supply circuit or the like are mounted on the other side of the mounting portion. A semiconductor mounting structure in which the radiating fins are located in opposite directions to each other and the mounting portions are opposed to each other with a predetermined space therebetween and connected to each other.
[0009]
Further, the pair of radiators are formed with fixing projections protruding in a direction opposite to the heat radiation fins on a side surface of the mounting portion opposite to the heat radiation fins, and the fixing protrusions are overlapped and connected by a connecting means. This is a semiconductor mounting structure.
[0010]
Further, a holding member such as a copper plate having an L-shaped cross section is attached to the mounting portion of the radiator on a side opposite to the radiation fin, and one of the holding members is attached to and fixed to the mounting portion from a fold of the holding member. The other is a connecting portion which stands upright at a substantially right angle from the mounting portion, and has a semiconductor mounting structure in which the connecting portions of the pair of holding members are connected by connecting means.
[0011]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIGS. 1A, 1B and 2 show a first embodiment of the present invention. A semiconductor mounting structure 10 of this embodiment includes a first radiator 12 shown in FIG. I have. The first radiator 12 is an extruded aluminum member, and is provided with a flat plate-shaped mounting portion 14 to which a first semiconductor 32 described later is mounted. On one side surface 14a of the mounting portion 14, a radiating fin 16 that projects laterally at substantially right angles to the mounting portion 14 is integrally provided. A plurality of radiating fins 16, here five radiating fins 16, are provided in parallel with each other. On the side surface 14b of the mounting portion 14 opposite to the heat radiating fins 16, a plate-shaped screw fixing projection 18 protruding on the side opposite to the heat radiating fins 16 is provided on an extension of the upper end 12a of the first radiator 12. Have been. The screw fixing projection 18 is substantially parallel to the radiation fin 16 and has a through hole 20 formed at the center.
[0012]
A second radiator 22 is provided to face the first radiator 12. As shown in FIG. 2, the second radiator 22 includes a mounting portion 24 and radiating fins 26 projecting laterally at substantially right angles to one surface 24 a of the mounting portion 24, similarly to the first radiator 12. Is provided. A plurality of radiation fins 26, here five, are provided, and are provided in parallel with each other. On a side surface 24b of the mounting portion 24 opposite to the heat radiation fin 26, a plate-like screw fixing projection 28 is provided slightly inside the upper end portion 22a of the mounting portion 24 and protrudes to the side opposite to the heat radiation fin 26. I have. The screw fixing projection 28 is substantially parallel to the radiation fin 26, and has a female screw hole 30 formed in the center.
[0013]
A screw hole 15 is formed substantially at the center of the mounting portion 14 of the first radiator 12, and a first semiconductor 32 is fixed to the screw hole 15 with a screw 34 on the side surface 14b. A screw hole 25 is formed substantially at the center of the mounting portion 24 of the second radiator 22, and a second semiconductor 36 is also fixed to the screw hole 25 with a screw 38 on the side surface 24b.
[0014]
In assembling the semiconductor mounting structure 10 of this embodiment, first, the first semiconductor 32 and the second semiconductor 36 are attached to the first radiator 12 and the second radiator 22 by screws 34, 36, respectively. Then, the screw fixing projection 18 of the first radiator 12 and the screw fixing projection 28 of the second radiator 22 are overlapped, and the through hole 20 and the screw hole 30 are aligned. At this time, since the screw fixing protrusion 28 of the second radiator 22 is located inside the upper end 24a of the mounting portion 24, the upper ends 12a and 22a of the first radiator 12 and the second radiator 22 are connected. Located at the same height. Then, an output terminal 40 made of a copper plate is superimposed on the outside of the screw fixing projection 18 of the first radiator 12. The output terminal 40 is provided with a screw through-hole 42. A screw 44 is inserted into the through-hole 42, and the screw 44 is screwed into the screw hole 30 through the through-hole 20 and fixed.
[0015]
According to the semiconductor mounting structure 10 of this embodiment, since a pair of heat radiation fins 16 and 26 are provided and the surface area is large and they face each other, heat can be efficiently radiated. Further, the distance between the first semiconductor 32 and the second semiconductor 36 is short, and the leakage inductance and the like are suppressed, and the efficiency as the power supply device is improved. Furthermore, heat dissipation can be improved without taking up a large space, which contributes to downsizing of the product. Also, assembly and mechanical fixing are easy. Further, the current path of the circuit is shortened, and power loss due to the equivalent series resistance of the current line can be reduced. When the circuit operates as a switch, generation of surge voltage and current due to parasitic inductance can be prevented, and noise and loss can be reduced.
[0016]
Next, a second embodiment of the present invention will be described with reference to FIG. Here, the same components as those in the above embodiment are denoted by the same reference numerals, and description thereof is omitted. The semiconductor mounting structure 46 of this embodiment includes a first radiator 48 and a second radiator 62. The first radiator 48 is an extruded aluminum member, and is provided with a flat plate-shaped mounting portion 50 to which the first semiconductor 32 is mounted. On one side surface 50a of the mounting portion 50, a plurality of plate-shaped heat radiation fins 54, here five, are provided and provided in parallel with each other. A screw hole 52 is provided at a predetermined position of the mounting portion 50 where the radiation fin 54 is not located.
[0017]
A holding member 56 formed by bending a copper plate into an L-shape is provided on a side surface 50 b of the mounting portion 50 opposite to the heat radiation fin 54 via an insulating sheet 51 made of resin. One of the folds of the holding member 56 is a fixing portion 56a that is mounted on the side surface 50b of the mounting portion 50 so as to overlap. In the fixing portion 56a, a through hole 58 that matches the through hole 52 of the first radiator 48 is formed. The other from the fold of the holding member 56 is a connecting portion 56b that stands substantially perpendicularly from the side surface 50b of the mounting portion 50. A through hole 60 is formed in the connection surface 56b.
[0018]
The first semiconductor 32 is mounted inside the mounting surface 56 a of the holding member 56. At this time, the screw 61 is inserted into the first semiconductor 32, passes through the through hole 58, and is screwed and fixed to the screw hole 52. At this time, the connecting portion 56b of the holding member 56 is located slightly inside the upper end portion 48a of the first radiator 48.
[0019]
Further, a second radiator 62 is provided to face the first radiator 48. The second radiator 62 has the same shape as the first radiator 48, and is provided with a mounting portion 64 and a radiating fin 66. At a predetermined position of the mounting portion 64, a screw hole 68 is provided.
[0020]
A holding member 70 formed by bending a copper plate into an L-shape is provided on a side surface 64 b of the mounting portion 64 opposite to the heat radiation fin 66 via an insulating sheet 71 made of resin. One of the folds of the holding member 70 is a fixing portion 70a that is mounted on the side surface 64b of the mounting portion 64 so as to overlap. The fixing portion 70a has a through hole 72 that matches the through hole 68 of the second radiator 62. The other part from the fold of the holding member 70 is a connecting part 70 b that stands substantially perpendicularly from the side surface 64 b of the mounting part 64. A through hole 74 is formed in the connecting portion 70b.
[0021]
The second semiconductor 36 is mounted inside the fixing portion 70a of the holding member 70. At this time, the screw 75 is inserted into the second semiconductor 36, and the screw 75 passes through the through hole 72 and is screwed into the screw hole 68. At this time, the fixing portion 70a of the holding member 70 is provided substantially on the extension of the upper end 46a of the second radiator 62.
[0022]
In assembling the semiconductor mounting structure 46 of this embodiment, first, the first semiconductor 32 and the second semiconductor 36 are attached to the holding members 56 and 70 via the insulating sheets 51 and 71 with screws 61 and 75, respectively. Thereafter, the connecting portion 56b of the holding member 56 of the first radiator 48 and the connecting portion 70b of the holding member 70 of the second radiator 62 are overlapped, and the through holes 60 and 74 are aligned. At this time, since the connecting portion 56b of the holding member 56 of the first radiator 48 is located inside the connecting portion 70b of the holding member 70 of the second radiator 62, the first radiator 48 and the second radiator The vessel 62 is located at the same height. Note that the holding members 56 and 70 may be common. Then, an output terminal 76 made of a copper plate is superimposed on the inside of the connecting portion 56b of the holding member 56 of the first radiator 48. The output terminal 76 is provided with a screw hole 78 corresponding to the through holes 60 and 74, and a screw 80 is inserted into the through holes 60 and 74 and screwed into the screw hole 78 of the output terminal 40 to be integrally fixed.
[0023]
According to the semiconductor mounting structure 46 of this embodiment, the same effects as those of the above embodiment can be obtained. Since the first radiator 48, the second radiator 62, and the holding members 56 and 70 may have the same shape, components can be shared, and component management becomes easy. Also, in assembling, after assembling the first radiator 48, the holding member 56, and the first semiconductor 32, further assembling the second radiator 62, the holding member 70, and the second semiconductor 36, the assembled members are combined. It is sufficient that the connecting portions 56b and 70b are overlapped and fixed with the screw 80, and mechanical fixing can be performed relatively easily.
[0024]
In the semiconductor mounting structure 46 of this embodiment, the mounting directions of the first radiator 48, the second radiator 62, and the holding portions 56 and 70 attached to the first radiator 48 and the second radiator 62 are limited. It can be changed to match. For example, as shown in FIGS. 4 (a) and 4 (b), the connecting portions 56b and 70b of the holding portions 56 and 70 may be mounted in a direction substantially perpendicular to the surfaces of the radiation fins 54 and 66. . This makes it possible to assemble the arrangement with a reduced height.
[0025]
The present invention is not limited to the above embodiments, and the number and type of semiconductors attached to each radiator, the material of the output terminal, and the like can be freely changed. The number, size, thickness, etc. of the radiation fins of the radiator can be freely changed.
[0026]
【The invention's effect】
ADVANTAGE OF THE INVENTION According to the semiconductor mounting structure of this invention, the heat dissipation effect is large, it contributes to size reduction of an apparatus, and assembly of each member is easy. Further, the distance between semiconductors can be reduced, and power loss due to equivalent series resistance can be suppressed.
[0027]
Therefore, when this mounting structure is used in a power supply device, power supply efficiency can be improved. Furthermore, the generation of the parasitic inductance of the power supply circuit and the surge voltage / current is suppressed, which contributes to the reduction of noise and loss.
[Brief description of the drawings]
FIG. 1 is a front view (a) and a right side view (b) of a semiconductor mounting structure according to a first embodiment of the present invention.
FIG. 2 is a perspective view of a radiator having a semiconductor mounting structure of the embodiment.
3A and 3B are a front view and a right side view of a semiconductor mounting structure according to a second embodiment of the present invention.
FIGS. 4A and 4B are a top view and a front view, respectively, showing a modification of the semiconductor mounting structure of the embodiment.
5A and 5B are a front view and a right side view of a conventional semiconductor mounting structure.
FIG. 6 is a front view (a) and a right side view (b) of a conventional semiconductor mounting structure.
[Explanation of symbols]
Reference Signs List 10 semiconductor mounting structure 12 first radiators 14, 24 mounting portions 16, 26 radiating fins 18, 28 screw fixing projections 20 through holes 15, 25, 30 screw holes 22 second radiator 32 first semiconductors 34, 38, 44 screw 36 second semiconductor 40 output terminal

Claims

A pair of radiators having a mounting portion provided with a radiating fin on one side, a semiconductor mounted on the other side surface of the mounting portion, and the radiating fins positioned in opposite directions to each other to form the mounting portions; Characterized in that they are connected to each other by facing each other at predetermined intervals.

The pair of radiators are formed with fixing projections protruding in a direction opposite to the radiating fins on a side of the mounting portion opposite to the radiating fins, and the fixing projections are overlapped and connected by a connecting means. The semiconductor mounting structure according to claim 1, wherein:

On the mounting portion of the radiator, a holding member having an L-shaped cross section is mounted on the side opposite to the heat radiation fin, and one of the folds of the holding member is a fixing portion that is mounted and fixed on the mounting portion. 2. The semiconductor device according to claim 1, wherein the other is a connecting portion that stands substantially at a right angle from the mounting portion, and the connecting portions of the pair of holding members are connected by connecting means. Mounting structure.