JP2004260146A5 - - Google Patents

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Publication number
JP2004260146A5
JP2004260146A5 JP2004025132A JP2004025132A JP2004260146A5 JP 2004260146 A5 JP2004260146 A5 JP 2004260146A5 JP 2004025132 A JP2004025132 A JP 2004025132A JP 2004025132 A JP2004025132 A JP 2004025132A JP 2004260146 A5 JP2004260146 A5 JP 2004260146A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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JP2004025132A
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Japanese (ja)
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JP2004260146A (ja
JP4543688B2 (ja
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Priority to JP2004025132A priority Critical patent/JP4543688B2/ja
Priority claimed from JP2004025132A external-priority patent/JP4543688B2/ja
Publication of JP2004260146A publication Critical patent/JP2004260146A/ja
Publication of JP2004260146A5 publication Critical patent/JP2004260146A5/ja
Application granted granted Critical
Publication of JP4543688B2 publication Critical patent/JP4543688B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2004025132A 2003-02-04 2004-02-02 回路基板の製造方法および製造装置 Expired - Fee Related JP4543688B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004025132A JP4543688B2 (ja) 2003-02-04 2004-02-02 回路基板の製造方法および製造装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003026797 2003-02-04
JP2004025132A JP4543688B2 (ja) 2003-02-04 2004-02-02 回路基板の製造方法および製造装置

Publications (3)

Publication Number Publication Date
JP2004260146A JP2004260146A (ja) 2004-09-16
JP2004260146A5 true JP2004260146A5 (nl) 2007-03-01
JP4543688B2 JP4543688B2 (ja) 2010-09-15

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ID=33133646

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004025132A Expired - Fee Related JP4543688B2 (ja) 2003-02-04 2004-02-02 回路基板の製造方法および製造装置

Country Status (1)

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JP (1) JP4543688B2 (nl)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5130803B2 (ja) * 2007-07-03 2013-01-30 日本電気株式会社 配線基板複合体
KR101311652B1 (ko) * 2009-02-06 2013-09-25 아사히 가라스 가부시키가이샤 전자 디바이스의 제조 방법 및 이것에 이용하는 박리 장치
JP6034669B2 (ja) * 2012-11-19 2016-11-30 モレックス エルエルシー シート搬送装置
CN103456689B (zh) * 2013-08-13 2015-02-25 京东方科技集团股份有限公司 用于将柔性基板与玻璃基板分离的装置及生产设备
KR102076054B1 (ko) * 2015-06-09 2020-02-11 로욜 코포레이션 플렉서블 전자 장치 제조 장치
WO2017115486A1 (ja) * 2015-12-29 2017-07-06 鴻海精密工業股▲ふん▼有限公司 樹脂フィルムの剥離方法及び装置、電子デバイスの製造方法並びに有機el表示装置の製造方法
US10847758B2 (en) 2015-12-29 2020-11-24 Hon Hai Precision Industry Co., Ltd. Method for releasing resin film and method for manufacturing organic EL display device
JP2017188395A (ja) * 2016-04-08 2017-10-12 株式会社半導体エネルギー研究所 積層体の加工装置および加工方法
US10804407B2 (en) 2016-05-12 2020-10-13 Semiconductor Energy Laboratory Co., Ltd. Laser processing apparatus and stack processing apparatus
CN110611051B (zh) * 2018-06-15 2024-07-16 京东方科技集团股份有限公司 电子装置的制备方法、电子装置及其制备工具

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5518828Y2 (nl) * 1975-01-17 1980-05-02
JPS566448Y2 (nl) * 1977-11-28 1981-02-12
JPH0453020Y2 (nl) * 1987-09-24 1992-12-14
JPH05319675A (ja) * 1992-05-25 1993-12-03 Matsushita Electric Works Ltd 表面シート材の剥離方法
JPH07215577A (ja) * 1994-01-31 1995-08-15 Canon Inc 部品の剥離方法
JP3552274B2 (ja) * 1994-05-20 2004-08-11 ソニーケミカル株式会社 シート状接着材の剥離フィルムの剥離方法及び剥離装置
JPH09309664A (ja) * 1996-05-20 1997-12-02 Sony Corp 保護シートの剥離方法及びそれに用いられる剥離装置
JP2001210998A (ja) * 2000-01-21 2001-08-03 Denso Corp フレキシブル基板の実装方法とそれに使用する補強板
JP2002104726A (ja) * 2000-09-26 2002-04-10 Ricoh Co Ltd 軟弱部材剥離装置
JP3813434B2 (ja) * 2000-10-31 2006-08-23 シャープ株式会社 基板剥離装置および基板剥離方法
JP4201513B2 (ja) * 2001-09-28 2008-12-24 株式会社リコー 粘着部品の剥離工具と剥離方法及び剥離装置

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