JP2004241760A5 - - Google Patents
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- Publication number
- JP2004241760A5 JP2004241760A5 JP2003399572A JP2003399572A JP2004241760A5 JP 2004241760 A5 JP2004241760 A5 JP 2004241760A5 JP 2003399572 A JP2003399572 A JP 2003399572A JP 2003399572 A JP2003399572 A JP 2003399572A JP 2004241760 A5 JP2004241760 A5 JP 2004241760A5
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- substrate
- solution
- dots
- discharge port
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000243 solution Substances 0.000 claims 35
- 239000000758 substrate Substances 0.000 claims 34
- 239000010419 fine particle Substances 0.000 claims 22
- 238000002347 injection Methods 0.000 claims 12
- 239000007924 injection Substances 0.000 claims 12
- 238000004519 manufacturing process Methods 0.000 claims 10
- 239000007787 solid Substances 0.000 claims 7
- 239000007788 liquid Substances 0.000 claims 5
- 239000000463 material Substances 0.000 claims 4
- 238000005507 spraying Methods 0.000 claims 3
- 239000004020 conductor Substances 0.000 claims 2
- 239000002245 particle Substances 0.000 claims 2
- 238000011144 upstream manufacturing Methods 0.000 claims 2
- 229960001716 benzalkonium Drugs 0.000 claims 1
- CYDRXTMLKJDRQH-UHFFFAOYSA-N benzododecinium Chemical compound CCCCCCCCCCCC[N+](C)(C)CC1=CC=CC=C1 CYDRXTMLKJDRQH-UHFFFAOYSA-N 0.000 claims 1
- 238000006073 displacement reaction Methods 0.000 claims 1
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003399572A JP4312036B2 (ja) | 2003-01-17 | 2003-11-28 | 溶液噴射型製造装置、微粒子含有溶液、パターン配線基板及びデバイス基板 |
| US10/758,398 US7380690B2 (en) | 2003-01-17 | 2004-01-15 | Solution jet type fabrication apparatus, method, solution containing fine particles, wiring pattern substrate, device substrate |
| US11/590,580 US20070044589A1 (en) | 2003-01-17 | 2006-10-30 | Solution jet type fabrication apparatus, method, solution containing fine particles, wiring pattern substrate, device substrate |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003009108 | 2003-01-17 | ||
| JP2003399572A JP4312036B2 (ja) | 2003-01-17 | 2003-11-28 | 溶液噴射型製造装置、微粒子含有溶液、パターン配線基板及びデバイス基板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004241760A JP2004241760A (ja) | 2004-08-26 |
| JP2004241760A5 true JP2004241760A5 (https=) | 2006-06-15 |
| JP4312036B2 JP4312036B2 (ja) | 2009-08-12 |
Family
ID=32964807
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003399572A Expired - Fee Related JP4312036B2 (ja) | 2003-01-17 | 2003-11-28 | 溶液噴射型製造装置、微粒子含有溶液、パターン配線基板及びデバイス基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4312036B2 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3478034A4 (en) * | 2016-06-28 | 2019-07-03 | Fuji Corporation | SWITCHING PROCESS |
| CN117896903B (zh) * | 2024-02-01 | 2024-08-13 | 深圳市得鑫自动化设备有限公司 | 一种pcb板定位装置及喷锡机 |
-
2003
- 2003-11-28 JP JP2003399572A patent/JP4312036B2/ja not_active Expired - Fee Related
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