JP4312036B2 - 溶液噴射型製造装置、微粒子含有溶液、パターン配線基板及びデバイス基板 - Google Patents

溶液噴射型製造装置、微粒子含有溶液、パターン配線基板及びデバイス基板 Download PDF

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Publication number
JP4312036B2
JP4312036B2 JP2003399572A JP2003399572A JP4312036B2 JP 4312036 B2 JP4312036 B2 JP 4312036B2 JP 2003399572 A JP2003399572 A JP 2003399572A JP 2003399572 A JP2003399572 A JP 2003399572A JP 4312036 B2 JP4312036 B2 JP 4312036B2
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Prior art keywords
pattern
solution
substrate
flexible substrate
discharge port
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Expired - Fee Related
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JP2003399572A
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Japanese (ja)
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JP2004241760A5 (https=
JP2004241760A (ja
Inventor
卓朗 関谷
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Ricoh Co Ltd
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Ricoh Co Ltd
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Priority to JP2003399572A priority Critical patent/JP4312036B2/ja
Priority to US10/758,398 priority patent/US7380690B2/en
Publication of JP2004241760A publication Critical patent/JP2004241760A/ja
Publication of JP2004241760A5 publication Critical patent/JP2004241760A5/ja
Priority to US11/590,580 priority patent/US20070044589A1/en
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Publication of JP4312036B2 publication Critical patent/JP4312036B2/ja
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Expired - Fee Related legal-status Critical Current

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  • Ink Jet (AREA)
  • Coating Apparatus (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2003399572A 2003-01-17 2003-11-28 溶液噴射型製造装置、微粒子含有溶液、パターン配線基板及びデバイス基板 Expired - Fee Related JP4312036B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2003399572A JP4312036B2 (ja) 2003-01-17 2003-11-28 溶液噴射型製造装置、微粒子含有溶液、パターン配線基板及びデバイス基板
US10/758,398 US7380690B2 (en) 2003-01-17 2004-01-15 Solution jet type fabrication apparatus, method, solution containing fine particles, wiring pattern substrate, device substrate
US11/590,580 US20070044589A1 (en) 2003-01-17 2006-10-30 Solution jet type fabrication apparatus, method, solution containing fine particles, wiring pattern substrate, device substrate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003009108 2003-01-17
JP2003399572A JP4312036B2 (ja) 2003-01-17 2003-11-28 溶液噴射型製造装置、微粒子含有溶液、パターン配線基板及びデバイス基板

Publications (3)

Publication Number Publication Date
JP2004241760A JP2004241760A (ja) 2004-08-26
JP2004241760A5 JP2004241760A5 (https=) 2006-06-15
JP4312036B2 true JP4312036B2 (ja) 2009-08-12

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JP2003399572A Expired - Fee Related JP4312036B2 (ja) 2003-01-17 2003-11-28 溶液噴射型製造装置、微粒子含有溶液、パターン配線基板及びデバイス基板

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JP (1) JP4312036B2 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3478034A4 (en) * 2016-06-28 2019-07-03 Fuji Corporation SWITCHING PROCESS
CN117896903B (zh) * 2024-02-01 2024-08-13 深圳市得鑫自动化设备有限公司 一种pcb板定位装置及喷锡机

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JP2004241760A (ja) 2004-08-26

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