JP2004239698A - Flow measuring system - Google Patents

Flow measuring system Download PDF

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Publication number
JP2004239698A
JP2004239698A JP2003027755A JP2003027755A JP2004239698A JP 2004239698 A JP2004239698 A JP 2004239698A JP 2003027755 A JP2003027755 A JP 2003027755A JP 2003027755 A JP2003027755 A JP 2003027755A JP 2004239698 A JP2004239698 A JP 2004239698A
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JP
Japan
Prior art keywords
substrate
thick film
flow
measuring device
difference
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003027755A
Other languages
Japanese (ja)
Inventor
Masatoshi Sugiura
正敏 杉浦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Hitachi Automotive Systems Engineering Co Ltd
Original Assignee
Hitachi Ltd
Hitachi Car Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Car Engineering Co Ltd filed Critical Hitachi Ltd
Priority to JP2003027755A priority Critical patent/JP2004239698A/en
Publication of JP2004239698A publication Critical patent/JP2004239698A/en
Pending legal-status Critical Current

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Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem that case exists where partial step-difference structure gives restriction to reliability and lifetime of an electronic substrate, the influence of an elimination part of ground conductor or the like is exerted thereon, and thick film screen printing or the like becomes structure including step-difference, since multilayer printing is performed on a flat substrate represented by ceramics in the conventional circuit substrate of a flow measuring system. <P>SOLUTION: The step-difference is formed in at least one portion on the substrate, thereby realizing flatness in the case of printing conductor, insulator and resistor which are formed in a subsequent process of the substrate. The step-difference may be formed in a plurality of portions on the substrate, or on both sides of the substrate. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

【0001】
【発明の属する技術分野】
本発明は内燃機関に用いられる流量測定装置に係わり、特には、流量測定装置の電子基板最下層にグランド導体を用いることで耐電波障害性向上を図った流量測定装置における回路基板に対し、意図的に段差を設けた基板を採用することにより、該基板上に設けられた厚膜抵抗の断面形状の歪みを解消し、信頼性に優れた製品を提供することに関する。
【0002】
【従来の技術】
流量計については、下記特許文献1などがある。また、電子基板最下層にグランド導体を用いることで耐電波障害性向上を図った流量測定装置は、回路基板に▲1▼グランド導体印刷,焼成 ▲2▼絶縁体印刷,焼成 ▲3▼回路導体印刷,焼成 ▲4▼厚膜抵抗印刷,焼成、の工程を行う。
【0003】
▲1▼グランド導体印刷,焼成の工程時に、後工程でトリミングされる厚膜抵抗下グランド導体の一部分を除いておく。これはオーバートリミングによるグランド導体と厚膜抵抗の電気短絡を防ぐ為である。
【0004】
従来技術では厚膜抵抗のペースト印刷時に、該グランド導体除き部の影響で、厚膜抵抗を印刷する表面に凹凸が生じることによる厚膜抵抗の耐久性もしくは抵抗値ばらつきに改良の余地を残していた。
【0005】
【特許文献1】
特開2002−61526号公報
【0006】
【発明が解決しようとする課題】
上記従来技術では、電子基板最下層に設けたグランド導体のトリミング用部周辺で、グランド導体分の段差が生じてしまうことに起因する厚膜抵抗印刷面の凹凸発生に問題があった。本発明は、基板のグランド導体除き部に予めグランド導体の厚さを目安とした意図的な段差を設定することで、厚膜抵抗の印刷面を平準化を図り、厚膜抵抗の耐久性向上及び厚膜抵抗の抵抗値ばらつきを低減した製品を市場に提供するものである。
【0007】
【課題を解決するための手段】
電子基板表面に意図的な段差を設ける。
【0008】
【発明の実施の形態】
以下、本発明の実施例を図1から図6を用いて説明する。
【0009】
図1は流量測定装置の一例である。モジュール1の内部には電子基板2がベース3上に固定されており、電気接続子5を介し、発熱抵抗体9と感温抵抗体6に接続される。またモジュール1はボディ4に固定されている。発熱抵抗体9と感温抵抗体6は流路通路7に覆われ、その内部を吸入空気8が流れる構造である。
【0010】
図2は電子基板2上の厚膜抵抗体22,導体21及び絶縁ガラス除き部23の位置関係を上面側から示した図である。
【0011】
図3は電子基板2上の厚膜抵抗体22,導体21及び絶縁ガラス32,グランド導体31及び基板30の位置関係を示す断面図の従来例である。従来構造では、図中央に設けられている絶縁ガラス除き部の影響を受け、最上面に設けられた厚膜抵抗体22の形状に段差があり、信頼性向上の余地を残していた。
【0012】
図4は電子基板2上の厚膜抵抗体22,導体21及び絶縁ガラス32,グランド導体31及び基板30の位置関係を示す断面図の本発明の一例である。図中央に設けられている基板30の段差により、最上面に設けられた厚膜抵抗体22の形状が平坦化され、信頼性向上を図った一例である。
【0013】
図5は本発明を用いた基板30の一実施例。基板上に意図的に設けた段差は複数箇所でも良いし、基板の両面に設けても良い。
【0014】
図6は本発明を用いた流量測定装置を用いた内燃機関のシステム図である。本発明を用いた流量測定装置104が用いられ、吸気温センサ103,スロットルポジションセンサ109,回転速度計113及び酸素濃度計117からの信号を基にインジェクタ112への出力信号をコントロールユニット111は演算する。
【0015】
【発明の効果】
本発明により、電子基板上の厚膜抵抗の信頼性を確保することにより、小型化のニーズに対応する小型流量測定装置に包括される小型多層基板の供給が可能となる。
【図面の簡単な説明】
【図1】流量測定装置の構造図。
【図2】従来の厚膜抵抗周辺の上面図。
【図3】従来の厚膜抵抗周辺の断面図。
【図4】本発明を用いた厚膜抵抗周辺の断面図。
【図5】本発明を用いた基板の一実施例を示す図。
【図6】本発明の流量測定装置を用いた内燃機関のシステム図。
【符号の説明】
1…モジュール、2…電子基板、3…ベース、4,105…ボディ、5…電気接続子、6…感温抵抗体、7…流路通路、8,101…吸入空気、9…発熱抵抗体、21…導体、22…厚膜抵抗体、23…ガラス除き部、30…基板、31…グランド導体、32…絶縁ガラス、102…エアクリーナ、103…吸気温センサ、104…流量測定装置、106…ダクト、107…アイドルエアコントロールバルブ、108…アイドルコントロールバルブ、109…スロットルポジションセンサ、110…吸気マニホールド、111…コントロールユニット、112…インジェクタ、113…回転速度計、114…エンジンシリンダ、115…排気マニホールド、116…ガス、117…酸素濃度計。
[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a flow measurement device used in an internal combustion engine, and more particularly, to a circuit board in a flow measurement device that improves electromagnetic interference resistance by using a ground conductor in the lowermost layer of an electronic board of the flow measurement device. The present invention relates to providing a product excellent in reliability by adopting a substrate having a step in order to eliminate distortion of a cross-sectional shape of a thick film resistor provided on the substrate.
[0002]
[Prior art]
As for the flow meter, there is Patent Document 1 below. In addition, the flow rate measuring device which has improved the electric wave interference resistance by using a ground conductor in the lowermost layer of the electronic substrate includes (1) printing of a ground conductor and firing (2) printing of an insulator and firing (3) circuit conductor on a circuit board. Printing and baking (4) Perform thick film resistance printing and baking processes.
[0003]
{Circle around (1)} In the process of printing and firing the ground conductor, a part of the ground conductor under the thick-film resistor that is trimmed in a later process is removed. This is to prevent an electrical short circuit between the ground conductor and the thick film resistor due to over trimming.
[0004]
In the prior art, when printing a thick film resistor paste, there is room for improvement in the durability or resistance value variation of the thick film resistor due to unevenness on the surface on which the thick film resistor is printed due to the influence of the ground conductor excluding portion. Was.
[0005]
[Patent Document 1]
JP-A-2002-61526
[Problems to be solved by the invention]
In the above prior art, there is a problem in that irregularities are generated on the printed surface of the thick film resistor due to a step difference of the ground conductor around the trimming portion of the ground conductor provided in the lowermost layer of the electronic substrate. The present invention aims to equalize the printing surface of the thick film resistor and to improve the durability of the thick film resistor by setting an intentional step in advance in the portion of the substrate other than the ground conductor, using the thickness of the ground conductor as a guide. And a product in which the variation in the resistance value of the thick film resistor is reduced is provided to the market.
[0007]
[Means for Solving the Problems]
An intentional step is provided on the surface of the electronic substrate.
[0008]
BEST MODE FOR CARRYING OUT THE INVENTION
An embodiment of the present invention will be described below with reference to FIGS.
[0009]
FIG. 1 is an example of a flow measurement device. An electronic board 2 is fixed on a base 3 inside the module 1, and is connected to a heating resistor 9 and a temperature-sensitive resistor 6 via an electric connector 5. The module 1 is fixed to the body 4. The heat-generating resistor 9 and the temperature-sensitive resistor 6 are covered with a flow path 7, and the intake air 8 flows through the inside thereof.
[0010]
FIG. 2 is a diagram showing a positional relationship between the thick film resistor 22, the conductor 21, and the insulating glass removing portion 23 on the electronic substrate 2 from the upper surface side.
[0011]
FIG. 3 is a conventional example of a sectional view showing the positional relationship between the thick film resistor 22, the conductor 21, the insulating glass 32, the ground conductor 31, and the substrate 30 on the electronic substrate 2. In the conventional structure, there is a step in the shape of the thick film resistor 22 provided on the uppermost surface due to the influence of the portion except the insulating glass provided in the center of the figure, leaving room for improvement in reliability.
[0012]
FIG. 4 is an example of the present invention of a sectional view showing the positional relationship between the thick film resistor 22, the conductor 21, the insulating glass 32, the ground conductor 31, and the substrate 30 on the electronic substrate 2. In this example, the shape of the thick-film resistor 22 provided on the uppermost surface is flattened by the step of the substrate 30 provided in the center of the figure, and the reliability is improved.
[0013]
FIG. 5 shows an embodiment of the substrate 30 using the present invention. Steps intentionally provided on the substrate may be provided at a plurality of positions, or may be provided on both surfaces of the substrate.
[0014]
FIG. 6 is a system diagram of an internal combustion engine using the flow measuring device according to the present invention. A control unit 111 calculates an output signal to an injector 112 based on signals from an intake air temperature sensor 103, a throttle position sensor 109, a rotational speed meter 113 and an oximeter 117 using a flow rate measuring device 104 using the present invention. I do.
[0015]
【The invention's effect】
According to the present invention, by ensuring the reliability of the thick film resistor on the electronic substrate, it becomes possible to supply a small multi-layer substrate that is included in a small flow rate measuring device that meets the needs for miniaturization.
[Brief description of the drawings]
FIG. 1 is a structural view of a flow measuring device.
FIG. 2 is a top view of the periphery of a conventional thick film resistor.
FIG. 3 is a cross-sectional view around a conventional thick film resistor.
FIG. 4 is a sectional view around a thick film resistor using the present invention.
FIG. 5 is a diagram showing one embodiment of a substrate using the present invention.
FIG. 6 is a system diagram of an internal combustion engine using the flow measurement device of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Module, 2 ... Electronic board, 3 ... Base, 4, 105 ... Body, 5 ... Electric connector, 6 ... Temperature sensitive resistor, 7 ... Flow path, 8, 101 ... Inhalation air, 9 ... Heating resistor , 21 ... conductor, 22 ... thick film resistor, 23 ... glass removal part, 30 ... substrate, 31 ... ground conductor, 32 ... insulating glass, 102 ... air cleaner, 103 ... intake air temperature sensor, 104 ... flow rate measuring device, 106 ... Duct, 107: idle air control valve, 108: idle control valve, 109: throttle position sensor, 110: intake manifold, 111: control unit, 112: injector, 113: rotational speed meter, 114: engine cylinder, 115: exhaust manifold , 116 ... gas, 117 ... oxygen concentration meter.

Claims (4)

気体の流量に応じた信号を発生する流量測定装置において、該測定装置を駆動する回路基板の基板表面に意図的に段差を設けることを特徴とする流量測定装置。What is claimed is: 1. A flow rate measuring apparatus for generating a signal corresponding to a gas flow rate, wherein a step is intentionally provided on a surface of a circuit board for driving the measuring apparatus. 請求項1において、基板はセラミックに代表される充分な強度を有する部材が、基板の範囲面積内側に少なくとも一個所の意図的に設けられた段差を有する型物で形成されることを特徴とする流量測定装置。The substrate according to claim 1, wherein the member having sufficient strength represented by ceramic is formed of a mold having at least one intentionally provided step inside the area of the substrate. Flow measurement device. 請求項1ないし2において、意図的に設けられた段差は、耐電波障害性向上の為に用いられるグランド導体の厚さを目安とし、段差を形成する部分の投影は多角形からなり、この多角形の一部に製品製造工程中の調整作業時にレーザー等に依る厚膜抵抗トリミングが入ることを特徴とする流量測定装置。In claims 1 and 2, the step provided intentionally is based on the thickness of the ground conductor used for improving the electric wave interference resistance, and the projection of the portion forming the step is formed of a polygon. A flow measuring device characterized in that thick film resistance trimming by a laser or the like enters a part of a square during an adjustment work during a product manufacturing process. 請求項1ないし3において、該流量測定装置が自動車,船舶,汽車及び定地用に用いられる内燃機関の気体通路内に配置されていることを特徴とする流量測定装置。4. The flow measuring device according to claim 1, wherein the flow measuring device is disposed in a gas passage of an internal combustion engine used for an automobile, a ship, a train, and a fixed place.
JP2003027755A 2003-02-05 2003-02-05 Flow measuring system Pending JP2004239698A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003027755A JP2004239698A (en) 2003-02-05 2003-02-05 Flow measuring system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003027755A JP2004239698A (en) 2003-02-05 2003-02-05 Flow measuring system

Publications (1)

Publication Number Publication Date
JP2004239698A true JP2004239698A (en) 2004-08-26

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ID=32955389

Family Applications (1)

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JP2003027755A Pending JP2004239698A (en) 2003-02-05 2003-02-05 Flow measuring system

Country Status (1)

Country Link
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