JP4636915B2 - Air flow measurement device - Google Patents

Air flow measurement device Download PDF

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JP4636915B2
JP4636915B2 JP2005078381A JP2005078381A JP4636915B2 JP 4636915 B2 JP4636915 B2 JP 4636915B2 JP 2005078381 A JP2005078381 A JP 2005078381A JP 2005078381 A JP2005078381 A JP 2005078381A JP 4636915 B2 JP4636915 B2 JP 4636915B2
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conductor
air flow
flow rate
measuring device
rate measuring
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JP2006258677A (en
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泉 渡辺
潤一 堀江
圭一 中田
恵二 半沢
亮 佐藤
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Hitachi Astemo Ltd
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Hitachi Automotive Systems Ltd
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Description

本発明は、内燃機関の流量,圧力,温度,酸素量を検出する装置に係り、例えば内燃機関の吸入空気量を計測する流量センサに関する。   The present invention relates to a device that detects the flow rate, pressure, temperature, and oxygen amount of an internal combustion engine, and more particularly to a flow rate sensor that measures the intake air amount of an internal combustion engine.

従来より、自動車などの内燃機関の吸気管や排気管には流量センサや圧力センサ,温度センサ,酸素濃度センサ等の物理量を計測する装置が設置され、内燃機関の運転状態が適切になるように制御されている。   Conventionally, devices for measuring physical quantities such as flow sensors, pressure sensors, temperature sensors, oxygen concentration sensors, etc. have been installed in the intake and exhaust pipes of internal combustion engines such as automobiles so that the operating state of the internal combustion engine is appropriate. It is controlled.

この物理量測定装置は、物理量を計測するためのセンサとそのセンサを駆動するとともにセンサ信号を増幅し、制御装置へ伝えるための駆動回路と入出力回路が形成されている。   In this physical quantity measuring device, a sensor for measuring a physical quantity and a drive circuit and an input / output circuit for driving the sensor, amplifying the sensor signal, and transmitting the sensor signal to the control device are formed.

近年は回路基板の小型,低価格化のため、回路基板に使用している配線材料に従来の
Ag−Pd導体から、純Ag、あるいはAgを主体としたAg−Pt導体を使用する例が多くなってきた。純Ag、及びAg−Pt導体は抵抗率が比較的小さいことから配線の微細化が可能で小型化に適している反面、従来のAg−Pd導体に比べて耐食性が低下するので、信頼性の確保が課題であった。
In recent years, in order to reduce the size and cost of circuit boards, there are many examples in which pure Ag or Ag-Pt conductors mainly composed of Ag are used as the wiring material used for circuit boards from conventional Ag-Pd conductors. It has become. Pure Ag and Ag-Pt conductors are relatively small in resistivity and can be miniaturized and suitable for downsizing, but their corrosion resistance is lower than that of conventional Ag-Pd conductors. Ensuring was an issue.

特開2001−12987号公報Japanese Patent Laid-Open No. 2001-12987

従来技術は、セラミック製積層基板上に印刷されたAgを主体とした配線導体が形成されたものである。   In the prior art, a wiring conductor mainly composed of Ag printed on a ceramic multilayer substrate is formed.

配線導体材料はAg−Pd導体やAg−Pt導体などが使用されることが多く、また、内装導体にはAgが使用される。   In many cases, an Ag—Pd conductor, an Ag—Pt conductor, or the like is used as the wiring conductor material, and Ag is used as the interior conductor.

近年、小型,低価格化を目的にAg−Pd導体に代わり、Ag−Pt導体を使用することが多いが、Ag−Pt導体は、そのほとんどがAgであり、耐食性が懸案である。   In recent years, Ag-Pt conductors are often used instead of Ag-Pd conductors for the purpose of miniaturization and cost reduction, but most of Ag-Pt conductors are Ag, and corrosion resistance is a concern.

通常、これらの導体材料の上には腐食防止のためガラスの被覆が行われるが、ガラスにはピンホールも存在するので、完全に腐食を防止するには更なる改善が必要である。   Usually, these conductor materials are coated with glass to prevent corrosion. However, since glass has pinholes, further improvement is necessary to completely prevent corrosion.

特に、内燃機関の吸気管、あるいは排気管に設置される空気流量センサや圧力センサ,温度センサ,酸素濃度センサ類は、各種の腐食性ガスに曝されるので、この腐食性ガスにより腐食しない物理量測定装置を提供することが課題である。   In particular, air flow sensors, pressure sensors, temperature sensors, and oxygen concentration sensors installed in the intake pipe or exhaust pipe of an internal combustion engine are exposed to various corrosive gases. The problem is to provide a measuring device.

本発明は、内燃機関の吸気管に設置され、前記吸気管を流れる空気流量を測定する空気流量測定装置であって、複数の基板を積層した積層基板と、前記積層基板に形成されたスルーホールと、前記積層基板に形成された卑金属材料を主体とする金属からなる導体と、前記導体によって電気的に接続されるチップ抵抗やチップコンデンサ等の複数の電子部品と、を有し、前記導体は、前記積層基板の内層に形成された内装導体であり、前記積層基板の表面に位置する前記スルーホール上に半田ペーストが塗布され、前記半田ペーストが塗布された箇所に、チップ抵抗やチップコンデンサ等の複数の電子部品が実装され、前記複数の電子部品は、内装導体によって電気的に接続されていることを特徴とする。これにより、Agを主体とする金属の腐食を防止でき、信頼性の大幅な向上が期待できる。


The present invention is an air flow rate measuring device that is installed in an intake pipe of an internal combustion engine and measures the flow rate of air flowing through the intake pipe, and includes a laminated substrate in which a plurality of substrates are laminated, and a through hole formed in the laminated substrate. And a conductor made of a metal mainly composed of a base metal material formed on the multilayer substrate , and a plurality of electronic components such as a chip resistor and a chip capacitor that are electrically connected by the conductor , and the conductor is , Ri interior conductor der formed on the inner layer of the multilayer substrate, the solder paste on the through hole is applied, the portion where the solder paste is applied, a chip resistor and a chip capacitor located on the surface of the laminated substrate A plurality of electronic components such as these are mounted, and the plurality of electronic components are electrically connected by an interior conductor. Thereby, corrosion of the metal mainly composed of Ag can be prevented, and a significant improvement in reliability can be expected.


Agを主体とする導体上を半田で覆ってしまう構造であり、Agの腐食を回避することが可能となる。これにより、信頼性の高い物理量測定装置を提供できる。   This is a structure in which the conductor mainly composed of Ag is covered with solder, and corrosion of Ag can be avoided. Thereby, a highly reliable physical quantity measuring device can be provided.

従来のセラミック製積層基板を用いた材料,部品構成を変えずにパターンレイアウトの変更だけで信頼性の改善が可能である。   Reliability can be improved by changing the pattern layout without changing the material and component configuration using the conventional ceramic multilayer substrate.

図1は本発明の1実施例の流量測定装置の断面構造である。図2は図1に示す回路を搭載した積層基板の断面構造を示している。図3は図2の積層基板の正面図である。   FIG. 1 shows a cross-sectional structure of a flow rate measuring apparatus according to one embodiment of the present invention. FIG. 2 shows a cross-sectional structure of a laminated substrate on which the circuit shown in FIG. 1 is mounted. FIG. 3 is a front view of the multilayer substrate of FIG.

以下、図1,図2,図3により本発明の第一の実施例を説明する。   The first embodiment of the present invention will be described below with reference to FIGS.

図1に示すように、流量測定装置1は、流量センサ素子2を主通路5中に形成された副通路7に配置し、流量センサ素子2を駆動し、且つ、出力信号に変換する積層基板4やハウジング3等から構成され、吸入された空気流量を測定するものである。吸入する空気の流れは符号6の矢印で表してある。   As shown in FIG. 1, a flow rate measuring device 1 has a flow rate sensor element 2 disposed in a sub-passage 7 formed in a main passage 5, a laminated substrate that drives the flow rate sensor element 2 and converts it into an output signal. 4 and the housing 3, etc., and measures the intake air flow rate. The flow of inhaled air is indicated by the arrow 6.

図1に示した積層基板4の詳細を図2に示す。積層基板4は、アルミナやガラス−アルミナ等のセラミック製のものが用いられ、熱伝導性が必要な場合にはアルミナ製のものが、熱絶縁性を要求される場合にはガラス−アルミナ製のものが使用される。   Details of the multilayer substrate 4 shown in FIG. 1 are shown in FIG. The laminated substrate 4 is made of ceramic such as alumina or glass-alumina, and when thermal conductivity is required, the product made of alumina is used, and when thermal insulation is required, the product is made of glass-alumina. Things are used.

積層基板の製法は、未焼成の柔らかいグリーンシート状態の基板にスルーホール25を形成し、スルーホールビア27a,27b,内装導体26,金導体28等を印刷後、グリーンシートを重ねてプレスし、密着させてから焼成する。焼成後にスルーホールビア27a,27b等の導体露出部をガラスペーストを印刷,焼成し、ガラス被覆29を形成した構造である。図2では積層基板4は5枚のグリーンシートを重ねたものを示した。また、流量センサ素子2を実装する部分は予めプレス打ち抜きによりグリーンシートに穴を空けた基板と穴を空けない基板を積層することで形成される。   The method of manufacturing the laminated substrate is to form through holes 25 in an unfired soft green sheet substrate, print through hole vias 27a and 27b, interior conductors 26, gold conductors 28, etc. Firing after adhering. In this structure, exposed portions of the conductors such as through-hole vias 27a and 27b are printed and baked after baking to form a glass coating 29. In FIG. 2, the laminated substrate 4 is a laminate of five green sheets. Further, the portion on which the flow sensor element 2 is mounted is formed by laminating a substrate in which holes are made in a green sheet and a substrate in which holes are not made in advance by press punching.

スルーホール25に充填される材料や内装導体26に使用される材料、スルーホールビア27a,27bに使用される材料としては、価格的に安価で、低抵抗化が可能なAgを主体にした材料を使用するのが一般的である。例えば、内装導体には、純Agが使用され、スルーホール25やスルーホールビア27a,27bにはAgに数パーセント程度の
Ptが混じったAg−Pt導体等が使用される。
Materials filled in the through-hole 25, materials used in the interior conductor 26, and materials used in the through-hole vias 27a and 27b are materials mainly composed of Ag that is inexpensive in price and capable of reducing resistance. Is generally used. For example, pure Ag is used for the interior conductor, and an Ag—Pt conductor in which Pt of several percent is mixed with Ag is used for the through hole 25 and the through hole vias 27a and 27b.

しかし、Agは腐食しやすい材料であり、特に、内燃機関の吸気管や排気管に取付けられる各種センサ類には、耐食性が課題となる。例えば、吸気管に配置される流量測定装置1では、ブローバイガスに含まれるSOxガスやNOxガス、あるいはイオウで加硫されたゴムダクト等からは過剰に入れられた未反応のイオウがイオウガスとなって発生し、エンジン停止後に流量測定装置1に到達する。   However, Ag is a material that easily corrodes, and in particular, various sensors attached to an intake pipe and an exhaust pipe of an internal combustion engine have a problem of corrosion resistance. For example, in the flow rate measuring device 1 arranged in the intake pipe, SOx gas or NOx gas contained in blow-by gas, or unreacted sulfur excessively introduced from a rubber duct vulcanized with sulfur becomes sulfur gas. Occurs and reaches the flow rate measuring device 1 after the engine is stopped.

また、排気管では、大量のSOxガスやNOxガスが発生し、排気管に取付けられた各種センサ類に到達する。   Further, a large amount of SOx gas or NOx gas is generated in the exhaust pipe, and reaches various sensors attached to the exhaust pipe.

そのため、耐食性を向上させるには貴金属であるPdを30%程度含んだAg−Pd導体を使用する等の工夫が必要となる。しかし、貴金属が多ければ価格的に高価であり、また、配線抵抗も増加するので配線導体を太くする必要が生じ、小型化が困難となる。   Therefore, in order to improve the corrosion resistance, it is necessary to devise such as using an Ag—Pd conductor containing about 30% of precious metal Pd. However, if there are many noble metals, it will be expensive in price, and since wiring resistance will also increase, it will be necessary to make a wiring conductor thick, and size reduction will become difficult.

そこで図2に示すように、スルーホールビア27a,27b上に半田23を介してチップコンデンサやチップ抵抗等のチップ部品30やチップ電極31を搭載し、Agを主体とする配線導体が積層基板の最表面に形成されない構造とした。また、半田23による接続が出来ない部分には金導体28を図2,図3に示すように形成し、更にスルーホールビア27a,27b上がガラス被覆29で覆われた構造とし、Agを主体とした配線導体が基板表面に形成されるのを防止した。   Therefore, as shown in FIG. 2, chip components 30 such as chip capacitors and chip resistors and chip electrodes 31 are mounted on the through-hole vias 27a and 27b via solder 23, and a wiring conductor mainly composed of Ag is formed on the laminated substrate. The structure was not formed on the outermost surface. In addition, a gold conductor 28 is formed in a portion where the solder 23 cannot be connected as shown in FIGS. 2 and 3, and the through-hole vias 27a and 27b are covered with a glass coating 29, and Ag is mainly used. The wiring conductor was prevented from being formed on the substrate surface.

これにより、流量測定装置1に本発明を適用することで、安価で、小型化も可能な上、大幅に耐食性を向上させることが可能となる。   As a result, by applying the present invention to the flow rate measuring device 1, it is possible to reduce the cost and reduce the size and to significantly improve the corrosion resistance.

なお、配線導体をAgを主体とする導体とし、その上からガラス被覆29を行うことでも、ある程度の耐食性が得られるが、ガラス被覆29にはピンホールも存在するため、細い配線導体上にピンホールが存在すると、そこから腐食が進行しやすい。   It is to be noted that a certain degree of corrosion resistance can also be obtained by making the wiring conductor a conductor mainly composed of Ag and applying the glass coating 29 on the wiring conductor. However, since the glass coating 29 has pinholes, the pin is formed on the thin wiring conductor. If holes exist, corrosion tends to proceed from there.

従って、本発明のようにスルーホールビア27a,27bのようにある程度大きい部分だけが積層基板4の最表面に形成された本発明の構造が非常に有利である。   Therefore, the structure of the present invention in which only a part that is somewhat large like the through-hole vias 27a and 27b is formed on the outermost surface of the multilayer substrate 4 as in the present invention is very advantageous.

基板上には、金線、あるいはアルミ線等の接続ワイヤ21a,21bで接続する流量センサ素子2や電子部品32もあるが、接続ワイヤ21aとスルーホールビア27b部がエポキシ樹脂22のような腐食性ガスを通さない材料で封止されていると、より一層耐食性が有利となる。   On the substrate, there are the flow sensor element 2 and the electronic component 32 which are connected by connection wires 21a and 21b such as gold wire or aluminum wire, but the connection wire 21a and the through-hole via 27b are corroded like the epoxy resin 22. If the material is sealed with a material that does not allow the passage of a reactive gas, the corrosion resistance becomes even more advantageous.

なお、上記はAgを主体とした導体の腐食防止について説明したが、本発明はAgを主体とした導体に限定されるものではなく、例えばCu導体やW導体等のその他の卑金属材料を使用した場合にも適用可能であり、同様の効果が得られる。   Although the above has described the prevention of corrosion of conductors mainly composed of Ag, the present invention is not limited to conductors mainly composed of Ag, and other base metal materials such as Cu conductors and W conductors are used. The same effect can be obtained.

また、積層基板4には樹脂製のものもあるが樹脂製では腐食性ガスが樹脂基板中を透過する危険性があることや、ガラス被覆29形成時の熱処理に絶えられないことから、上記に述べたアルミナ、あるいはガラス−アルミナ等のセラミックスから成る積層基板4を使用することが有効である。   In addition, some laminated substrates 4 are made of resin. However, in the case of resin, there is a risk that corrosive gas permeates through the resin substrate, and the heat treatment at the time of forming the glass coating 29 is not constant. It is effective to use the laminated substrate 4 made of ceramics such as the aforementioned alumina or glass-alumina.

図4,図5は本発明のその他の一実施例を説明する積層基板4の断面図、及び正面図である。   4 and 5 are a sectional view and a front view of a laminated substrate 4 for explaining another embodiment of the present invention.

本発明ではチップ部品30やチップ電極31等の半田で覆うスルーホールビア27a以外は、スルーホールビア27c上を金導体28で完全に覆ってしまう。更にその上からガラス被覆29した構造とする。これにより、Agを主体とした部分は完全に金導体28とガラス被覆29で覆われた構造となり、より一層、耐食性の向上が期待できる。但し、
AuとAgは印刷後の熱処理時に、拡散現象でその境界部に隙間が発生する場合がある。そこで、AgにAuを混ぜたAg導体を使用し、その上にAu導体28を重ねる等の工夫が必要となる。
In the present invention, the through hole via 27c is completely covered with the gold conductor 28 except for the through hole via 27a covered with solder such as the chip component 30 and the chip electrode 31. Further, the glass coating 29 is formed thereon. As a result, a portion mainly composed of Ag has a structure completely covered with the gold conductor 28 and the glass coating 29, and further improvement in corrosion resistance can be expected. However,
When Au and Ag are subjected to heat treatment after printing, a gap may occur at the boundary due to a diffusion phenomenon. Therefore, it is necessary to devise such as using an Ag conductor in which Au is mixed with Au and overlaying the Au conductor 28 thereon.

なお、実施例2では、Agを主体とした導体の腐食防止について説明したが、本発明はAgを主体とした導体に限定されるものではなく、例えばCu導体やW導体等のその他の卑金属材料を使用した場合にも適用可能であり、同様の効果が得られる。   In the second embodiment, the corrosion prevention of the conductor mainly composed of Ag is described. However, the present invention is not limited to the conductor mainly composed of Ag. For example, other base metal materials such as a Cu conductor and a W conductor are used. The same effect can be obtained even when using.

図6により本発明のその他の一実施例を説明する。図6に示すように、内燃機関は、吸気管の入り口部にエアクリーナ101を設置し、エアクリーナ101とスロットルボディ109の間に温度センサ102,流量測定装置1が取付けられている。また、エアクリーナ101とスロットルボディ109はゴムダクト106で接続され、スロットルボディ
109には圧力センサ108が取付けられる。
FIG. 6 illustrates another embodiment of the present invention. As shown in FIG. 6, the internal combustion engine has an air cleaner 101 installed at the inlet of the intake pipe, and a temperature sensor 102 and a flow rate measuring device 1 are attached between the air cleaner 101 and the throttle body 109. The air cleaner 101 and the throttle body 109 are connected by a rubber duct 106, and a pressure sensor 108 is attached to the throttle body 109.

また排気管には酸素濃度センサ117が取付けられ、上述の各種センサ信号はコントロールユニット111で処理され、その情報に基づきインジェクタ112から燃料がシリンダーに噴射される。   An oxygen concentration sensor 117 is attached to the exhaust pipe, and the various sensor signals described above are processed by the control unit 111. Based on the information, fuel is injected from the injector 112 into the cylinder.

この吸気管、及び排気管に搭載される温度センサ102,流量測定装置1,圧力センサ108,酸素濃度センサ117等の各種センサ類に本発明の積層基板を採用することにより、低価格で小型が可能で耐食性の高い製品とすることができる。   By adopting the laminated substrate of the present invention for various sensors such as the temperature sensor 102, the flow rate measuring device 1, the pressure sensor 108, and the oxygen concentration sensor 117 mounted on the intake pipe and the exhaust pipe, it is possible to reduce the cost and size. It can be a product with high corrosion resistance.

内燃機関の吸気管,排気管に取付けられる物理量測定装置以外にも、EGRガスの流量を検出する流量センサや圧力センサ,温度センサにも適用できる。   In addition to a physical quantity measuring device attached to an intake pipe and an exhaust pipe of an internal combustion engine, the present invention can be applied to a flow rate sensor, a pressure sensor, and a temperature sensor that detect the flow rate of EGR gas.

本発明による流量測定装置を示す断面図である(実施例1)。It is sectional drawing which shows the flow volume measuring apparatus by this invention (Example 1). 図1に示す積層基板の断面図である(実施例1)。FIG. 2 is a cross-sectional view of the multilayer substrate shown in FIG. 1 (Example 1). 図2に示す積層基板の正面図である(実施例1)。FIG. 3 is a front view of the multilayer substrate shown in FIG. 2 (Example 1). 本発明による積層基板の断面図である(実施例2)。(Example 2) which is sectional drawing of the multilayer substrate by this invention. 図4に示す積層基板の正面図である(実施例2)。(Example 2) which is a front view of the laminated substrate shown in FIG. 本発明による内燃機関のシステム図である(実施例3)。(Example 3) which is a system diagram of the internal combustion engine by this invention.

符号の説明Explanation of symbols

1…流量測定装置、2…流量センサ素子、3…ハウジング、4…積層基板、5…主通路、6…流体の流れ、7…副通路、21a,21b…接続ワイヤ、22…エポキシ樹脂、
23…半田、24…ダイボンド材剤、25…スルーホール、26…内装導体、27a,
27b…スルーホールビア、28…金導体、29…ガラス被覆、30…チップ部品、31…チップ電極、101…エアクリーナ、102…温度センサ、106…ゴムダクト、108…圧力センサ、109…スロットルボディ、111…コントロールユニット、112…インジェクタ、117…酸素濃度センサ。

DESCRIPTION OF SYMBOLS 1 ... Flow measuring device, 2 ... Flow sensor element, 3 ... Housing, 4 ... Laminated substrate, 5 ... Main passage, 6 ... Fluid flow, 7 ... Sub passage, 21a, 21b ... Connection wire, 22 ... Epoxy resin,
23 ... Solder, 24 ... Die bond material, 25 ... Through hole, 26 ... Interior conductor, 27a,
27b: Through-hole via, 28 ... Gold conductor, 29 ... Glass coating, 30 ... Chip component, 31 ... Chip electrode, 101 ... Air cleaner, 102 ... Temperature sensor, 106 ... Rubber duct, 108 ... Pressure sensor, 109 ... Throttle body, 111 ... Control unit, 112 ... Injector, 117 ... Oxygen concentration sensor.

Claims (5)

内燃機関の吸気管に設置され、前記吸気管を流れる空気流量を測定する空気流量測定装置であって、
複数の基板を積層した積層基板と、
前記積層基板に形成されたスルーホールと、
前記積層基板に形成された卑金属材料を主体とする金属からなる導体と、
前記導体によって電気的に接続されるチップ抵抗やチップコンデンサ等の複数の電子部品と、を有し、
前記導体は、前記積層基板の内層に形成された内装導体であり、
前記積層基板の表面に位置する前記スルーホール上には半田ペーストが塗布され、
前記半田ペーストが塗布された箇所に前記複数の電子部品が実装され、
前記複数の電子部品は、前記内装導体によって電気的に接続されていることを特徴とする空気流量測定装置。
An air flow rate measuring device that is installed in an intake pipe of an internal combustion engine and measures an air flow rate flowing through the intake pipe,
A laminated substrate in which a plurality of substrates are laminated;
A through hole formed in the laminated substrate;
A conductor made of a metal mainly composed of a base metal material formed on the laminated substrate ;
A plurality of electronic components such as chip resistors and chip capacitors electrically connected by the conductor ,
Said conductor, Ri interior conductor der formed on the inner layer of the multilayer substrate,
A solder paste is applied on the through hole located on the surface of the multilayer substrate,
The plurality of electronic components are mounted at a location where the solder paste is applied,
The plurality of electronic components are electrically connected by the interior conductor.
請求項1に記載の空気流量測定装置において、
前記積層基板の表面に位置する金を主体とする金属からなる金導体と、
前記金導体によって電気的に接続される複数の電子部品と、を有し、
前記金導体は、前記半田ペーストの代わりに、前記積層基板の表面に位置する前記スルーホール上に配線され、
前記スルーホールビア上をガラスで保護したことを特徴とする空気流量測定装置。
The air flow rate measuring device according to claim 1,
A gold conductor made of a metal mainly composed of gold located on the surface of the multilayer substrate;
A plurality of electronic components electrically connected by the gold conductor,
The gold conductors, instead of the solder paste, the wiring on the through hole located on the surface of the laminated substrate,
An air flow rate measuring apparatus, wherein the through hole via is protected with glass.
請求項1,請求項2において、卑金属材料とはAgを主体とする金属材料であることを特徴とする空気流量測定装置。   3. The air flow rate measuring device according to claim 1, wherein the base metal material is a metal material mainly composed of Ag. 請求項1,請求項2において、積層基板はアルミナやガラス−アルミナ等のセラミックスで構成されていることを特徴とする空気流量測定装置。   3. The air flow rate measuring device according to claim 1, wherein the laminated substrate is made of ceramics such as alumina or glass-alumina. 請求項1乃至4のいずれかに記載の空気流量測定装置において、
前記内燃機関の吸気管の一部にイオウで加硫したゴムダクトが使用され、前記吸気管に挿入される空気流量測定装置。
In the air flow measuring device according to any one of claims 1 to 4,
An air flow rate measuring device in which a rubber duct vulcanized with sulfur is used in a part of an intake pipe of the internal combustion engine, and is inserted into the intake pipe.
JP2005078381A 2005-03-18 2005-03-18 Air flow measurement device Expired - Fee Related JP4636915B2 (en)

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JP6720200B2 (en) * 2015-09-30 2020-07-08 日立オートモティブシステムズ株式会社 Physical quantity detection device

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JP2003204128A (en) * 2002-01-10 2003-07-18 Sharp Corp Printed wiring board, converter for receiving radio wave, and antenna device
JP2004071588A (en) * 2002-08-01 2004-03-04 Hitachi Ltd Electronic equipment

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* Cited by examiner, † Cited by third party
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