JP2004235322A - Electronic component, manufacturing method thereof, manufacturing method of electro-optical device, electro-optical device, and electronic instrument - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic component which is capable of manufacturing the electronic component such as a TAB substrate or the like without causing faulty wiring, the electronic component, the manufacturing method of an electro-optical device, the electro-optical device and an electronic instrument. <P>SOLUTION: When the TAB substrate 6 is ruptured from a TCP 32, a perforation 33 and a perforation 34 are provided on the rupturing lines of a wiring 29 formed on the TAB substrate 6 to permit the reduction of a stress impressed on the wiring 29. According to this method, the TAB substrate 6 can be manufactured in which the breakage or the turning up of the wiring 29 is eliminated. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for manufacturing an electronic component, an electronic component, a method for manufacturing an electro-optical device, an electro-optical device, and an electronic apparatus.
[0002]
[Prior art]
A liquid crystal device, which is an example of an electro-optical device, includes a liquid crystal panel in which liquid crystal is sandwiched between a pair of substrates, which is an example of an electro-optical panel, a TAB (tape automated bonding) substrate, which is electrically connected to the liquid crystal panel. , A circuit board for electrically connecting to and controlling the TAB board.
[0003]
Wiring having an output terminal, an input terminal, and the like is formed on the above-described TAB substrate, and a driving IC is mounted. A plurality of output terminals are provided at one end of the TAB substrate, and a plurality of input terminals are provided at the other end of the TAB substrate. In this method of manufacturing a TAB substrate, a plurality of TAB substrates are formed by stamping out one flexible film-shaped tape called TCP (tape carrier package) on which wiring and a driving IC are formed and mounted. Here, in the state before the die cutting, for example, an input terminal of one of the adjacent TAB substrates and an output terminal of the other TAB substrate are connected. Therefore, in the die-cutting process, the input terminal part of one substrate and the output terminal part of the other TAB substrate are broken by die-cutting (for example, see Patent Document 1).
[0004]
[Patent Document 1] JP-A-05-047837 (paragraph number 0013,
FIG. 4).
[0005]
[Problems to be solved by the invention]
However, the terminal portion of the wiring has a problem such as being broken or turned up by the stress applied when the die is cut from the TCP to each TAB substrate.
[0006]
The present invention has been made in view of the above circumstances, and provides a method of manufacturing an electronic component, an electronic component, a method of manufacturing an electro-optical device, and an electro-optical device capable of manufacturing an electronic component such as a TAB substrate having no wiring failure. And electronic equipment.
[0007]
[Means for Solving the Problems]
The method for manufacturing an electronic component according to the present invention includes a step of forming a plurality of holes or notches in at least the electrodes along a direction in which the electrodes are arrayed on the flexible substrate; Cutting the flexible substrate along the line.
[0008]
According to such a configuration of the present invention, since a plurality of holes or notches are formed on the line where the electrode breaks, when the flexible substrate is broken to form an electronic component, the stress applied to the electrode at the broken portion is reduced. It is possible to manufacture an electronic component with reduced number of electrodes and no breakage or curling of the electrode.
[0009]
According to one embodiment of the present invention, the hole or the notch is patterned and formed at the same time when the electrode is patterned and formed.
[0010]
According to such a configuration, a hole or a notch can be formed at the same time as the patterning and formation of the electrode, which is a normal manufacturing process, so that manufacturing efficiency is high.
[0011]
According to one embodiment of the present invention, the hole or the notch is formed using a laser.
[0012]
Thus, holes or notches can be formed not only by the above-described pattern formation but also by processing using a laser.
[0013]
According to one embodiment of the present invention, the hole or the notch is formed substantially at the center of the width of the electrode.
[0014]
According to such a configuration, the hole or the notch on the break line is formed by forming the hole or the notch substantially at the center of the electrode on the flexible substrate, that is, at the substantially center of the width of the electrode along the electrode arrangement direction. Since the stress applied to both ends of the electrode excluding the above is uniformly applied, peeling can be prevented.
[0015]
According to one embodiment of the present invention, the cutting step uses a laser.
[0016]
According to such a configuration, since the portion is formed by laser processing instead of the conventional die cutting, generation of particles can be suppressed. Therefore, it is possible to prevent the electrode from being short-circuited due to particles.
[0017]
An electronic component according to an aspect of the invention includes a flexible substrate and an electrode having a notch at one end arranged in a row on the flexible substrate.
[0018]
According to such a configuration of the present invention, when one end of the flexible substrate is electrically connected to another substrate via solder or the like as an adhesive member, the cutout portion of the electrode at one end of the flexible substrate is formed. Since the solder or the like flows, the adhesion can be improved.
[0019]
According to one embodiment of the present invention, a plurality of the cutouts are formed along a direction in which the electrodes are arranged in a row.
[0020]
According to such a configuration, since a plurality of cutouts are formed in one electrode, the stress applied to the electrodes when fractured is further reduced as compared with the case where one cutout is formed in one electrode. Can be.
[0021]
According to one embodiment of the present invention, the electronic component is manufactured by the above-described method for manufacturing an electronic component.
[0022]
According to such a configuration, since it is manufactured by the manufacturing method, it is possible to manufacture an electronic component having no wiring failure.
[0023]
The method of manufacturing an electro-optical device according to the present invention includes a step of forming a first electrode at one end of a flexible substrate so that the one end is located, and a method of forming at least the first electrode along a row direction of the first electrodes. Forming a plurality of holes or notches at one end of the electrode, cutting the flexible substrate along the holes or notches, and electrically connecting the one end of the first electrode and the electro-optical panel. And a step of electrically connecting.
[0024]
According to such a configuration of the present invention, the stress applied to the electrode when the flexible substrate is cut is reduced. Therefore, since the first electrode on the flexible substrate connected to the electro-optical panel is not damaged or turned up, an electro-optical device free from poor connection between the electro-optical panel and the flexible substrate can be manufactured.
[0025]
According to one embodiment of the present invention, a step of forming a second electrode at the other end of the flexible substrate so that one end thereof is located, and forming at least the second electrode along a row direction of the second electrode. The method includes a step of forming a plurality of holes or cutouts at one end of the second electrode, and a step of connecting the one end of the second electrode and the circuit board by soldering.
[0026]
According to such a configuration, stress applied to the second electrode when cutting the flexible substrate is reduced. Therefore, since the second electrode on the flexible board connected to the circuit board is not damaged or turned, it is possible to manufacture an electro-optical device having no connection failure between the circuit board and the flexible board. Furthermore, when the hole or the notch formed at the other end of the flexible substrate and the circuit board are electrically connected via the solder, the solder flows into the hole or the notch, so that the adhesion can be improved. .
[0027]
The electro-optical device according to the present invention is characterized in that the electro-optical panel is connected to the above-mentioned electronic component connected to the electro-optical panel.
[0028]
According to such a configuration of the present invention, since the electronic component having no wiring failure and the electro-optical panel are connected, the electro-optical device has no operation failure.
[0029]
An electro-optical device according to the present invention is manufactured by the above-described manufacturing method.
[0030]
According to such a configuration of the present invention, it is possible to obtain an electro-optical device free from malfunction due to poor connection of wiring.
[0031]
According to another aspect of the invention, an electronic apparatus includes the above-described electro-optical device.
[0032]
According to such a configuration, it is possible to provide an electronic device having no wiring failure.
[0033]
[Means for Solving the Problems]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0034]
(1st Embodiment)
<Liquid crystal device>
FIG. 1 is an exploded perspective view of a liquid crystal device according to an embodiment of the present invention, and FIG. 2 is a sectional view of the liquid crystal device of the present invention.
[0035]
Hereinafter, the structure of the liquid crystal device 1 according to the first embodiment will be described with reference to FIGS.
[0036]
In the present embodiment, a TAB liquid crystal device 1 will be described.
[0037]
As shown in FIG. 1, a liquid crystal device 1 as an electro-optical device includes a liquid crystal panel 2 as an electro-optical panel, a backlight 3 arranged adjacent to the liquid crystal panel 2, and a case 4 for fixing the backlight 3. And a reflection plate 5 disposed below the case 4, a TAB substrate 6 as an electronic component electrically connected to the liquid crystal panel 2, and a circuit board 7 connected to the TAB substrate 6.
[0038]
As shown in FIG. 2, the liquid crystal panel 2 includes a first substrate 8, a second substrate 9 as an opposing substrate facing the first substrate 8, and a seal provided at a peripheral portion of the substrate where the pair of substrates 8 and 9 are bonded. It has a material 10 and a liquid crystal 11 sandwiched in a space formed by the pair of first substrates 8 and 9 and the sealing material 10.
[0039]
The liquid crystal device 1 has a first polarizing plate 12 and a second polarizing plate 13 provided so as to sandwich the liquid crystal panel 2, and an overhang portion 14 protruding from the second substrate 9 on the first substrate 8. . In the overhang portion 14, a wiring 17 for electrically connecting the data line 15 or the scanning line 16 and a terminal portion 19 for connecting to the TAB substrate 6 via an ACF (Anisotropic Conductive Film) 18 are provided. Is formed.
[0040]
On the second substrate 9, stripe-shaped scanning lines 16 made of an ITO (Indium Tin Oxide) film are formed, and on the first substrate 8, the data lines 15 arranged in a stripe shape orthogonal to the scanning lines 16. And TFD elements (not shown) as a plurality of switching elements electrically connected to the data lines 15. A scanning signal and an image signal are supplied to the scanning line 16 and the data line 15 from the driving IC, respectively.
[0041]
The backlight 3 is disposed adjacent to the second substrate 9 and includes an optical sheet such as a diffusion sheet 20, prism sheets 21 and 22, a frame member 23 provided to surround the optical sheet, and an LED 24 serving as a light source. The light source unit includes an LED case 25 that covers and supports the LED 24, and a light guide plate 26 to which light from the LED 24 is incident.
[0042]
The above-described TAB substrate 6 is electrically connected to a terminal 19 electrically connected to a data line 15 or a scanning line 16 formed on an overhang portion 14 protruding from the second substrate 9 on the first substrate 8. You. Details of the TAB substrate 6 will be described later.
[0043]
On the circuit board 7, interconnections between the TAB board 6 and the driving IC 28, an interface control circuit, and the like are mounted.
[0044]
In the liquid crystal device 1, pixels are formed by the scanning lines 16 and the pixel electrodes facing each other, and the liquid crystal 11 sandwiched therebetween. The optical characteristics of the liquid crystal 11 are changed by selectively changing the voltage applied to each pixel, and the light emitted from the backlight 3 is modulated by transmitting the liquid crystal 11 of each pixel.
[0045]
Next, the TAB substrate 6 will be described.
[0046]
FIG. 3 is a schematic plan view showing the TAB substrate according to the present embodiment, and FIG. 4 is a schematic cross-sectional view showing the TAB substrate broken along the line AA ′ in FIG.
[0047]
As shown in FIGS. 3 and 4, the TAB substrate 6 includes a TAB tape 27 formed of polyimide or the like, a wiring 29 formed of copper or the like, and a driving IC 28 mounted on the TAB tape 27. ing. The wiring 29 has an output terminal 30 as a first electrode at one end of the TAB substrate 6 and an input terminal 31 as a second electrode at the other end of the TAB substrate 6. When each of the terminals is assembled as the liquid crystal device 1, one end of the output terminal 30 is electrically connected to the terminal portion 19 of the liquid crystal panel 2 and the other end of the input terminal 31 is electrically connected to the circuit board 7.
[0048]
At each end of the output terminal 30 and the input terminal 31, a notch 30 a and a notch 31 a having a semicircular planar shape are provided substantially in the center of the terminals 30 and 31 along the direction in which the terminals 30 and 31 are arranged. Is formed. The notch 30a and the notch 31a correspond to a part of a plurality of holes used when breaking a plurality of TAB substrates 6 from a TCP described later. This portion particularly shows the portion remaining on the TAB substrate 6 side.
[0049]
Next, the structure of the output terminal 30, particularly in the vicinity of the notch 30a will be described.
[0050]
FIG. 5 is a schematic plan view in which the output terminal side of the TAB substrate is enlarged.
[0051]
As shown in FIG. 5, a notch 30a is provided at an end of the output terminal 30. A pitch distance h1 between the output terminals 30 is 80 μm to 300 μm. The width h2 (μm) of the output terminal 30 is 0.4h1 ≦ h2 ≦ 0.6h1, and the width h3 (μm) of the cutout portion 30a located at substantially the center of the output terminal 30 is h2−30 μm ≦ h3. .Ltoreq.h2-20 .mu.m. The value of the width h3 of the cutout portion 30a is more preferable when the value is closer to the value of the width h2 of the output terminal 30 because the stress applied to the remaining portion 30b when the terminal 30 is broken can be reduced.
[0052]
FIG. 6 is an enlarged schematic plan view of the input terminal side of the TAB substrate.
[0053]
Next, the structure of the input terminal 31, particularly in the vicinity of the cutout portion 31 a, will be described.
[0054]
As shown in FIG. 6, the input terminal 31 has a notch 31a at one end. One end of the input terminal 31 and the circuit board 7 are electrically connected via solder or the like as an adhesive member. In the present embodiment, by providing the notch 31a, when the TAB substrate 6 and the circuit board 7 are bonded, the solder is applied with pressure and flows into the notch 31a. Thereby, the adhesion between the TAB substrate 6 and the circuit board 7 can be improved.
[0055]
The pitch distance h11 between the input terminals 31 is 500 μm to 2000 μm. The width h12 (μm) of the input terminal 31 is 0.4h11 ≦ h12 ≦ 0.6h11, and the width h13 (μm) of the cutout portion 31a of the input terminal 31 is h12−30 μm ≦ h13 ≦ h12−20 μm. is there. It is more preferable that the value of the width h13 of the cutout portion 31a be closer to the value of the width h12 of the input terminal 31 because the stress applied to the remaining portion 31b at the time of breaking, which will be described later, can be reduced.
[0056]
Hereinafter, a method for manufacturing the liquid crystal device 1 will be described.
[0057]
First, a method for manufacturing the TAB substrate 6 will be described.
[0058]
In the manufacturing process of the TAB substrate 6, a plurality of TAB substrates 6 are formed by cutting out a TCP made of polyimide or the like on which the plurality of wirings 29 and the driving ICs 28 are formed and mounted.
[0059]
Hereinafter, a method for manufacturing the above-described TAB substrate 6 will be described in detail with reference to FIGS. FIG. 7 is a schematic plan view of the TCP on which the wiring is formed. FIG. 8 is a schematic plan view of a TCP in which a region where a TAB substrate is to be formed is cut away except for a part. FIG. 9 is a schematic plan view of the soldering device. FIG. 10 is a schematic plan view of a TCP on which a driving IC is mounted.
[0060]
First, as shown in FIG. 7, a wiring 29 is formed on the TCP 32 by, for example, a photolithography method. In the patterning step of this photolithography method, holes 33 and holes 34 from which the electrodes inside are removed are formed simultaneously with the wiring 29. Here, a wiring 29 having circular holes 33 and 34 from which electrodes inside are removed by using a mask in which a pattern of the wiring 29 and the holes 33 and 34 is formed in advance is formed. The dotted line here indicates the area 6a where the TAB substrate 6 is to be formed. The wiring 29 is formed so as to straddle the formation planned area 6a and the outside of the formation planned area 6a. Further, a hole 33 is formed in the intersection area between the wiring 29 and the boundary inside the formation planned area 6a and outside the formation planned area 6a.
[0061]
Next, as shown in FIG. 8, the TCP 32 is broken by die cutting along the region 6a to be formed except for the connecting portion 6b. In this state, only the connecting portion 6b of the TAB substrate 6 is connected to the TCP 32. Here, the wiring 29 extending from the inside of the planned formation region 6a to the adjacent planned formation region 6a is broken. Since the wiring 29 has the holes 33 and 34 on the line to be broken, the stress applied to the remaining portion 30b of the wiring 29 at the time of breaking can be reduced. Thereby, breakage or curling due to breakage of the wiring 29 can be eliminated.
[0062]
Next, the TCP 32 is carried into the soldering device 35 shown in FIG.
[0063]
First, as shown in FIG. 9, the TCP 32 carried into the soldering device 35 is stored in the substrate supply device 36. Thereafter, the TCP 32 transported from the substrate supply device 36 into the paste printing machine 37 has the solder paste printed on the drive IC formation scheduled area 28a. Thereafter, in the mounter 38, the driving IC 28 is mounted on the driving IC formation scheduled area 28a. Thereafter, the driving IC 28 is heated in the reflow furnace 39 and soldered on the TCP 32. Thereafter, the TCP 32 on which the driving IC 28 is mounted is carried into the substrate storage device 40.
[0064]
Thereafter, in the TCP 32 on which the driving IC 28 as shown in FIG. 10 is mounted, the TAB substrate 6 is formed by breaking the connecting portion 6b.
[0065]
Next, the output terminal 30 of the TAB substrate 6 manufactured here and the liquid crystal panel 2 are electrically connected via an ACF or the like. Further, the input terminal 31 of the TAB substrate 6 and the circuit substrate 7 are electrically connected via solder or the like, and the liquid crystal device 1 is completed.
[0066]
As described above, according to the manufacturing method of the present invention, when the TAB substrate 6 is broken from the TCP 32, the holes 33 and the holes 34 are provided in the wiring 29 of the TAB substrate 6 on the breaking line, so that the stress applied to the wiring 29 can be reduced. Thus, the TAB substrate 6 without breakage or curling of the wiring 29 can be manufactured.
[0067]
(2nd Embodiment)
FIG. 11 is a schematic plan view of a TCP on which wirings according to the second embodiment of the present invention are formed, and shows a state before separation into individual TAB substrates. FIG. 12 is an enlarged schematic plan view particularly showing the output terminal side of the TAB substrate separated from the state shown in FIG. Note that the present embodiment differs from the TAB substrate 6 of the first embodiment only in that the number of cutouts or holes provided at one end of one wiring 29 is different, and the description of the same parts is omitted. I do.
[0068]
FIG. 11 shows a state before the TAB substrate 106 is broken from the TCP 132. A hole 133 and two notches 141 are provided at one end of the output terminal 130 at one end of the TAB substrate 106, and holes 134 and 2 are provided at one end of the input terminal 131 at the other end of the TAB substrate 106. And two notches 142.
[0069]
At one end of the output terminal 130 in FIG. 12, three notches 130a and 130c are provided, respectively. The cutout portion 130a is broken at the boundary inside and outside the area 6a where the hole 134 in FIG. 11 is to be formed and remains on the TAB substrate 106. The cutout portion 130c is the cutout portion 141 in FIG. This shows that the substrate is broken at the region 6a and remains on the TAB substrate 106. By providing the cutout portions 130a and 130c of the output terminal 130, the area of each remaining portion 130b is reduced. Thereby, the stress applied to the output terminal 130 at the time of breakage is reduced as compared with the first embodiment, and the TAB substrate 106 with less wiring defects can be formed.
[0070]
In FIG. 12, the output terminal 130 has been described, but the input terminal 131 also has a reduced stress when it breaks.
[0071]
(Third embodiment)
FIG. 13 is a schematic plan view of a TAB substrate according to the third embodiment of the present invention. In FIG. 13, a portion indicated by a dotted semicircle and a portion indicated by a semicircle of the TAB substrate 206 form a circular shape, and are cut along the circular shape. FIG. 14 is a schematic sectional view taken along the line BB ′ in FIG. Note that the present embodiment is different from the TAB substrates of the first and second embodiments only in that the shape of the cutout portion provided in the wiring is different, and the description of the same portions will be omitted. .
[0072]
The notch 230a and the notch 230b of the present embodiment are formed using a laser unlike the above-described embodiments. Therefore, as shown in FIGS. 13 and 14, not only the output terminal 230 but also the TAB tape 227 has a notch with a semicircular planar shape.
[0073]
Next, a method for manufacturing the TAB substrate 229 will be described.
[0074]
First, the wiring 229 is formed on the TCP 232 by, for example, a photolithography method.
[0075]
Next, a circular hole formed by the semicircle of the dotted line and the semicircle of the TAB substrate shown in FIG. 13 is formed in the output terminal 230 using a laser. As described above, the holes having the cutout portions 230a and the cutout portions 230b can be formed not only by the above-described pattern formation but also by a laser as well as the photolithography method.
[0076]
Next, the TCP 232 is broken by the laser along the region 206a to be formed except for the connecting portion 206b. Here, the output terminal 230 extended from the inside of the planned formation region 206a to the adjacent planned formation region is broken. Since the output terminal 230 has the cutout portion 229a and the cutout portion 229b on the line to be broken, the stress applied to the remaining portion 229b of the output terminal 230 can be reduced. Thereby, breakage or curling due to breakage of the output terminal 230 can be eliminated.
[0077]
Next, the TCP 232 is carried into a soldering device, and a solder paste is printed on the driving IC formation scheduled area 228a. Thereafter, in the mounter 238, the driving IC 228 is mounted in the driving IC formation planned area 228a. Thereafter, the driving IC 228 is heated in the reflow furnace 239 and soldered on the TCP 232. Thereafter, the TCP 232 on which the driving IC 228 is mounted is carried into the substrate storage device 240.
[0078]
Thereafter, the TCP 232 on which the driving IC 228 is mounted is broken at the connecting portion 206b to form the TAB substrate 206.
[0079]
Although the output terminal 230 has been described with reference to FIGS. 13 and 14, the stress at the time of breaking the input terminal 231 is also reduced.
[0080]
<Embodiment of electronic device>
Finally, an embodiment in which a liquid crystal device including the above liquid crystal panel is used as a display device of an electronic device will be described. FIG. 15 is a schematic configuration diagram illustrating the overall configuration of the present embodiment. The electronic device shown here has a liquid crystal panel 400 similar to the above, and control means 1200 for controlling the same. Here, the liquid crystal panel 400 is conceptually divided into a panel structure 400A and a driving circuit 200B including a semiconductor IC or the like. The control means 1200 includes a display information output source 1210, a display processing circuit 1220, a power supply circuit 1230, and a timing generator 1240.
[0081]
The display information output source 1210 includes a memory such as a ROM (Read Only Memory) or a RAM (Random Access Memory), a storage unit such as a magnetic recording disk or an optical recording disk, and a tuning circuit for synchronizing and outputting a digital image signal. And is configured to supply display information to the display information processing circuit 1220 in the form of an image signal or the like in a predetermined format based on various clock signals generated by the timing generator 1240.
[0082]
The display information processing circuit 1220 includes various known circuits such as a serial-parallel conversion circuit, an amplification / inversion circuit, a rotation circuit, a gamma correction circuit, and a clamp circuit. Is supplied to the drive circuit 400B together with the clock signal CLK. The driving circuit 400B includes a scanning line driving circuit, a data line driving circuit, and an inspection circuit. The power supply circuit 1230 supplies a predetermined voltage to each of the above-described components.
[0083]
In the above-described embodiment, a simple matrix type liquid crystal device has been described as an example of the electro-optical device, but the present invention is not limited to this. For example, it goes without saying that the present invention can be applied to an active matrix type liquid crystal device using a TFD element or a TFT element.
[0084]
Further, in the above-described embodiment, the case where the present invention is applied to a liquid crystal device is described as an electro-optical device. However, the present invention is not limited to this, and an electroluminescent device, particularly, an organic electroluminescent device, an inorganic electroluminescent device, or the like may be used. , Plasma display device, FED (field emission display) device, LED (light emitting diode) display device, electrophoretic display device, thin TV, thin television using liquid crystal shutter, etc., device using digital micromirror device (DMD) And other various electro-optical devices.
[0085]
Further, in the above-described embodiment, a mobile phone has been described as an example of the electronic device, but the present invention can be applied to other electronic devices. For example, as electronic devices, mobile personal computers, digital watches, digital still cameras, touch panels, calculators, liquid crystal televisions, projectors, viewfinders, video tape recorders with direct-view monitors, car navigation devices, pagers, electronic notebooks, word processors, Workstations, video phones, POS terminals, and the like. Then, the electro-optical device according to the invention can be used as a display portion of these various electronic devices, and an electronic device capable of displaying a plurality of screens can be obtained.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view of a liquid crystal device according to a first embodiment of the present invention.
FIG. 2 is a sectional view of the liquid crystal device according to the first embodiment of the present invention.
FIG. 3 is a schematic plan view of the TAB substrate according to the first embodiment of the present invention.
FIG. 4 is a schematic cross-sectional view of the TAB substrate taken along the line AA ′ in FIG.
FIG. 5 is an enlarged schematic plan view on the output terminal side of the TAB substrate according to the first embodiment of the present invention.
FIG. 6 is an enlarged schematic plan view of an input terminal side of the TAB substrate according to the first embodiment of the present invention.
FIG. 7 is a schematic plan view of a TCP on which a wiring according to the first embodiment of the present invention is formed.
FIG. 8 is a schematic plan view of the TCP in which a region where a TAB substrate is to be formed is cut away except for a part according to the first embodiment of the present invention.
FIG. 9 is a schematic plan view of the soldering device according to the first embodiment of the present invention.
FIG. 10 is a schematic plan view of a TCP on which the driving IC according to the first embodiment of the present invention is mounted.
FIG. 11 is a schematic plan view of a TCP on which a wiring according to a second embodiment of the present invention is formed.
FIG. 12 is a schematic plan view of a TAB substrate according to a second embodiment of the present invention.
FIG. 13 is a schematic plan view of a TAB substrate according to a third embodiment of the present invention.
FIG. 14 is a schematic cross-sectional view taken along the line BB ′ of FIG.
FIG. 15 is a schematic configuration diagram illustrating an overall configuration of an electronic device.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Liquid crystal device, 2 ... Liquid crystal panel, 6 ... TAB board, 7 ... Circuit board, 27 ... TAB tape, 29 ... Wiring, 30 ... Output terminal, 31 ... Input terminal, 30a ... Notch, 31a ... Notch , 33 ... hole, 34 ... hole, 129 ... wiring, 129 a ... notch, 227 ... TAB tape, 229 ... wiring, 229 a ... notch, 229 b ... notch, 400 ... liquid crystal panel

Claims (13)

Forming a plurality of holes or notches in at least the electrodes along the direction in which the electrodes are arranged on the flexible substrate,
Cutting the flexible substrate along the holes or cutouts. The method according to claim 1, wherein the hole or the notch is simultaneously formed by patterning when the electrode is formed by patterning. The method according to claim 1, wherein the hole or the notch is formed by using a laser. The method according to claim 1, wherein the hole or the notch is formed substantially at a center of a width of the electrode. The method according to claim 1, wherein a laser is used in the cutting step. A flexible substrate,
An electrode having a notch at one end, the electrodes being arranged on the flexible substrate. The electronic component according to claim 6, wherein a plurality of the cutouts are formed along a direction in which the electrodes are arranged. An electronic component manufactured by the method for manufacturing an electronic component according to claim 1. Forming a first electrode at one end of the flexible substrate such that the one end is located;
Forming a plurality of holes or notches at least at one end of the first electrode along a direction in which the first electrodes are arranged;
Cutting the flexible substrate along the hole or notch,
Electrically connecting the one end of the first electrode to an electro-optical panel. Forming a second electrode at the other end of the flexible substrate such that one end thereof is located;
Forming a plurality of holes or notches at least at one end of the second electrode along a direction in which the second electrodes are arranged;
The method of manufacturing an electro-optical device according to claim 9, further comprising: connecting the one end of the second electrode to a circuit board by soldering. An electro-optic panel,
An electro-optical device comprising the electronic component according to any one of claims 6 to 8, connected to the electro-optical panel. An electro-optical device manufactured by the manufacturing method according to claim 9. An electronic apparatus comprising the electro-optical device according to claim 11.

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