JP2007256724A - Electro-optical device, mounting structure, method of manufacturing electro-optical device, and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electro-optical device and a mounting structure in which damage to wiring, electronic components or the like arranged in a position near a curved part of a flexible substrate can be prevented without using other members, and to provide a method of manufacturing the electro-optical device, and electronic equipment provided with the electro-optical device. <P>SOLUTION: The flexible substrate 20 has: a tongue part 28 where the wiring 36 and a semiconductor IC 31 are disposed; an aperture part 29 arranged so as to surround the tongue part 28; and curved parts 30 arranged so as to hold the aperture part 29 on both sides of the tongue part 28, and consequently the stress generated in the curved parts 30 is parted by the aperture part 29 and can be prevented from acting on the tongue part 28, and the tongue part 28 can be kept flat, so that it is possible to prevent the stress from acting on the wiring 36 and the semiconductor IC 31 on the tongue part 28 and to prevent the damage or the like to the wiring 36 and the semiconductor IC 31 without using other members. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

The present invention relates to an electronic device such as a personal computer or a cellular phone, an electro-optical device used in the electronic device, a mounting structure, and a method of manufacturing the electro-optical device.

2. Description of the Related Art Conventionally, electro-optical devices such as liquid crystal devices have been used as display devices for electronic devices such as personal computers and mobile phones. The liquid crystal device or the like includes, for example, a flexible substrate, and a semiconductor element or the like is mounted on the flexible substrate. For example, in the process of mounting electronic components, it is necessary to use a heating furnace or the like for melting solder, for example, when the number of electronic components mounted on a flexible substrate or the like is large or small. On the contrary, when the number is small, there is a problem that the efficiency is deteriorated.

In order to solve this problem, an electrode pattern forming portion in which the periphery of the electrode pattern on the flexible substrate is cut out is formed, and an electronic component is placed on the electrode pattern forming portion, and the lower side of the electrode pattern forming portion. A technique is disclosed in which an electrode pattern forming portion and an electronic component are held by a holding member while the electrode pattern forming portion is bent. (For example, refer to Patent Document 1).
Japanese Patent Laid-Open No. 11-40917 (paragraphs [0014] and [0020], FIG. 1).

However, in the above-described technique, there is a problem that, for example, a pinching member that is a separate member is necessary because the electronic component is attached to the flexible substrate by a pinching member.

In addition, there is a problem that the bending portion of the flexible substrate or an electronic component provided near the bending portion may be damaged due to the stress of the bending portion.

Furthermore, in order to avoid the influence of the stress of the bending part of a flexible substrate, there exists a problem that it is necessary to arrange | position an electronic component in the position away from the bending part.

The present invention has been made in view of the above-described problems, and is capable of preventing damage to wiring, electronic components, and the like provided near the curved portion of the flexible substrate without using a separate member. Optical devices,
It is an object to provide a mounting structure, a method of manufacturing an electro-optical device, and an electronic apparatus including the electro-optical device.

In order to achieve the above object, an electro-optical device according to a main aspect of the present invention includes a substrate, a flexible substrate that is connected to the substrate, includes a curved portion, and has at least one of wiring and electronic components, The flexible substrate is provided with a tongue-shaped portion, an opening surrounding the tongue-shaped portion, and sandwiching the opening on both sides of the tongue-shaped portion. The curved portion is provided, and the one of the electronic component and the wiring is disposed on the tongue-shaped portion.

In the present invention, the flexible substrate includes a tongue-shaped portion, an opening surrounding the tongue-shaped portion, and a curved portion provided so as to sandwich the opening on both sides of the tongue-shaped portion. Since at least one of the electronic component and the wiring is arranged, for example, the stress generated in the curved portion is divided by the opening portion to prevent the stress from acting on the tongue portion, and the tongue portion is left flat. For example, it is possible to prevent stress from acting on the wiring and electronic parts arranged on the tongue-shaped part, and it is possible to prevent damage to the wiring and electronic parts on the tongue-shaped part without using a separate member.

In addition, since curved portions provided so as to sandwich the opening on both sides of the tongue-shaped portion are provided, for example, in the past, when wiring or electronic parts are arranged close to the curved portion, wiring or the like is provided together with the flexible substrate. However, the wiring on the tongue-shaped part, the electronic component, etc. can be arranged close to the curved part together with the tongue-shaped part. Furthermore, since at least one of the electronic component and the wiring is arranged on the tongue-shaped portion, for example, the tongue-shaped portion near the curved portion can be used as a region for arranging the wiring, the electronic component, etc. By arranging the wiring and electronic parts on the tongue-like portion, another wiring and electronic parts can be provided in the vacant area, or the size can be reduced. Conventionally, when the opening is formed in the curved portion, the opening is formed without forming the tongue-shaped portion, whereas the portion that has been removed to form the opening is conventionally used. The tongue-like portion surrounded by the opening can be formed without using a separate member.

According to an aspect of the present invention, the bending portion is bent so that the extending direction of the flexible substrate is opposite, and the length of the tongue-like portion is the bending portion. The curvature radius is less than or equal to. Thereby, the bending portion is bent so that the extending direction of the flexible substrate is reversed, and the tongue-like portion has a length equal to or less than the curvature radius of the bending portion. It is possible to prevent the tongue-like portion near the protrusion from protruding from the curved portion in the extending direction of the flexible substrate, and the liquid crystal device can be reduced in size.

According to an aspect of the present invention, the bending portion has a bending start point and a bending end point, and the tongue-like portion connects the bending start point and the bending end point of the bending portion. It is characterized by having a length of ½ or less of the height. Accordingly, the bending portion has a bending start point and a bending end point, and the tongue-like portion has a length equal to or less than ½ of the height connecting the bending start point and the bending end point of the bending portion. Therefore, for example, the tongue-like portion near the curved portion can be prevented from protruding from the curved portion in a direction perpendicular to the height direction, and the liquid crystal device can be miniaturized.

According to an aspect of the present invention, the tongue-like portion has a flat portion, and the flat portion is provided in parallel to a line segment connecting the bending start point and the bending end point. It is characterized by. Thereby, the tongue-shaped portion has a flat portion, and the flat portion is provided in parallel to the line segment connecting the bending start point and the bending end point. For example, conventionally, the flexible substrate is bent. An electronic component or the like could not be placed at the position, but a tongue-like portion can be provided near the bent position, and the stress of the flexible base material is divided by the opening to break the electronic component provided on the tongue-like portion Etc., and
By arranging the wiring or the like on the tongue-like portion, another wiring can be routed in the vacant area.

According to an aspect of the present invention, the flexible substrate has two openings and two tongues, and the two openings have the two tongues facing away from each other. It is formed so that it becomes. Accordingly, the flexible substrate has two openings and two tongues, and the two openings are formed so that the two tongues are opposite to each other. When the flexible substrate is bent on one opening side and the other opening side of the component, the stress generated in the flexible substrate is divided by one opening and the other opening, and the tongue-shaped portion It is possible to prevent stress from acting on the wiring, electronic parts and the like, and to prevent the wiring of the tongue-shaped part and the electronic parts from being damaged.

According to an aspect of the present invention, the electronic component is a point light source. Thereby, since the electronic component is a point light source, for example, a light emitting diode as a point light source having a light emitting surface on the upper surface side opposite to the mounting surface side of the electronic component is used, for example, to be stacked on a substrate. Light can be applied to the provided light guide plate. Since a light emitting diode having a light emitting surface on the side surface orthogonal to the upper surface causes high costs, the use of a light emitting diode having a light emitting surface on the upper surface side can reduce the cost.

According to one aspect of the present invention, the length of the opening in the bending direction along the bending portion is a length L,
When a height connecting the bending start point and the bending end point of the bending portion is a height h, L ≦
It is characterized by satisfying πh / 2. Thus, when the length of the opening in the bending direction along the bending portion is length L, and the height connecting the bending start point and the bending end point of the bending portion is height h, L ≦ π
Since h / 2 is satisfied, for example, by setting the length of the opening in the bending direction along the bending portion to the length L, the opening can be formed over substantially the entire region in the bending direction along the bending portion, The flexible substrate can be bent more easily and the repulsive force can be reduced, and the stress can be more reliably divided at the opening to prevent the wiring of the tongue-shaped portion and the electronic component from being damaged.

According to one form of this invention, the said opening part is slit shape, It is characterized by the above-mentioned. Accordingly, since the opening is slit-shaped, for example, the width of the opening can be narrowed and the area for forming the opening can be reduced as compared with the case where the opening is different from the slit. . Therefore, it is possible to secure a region for providing another wiring or a region for mounting another electronic component at a position where an opening has been conventionally formed.

A mounting structure according to another aspect of the present invention is a mounting structure including a flexible substrate having a curved portion and having at least one of a wiring and an electronic component, wherein the flexible substrate has a tongue An opening surrounding the tongue-like portion, and the curved portion provided on both sides of the tongue-like portion so as to sandwich the opening. And the one of the wirings is arranged.

In the present invention, the flexible substrate has a tongue-shaped portion, an opening surrounding the tongue-shaped portion, and a curved portion provided so as to sandwich the opening on both sides of the tongue-shaped portion. Since at least one of the electronic component and the wiring is disposed, for example, the stress generated in the curved portion is divided by the opening portion to prevent the stress from acting on the tongue-like portion, and the tongue-like portion remains flat. For example, it is possible to prevent stress from acting on the wiring and electronic parts arranged on the tongue-shaped part, and it is possible to prevent damage to the wiring and electronic parts on the tongue-shaped part without using a separate member. .

In addition, since curved portions provided so as to sandwich the opening on both sides of the tongue-shaped portion are provided, for example, in the past, when wiring or electronic parts are arranged close to the curved portion, wiring or the like is provided together with the flexible substrate. However, the wiring on the tongue-shaped part, the electronic component, etc. can be arranged close to the curved part together with the tongue-shaped part. Furthermore, conventionally, when the opening is formed in the curved portion, the opening is formed without forming the tongue-shaped portion, whereas the portion that has been removed to form the opening is conventionally used. The tongue-like portion surrounded by the opening can be formed without using a separate member. In addition, since at least one of the electronic component and the wiring is arranged on the tongue-shaped portion, for example, the tongue-shaped portion near the curved portion can be used as a region for arranging the wiring, the electronic component, etc. By arranging the wiring and electronic parts on the tongue-like portion, another wiring and electronic parts can be provided in the vacant area, or the size can be reduced.

An electro-optical device manufacturing method according to another aspect of the present invention includes a substrate and a flexible substrate that is connected to the substrate and includes a curved portion and includes at least one of a wiring and an electronic component. A wiring forming step of forming the wiring on the flexible substrate; and
A tongue-shaped portion forming step of forming an opening in the flexible substrate to form a tongue-shaped portion surrounded by the opening and having the one of the wiring and the electronic component disposed thereon; and the flexibility A bending portion forming step of forming a bending portion by bending portions on both sides of the opening of the substrate.

In the present invention, a wiring forming step for forming wiring on a flexible substrate, and a tongue-shaped portion in which at least one of wiring and electronic components is disposed by being surrounded by the opening by forming an opening in the flexible substrate. And a bending portion forming step for forming a bending portion by bending portions on both sides of the opening of the flexible substrate. For example, the bending portion forming step is flexible. Even if both sides of the opening of the conductive substrate are bent, the stress generated in the bent portion is divided by the opening to prevent the stress from acting on the tongue, and the tongue is left flat. It is possible to prevent stress from acting on the wiring and the electronic component, and to prevent damage to the wiring and the electronic component without using a separate member. Also,
Since the bending portion forming step for forming the bending portion is provided by bending the opening portion on both sides of the opening portion of the flexible substrate, for example, conventionally, it is flexible when trying to arrange wiring and electronic parts close to the bending portion. The wiring and the electronic parts on the tongue-like part should be placed close to the curved part together with the tongue-like part in the curved part forming process, while the wiring etc. may be bent with the conductive substrate. Can do. Therefore, for example, another wiring or electronic component can be provided in the vacant region by arranging the wiring, the electronic component, or the like close to the curved portion on the tongue portion. Furthermore, conventionally, when the opening is formed in the curved portion, the opening is formed without forming the tongue-shaped portion, whereas the portion that has been removed to form the opening is conventionally used. The tongue-like portion surrounded by the opening can be formed without using a separate member. In addition, since at least one of the electronic component and the wiring is formed on the tongue-shaped portion, for example, the tongue-shaped portion near the curved portion can be used as a region for arranging the wiring, the electronic component, etc. In addition, by forming an electronic component or the like on the tongue-like portion, another wiring or electronic component can be provided in the vacant region, or the size can be reduced.

An electronic apparatus according to another aspect of the invention includes the above-described electro-optical device.

In the present invention, since the electro-optical device that can prevent the breakage of the wiring, the electronic component, and the like provided near the curved portion of the flexible substrate without using another member is provided, the display performance is improved. An excellent electronic device can be obtained.

Embodiments according to the present invention will be described below with reference to the drawings. In the following description of the embodiments, a liquid crystal device as an electro-optical device, specifically, a reflective transflective TFT (Th
In Film Transistor) An active matrix type liquid crystal device, a method for manufacturing the liquid crystal device, and an electronic apparatus using the liquid crystal device will be described, but the present invention is not limited thereto. Moreover, in the following drawings, in order to make each structure easy to understand, the actual structure and the scale and number of each structure are different.

  (First embodiment)

1 is a schematic perspective view of a liquid crystal device according to a first embodiment of the present invention, FIG. 2 is a cross-sectional view taken along line AA of the liquid crystal device of FIG. 1, and FIG. Integrated
FIG. 4 is an enlarged cross-sectional view in the vicinity of the semiconductor IC of the circuit board of the liquid crystal device of FIG. In FIG. 3, the circuit board 3 is shown in a state before being bent. Further, illustration of insulating films formed on one surface and the other surface of the circuit board 3 is omitted.

  (Configuration of liquid crystal device)

The liquid crystal device 1 includes a liquid crystal panel 2, a circuit board 3 connected to the liquid crystal panel 2, a frame 4 that supports the liquid crystal panel 2, and the like.

The liquid crystal panel 2 includes a substrate 5, a substrate 6 provided so as to face the substrate 5, and the substrates 5 and 6.
And a liquid crystal (not shown) sealed by a sealing material 7 and substrates 5 and 6 provided between the two. For example, TN (Twisted Nematic) is used for the liquid crystal.

The substrate 5 and the substrate 6 are plate-like members made of a light-transmitting material such as glass or synthetic resin. A gate electrode 8, a source electrode 9, a thin film transistor element T and a pixel electrode 10 are formed on the liquid crystal side of the substrate 5, and a common electrode 6 a is formed on the liquid crystal side of the substrate 6.

The gate electrode 8 is formed in the X direction, and the source electrode 9 is formed in the Y direction, for example, by a metal material such as aluminum. The source electrode 9 is formed, for example, as shown in FIG. 1, with the upper half routed to the left side and the lower half routed to the right side. Note that the numbers of the gate electrode 8 and the source electrode 9 can be appropriately changed according to the resolution of the liquid crystal device 1 and the size of the display area.

The thin film transistor element T includes three terminals connected to the gate electrode 8, the source electrode 9, and the pixel electrode 10, respectively. The thin film transistor element T is electrically connected to the pixel electrode 10, the gate electrode 8, and the source electrode 9. Thereby, when a voltage is applied to the gate electrode 8, a current flows from the source electrode 9 to the pixel electrode 10 or vice versa.

The substrate 5 includes a region (hereinafter referred to as “projected portion”) 5 a that projects from the outer edge of the substrate 6. On the surface of the projecting portion 5a, output wirings 11 to 13, input wirings 14 to
16 is attached, and for example, a driver IC 17 for driving the liquid crystal is mounted.

As shown in FIG. 2, the output wiring 11 has one end 18 connected to the driver side output terminal 19 of the driver IC 17 and the other side connected to the gate electrode 8. Output wiring 12 and output wiring 13
The one end is connected to a driver side output terminal (not shown) of the driver IC 17 and the other side is connected to the source electrode 9.

As shown in FIG. 2, the input wiring 14 has one end 21 connected to the driver-side input terminal 22 of the driver IC 17 and the other end connected to the one side of the flexible substrate 20 of the circuit board 3. 2
3 is connected via an ACF (anisotropic conductive film) or the like (not shown). The connecting portion 23 is a wiring 25 formed on the other surface side of the flexible substrate 20.
Are connected to each other through a conductive member 24 in the through hole. Each of the input wirings 15 and 16 has one end connected to a driver-side input terminal (not shown) of the driver IC 17 and the other end connected to a connection (not shown) formed on one surface side of the flexible substrate 20. It is connected to wirings 26 and 27 on the other surface side of the flexible substrate 20 shown in FIG. 1 through a conductive member in a through hole (not shown).

The driver IC 17 is a driver-side input terminal 2 protruding from the mounting surface side of the driver IC 17.
2 and a driver side output terminal 19. The driver IC 17 is, for example, an AC (not shown)
It is mounted on the substrate 5 side by an adhesive such as F.

As shown in FIGS. 1 and 2, the circuit board 3 is connected to the projecting portion 5 a via, for example, an adhesive (not shown) and is bent. The circuit board 3 includes a flexible base material 20
The flexible substrate 20 is provided so as to surround the tongue-like portion 28 in which wirings 36 and semiconductor ICs 31 to be described later shown in FIG. 4 are arranged, and the tongue-like portion 28 as shown in FIG. 4 provided on both sides of the opening 29 in a direction (Y direction in FIGS. 3 and 4) intersecting the opening 29 and the direction in which the tongue-like portion 28 protrudes (X direction in FIGS. 3 and 4). And a bending portion 30 shown in FIG.

The flexible base material 20 is used as a base material of the circuit board 3, and for example, a resin material or the like is used as a constituent material. For example, polyimide is used as the resin material. On the other surface side of the flexible substrate 20, wirings 25, 26, and 27 are provided.

As shown in FIG. 4, for example, the wiring 25 is routed to the other surface side of the flexible substrate 20, and one end of the wiring 25 is connected to the input wiring 14 via the conductive member 24 in the through hole of the flexible base material 20. Connected to
As shown in FIG. 3, the lower side of the semiconductor IC 31 is routed and connected to a conductive member 34 in a through hole shown in FIG. As shown in FIG. 1, the wirings 26 and 27 are formed of the flexible base 2
Is connected to the input wirings 15 and 16 via a conductive member in a through hole (not shown) of the flexible base material 20 and the other end is, for example, It is connected to an electronic component (not shown).

As shown in FIG. 4, the tongue-shaped portion 28 is a substrate 5 as a connection surface between the substrate 5 and the flexible base material 20.
A plane (X in FIG. 4) that is substantially parallel to the connection surface S between the input wiring 14 and the connection portion 23 of the flexible base material 20.
(Y plane) is provided flat.

The shape of the tongue portion 28 is, for example, a tongue piece shape as shown in FIG. In addition, about the shape of the tongue-shaped part 28, it is not limited to this, For example, a substantially rectangular shape may be sufficient. The tongue portion 28 has a length equal to or less than the curvature radius of the curved portion 30. The tongue-like portion 28 has a length equal to or less than ½ of a height h connecting a bending start point Pi and a bending end point Pf, which will be described later, of the bending portion 30. When the length in the protruding direction of the tongue-like portion 28 (the X direction in FIGS. 3 and 4) is a length a, a ≦ h / 2 is satisfied. Here, the direction in which the tongue-shaped portion 28 protrudes is, for example, both ends 29 </ b> A in the longitudinal direction of the opening 29.
, 29B (Y direction in FIG. 3) intersecting direction (X direction in FIG. 3). In FIG. 4 and the like, the illustration of the insulating film covering the wiring 25 and the like is omitted, but the height h is a height including the thickness of the insulating film or the like (not shown).

As shown in FIG. 4, the end face 28 a of the tongue-like portion 28 is a plane E (Y in FIG. 4) including the end face of the substrate 5.
(Z plane) away from the plane E in the X direction, and at the same position in the X direction as the end 30a of the bending portion 30 farthest away from the plane E in the X direction, or located on the plane E side. . That is, the end face 28a is provided so as not to protrude in the X direction from the end 30a.

As shown in FIGS. 3 and 4, for example, a tongue side input terminal 33 is formed on one surface side of the tongue 28, and a tongue side output terminal 32 is formed near the tongue 28. Yes. Tongue 28 includes
A through hole is formed at a position overlapping the tongue-shaped portion side input terminal 33 in a plan view, and a conductive member 35 is provided in the through hole. Near the tongue 28, the tongue-side output terminal 32 is provided.
A through hole is formed in a position overlapping with the conductive member 34 in the through hole.
Is provided. The tongue side input / output terminals 32 and 33 are connected to the conductive members 34 and 35. A wiring 36 connected to the conductive member 35 is provided on the other surface side of the tongue 28.
The wiring 36 is connected to an electronic component or the like (not shown). On the other surface side near the tongue-like portion 28, a wiring 25 connected to the conductive member 34 is provided.

As shown in FIG. 3, the opening 29 is provided in a substantially U shape on one side of the semiconductor IC 31 so as to surround the two corners R <b> 1 on one side of the semiconductor IC 31. As shown in FIG. 3, when the length of the opening 29 in the bending direction of the bending portion 30 (the X direction in FIG. 3 before bending) is the length L, L ≦ πh / 2 is satisfied. Yes. For example, when L = πh / 2, the opening 29 is provided over substantially the entire region in the bending direction of the bending portion 30. The width w of the opening 29 is U
It is substantially the same in the longitudinal direction of the opening 29 curved in a letter shape.

The curved portion 30 is a portion where the curvature of the flexible base material 20 is not 0. For example, in FIGS.
This is a bent portion on the opposite side of the plane E from the driver IC 17 side. The bending portion 30 has a bending start point Pi and a bending end point Pf, and is provided so that the extending direction of the flexible substrate 20 is reversed. The curved portion 30 is provided so as to be curved in a substantially U shape as a whole by being pulled out from the plane E to the side opposite to the driver IC 17 side and bent toward the frame 4 side.

For example, as shown in FIG. 4, the semiconductor IC 31 includes semiconductor IC side input / output terminals 37 and 38. The semiconductor IC side input / output terminals 37 and 38 are connected to the tongue-like portion side input / output terminals 32 and 33 via, for example, solder 39.

  (Manufacturing method of the liquid crystal device 1)

  Next, a method for manufacturing the liquid crystal device 1 will be described with reference to the drawings.

FIG. 5 is a flowchart showing manufacturing steps of the liquid crystal device 1 according to the first embodiment. In the present embodiment, the manufacturing process (S1) of the liquid crystal panel 2 is the same as that of the known technique, and thus the description thereof is omitted. The manufacturing process (S2 to S4) of the circuit board 3 and the bending process of the circuit board 3 (S7). Will be explained mainly.

First, while manufacturing the liquid crystal panel 2, the tongue-like portion side input / output terminals 32 and 33 are formed on one surface side of the flexible substrate 20, and the wirings 25 and 36 are formed on the other surface side (S2). . For example, a through hole is formed in the flexible base material 20, and the tongue-like portion side input / output terminals 32 and 33 are connected to the wirings 25 and 36 through the conductive members 34 and 35, respectively.

Next, the tongue-shaped part 28 is formed by forming the substantially U-shaped opening part 29 in the flexible base material 20 (S3). At this time, the height h connecting the bending start point Pi and the bending end point Pf, the length in the protruding direction of the tongue 28 (the X direction in FIGS. 3 and 4), the length a is a ≦ h / 2. To satisfy.
Thereby, after the bending process (S7) described later, as shown in FIG.
It is possible to prevent a from projecting in the X direction from the end 30a of the bending portion 30.

Next, the tongue-shaped portion side input / output terminals 32 and 33 on the tongue-shaped portion 28 and the semiconductor IC side output / input terminals 37 and 38 of the semiconductor IC 31 are connected via, for example, solder 39 (S4). Thereby, the semiconductor IC 31 is mounted on the tongue-shaped portion 28 in a state where the semiconductor IC 31 is close to the curved portion 30.

Then, the connection part 23 of the circuit board 3 and the input wiring 14 of the board | substrate 4 are connected through the adhesive material which is not shown in figure (S5).

  Subsequently, the frame 4, the light guide plate and the like are fixed to the liquid crystal panel 2 (S6).

Then, the circuit board 3 is bent in a substantially U shape from the projecting portion 5a side of the substrate 5 to the frame 4 side by bending portions on both sides of the opening 29 of the circuit board 3, and the other end of the circuit board 3 is bent. The liquid crystal device 1 is manufactured, for example, by fixing the part to the light guide plate side (S7). As a result, the tongue 28
The curved portion 30 can be formed while maintaining a flat shape. At this time, the end surface 28a of the tongue-shaped portion 28 and the end 30a of the bending portion 30 are located at substantially the same position in the X direction.

  This is the end of the description of the method for manufacturing the liquid crystal device 1.

As described above, according to the present embodiment, the flexible substrate 20 includes the tongue portion 28 in which the wiring 36 and the semiconductor IC 31 are disposed, the opening portion 29 provided so as to surround the tongue portion 28, and the tongue shape. Since the bending portion 30 is provided on both sides of the portion 28 so as to sandwich the opening 29, the bending portion 30 is provided.
The stress generated in the step is divided by the opening 29 to prevent the stress from acting on the tongue 28 and to prevent the tongue 28
Can be kept flat, stress can be prevented from acting on the wiring 36 and the semiconductor IC 31 of the tongue-shaped portion 28, and damage to the wiring 36 and the semiconductor IC 31 can be prevented without using a separate member.

In addition, since the curved portion 30 is provided on both sides of the tongue-shaped portion 28 so as to sandwich the opening 29, for example, conventionally, when the wiring 36 and the semiconductor IC 31 are arranged close to the curved portion 30, the flexible substrate 20 is arranged. At the same time, there is a possibility that the wiring 36 and the like may be bent, so that the wiring 36 and the semiconductor IC 31 on the tongue 28 can be arranged close to the bending portion 30 together with the bending portion 30. For example, since the opening 29 is formed between the tongue-shaped portion 28 and the curved portion 30, when the curved portion 30 is formed, the stress of the curved portion 30 is divided by the opening 29 and the tongue-shaped portion 28. So that the tongue 28 can remain flat. Therefore, for example, the wiring 36 and the semiconductor IC 31 are connected to the bending portion 30.
By arranging it on the tongue-like portion 28 so as to be close to, it is possible to provide another wiring or electronic component in the vacant region, or to reduce the size. Conventionally, when the opening is formed in the curved portion, the opening is formed without forming the tongue-shaped portion, whereas the portion that has been removed to form the opening is conventionally used. The tongue 28 surrounded by the opening 29 can be formed without using a separate member.

Further, conventionally, when the opening is formed in the curved portion of the flexible substrate 20, the opening is formed without forming the tongue-shaped portion 28, whereas it is removed to form the conventional opening. The tongue-shaped portion 28 surrounded by the opening 29 can be formed using the portion thus formed without using a separate member.

Further, since the protruding direction of the tongue-shaped portion 28 (X direction in FIG. 3) and the bending direction of the bending portion 30 (X direction in FIG. 3) are parallel, for example, the wirings 25 and 36 are formed in a tongue shape. For example, the stress acting on the wirings 25 and 36 can be suppressed to prevent breakage or the like.

Further, the tongue-shaped portion 28 has a length a that is equal to or less than the radius of curvature of the curved portion 30, a height h that connects the bending start point Pi and the bending end point Pf of the curved portion 30, and the tongue-shaped portion 28. When the length in the projecting direction (X direction in FIG. 3) is a length a, a ≦ h / 2 is satisfied, so that, for example, the end face 28a of the tongue-like portion 28 near the bending portion 30 is the bending portion 30. Therefore, the liquid crystal device 1 can be reduced in size because it does not protrude from the end 30a in the protruding direction of the tongue portion 28 (X direction in FIG. 4).

Further, when the length of the opening 29 in the bending direction along the bending portion 30 is a length L, L ≦ πh
/ 2 is satisfied, for example, the opening can be surely formed in the bending direction along the bending portion 30, and the stress is divided at the opening 29 to damage the wiring 36 on the tongue 28 and the semiconductor IC 31. Can be prevented. Further, the length L of the opening 29 in the bending direction along the bending portion 30 is set to πh /
2, the opening is formed over substantially the entire region in the bending direction along the bending portion 30, and the flexible base material 20 can be bent more easily and the repulsive force can be reduced. In addition, the stress can be divided at the opening 29 to prevent the wiring 36 on the tongue 28 and the semiconductor IC 31 from being damaged.

  (Second Embodiment)

Next, a second embodiment according to the present invention will be described. In addition, about this following embodiment, the same code | symbol is attached | subjected to the same structural member etc. as 1st Embodiment, the description is abbreviate | omitted, and a different location is demonstrated centering. Further, since the manufacturing method of the liquid crystal device is substantially the same as that of the first embodiment, the description thereof is omitted.

  (Configuration of liquid crystal device)

6 is a schematic perspective view of the liquid crystal device according to the second embodiment, and FIG. 7 is a cross-sectional view taken along the line BB of the liquid crystal device of FIG.

In the first embodiment, the tongue-shaped portion 28 is provided in the same plane as the connection surface S, and the opening 29 is provided around the tongue-shaped portion 28. However, in this embodiment, the bending starts. Two tongue-shaped portions 40 to be described later are provided in parallel to a line segment connecting the point Pi and the curve end point Pf, and the two tongue-shaped portions 4 are provided.
In this example, a substantially U-shaped first opening 41a and a second opening 41b are provided around 0.

The liquid crystal device 1 ′ includes a liquid crystal panel 2 and a circuit board 3 ′ connected to the liquid crystal panel 2.

As shown in FIGS. 6 and 7, the circuit board 3 includes a flexible base material 20 ′, and the flexible base material 20 ′ includes a wiring 36 ′ described later and a light emitting diode (Light) as a point light source. Emit
Hereinafter, it is abbreviated as LED. ) Two tongues 4 on which 31 'is arranged
0, a first opening 41a and a second opening 41b provided so as to surround each of the two tongues 40, and first openings 41a on both sides of each tongue 40, Second opening 4
And a curved portion 30 'provided so as to sandwich 1b.

The flexible base material 20 ′ is used as a base material for the circuit board 3 ′. Wirings 25 ′, 26 and 27 are provided on the other surface side of the flexible substrate 20 ′.

As shown in FIG. 7, the wiring 25 ′ is routed, for example, to the other surface side of the flexible substrate 20 ′, and one end thereof is connected to the input wiring 14 through the conductive member 24 in the through hole. ´
Is connected to the conductive member 34 in the through hole of the flexible base material 20 ′.

As shown in FIG. 7, the tongue-like portion 40 is a plane parallel to the plane E including the end face of the substrate 5 (Y in FIG. 7).
(Z plane) is provided flat. As shown in FIG. 7, the tongue 40 has a bending start point P.
It is provided in parallel to the line segment connecting i and the bending end point Pf.

The shape of the tongue-like portion 40 is, for example, a substantially semi-disc shape as shown in FIG. The tongue-like portion 40 has a length a ′ that is equal to or less than the radius of curvature of the curved portion 30 ′. The tongue-like portion 40 has a length a ′ that is ½ or less of the height h connecting the bending start point Pi and the bending end point Pf of the bending portion 30 ′. When the width of the curved portion 30 ′ in the X direction is the width h / 2 and the length in the direction in which the tongue-shaped portion 40 protrudes (the Z direction in FIG. 7) is the length a ′, a ′ ≦ h / 2 Meet. Here, the direction in which the tongue-shaped portion 40 protrudes is, for example, a direction connecting both ends in the longitudinal direction of the first opening 41a (Y direction in FIG. 6).
Is a direction (Z direction in FIG. 6) intersecting with. In FIG. 7 and the like, the illustration of the insulating film covering the wiring 25 ′ and the like is omitted, but the height h is a height including the thickness of the insulating film or the like (not shown).

As shown in FIG. 7, the upper end surface 40a of one tongue-shaped portion 40 and the lower end surface 40b of the other tongue-shaped portion 40 are substantially at the same position in the Z direction as the upper and lower end surfaces of the curved portion 30 ′ or LED 31 ′. Located on the side. That is, the upper and lower end surfaces 40a and 40b are provided so as not to protrude in the Z direction from the upper and lower end surfaces of the circuit board 3 ′.

For example, tongue-shaped portion side input / output terminals 32 and 33 are formed on one surface side of the two tongue-shaped portions 40. The tongue-like portion 40 is formed with a through hole at a position overlapping the tongue-like portion side input / output terminals 32 and 33 in a plan view, and conductive members 34 and 35 are provided in the through hole, respectively.
The tongue side input / output terminals 32 and 33 are connected to the conductive members 34 and 35. Wirings 25 ′ and 36 ′ connected to the conductive members 34 and 35 are provided on the other surface side of the tongue-like portion 40. The wiring 36 'is connected to an electronic component or the like (not shown).

As shown in FIGS. 6 and 7, the first opening 41 a and the second opening 41 b are formed so that the two tongue-like portions 40 are opposite to each other. For example, the first opening 41a, the second
The opening portions 41b are provided to face each other so as to surround the tongue-like portion 40, respectively. As shown in FIGS. 6 and 7, the first opening 41a is provided in a substantially U shape on one side of the LED 31 ′ so as to surround two corners L1 on one side of the LED 31 ′. Opening 41b is LED3
It is provided in a substantially U shape on the other side of the LED 31 ′ so as to surround the two corners L2 on the other side of 1 ′. As shown in FIG. 7, the first and second openings 41a in the bending direction of the bending portion 30 ′ are curved.
When each length of 41b is defined as a length L ′, L ′ ≦ πh / 4 is satisfied. L ′ is indicated by a one-dot chain line in FIG. For example, when the lengths L ′ of the first openings 41a and 41b are approximately L ′ = πh / 4, the first and second openings 41a and 41b are curved portions 30 ′.
Are provided over substantially the entire region in the bending direction. The first opening 41a and the second opening 4
L ′ with 1b does not become πh / 4 at the same time. The widths of the first and second openings 41a and 41b in the direction intersecting the longitudinal direction are substantially the same in the longitudinal direction curved in a U shape.

The curved portion 30 ′ is a portion where the curvature of the flexible base material 20 ′ is not 0. For example, in FIG. 7, the curved portion 30 ′ is a bent portion on the side opposite to the substrate 5 side from the plane E. The curved portion 30 ′ is provided so as to be curved in a substantially U shape as a whole by being drawn from the plane E to the opposite side of the substrate 5 and bent to the frame 4 side.

Thus, according to the present embodiment, the tongue-like portion 40 is provided in parallel to the line segment connecting the bending start point Pi and the bending end point Pf, as shown in FIG. An electronic component or the like could not be arranged at the bent position of the flexible substrate 20 ′, but two tongue-shaped portions 40 were provided in an island shape so as to be surrounded by the curved portion 30 ′, and the LEDs 31 ′ were formed on the two tongue-shaped portions 40. Can be provided,
For example, the stress due to the bending of the flexible substrate 20 is divided by the first opening 41a and the second opening 41b to prevent the stress from acting on the wiring 36 'and the LED 31' on the tongue 40. Breakage and the like can be prevented, and another wiring or the like can be routed in the vacant area.

Further, as shown in FIG. 7, the tongue-like portion 40 is provided in parallel to a line segment connecting the bending start point Pi and the bending end point Pf, so that, for example, the side opposite to the mounting surface side of the LED 31 ′ By mounting the LED 31 ′ having a light emitting surface on the upper surface Sa side on the tongue-like portion 40, for example, a light guide plate (not shown) provided so as to be laminated on the substrate 5 can be irradiated with light in the direction of arrow La. it can.
Since the light emitting diode having the light emitting surface on the side surface orthogonal to the upper surface Sa causes a high cost, the use of the light emitting diode having the light emitting surface on the upper surface Sa can reduce the cost.

Further, the height h connecting the bending start point Pi and the bending end point Pf, the width h / 2 of the width occupied by the bending portion 30 'in the X direction, and the direction in which the two tongue-like portions 40 protrude (Z in FIG. 7). When the length of each direction is set to the length a ′, a ′ ≦ h / 2 is satisfied, so that the upper and lower end surfaces 40a, 40b of the tongue-like portion 40 near the curved portion 30 ′ are, for example, the curved portion 30. It is possible to prevent the tongue-shaped portion 40 from protruding in the protruding direction (the Z direction in FIG. 7) from the upper and lower end surfaces of ′, and the liquid crystal device 1 ′ can be thinned.

In the present embodiment, as shown in FIG. 7, the two tongue-shaped portions 40 have a bending start point Pi,
The example provided in parallel with the line segment which connects the curve end point Pf was shown. However, the position where the two tongue-shaped portions 40 are arranged is not limited to this. For example, the tongue-shaped portion 40 is formed on a plane that forms an angle of 45 degrees with respect to a line segment connecting the bending start point Pi and the bending end point Pf. A portion may be provided. In addition, an example has been shown in which the lengths a ′ of the two tongue-shaped portions 40 in the opposite directions are substantially equal to each other. However, the length is not limited to this, and the length may be appropriately changed so that one length is shorter than the other length. It may be.

  (Third embodiment)

Next, a third embodiment according to the present invention will be described. The method for manufacturing the liquid crystal device is substantially the same as in the first embodiment, and a description thereof will be omitted.

  (Configuration of liquid crystal device)

8 is a schematic perspective view of the liquid crystal device according to the third embodiment, FIG. 9 is a schematic perspective view of a capacitor of the liquid crystal device of FIG. 8, and FIG. 10 is a cross-sectional view taken along the line CC of the liquid crystal device of FIG.

In the first embodiment, the semiconductor IC 31 is mounted on the tongue portion 28 of the circuit board 3. However, in this embodiment, a capacitor 52 is mounted on the tongue portion 51 of the circuit board 50 described later. This is an example.

As shown in FIGS. 8 and 9, the liquid crystal device 100 includes a liquid crystal panel 2 and a circuit board 50 connected to the liquid crystal panel 2.

As shown in FIG. 10, the circuit board 50 includes a flexible base material 50a used as a base material of the circuit board 50, and an insulating film provided on one side and the other side of the flexible base material 50a. 50b, 50
c. Further, as shown in FIG. 10, the circuit board 50 includes a tongue-like portion 51 in which a part of board-side input / output terminals 55 and 56 described later shown in FIG. 9 is formed, and a tongue on one side of the tongue-like portion 51. An opening 53 provided so as to surround the shaped part 51, and a curved part 54 provided so as to sandwich the opening 53 on both sides of the tongue-like part 51. For example, at least part of the board-side input / output terminals 55 and 56 shown in FIG.

As shown in FIG. 8, the tongue-like portion 51 is provided flat in a plane parallel to the connection surface S ′ between the substrate 5 and the circuit board 50. The shape of the tongue-like portion 51 is, for example, a substantially rectangular shape as shown in FIG. The tongue 51 has a length a that is equal to or less than the radius of curvature of the curved portion 54. Tongue 51
Is a height h connecting the bending start point Pi and the bending end point Pf of the bending portion 54 shown in FIG.
Less than half of the length. The length a of the protruding direction of the tongue 51 (the X direction in FIG. 8) is a
≦ h / 2 is satisfied. Here, the direction in which the tongue-like portion 51 protrudes is, for example, a direction (X direction in FIG. 8) that intersects the direction (Y direction in FIG. 8) connecting the input / output terminals 59 and 60 of the capacitor 52. As shown in FIG. 10, the end face 51 a of the tongue-like portion 51 is substantially at the same position in the X direction as the end of the curved portion 54 or is located on the capacitor 52 side. That is, the end surface 51 a is provided so as not to protrude in the X direction from the end surface of the bending portion 54. As shown in FIG. 8, for example, part of the board-side input / output terminals 55 and 56 is formed on one surface side of the tongue 51, and is connected to the board-side input / output terminals 55 and 56. Output wirings 57 and 58 are formed. The board-side input / output wirings 57 and 58 are connected to an electronic component (not shown) at the end opposite to the side connected to the board-side input / output terminals 55 and 56.

As shown in FIG. 9, the opening 53 is provided on one side of the capacitor 52 so as to surround the two corners L <b> 3 on one side of the capacitor 52. As shown in FIG. 10, when the length of the opening portion 54 in the bending direction of the bending portion 54 is set to the length L, L = πh / 2 (L ≦ πh / 2) is satisfied. For example, as shown in FIG. 10, the length L is the length of a semicircular arc-shaped portion and is indicated by a one-dot chain line. For example, the opening 53 is provided over substantially the entire region in the bending direction of the bending portion 54.

The curved portion 54 is a portion where the curvature of the flexible base material 50a is not 0. For example, the curved portion 54 is a portion bent outside the capacitor 52 in FIG. The curved portion 54 is drawn out from the substrate 5 and bent so as to be curved in a substantially U shape as a whole.

As described above, according to the present embodiment, the circuit board 50 includes the tongue-like portion 51 in which part of the board-side input / output terminals 55 and 56 is formed, and the opening 52 provided so as to surround the tongue-like portion 51. And tongue 5
1 and the curved portion 54 provided so as to sandwich the opening 53 between the both sides of the curved portion 54.
The stress generated in the process is divided by the opening 53 to prevent the stress from acting on the tongue 51 and prevent the tongue 51
Can be kept flat, and stress can be prevented from acting on the board-side input / output terminals 55 and 56 and the capacitor 52 on the tongue 51, and the board-side input / output terminals 55 and 56 and the capacitor 52 can be damaged. Can be prevented without using a separate member.

Further, since the curved portions 54 are provided on both sides of the opening 53 in a direction (Y direction in FIG. 8) that intersects the direction in which the tongue-shaped portion 51 projects (X direction in FIG. 8), for example, If the board side input / output wirings 57, 58 and the capacitor 52 are arranged close to each other, the board side input / output wirings 57, 58 and the like may be disconnected together with the circuit board 50. The stress due to the bending of the portion 54 is divided by the opening 53 so that the tongue-like portion 51 remains flat, so that the substrate-side input / output wirings 57 and 58 and the capacitor 52 on the tongue-like portion 51 are connected together with the tongue-like portion 51. It can be disposed close to the curved portion 54. Therefore, for example, the substrate side input / output wiring 57, 5
8 and the capacitor 52 are arranged close to the curved portion 54 and arranged on the tongue-like portion 51, so that another wiring or electronic component (not shown) can be provided in the vacant region.

  FIG. 11 is a partially enlarged plan view of a circuit board on which slit-like openings are formed.

For example, in the first embodiment, an example in which the width in the direction orthogonal to the longitudinal direction of the opening 29 is the width w has been described. However, the width w of the opening 29 or the like is not limited to this. For example, the opening 61 may be formed in a slit shape as shown in FIG. A slit-like opening 61 may be formed in a substantially U shape around the tongue 60 on which the semiconductor IC 31 or the like is mounted, for example, so as to surround two corners R1 on one side of the semiconductor IC 31. A substantially circular opening end 62 may be formed at both ends of the opening 61.

In this case, since the opening 61 is slit-shaped, for example, the width of the opening 61 can be reduced compared to the case where the opening 61 has a width w unlike the slit as in the first embodiment. The area for forming the opening 61 can be narrowed. So, for example,
In the region where the opening 29 is formed, the tongue-shaped side input / output terminals 32 and 33 and the wirings 25 and 36 are provided.
By shifting the positions for forming etc., the tongue-shaped side input / output terminals 32 and 33 and the wirings 25 and 36 are shifted closer to the curved portion 30 to secure a region for providing another wiring (not shown). In addition, an area for mounting another electronic component (not shown) can be secured, or the size can be reduced.

Further, since the opening end 62 of the opening 61 is circular, it is possible to prevent the circuit board from being cut from the opening end 62 during the bending process or when an external force is applied in a bent state. it can.

Further, even if the curved portions on both sides of the opening 61 are bent, the stress due to bending can be divided by the slit-shaped opening 61 so that the tongue-like portion 60 can be kept flat. It is possible to prevent the tongue-shaped portion side input terminal 33 and the semiconductor IC 31 from being damaged without using a separate member.

In addition, although the example which the opening part 61 has the substantially U-shaped shape which has a corner | angular was shown in FIG. 11, it is good also as a curved substantially U-shaped shape without a corner | angular.

  FIG. 12 is a partially enlarged plan view of a circuit board in which wiring is formed on the tongue-like portion.

Further, for example, in the first embodiment described above, the wiring 36 and the semiconductor IC are provided on the tongue 28.
An example in which a part of 31 is arranged is shown. However, the present invention is not limited to this. For example, as shown in FIG. 12, only the wiring 70 connected to an electronic component or the like (not shown) may be routed around the tongue 28. For example, the wiring 70 may be formed along the substantially U-shaped outline 28 </ b> A of the tongue 28.

In this case, for example, another wiring (not shown), another electronic component, or the like can be arranged in the vacant region R by forming the wiring 70 on the tongue 28. Further, the opening 29 divides the stress due to bending of the flexible base material 20, keeps the tongue-like portion 28 flat, and prevents breakage of the wiring 70 on the tongue-like portion 28 without using another member. be able to.

  (Fourth Embodiment / Electronic Device)

Next, an electronic apparatus according to the fourth embodiment of the present invention including the above-described liquid crystal device 1 will be described.

FIG. 13: is a schematic block diagram of the whole structure of the display control system of the electronic device concerning the 4th Embodiment of this invention.

The electronic device 300 includes, for example, a liquid crystal panel 2 and a display control circuit 390 as a display control system as shown in FIG. 13, and the display control circuit 390 includes a display information output source 391, a display information processing circuit 392, a power supply circuit 393, and the like. A timing generator 394 and the like are included.

The liquid crystal panel 2 includes a drive circuit 361 including a semiconductor element 23 that drives the display region I.
Have

The display information output source 391 includes a ROM (Read Only Memory) and a RAM (R
and a memory unit composed of a magnetic recording disk, an optical recording disk, and the like, and a tuning circuit that tunes and outputs a digital image signal. Further, the display information output source 391 is configured to supply display information to the display information processing circuit 392 in the form of a predetermined format image signal or the like based on various clock signals generated by the timing generator 394.

The display information processing circuit 392 includes various well-known circuits such as a serial-parallel conversion circuit, an amplification / inversion circuit, a rotation circuit, a gamma correction circuit, and a clamp circuit, and executes processing of input display information to display the image. Information is supplied to the drive circuit 361 together with the clock signal CLK. The power supply circuit 393 supplies a predetermined voltage to each component described above.

Thus, according to the present embodiment, the liquid crystal device 1 that can prevent the wiring 36 and the semiconductor IC 31 provided near the curved portion 30 of the flexible substrate 20 from being damaged without using another member. Thus, an electronic device with excellent display performance can be obtained.

Specific electronic devices include a touch panel equipped with a liquid crystal device in addition to a mobile phone, a personal computer, etc., a projector, a liquid crystal television, a viewfinder type, a monitor direct view type video tape recorder, a car navigation, a pager, an electronic notebook, Calculators, word processors, workstations, videophones, POS terminals, etc. Needless to say, for example, the above-described liquid crystal device 1 or the like can be applied as a display unit of these various electronic devices.

Note that the electronic apparatus of the present invention is not limited to the above-described example, and it is needless to say that various modifications can be made without departing from the gist of the present invention. Moreover, you may combine said each embodiment in the range which does not change the summary of this invention.

For example, in the above-described embodiment, the TFT type liquid crystal device 1 and the like have been described. However, the present invention is not limited to this. For example, a TFD (Thin Film Diode) type active matrix type or passive matrix type liquid crystal device may be used. In addition, plasma display devices, electrophoretic display devices, and devices using electron-emitting devices (Field Emis)
sion Display and Surface-Condection Electro
The present invention may be applied to various electro-optical devices such as n-Emitter Display.

1 is a schematic perspective view of a liquid crystal device according to a first embodiment of the present invention. It is AA sectional drawing of the liquid crystal device of FIG. FIG. 2 is a plan view of a semiconductor IC on a circuit board of the liquid crystal device of FIG. 1. FIG. 3 is an enlarged cross-sectional view of the vicinity of a semiconductor IC on a circuit board of the liquid crystal device of FIG. 4 is a flowchart illustrating a manufacturing process of the liquid crystal device according to the first embodiment. It is a general-view perspective view of the liquid crystal device of 2nd Embodiment. It is BB sectional drawing of the liquid crystal device of FIG. It is a general-view perspective view of the liquid crystal device of 3rd Embodiment. FIG. 9 is a schematic perspective view of a capacitor of the liquid crystal device in FIG. 8. It is CC sectional drawing of the liquid crystal device of FIG. It is the elements on larger scale of the circuit board in which the slit-shaped opening part was formed. It is the elements on larger scale of the circuit board by which wiring was formed in the tongue-shaped part. It is a schematic block diagram of the display control system of the electronic device of 4th Embodiment which concerns on this invention.

Explanation of symbols

a, a ′, L, L ′ length, E plane, h thickness, L1, L3 corner, La
Arrow, Pi curve start point, Pf curve end point, R region, S, S ′ connecting surface,
Sa upper surface, w width, 1, 1 ′, 100 liquid crystal device, 2 liquid crystal panel, 3, 3 ′,
50 circuit board, 4 frame, 5, 6 substrate, 5a overhang, 6a common electrode, 7 seal material, 8 gate electrode, 9 source electrode, T thin film transistor element, 10 pixel electrode, 11, 12, 13 output wiring, 14, 15, 16 input wiring, 17 driver IC, 18 one end, 19 driver side output terminal, 20, 2
0 ', 50a Flexible base material, 22 Driver side input terminal, 23 Connection part, 24 Conductive member, 25, 25', 26, 27, 36, 36 ', 70 Wiring, 28, 40, 51
Tongue, 28a, 51a end face, 28A outline, 29, 53, 61 opening,
29A, 29B, 30a end, 30, 30 ′, 54 curved portion, 31 semiconductor IC,
31 'Light emitting diode (LED), 32 Tongue side output terminal, 33 Tongue side input terminal, 34, 35 Conductive member, 37 Semiconductor IC side output terminal, 38 Semiconductor IC side input terminal, 39 Solder, 40a 40b lower end surface, 41a first opening, 41b second opening, 50b, 50c insulating film, 52 capacitor, 55
Substrate side input terminal, 56 Substrate side output terminal, 57 Substrate side input wiring, 58 Substrate side output wiring, 59 Input terminal, 60 Output terminal, 62 Open end, Electronic device 300

Claims (11)

An electro-optical device comprising: a substrate; and a flexible substrate connected to the substrate and having a curved portion and having at least one of a wiring and an electronic component,
The flexible substrate includes a tongue-shaped portion, an opening surrounding the tongue-shaped portion, and the curved portion provided so as to sandwich the opening on both sides of the tongue-shaped portion,
The electro-optical device, wherein the one of the electronic component and the wiring is disposed on the tongue-shaped portion. The curved portion is curved so that the extending direction of the flexible substrate is reversed,
The tongue-shaped portion has a length equal to or less than a radius of curvature of the curved portion.
The electro-optical device according to 1. The bending portion has a bending start point and a bending end point,
3. The electricity according to claim 1, wherein the tongue-like portion has a length of ½ or less of a height connecting the bending start point and the bending end point of the bending portion. Optical device. The tongue has a flat portion;
The electro-optical device according to claim 3, wherein the flat portion is provided in parallel to a line segment connecting the bending start point and the bending end point. The flexible substrate has two openings and two tongues,
5. The electro-optical device according to claim 1, wherein the two openings are formed so that the two tongues are opposite to each other. 6. . The electro-optical device according to claim 1, wherein the electronic component is a point light source. When the length of the opening in the bending direction along the bending portion is a length L, and the height connecting the bending start point and the bending end point of the bending portion is a height h, L ≦ πh / The electro-optical device according to claim 3, wherein The electro-optical device according to claim 1, wherein the opening has a slit shape. A mounting structure including a flexible substrate having a curved portion and having at least one of wiring and electronic components,
The flexible substrate has a tongue-shaped portion, an opening surrounding the tongue-shaped portion, and the curved portion provided so as to sandwich the opening on both sides of the tongue-shaped portion,
The mounting structure according to claim 1, wherein the one of the electronic component and the wiring is disposed on the tongue. An electro-optical device manufacturing method comprising: a substrate; and a flexible substrate connected to the substrate and having a curved portion and having at least one of a wiring and an electronic component,
A wiring forming step of forming the wiring on the flexible substrate;
A tongue-shaped part forming step for forming a tongue-shaped part surrounded by the opening part and forming the one of the wiring and the electronic component by forming an opening in the flexible substrate;
A bending portion forming step of forming a bending portion by bending portions on both sides of the opening of the flexible substrate;
An electro-optical device manufacturing method comprising: An electronic apparatus comprising the electro-optical device according to any one of claims 1 to 8.

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