WO2019106935A1

WO2019106935A1 - Display device

Info

Publication number: WO2019106935A1
Application number: PCT/JP2018/036495
Authority: WO
Inventors: 匠佐野
Original assignee: 株式会社ジャパンディスプレイ
Priority date: 2017-12-01
Filing date: 2018-09-28
Publication date: 2019-06-06
Also published as: JP2019101224A

Abstract

A display device which is provided with: an insulating substrate which has a first region that overlaps with a display region, a second region that overlaps with a plurality of pads that are aligned in a first direction, and a third region that is positioned between the first region and the second region; a signal wiring line which is formed on one surface of the insulating substrate so as to extend in a second direction that intersects with the first direction, and which is connected to the pads; a first supporting substrate which is arranged on the other surface of the insulating substrate, said other surface being on the reverse side of the above-described one surface, and which is bonded to the first region, with a first bonding layer being interposed therebetween; and a second supporting substrate which is bonded to the second region, with a second bonding layer being interposed therebetween. The insulating substrate has, in the other surface, a first slit which extends in the first direction at a first boundary between the first region and the third region, while having a second slit which extends in the first direction at a second boundary between the second region and the third region.

Description

Display device

Embodiments of the present invention relate to a display device.

In recent years, in the field of display devices such as liquid crystal display devices and organic EL (Organic Electroluminescence) display devices, there is an increasing demand for display devices that realize further narrowing of the frame. In addition, a flexible display device which can be bent by being formed using a flexible substrate has been developed.

Such a display device is provided with a pad connected to an external circuit or the like in the non-display area around the display area to supply a voltage to each pixel, a wire connected to the pad, etc. . In order to narrow the frame of the display device, the substrate is accommodated in an electronic device or the like in a bent state such that the pad is disposed on the back surface of the substrate.
Moreover, after manufacturing an organic electroluminescent apparatus on a glass-made board | substrate, the technique which peels a glass-made board | substrate and laminates a flexible back plate on the peeled part is known.

JP, 2015-50181, A JP 2015-148728 A JP, 2014-232300, A

An object of the present embodiment is to provide a display device capable of suppressing a decrease in yield.

According to this embodiment, the first area overlapping the display area, the second area overlapping the plurality of pads arranged in the first direction, and the second area are positioned between the first area and the second area. An insulating substrate having a third region, a signal line formed on one surface of the insulating substrate, extending in a second direction intersecting the first direction, and connected to the pad; the insulating substrate A first support substrate disposed on the other surface side opposite to the one surface side of the first adhesive layer and adhered to the first area via the first adhesive layer, and the second area via the second adhesive layer A second support substrate bonded to the second support substrate, and the insulating substrate extends in the first direction to a first boundary between the first region and the third region on the other surface side A second slit extending in the first direction at a second boundary between the first slit, the second region, and the third region Tsu a preparative and, a display apparatus is provided.

According to this embodiment, the first area overlapping the display area, the second area overlapping the plurality of pads arranged in the first direction, and the second area are positioned between the first area and the second area. An insulating substrate having a third region, a signal line formed on one surface of the insulating substrate, extending in a second direction intersecting the first direction, and connected to the pad; the insulating substrate A first support substrate disposed on the other surface side opposite to the one surface side of the first adhesive layer and adhered to the first area via the first adhesive layer, and the second area via the second adhesive layer And a third support substrate bonded to the second support substrate, the third region including a first portion, a second portion, and a third portion located between the first portion and the second portion. The signal line is continuously formed from the first area to the pad in the second area; In the display device, the display device is formed in a position overlapping with the third portion, and the film thickness of the third portion is larger than the film thickness of the first portion and the film thickness of the second portion. .

FIG. 1 is a perspective view showing a configuration of a display device according to the present embodiment. FIG. 2 is a cross-sectional view showing a display area of the display device shown in FIG. FIG. 3 is a cross-sectional view of the display shown in FIG. 1 along the YZ plane. FIG. 4 is a plan view showing the display device according to the first embodiment. FIG. 5 is a cross-sectional view for explaining the step of peeling the substrate from the insulating substrate. FIG. 6 is a cross-sectional view for explaining a process of attaching a support substrate by an adhesive layer. FIG. 7 is a cross-sectional view for explaining the process of pressure bonding the first flexible wiring substrate to the display panel. FIG. 8 is a cross-sectional view for explaining the step of forming the protective member and the step of cutting the support substrate. FIG. 9 is a cross-sectional view for explaining the step of peeling the portion of the support substrate and the portion of the adhesive layer in the third region. FIG. 10 is a cross-sectional view for explaining the step of bending the bending area of the display panel. FIG. 11 is a cross-sectional view showing the display panel after the bending area shown in FIG. 10 is bent. FIG. 12 is a plan view showing a display device according to the second embodiment. FIG. 13 is a cross-sectional view taken along line AB of the display device shown in FIG. FIG. 14 is a cross-sectional view of the display device shown in FIG. FIG. 15 is a cross-sectional view along the YZ plane of the display device shown in FIG. 1 according to the third embodiment.

Hereinafter, the present embodiment will be described with reference to the drawings. The disclosure is merely an example, and it is naturally included within the scope of the present invention as to what can be easily conceived of by those skilled in the art as to appropriate changes while maintaining the gist of the invention. In addition, the drawings may be schematically represented as to the width, thickness, shape, etc. of each portion as compared with the actual embodiment in order to clarify the description, but this is merely an example, and the present invention It does not limit the interpretation. In the specification and the drawings, components having the same or similar functions as those described above with reference to the drawings already described may be denoted by the same reference symbols, and overlapping detailed descriptions may be omitted as appropriate. .

First, the display device according to the first embodiment will be described in detail.

FIG. 1 is a perspective view showing the configuration of a display device DSP according to the present embodiment. Hereinafter, the case where the display device DSP is an organic electroluminescence (EL) display device will be described.
FIG. 1 shows a three-dimensional space defined by a first direction X, a second direction Y perpendicular to the first direction X, and a third direction Z perpendicular to the first direction X and the second direction Y. ing. The first direction X, the second direction Y, and the third direction Z are orthogonal to each other, but may intersect at an angle other than 90 °.

Further, in the present embodiment, the direction toward the tip of the arrow in the third direction Z is defined as upper, and the direction opposite to the direction toward the tip of the arrow in the third direction Z is defined as downward. Further, in the case of “the second member on the first member” and “the second member below the first member”, the second member may be in contact with the first member or separated from the first member It may be In the latter case, a third member may be interposed between the first member and the second member.

As shown in FIG. 1, the display device DSP includes a display panel PNL, a first flexible printed circuit FPC1, a second flexible printed circuit FPC2, a first support substrate SP1, and a second support substrate SP2.

The display panel PNL includes a flat first substrate SUB1 and a flat second substrate SUB2 opposite to the first substrate SUB1. The display panel PNL also includes a display area DA for displaying an image and a non-display area NDA surrounding the display area DA. The display panel PNL includes a plurality of pixels PX in the display area DA. The plurality of pixels PX are arranged in the first direction X and the second direction Y, and are provided in a matrix.

The first substrate SUB1 has a terminal portion T and a bending area BA in the area extending outward beyond the area overlapping the second substrate SUB2. The three side edges of the first substrate SUB1 are aligned with the three side edges of the second substrate SUB2 in the third direction Z. The length of the side edge parallel to the first direction X of the first substrate SUB1 is substantially equal to the length of the side edge parallel to the first direction X of the second substrate SUB2. Further, the length of the side edge of the first substrate SUB1 parallel to the second direction Y is larger than the length of the side edge parallel to the second direction Y of the second substrate SUB2. That is, the area parallel to the XY plane of the first substrate SUB1 is larger than the area parallel to the XY plane of the second substrate SUB2. Here, the XY plane is a plane defined by the first direction X and the second direction Y.

In the illustrated example, the first flexible printed circuit FPC1 is mounted on the terminal portion T in the non-display area NDA. In the illustrated example, the length of the side edge parallel to the first direction X of the first flexible wiring board FPC1 is compared to the length of the side edge parallel to the first direction X of the first substrate SUB1 and the second substrate SUB2. It may be small but equal. The first flexible printed circuit FPC1 is electrically connected to the display panel PNL. The second flexible printed circuit FPC2 is mounted under the first flexible printed circuit FPC1 and is electrically connected to the first flexible printed circuit FPC1.

The bending area BA is located between the terminal portion T and the display area DA in the non-display area NDA. The bending area BA corresponds to an area to be bent when the display device DSP is accommodated in a housing of an electronic device or the like, and is shown by oblique lines in the drawing. That is, the bending area BA is bent so that the first flexible wiring board FPC1 and the second flexible wiring board FPC2 are disposed below the display area DA.

The first support substrate SP1 and the second support substrate SP2 are attached below the display panel PNL. The first support substrate SP1 overlaps the display area DA in the third direction Z. The second support substrate SP2 overlaps the terminal portion T in the third direction Z. The first support substrate SP1 and the second support substrate SP2 are not arranged at positions overlapping the bending area BA in the third direction Z.

FIG. 2 is a cross-sectional view showing a display area DA of the display device DSP shown in FIG.
As shown in FIG. 2, the display panel PNL includes the insulating substrate 10, the switching elements SW 1, SW 2, SW 3, the reflective layer 4, the organic EL elements OLED 1, OLED 2, OLED 3, the sealing layer 41, the first support substrate SP 1, the first. An adhesive layer AD1, an adhesive layer GL, a film FL and the like are provided. In such an organic electroluminescence display device, the first substrate SUB1 includes the insulating substrate 10, the switching elements SW1, SW2, SW3, the reflective layer 4, the organic EL elements OLED1, OLED2, OLED3, the sealing layer 41, the first adhesion The layer AD1, the first support substrate SP1, the second substrate SUB2 is a film FL, and the first substrate SUB1 and the second substrate SUB2 are bonded to each other by the adhesive layer GL.

The insulating substrate 10 is formed using an organic insulating material, and is formed using, for example, polyimide. The insulating substrate 10 may be a single layer formed of polyimide, or a laminated body in which a layer formed of polyimide, an inorganic film, and a layer formed of polyimide are sequentially laminated. It may be The insulating substrate 10 has one surface SF11 and the other surface SF12 opposite to the one surface. One surface SF 11 of the insulating substrate 10 is covered with the first insulating film 11.

The switching elements SW1, SW2, and SW3 are formed on the first insulating film 11. In the illustrated example, the switching elements SW1, SW2, and SW3 are formed of top gate thin film transistors, but may be formed of bottom gate thin film transistors. Since the switching elements SW1, SW2, and SW3 have the same configuration, the structure will be described in more detail focusing on the switching element SW1. The switching element SW1 includes a semiconductor layer SC formed on the first insulating film 11. The semiconductor layer SC is covered by the second insulating film 12. The second insulating film 12 is also disposed on the first insulating film 11.

The gate electrode WG of the switching element SW1 is formed on the second insulating film 12, and is located directly on the semiconductor layer SC. The gate electrode WG is covered by the third insulating film 13. The third insulating film 13 is also disposed on the second insulating film 12.

The first insulating film 11, the second insulating film 12, and the third insulating film 13 are made of, for example, an inorganic material such as silicon oxide or silicon nitride.

The source electrode WS and the drain electrode WD of the switching element SW1 are formed on the third insulating film 13. The source electrode WS and the drain electrode WD are electrically connected to the semiconductor layer SC through contact holes penetrating the second insulating film 12 and the third insulating film 13, respectively. The switching element SW1 is covered by the fourth insulating film 14. The fourth insulating film 14 is also disposed on the third insulating film 13. Such a fourth insulating film 14 is formed of, for example, an organic material such as a transparent resin.

The reflective layer 4 is formed on the fourth insulating film 14. The reflective layer 4 is formed of a metal material having a high light reflectance, such as aluminum or silver. The upper surface of the reflective layer 4 may be a flat surface or may be an uneven surface for imparting light scattering properties.

The organic EL elements OLED1 to OLED3 are formed on the fourth insulating film 14. That is, the organic EL elements OLED1 to OLED3 are located between the insulating substrate 10 and the film FL. In the illustrated example, the organic EL element OLED1 is electrically connected to the switching element SW1, the organic EL element OLED2 is electrically connected to the switching element SW2, and the organic EL element OLED3 is electrically connected to the switching element SW3. There is. The organic EL elements OLED1 to OLED3 are configured as top emission types that emit blue light, green light, and red light toward the side of the film FL, respectively. All such organic EL elements OLED1 to OLED3 have the same structure. In the illustrated example, the organic EL elements OLED1 to OLED3 are partitioned by the ribs 15, respectively.

The organic EL element OLED1 includes a pixel electrode PE1 formed on the reflective layer 4. The pixel electrode PE1 is in contact with the drain electrode WD of the switching element SW1 and is electrically connected to the switching element SW1. Similarly, the organic EL element OLED2 includes a pixel electrode PE2 electrically connected to the switching element SW2, and the organic EL element OLED3 includes a pixel electrode PE3 electrically connected to the switching element SW3. The pixel electrodes PE1, PE2 and PE3 are formed of, for example, a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO).

For example, the organic EL element OLED1 comprises an organic light emitting layer ORGB emitting blue light, the organic EL element OLED2 comprises an organic light emitting layer ORGG emitting green, and the organic EL element OLED3 comprises an organic light emitting layer ORGR emitting red There is. The organic light emitting layer ORGB is located on the pixel electrode PE1, the organic light emitting layer ORGG is located on the pixel electrode PE2, and the organic light emitting layer ORGR is located on the pixel electrode PE3. In addition, the organic EL elements OLED1 to OLED3 are provided with the common electrode CE. The common electrode CE is located on the organic light emitting layers ORGB, ORGG, ORGR. The common electrode CE is also located on the rib 15. One of the pixel electrode PE and the common electrode CE is an anode, and the other is a cathode. The common electrode CE is formed of, for example, a transparent conductive material such as ITO or IZO.

The sealing layer 41 covers the top of the organic EL elements OLED1, OLED2, and OLED3. The sealing layer 41 seals a member disposed between the insulating substrate 10 and the sealing layer 41. The sealing layer 41 suppresses the entry of oxygen and moisture into the organic EL elements OLED1, OLED2, and OLED3, and suppresses the deterioration of the organic EL elements OLED1, OLED2, and OLED3. The sealing layer 41 may be formed of a laminate of an inorganic film and an organic film.

The film FL is disposed on the sealing layer 41. The film FL is, for example, a protective film, an optical film, or the like, and is formed using a transparent material. The film FL is adhered to the sealing layer 41 by the adhesive layer GL. The adhesive layer GL is formed using, for example, any of an acrylic material, an epoxy material, and a polyimide.

The first support substrate SP1 is bonded to the surface SF12 of the insulating substrate 10 by the first adhesive layer AD1. As a material of the first support substrate SP1, for example, a material which is excellent in heat resistance, gas barrier property, moisture resistance, and strength and is inexpensive is preferable. The first support substrate SP1 has, for example, heat resistance that does not deteriorate or deform at the process temperature in the process of manufacturing the display device DSP. In addition, the first support substrate SP1 has, for example, a strength higher than that of the insulating substrate 10, and functions as a support layer that suppresses a situation where the display panel PNL is bent in the state where no external stress is applied. In addition, the first support substrate SP1 has, for example, a moisture-proof property that suppresses the entry of moisture and the like into the insulating substrate 10, a gas blocking property that suppresses the entry of gas, and the like, and functions as a barrier layer. The first support substrate SP1 is, for example, a film formed using polyethylene terephthalate. The second support substrate SP2 shown in FIG. 1 is also formed using the same material as the first support substrate SP1.

In such a display device DSP, when each of the organic EL elements OLED1 to OLED3 emits light, the organic EL element OLED1 emits blue light, and the organic EL element OLED2 emits green light, and the organic EL element OLED3 Emits red light. Therefore, color display of the display device DSP is realized.

The pixel PX shown in FIG. 1 is, for example, the smallest unit constituting a color image, and includes the above-described organic EL elements OLED1 to OLED3.

In the above configuration example, the organic EL elements OLED1 to OLED3 respectively include the organic light emitting layer ORGB emitting blue light, the organic light emitting layer ORGG emitting green light, and the organic light emitting layer ORGR emitting red light. It is not limited. The organic EL elements OLED1 to OLED3 may be provided with a common organic light emitting layer. At this time, for example, the organic EL elements OLED1 to OLED3 emit white light. In such a configuration example, the color filter layer is disposed on the sealing layer 41.

FIG. 3 is a cross-sectional view of the display device DSP shown in FIG. 1 along the YZ plane.
The insulating substrate 10 has a first area AR1 overlapping the display area DA, a second area AR2 overlapping the terminal T, and a third area AR3 located between the first area AR1 and the second area AR2. doing. The third area AR3 corresponds to an area overlapping the bending area BA. The insulating substrate 10 has a first film thickness T1 in the first region AR1, a second film thickness T2 in the second region AR2, and a third film thickness T3 in the third region AR3. In addition, insulating substrate 10 has slit SL1 at the first boundary BR1 between first region AR1 and third region AR3 on the side of surface SF12, and the second boundary between second region AR2 and third region AR3. And a slit SL2 in BR2. The slit SL1 and the slit SL2 are formed in a straight line along the first boundary BR1 and the second boundary BR2, respectively. The insulating substrate 10 has a film thickness T11 in the slit SL1 and a film thickness T12 in the slit SL2. The first film thickness T1 and the second film thickness T2 are respectively larger than the third film thickness T3. The first film thickness T1 and the second film thickness T2 are equal to each other. The film thicknesses T11 and T12 are respectively smaller than the third film thickness T3.

The insulating substrate 10 has the first surface SF1 of the first region AR1, the second surface SF2 of the second region AR2, and the third surface SF3 of the third region AR3 on the surface SF12 side. The third surface SF3 is located between the first surface SF1 and the second surface SF2. The third surface SF3 is located closer to the surface SF11 than the first surface SF1 and the second surface SF2.

The first support substrate SP1 and the second support substrate SP2 are disposed on the surface SF12 side of the insulating substrate 10. The first support substrate SP1 is bonded to the first surface SF1 of the first area AR1 via the first adhesive layer AD1. The second support substrate SP2 is bonded to the second surface SF2 of the second area AR2 via the second adhesive layer AD2.

Although described later, the insulating substrate 10 has an end EG4 extending in the first direction X. In the illustrated example, the first insulating film 11 and the second insulating film 12 extend in the second direction Y to a position overlapping the end EG 4 of the insulating substrate 10. The third insulating film 13 does not extend in the second direction Y to a position overlapping the first boundary BR1.

The signal wiring 6 is disposed on the second insulating film 12 and the third insulating film 13. That is, the signal wiring 6 is disposed on the surface SF11 side of the insulating substrate 10. The signal wiring 6 is continuously arranged from the first area AR1 to the pad of the second area AR2. In addition, the signal wiring 6 overlaps the first area AR1, the second area AR2, and the third area AR3. The signal wiring 6 is formed of, for example, a laminated body of titanium, aluminum, and titanium. The signal lines 6 correspond to power supply lines, various control lines, and the like.

The fourth insulating film 14 covers the signal wiring 6. The fourth insulating film 14 has a contact hole CH penetrating to the signal wiring 6.

The pad PD is disposed on the fourth insulating film 14 and also disposed in the contact hole CH. Further, the pad PD is disposed at a position overlapping with the second area AR2. The pad PD is electrically connected to the signal wiring 6 in the contact hole CH. The pad PD is formed of, for example, the same material and in the same process as the pixel electrodes PE1, PE2, and PE3 illustrated in FIG. 2, and is formed using ITO, IZO, or the like.

Note that both of the signal wiring 6 and the pad PD may be disposed in the same layer. At this time, the signal wiring 6 and the pad PD may be separately formed or may be integrally formed. Further, as shown in the figure, signal interconnection 6 and pad PD are arranged in different layers, and both are electrically connected through a contact hole formed in the interlayer insulating film between signal interconnection 6 and pad PD. May be

The rib 15, the sealing layer 41, the adhesive layer GL, and the film FL are disposed at positions overlapping the first area AR1 and do not extend to positions overlapping the second area AR2. The sealing layer 41 covers the rib 15 and is also in contact with the fourth insulating film 14. The adhesive layer GL covers the sealing layer 41 and is also in contact with the fourth insulating film 14.

The first flexible printed circuit FPC1 is mounted on the display panel PNL on the fourth insulating film 14. That is, the first flexible printed circuit FPC1 is mounted at a position overlapping the second region AR2 on the surface SF11 side of the insulating substrate 10. The first flexible printed circuit FPC 1 includes the core substrate 200, the connection wiring 100 disposed on the lower surface side of the core substrate 200, and the drive IC chip 3 disposed on the upper surface side of the core substrate 200. The drive IC chip 3 functions as a signal supply source or the like that supplies signals necessary to drive the display panel PNL. The position of the drive IC chip 3 is not particularly limited, and may be disposed on the lower surface side of the core substrate 200.

The display panel PNL and the first flexible printed circuit FPC1 are electrically connected to and bonded to each other through an anisotropic conductive film 8 which is a conductive material. The anisotropic conductive film 8 contains conductive particles dispersed in an adhesive. The anisotropic conductive film 8 is in contact with the pad PD and electrically connected. The anisotropic conductive film 8 is in contact with the connection wiring 100 and is electrically connected. Thus, the connection wiring 100 is electrically connected to the pad PD and the signal wiring 6 via the anisotropic conductive film 8.

The protective member PT is disposed on the fourth insulating film 14 at a position overlapping with the bending area BA. In the illustrated example, the protection member PT is in contact with the upper surface US1 and the side surface SD1 of the first flexible printed circuit FPC1, the upper surface US2 and the side surface SD2 of the film FL, the side surface SD3 of the adhesive layer GL, and the like. By arranging the protective member PT, the thickness of the insulating substrate 10 can be reinforced between the first flexible printed circuit FPC1 and the film FL. The protective member PT is formed of, for example, a resin.

FIG. 4 is a plan view showing the display device DSP according to the first embodiment. FIG. 4 shows the positional relationship and the like of the first area AR1, the second area AR2, and the third area AR3.
The insulating substrate 10 has a first end EG1 and a second end EG2 extending in the second direction Y, and a third end EG3 and a fourth end EG4 extending in the first direction X. ing. The second end EG2 is located on the opposite side of the first end EG1 across the display area DA. The fourth end EG4 is located on the opposite side of the third end EG3 across the display area DA.

In FIG. 4, the first area AR 1 is indicated by diagonal lines rising to the left, and the second area AR 2 is indicated by diagonal lines rising to the right. The third area AR3 overlaps the bending area BA, is located between the first area AR1 and the second area AR2, and extends from the first end EG1 to the second end EG2 along the first direction X There is. The first area AR1, the third area AR3 and the second area AR2 are arranged in the second direction Y in this order. The first area AR1 corresponds to an area overlapping with the first support substrate SP1 in plan view, the second area AR2 corresponds to an area overlapping with the second support substrate SP2 in plan view, and the third area AR3 is This corresponds to a region not overlapping with the first support substrate SP1 and the second support substrate SP2 in plan view. The plurality of pads PD overlap the second area AR2 in plan view, and are arranged side by side in the first direction X. The plurality of signal lines 6 are respectively connected to the pads PD, extend in the second direction Y in the bending area BA, and are arranged side by side in the first direction X. The slit SL1 extends in the first direction X at the first boundary BR1. The slit SL2 extends in the first direction X at the second boundary BR2.

In the illustrated example, the outer shape of the display panel PNL in the XY plane is rectangular, but it may be a round shape in which the four corners of the display panel PNL are rounded.

Next, the manufacturing process of the display device DSP of the present embodiment will be described with reference to FIG. 5 to FIG.

FIG. 5 is a cross-sectional view for explaining a process of peeling the substrate 7 from the insulating substrate 10.
First, the first mother substrate M1 for forming the plurality of first substrates SUB1 is formed on the substrate 7, and the second mother substrate M2 for forming the plurality of second substrates SUB2 is formed by the adhesive layer GL. 1 Bond to the mother substrate M1. Thereafter, in order to peel off the substrate 7 from the insulating substrate 10, the insulating substrate 10 is irradiated with the laser beam LL1 from under the substrate 7. Here, in the present embodiment, for example, the substrate 7 is formed of glass, and the insulating substrate 10 is formed of polyimide. When the laser beam LL 1 is irradiated from below the substrate 7, the laser beam LL 1 reaches the surface SF 12 of the insulating substrate 10. The insulating substrate 10 is decomposed at the interface between the substrate 7 and the insulating substrate 10 by absorbing the laser light LL1. Thus, a space is generated at the interface between the substrate 7 and the insulating substrate 10, and the substrate 7 is peeled off from the insulating substrate 10.

FIG. 6 is a cross-sectional view for explaining the process of attaching the support substrate SP by the adhesive layer AD.
Next, the support substrate SP is attached to the surface SF12 of the insulating substrate 10 by the adhesive layer AD. Specifically, in a state in which, for example, an adhesive sheet or the like is disposed as the adhesive layer AD between the insulating substrate 10 and the support substrate SP, the support substrate SP is aligned and then heated to perform the insulating substrate Paste to 10 faces SF12. As described above, since the adhesive layer AD is heated after the alignment of the support substrate SP, the positional deviation of the support substrate SP with respect to the insulating substrate 10 can be suppressed.

FIG. 7 is a cross-sectional view for explaining a process of pressure bonding the first flexible printed circuit FPC1 to the display panel PNL.
Next, individual display panels PNL are cut out from the display panel PNL configured by the first mother substrate and the second mother substrate. Then, the step of pressure-bonding the first flexible wiring substrate FPC1 to the respective display panels PNL using the anisotropic conductive film 8 is performed. That is, the anisotropic conductive film 8 is disposed between the first flexible wiring substrate FPC1 and the display panel PNL and at a position overlapping the pad PD, and the first flexible wiring substrate FPC1 and the display panel PNL are provided. From the bottom, pressure is applied in the direction of the arrow shown in FIG. Thereby, the anisotropic conductive film 8 melts, and the conductive particles contained in the anisotropic conductive film 8 contact the pad PD and the connection wiring 100, and the first flexible wiring substrate FPC1 and the display panel PNL are electrically and physically Connected.

In the processes shown in FIGS. 6 and 7, the support substrate SP is disposed on the entire lower surface of the display panel PNL. Therefore, the supporting substrate SP can reinforce the strength of the insulating substrate 10 in each process, and it is possible to suppress the occurrence of disconnection of the signal wiring 6 and the like.

FIG. 8 is a cross-sectional view for illustrating the process of forming the protective member PT and the process of cutting the support substrate SP.
Next, an organic insulating material is applied on the fourth insulating film 14 between the film FL and the first flexible wiring substrate FPC1, and cured by UV irradiation to form a protective member PT. Then, in order to cut the support substrate SP, the laser light LL2 is irradiated from below the support substrate SP. In order to remove the support substrate SP in the bending area BA, the support substrate SP is cut at two places. At this time, the portion irradiated with the laser beam LL2 corresponds to the first boundary BR1 and the second boundary BR2. In the present embodiment, the support substrate SP is cut by the laser beam LL2, and at the same time, the adhesive layer AD is cut to form a slit in the insulating substrate 10. That is, the laser beam LL2 reaches the insulating substrate 10.

FIG. 9 is a cross-sectional view for explaining the step of peeling the portion SPa of the support substrate SP and the portion ADa of the adhesive layer AD in the third region AR3.
After irradiating the laser beam LL2 from under the support substrate SP, cuts 61 and 62 are formed in the support substrate SP, the adhesive layer AD, and the insulating substrate 10. The cut 61 and the cut 62 penetrate the support substrate SP and the adhesive layer AD, and the insulating substrate 10 is formed halfway without penetrating. That is, the cut 61 includes the slit SL1 formed in the insulating substrate 10, and the cut 62 includes the slit SL2 formed in the insulating substrate 10.

Next, in order to peel off the portion SPa of the support substrate SP and the portion ADa of the adhesive layer AD in the third region AR3, the laser beam LL3 is irradiated from below the support substrate SP in the third region AR3. The laser beam LL3 reaches the surface SF12 of the insulating substrate 10, and the insulating substrate 10 is reformed at the interface with the adhesive layer AD. Thus, a space GP is generated between the insulating substrate 10 and the adhesive layer AD in the third region AR3. By forming the cut 61 and the cut 62 penetrating the support substrate SP and the adhesive layer AD, the portion SPa and the portion ADa can be peeled off from the insulating substrate 10.

As shown in FIG. 8, when cutting the support substrate SP, for example, the tip of the laser beam LL2 may be irradiated with waves in the third direction Z. Therefore, when the laser beam LL2 is irradiated so as to form the cut 61 and the cut 62 in the middle of the adhesive layer AD, the tip of the laser beam LL2 is irradiated to both the support substrate SP and the adhesive layer AD. As a result, the supporting substrate SP and the adhesive layer AD melt, are mixed, and are cooled, and there is a possibility that a sticking substance having high adhesive strength may be generated. When the portion SPa of the support substrate SP is peeled off from the insulating substrate 10 in the state where such a fixed substance is generated, the display panel PNL is pulled, which may cause a crack in the inorganic film or a break in the signal wiring 6. is there.

According to the present embodiment, the insulating substrate 10 has the slit SL1 and the slit SL2. That is, the laser beam LL2 for cutting the support substrate SP is irradiated to the insulating substrate 10. Therefore, even if the tip of the laser beam LL2 is waved in the third direction Z, since the wave is waved in the insulating substrate 10, a fixed substance in which the support substrate SP and the adhesive layer AD are mixed hardly occurs. Therefore, the load on the display panel PNL when peeling off the portion SPa can be suppressed, and the occurrence of the crack of the inorganic film and the disconnection of the signal wiring 6 can be suppressed.

Further, according to the present embodiment, the first support substrate SP1 and the second support substrate SP2 are formed by peeling the portion SPa of the support substrate SP. For this reason, the process of peeling the whole support substrate SP once, and sticking the other member used as 1st support substrate SP1 and 2nd support substrate SP2 is unnecessary. By omitting the step of peeling the entire support substrate SP, charging of the insulating substrate 10 can be suppressed, and damage to the display panel PNL due to electrostatic breakdown or the like can be suppressed. Further, since electrostatic breakdown of the insulating films such as the second insulating film 12 and the third insulating film 13 can be suppressed, damage to the switching element SW can be suppressed. Moreover, it is possible to suppress the increase in the manufacturing cost by using 1st support substrate SP1 and 2nd support substrate SP2 as a member different from support substrate SP.

FIG. 10 is a cross-sectional view for illustrating the process of bending the bending area BA of the display panel PNL.
In the process shown in FIG. 9, since the third region AR3 is modified by the laser beam LL3, the third film thickness T3 is formed smaller than each of the first film thickness T1 and the second film thickness T2. The third surface SF3 is located above the first surface SF1 and the third surface SF3. In addition, since the support substrate SP is peeled off in a region overlapping with the third region AR3, the first support substrate SP1 and the second support substrate SP2 are formed from the support substrate SP. Further, by peeling off the adhesive layer AD in the region overlapping with the third region AR3, the first adhesive layer AD1 and the second adhesive layer AD2 are formed from the adhesive layer AD.

Next, the position of the support member 9 is aligned, and the support member 9 is bonded to the first support substrate SP1 by the adhesive layer AD11. Thereafter, the bending area BA of the display panel PNL is bent so that the first flexible printed circuit FPC1 is disposed below the first support substrate SP1. That is, the bending area BA is bent so that the first flexible printed circuit FPC1 is disposed under the support member 9 with the support member 9 as a base point, and the first flexible printed circuit FPC1 is attached to the support member 9 by the adhesive layer AD12. . In the present embodiment, the support member 9 is formed in, for example, a sheet shape.

In the present embodiment, the insulating substrate 10 has a slit SL1 and a slit SL2. Therefore, when bending, since the slit can be used as a starting point, the insulating substrate 10 can be easily bent as compared with the case where the slit is not provided. Therefore, the load on the display panel PNL when bending the bending area BA can be suppressed, and the occurrence of the crack of the inorganic film and the disconnection of the signal wiring 6 can be suppressed.

FIG. 11 is a cross-sectional view showing the display panel PNL after the bending area BA shown in FIG. 10 is bent.
The bending area BA is bent so that the first support substrate SP1 and the first flexible printed circuit FPC1 face each other. The support member 9 is disposed between the first support substrate SP1 and the first flexible printed circuit FPC1. The adhesive layer AD11 is disposed between the first support substrate SP1 and the support member 9, and bonds the both. Further, the adhesive layer AD12 is disposed between the first flexible printed circuit FPC1 and the support member 9, and bonds the two together. The adhesive layers AD11 and AD12 may be formed separately as shown, or may be integrally formed. The adhesive layers AD11 and AD12 are, for example, double-sided tapes.

Next, the display device according to the second embodiment will be described in detail.

FIG. 12 is a plan view showing a display device DSP according to the second embodiment. Compared with the configuration shown in FIG. 4, the configuration shown in FIG. 12 is different from the configuration shown in FIG. 4 in the third area AR3 between the first portion PA1, the second portion PA2, the first portion PA1 and the second portion PA2. It is different in having a portion PA3.

The first portion PA1 and the second portion PA2 correspond to a region indicated by oblique lines rising to the right in the third region AR3. The first portion PA1, the third portion PA3, and the second portion PA2 are aligned in the first direction X in this order. The first portion PA1 is located on the first end EG1 side, and the second portion PA2 is located on the second end EG2 side. The signal wiring 6 is disposed at a position overlapping the third portion PA3 and is not disposed at a position overlapping the first portion PA1 and the second portion PA2.

FIG. 13 is a cross-sectional view of the display device DSP shown in FIG. 12 taken along line AB.
The insulating substrate 10 has a fourth film thickness T4 in the first portion PA1, a fifth film thickness T5 in the second portion PA2, and a sixth film thickness T6 in the third portion PA3. The fourth film thickness T4 and the fifth film thickness T5 are respectively smaller than the sixth film thickness T6. Here, for example, the sixth film thickness T6 is equivalent to the third film thickness T3 shown in FIG. Also, for example, the fourth film thickness T4 and the fifth film thickness T5 are equal to each other. The insulating substrate 10 has a fourth surface SF4 of the first portion PA1, a fifth surface SF5 of the second portion PA2, and a sixth surface SF6 of the third portion PA3 on the surface SF12 side. The fourth surface SF4 and the fifth surface SF5 are respectively located closer to the surface SF11 than the sixth surface SF6.

As described above, according to the present embodiment, the fourth surface SF4 and the fifth surface SF5 are located above the sixth surface SF6, thereby removing the portion SPa of the support substrate SP as shown in FIG. It becomes easy to insert a tool for peeling off the portion SPa between the portion ADa of the adhesive layer AD and the first portion PA1 and between the portion ADa and the second portion PA2. Therefore, it becomes possible to peel part SPa easily.

As illustrated, in order to form the first portion PA1 and the fifth region AR thinner than the third portion PA3, the conditions such as the number of scans of the laser beam LL3, the power, and the overlap in the process shown in FIG. The part PA1, the second part PA2, and the third part PA3 are different from one another. For example, the number of times of irradiation of the first portion PA1 and the second portion PA2 of the laser beam LL3 is made larger than the number of times of irradiation of the third portion PA3.

FIG. 14A is a cross-sectional view of the display device DSP shown in FIG. 12 along the line CD. FIG. 14B is a cross-sectional view of the display device DSP shown in FIG. 12 along the line EF. FIG. 14C is a cross-sectional view of the display device DSP shown in FIG. 12 along the line GH.

As shown in FIG. 14B, the insulating substrate 10 has a slit SL1 at a first boundary BR1 between the first region AR1 and the third portion PA3, and the insulating substrate 10 has a slit SL1 between the second region AR2 and the third portion PA3. And a second slit SL2 at a second boundary BR2 between them. As shown in FIG. 3, the insulating substrate 10 has a film thickness T11 in the slit SL1 and a film thickness T12 in the slit SL2. The sixth surface SF6 is located closer to the surface SF11 than the first surface SF1 and the second surface SF2.

As shown in FIG. 14A, the fourth film thickness T4 is smaller than each of the first film thickness T1 and the second film thickness T2. The fourth surface SF4 is located closer to the surface SF11 than the first surface SF1 and the second surface SF2. Is the fourth film thickness T4 equal to or less than the film thickness T11 at the first boundary BR1 shown in FIG. 14 (b), and is it equal to the film thickness T12 at the second boundary BR2 shown in FIG. 14 (b)? It is less than that. That is, when the first portion PA1 is formed thinner than the third portion PA3 by laser light, the slit SL1 between the first portion PA1 and the first region AR1, and the first portion PA1 and the second region AR2 The slit SL2 between them disappears.

As shown in FIG. 14C, the fifth film thickness T5 is smaller than each of the first film thickness T1 and the second film thickness T2. The fifth surface SF5 is located closer to the surface SF11 than the first surface SF1 and the second surface SF2. Is the fifth film thickness T5 equal to or less than the film thickness T11 at the first boundary BR1 shown in FIG. 14 (b), and is it equal to the film thickness T12 at the second boundary BR2 shown in FIG. 14 (b)? It is less than that. That is, when the second part PA2 is formed thinner than the third part PA3 by laser light, the slit SL1 between the second part PA2 and the first area AR1, and the second part PA2 and the second area AR2 The slit SL2 between them disappears.

Next, the display device according to the third embodiment will be described in detail.

FIG. 15 is a cross-sectional view of the display device DSP shown in FIG. 1 according to the third embodiment, taken along the YZ plane. In the configuration shown in FIG. 15, compared with the configuration shown in FIG. 3, the end portions ADE1 and ADE2 of the first adhesive layer AD1 and the second adhesive layer AD2 are respectively recessed behind the first boundary BR1 and the second boundary BR2 It differs in the point which is doing. The other configuration shown in FIG. 15 is the same as that shown in FIG. The end ADE1 on the third area AR3 side of the first adhesive layer AD1 is located closer to the first area AR1 than the end SPE1 on the third area AR3 side of the first support substrate SP1. The end ADE2 on the third area AR3 side of the second adhesive layer AD2 is located closer to the second area AR2 than the end SPE2 on the third area AR3 side of the second support substrate SP2. In the illustrated example, both ends of the first adhesive layer AD1 and the second adhesive layer AD2 are retracted, but only one of them may be retracted. In that case, the end of the adhesive layer on the bending start side should be retracted, and in the present embodiment, the end ADE1 of the first adhesive layer AD1 should be retracted.

As shown in FIG. 8, the supporting substrate SP is cut by irradiating the first boundary BR1 and the second boundary BR2 with the laser light LL2. Here, in the present embodiment, the adhesive layer AD contains a wavelength absorber. Therefore, the thermal sensitivity of the adhesive layer AD can be improved, and the amount of scraping of the adhesive layer AD with respect to the laser beam LL2 can be increased. For example, in the present embodiment, the laser beam LL2 has a wavelength of 266 to 10600 nm. More specifically, the laser beam LL2 has a wavelength of 266, 355, 532, 1064, 9300, 9600, 10600 nm. In the present embodiment, a wavelength absorber optimum for the wavelength of the laser light LL2 as described above is used.

The insulating substrate 10 does not absorb the laser beam LL2 more than the adhesive layer AD. Therefore, the plasma and plume generated at the time of the irradiation of the laser beam LL2 tend to cut the adhesive layer AD perpendicularly to the irradiation direction of the laser beam LL2. In the example shown in FIG. 8, the irradiation direction of the laser beam LL2 is parallel to the third direction Z. That is, the plasma and the plume can scrape the adhesion layer AD in the direction along the XY plane. Therefore, the end ADE1 of the first adhesive layer AD1 and the end ADE2 of the second adhesive layer AD2 recede from the first boundary BR1 and the second boundary BR2.

Next, as shown in FIG. 10, a step of bending the bending area BA is performed. At this time, as an example, in order to obtain a desired curvature, the bending area BA is bent with the support member 9 as a base point while holding and pulling the second area AR2 of the insulating substrate 10. By holding and pulling the second area AR2, the insulating substrate 10 may be extended to some extent, and the first area AR1 may also be bent. Then, tensile stress is also applied to the portion where the first support substrate SP1 and the insulating substrate 10 are bonded. Since the first support substrate SP1 is superior in strength to the insulating substrate 10, the stress applied when the first area AR1 is bent is large, and cracks of the inorganic film and disconnection of the signal wiring 6 are close to the display area DA. May occur.

In addition, when the support member 9 is not used or when the positional deviation of the support member 9 occurs, the first area AR1 which is not supposed to be bent may also be bent. Then, cracks in the inorganic film and disconnection of the signal wiring 6 may occur.

According to the present embodiment, the end ADE1 of the first adhesive layer AD1 and the end ADE2 of the second adhesive layer AD2 are respectively recessed relative to the first boundary BR1 and the second boundary BR2. Therefore, even if the first support substrate SP1 and the second support substrate SP2 are bent, the stress applied to the insulating substrate 10 can be relaxed. Therefore, the load on the display panel PNL at the time of bending can be suppressed, and the occurrence of the crack of the inorganic film and the disconnection of the signal wiring 6 can be suppressed.

Further, according to the present embodiment, even if the tip of the laser beam LL2 is waved in the third direction Z, the adhesive layer AD is more easily scraped by the laser beam LL2 than the support substrate SP. There is almost no sticking of the layer AD. Therefore, the load on the display panel PNL when peeling off the portion SPa can be suppressed, and the occurrence of the crack of the inorganic film and the disconnection of the signal wiring 6 can be suppressed.

Furthermore, according to the present embodiment, the slits SL1 and SL2 formed in a straight line are provided at the first boundary BR1 and the second boundary BR2. Therefore, even if the support member 9 is not used or positional deviation occurs, the slits SL1 and SL2 can be used as a starting point for bending, so it is possible to suppress bending of a region not supposed to be bent. it can. Therefore, the load on the display panel PNL at the time of bending can be suppressed, and the occurrence of the crack of the inorganic film and the disconnection of the signal wiring 6 can be suppressed.

As described above, according to the present embodiment, it is possible to obtain a display device capable of suppressing a decrease in yield.

The above first and second embodiments can be applied not only to the organic electroluminescence display device but also to a liquid crystal display device. In that case, the display panel PNL is, for example, a liquid crystal display panel including a first substrate SUB1, a second substrate SUB2, and a liquid crystal layer sandwiched between the first substrate SUB1 and the second substrate SUB2. . When the display panel PNL is a liquid crystal display panel, it may be a reflective type that displays an image by selectively reflecting light incident from the second substrate SUB2 side, or is incident from the first substrate SUB1 side. It may be of a transmission type that displays an image by selectively transmitting the light. The main configuration of the present embodiment is substantially the same as in the case where the display device DSP is a liquid crystal display device.

While certain embodiments of the present invention have been described, these embodiments have been presented by way of example only, and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and the gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

Claims

A first area overlapping the display area, a second area overlapping the plurality of pads arranged in the first direction, and a third area positioned between the first area and the second area An insulating substrate,
A signal line formed on one surface side of the insulating substrate, extending in a second direction intersecting the first direction and connected to the pad;
A first support substrate disposed on the other side opposite to the one side of the insulating substrate and bonded to the first region via the first adhesive layer, and the second supporting layer via the second adhesive layer And a second support substrate bonded to the second area,
The insulating substrate has a first slit extending in the first direction to a first boundary between the first area and the third area on the other surface side, the second area, and the third area. And a second slit extending in the first direction at a second boundary between the regions.
The insulating substrate has a first thickness of the first area, a second thickness of the second area, and a third thickness of the third area.
The display device according to claim 1, wherein the first film thickness and the second film thickness are larger than the third film thickness.
The display device according to claim 2, wherein the first film thickness is equal to the second film thickness.
The insulating substrate is provided, on the other side, between a first surface in contact with the first adhesive layer, a second surface in contact with the second adhesive layer, and the first surface and the second surface. And a third surface located on the
The display device according to claim 1, wherein the third surface is located closer to the one surface than the first surface and the second surface.
The third region has a first portion, a second portion, and a third portion located between the first portion and the second portion,
The signal wiring is continuously disposed from the first area to the pad of the second area, and is disposed at a position overlapping the third portion in the third area.
The display device according to claim 1, wherein a fourth film thickness of the first portion and a fifth film thickness of the second portion are smaller than a sixth film thickness of the third portion.
The display device according to claim 5, wherein the signal wiring is not disposed at a position overlapping with the first portion and the second portion.
The insulating substrate has a fourth surface of the first portion, a fifth surface of the second portion, and a sixth surface of the third portion on the other surface side,
The display device according to claim 5, wherein the fourth surface and the fifth surface are respectively located on the one surface side of the sixth surface.
The display device according to claim 1, wherein the third region is bent and the wiring substrate and the first support substrate face each other.
The display according to claim 1, wherein an end of the first adhesive layer on the third area side is positioned closer to the first area than an end of the first support substrate on the third area side. apparatus.
The display according to claim 1, wherein an end of the second adhesive layer on the third area side is positioned closer to the second area than an end of the second support substrate on the third area side. apparatus.
A first area overlapping the display area, a second area overlapping the plurality of pads arranged in the first direction, and a third area positioned between the first area and the second area An insulating substrate,
A signal line formed on one surface side of the insulating substrate, extending in a second direction intersecting the first direction and connected to the pad;
A first support substrate disposed on the other side opposite to the one side of the insulating substrate and bonded to the first region via the first adhesive layer, and the second supporting layer via the second adhesive layer And a second support substrate bonded to the second area,
The third region has a first portion, a second portion, and a third portion located between the first portion and the second portion,
The signal wiring is continuously formed from the first area to the pad in the second area, and is formed at a position overlapping the third portion in the third area,
The display device, wherein the film thickness of the third portion is larger than the film thickness of the first portion and the film thickness of the second portion.
The display device according to claim 11, wherein the signal wiring is not disposed in the first portion and the second portion.
The display device according to claim 11, wherein a film thickness of the first portion is equal to a film thickness of the second portion.
The display device according to claim 11, wherein a film thickness of the third portion is smaller than a film thickness of the first region and a film thickness of the second region.
The insulating substrate has a first slit extending in the first direction to a first boundary between the first region and the third portion on the other surface side, the second region, and the third region. The display device according to claim 11, further comprising: a second slit extending in the first direction at a second boundary between the parts.
The display device according to claim 11, wherein the third region is bent and the wiring substrate and the first support substrate face each other.
The display according to claim 11, wherein an end of the first adhesive layer on the third area side is positioned closer to the first area than an end of the first support substrate on the third area side. apparatus.
The display according to claim 11, wherein an end of the second adhesive layer on the side of the third area is positioned closer to the second area than an end of the second support substrate on the side of the third area. apparatus.