JP2019184978A - Display device - Google Patents

Abstract

To enable improvement of reliability.SOLUTION: A display device comprises: an insulation substrate 10 having signal wiring 6 arranged in a first direction X and a pad connecting to an external circuit supplying a signal to the signal wiring; and a support substrate provided on a back side opposite to a facing surface which faces the signal wiring and the pad of the insulation substrate. The support substrate includes a first support substrate SP1 overlapping a display region and a second support substrate SP2 overlapping the pad separated from the first support substrate. The first support substrate has a first end portion EN1 on the main surface side in contact with the insulation substrate and a second end portion TP1 on the rear surface side opposite to the main surface. The second end portion is located closer to the second support substrate side than the first end portion and thickness of the second end portion is smaller than that of the first end portion.SELECTED DRAWING: Figure 5

Description

  Embodiments described herein relate generally to a display device.

  In recent years, flexible display devices using a resin substrate have been developed. In flexible display devices, it is required to reduce the area of the frame portion outside the display area. For example, a method of reducing the area of the frame portion by bending the end portion on the terminal portion side by about 180 degrees so that the terminal portion is located on the back surface of the display panel can be considered. Wiring is provided in a region where the display panel is bent. When the display panel is bent, bending stress is applied to the wiring provided in the bent region, and the wiring may be disconnected.

JP 2012-128006 A JP 2014-232300 A

  An object of the present embodiment is to provide a display device capable of improving reliability.

  According to one embodiment, an insulating substrate having a signal wiring arranged in a first direction, and a pad connected to an external circuit that supplies a signal to the signal wiring, the signal wiring of the insulating substrate, and A support substrate provided on the back side opposite to the opposing surface facing the pad, the support substrate being spaced apart from the first support substrate, the first support substrate overlapping the display region, and the pad The first support substrate includes a first end portion on a main surface side in contact with the insulating substrate, and a second end portion on a back surface side opposite to the main surface. And the second end is located closer to the second support substrate than the first end, and the thickness of the second end is smaller than the thickness of the first end. A display device is provided.

FIG. 1 is a perspective view showing the configuration of the display device according to the first embodiment. FIG. 2 is a cross-sectional view showing a display area of the display device shown in FIG. 3 is a cross-sectional view including a non-display region of the display device shown in FIG. FIG. 4 is a plan view showing the display panel according to the first embodiment. FIG. 5 is a cross-sectional view illustrating an example of a state where the third region of the display panel according to the first embodiment is not bent. FIG. 6 is a cross-sectional view showing an example of a state where the third region of the display panel shown in FIG. 5 is bent. FIG. 7 is a cross-sectional view showing a state in which the third region of the display panel shown in FIG. FIG. 8 is a plan view showing a display panel according to the first modification. FIG. 9 is a cross-sectional view showing an example of a state where the third region of the display panel shown in FIG. 8 is bent. FIG. 10 is a cross-sectional view illustrating an example of a state in which the third region of the display panel according to Modification 2 is bent. FIG. 11 is a cross-sectional view illustrating an example of a state where the third region of the display panel according to Modification 3 is bent. FIG. 12 is a cross-sectional view illustrating an example of a state in which the third region of the display panel according to Modification 4 is not bent. FIG. 13 is a cross-sectional view showing an example of a state where the third region of the display panel shown in FIG. 12 is bent.

  Hereinafter, embodiments will be described with reference to the drawings. It should be noted that the disclosure is merely an example, and those skilled in the art can easily conceive of appropriate changes while maintaining the gist of the invention are naturally included in the scope of the present invention. In addition, for the sake of clarity, the drawings may be schematically represented with respect to the width, thickness, shape, etc. of each part as compared to actual aspects, but are merely examples, and The interpretation is not limited. In addition, in the present specification and each drawing, components that perform the same or similar functions as those described above with reference to the previous drawings are denoted by the same reference numerals, and repeated detailed description may be omitted as appropriate. .

First, the display device according to the embodiment will be described in detail. Hereinafter, in the embodiment, a case where the display device DSP is an organic electroluminescence (EL) display device will be described.
FIG. 1 is a perspective view showing the configuration of the display device DSP according to the first embodiment. FIG. 1 shows a three-dimensional space defined by a first direction X, a second direction Y perpendicular to the first direction X, and a third direction Z perpendicular to the first direction X and the second direction Y. Yes. In the illustrated example, the first direction X, the second direction Y, and the third direction Z are orthogonal to each other, but may intersect at an angle other than 90 degrees. Further, viewing the XY plane defined by the first direction X and the second direction Y from the third direction Z is referred to as a plan view.

  In the present embodiment, the direction toward the tip of the arrow in the third direction Z may be referred to as “up”, and the direction opposite to the direction toward the tip of the arrow in the third direction Z may be referred to as “down”. Further, when “the second member above the first member” and “the second member below the first member” are used, the second member may be in contact with the first member or separated from the first member. It may be. In the latter case, a third member may be interposed between the first member and the second member.

As shown in FIG. 1, the display device DSP includes a display panel PNL, a wiring board FPC1, a wiring board FPC2, and the like.
The display panel PNL includes an insulating substrate 10, a film FL, a support substrate SP, a protective member PT, and the like. The display panel PNL includes a display area DA that displays an image and a non-display area NDA that surrounds the display area DA. The display panel PNL includes a plurality of pixels PX in the display area DA. The plurality of pixels PX are arranged in the first direction X and the second direction Y and are provided in a matrix.

  The film FL is disposed on the insulating substrate 10. In the illustrated example, the length of the end portion of the film FL parallel to the first direction X is substantially equal to the length of the end portion of the insulating substrate 10 parallel to the first direction X. Further, the length of the end portion of the film FL parallel to the second direction Y is smaller than the length of the end portion of the insulating substrate 10 parallel to the second direction Y. That is, the three end portions of the film FL are aligned with the three end portions of the insulating substrate 10 in the third direction Z. In the XY plane defined by the first direction X and the second direction Y, the area of the film FL is smaller than the area of the insulating substrate 10. As will be described later, a plurality of layers are disposed between the insulating substrate 10 and the film FL.

  The support substrate SP is affixed under the insulating substrate 10. The support substrate SP has a first support substrate SP1 and a second support substrate SP2, and has a groove portion GR between the first support substrate SP1 and the second support substrate SP2. The first support substrate SP1 includes a first support portion SPP1 attached under the insulating substrate 10 and a first protrusion portion PR1 that protrudes from the first support portion SPP1 toward the groove portion GR. The first support substrate SP1 overlaps the display area DA in the third direction Z. In other words, the first support substrate SP1 is located on the display area DA side in the second direction Y. The second support substrate SP2 includes a second support portion SPP2 attached under the insulating substrate 10, and a second protrusion portion PR2 protruding from the second support portion SPP2 toward the groove portion GR. The groove part GR and the second support substrate SP2 overlap the non-display area NDA of the insulating substrate 10 in the third direction Z. In other words, the groove part GR and the second support substrate SP2 are located on the non-display area NDA side in the second direction Y.

The display panel PNL has a mounting portion MT extending outward from the region where the film FL is disposed. The protection member PT is disposed in the mounting part MT. The protective member PT is in contact with the film FL and the wiring board FPC1.
In the illustrated example, the wiring board FPC1 is mounted on the mounting portion MT in the non-display area NDA. Further, the length of the end portion of the wiring board FPC1 parallel to the first direction X is smaller than the length of the end portion of the insulating substrate 10 parallel to the first direction X, but may be equivalent. The display panel PNL and the wiring board FPC1 are electrically connected to each other. The wiring board FPC2 is disposed under the wiring board FPC1 and is electrically connected to the wiring board FPC1. The wiring board FPC2 overlaps the opposite side of the wiring board FPC1 from the side where the display panel PNL overlaps. The wiring board FPC2 may be disposed on the wiring board FPC1.

FIG. 2 is a cross-sectional view showing the display area DA of the display device DSP shown in FIG.
As shown in FIG. 2, the display panel PNL includes an insulating substrate 10, switching elements SW1, SW2, SW3, a reflective layer 4, an organic EL element OLED1, OLED2, OLED3, a sealing layer 41, a support substrate SP, an adhesive layer GL, And a film FL or the like.

  The insulating substrate 10 has an upper surface 10A and a lower surface 10B opposite to the upper surface 10A. The insulating substrate 10 is provided on the support substrate SP via the adhesive layer AD. The insulating substrate 10 is formed using an organic insulating material, for example, using polyimide. The upper surface 10 </ b> A of the insulating substrate 10 is covered with the first insulating layer 11. The insulating substrate 10 may be composed of only a single layer formed using an organic insulating material such as polyimide, or may be formed using a layer formed using an organic insulating material and an inorganic insulating material. The layers may be alternately stacked.

The switching elements SW1, SW2, and SW3 are formed on the first insulating layer 11. In the illustrated example, the switching elements SW1, SW2, and SW3 are formed of top gate type thin film transistors, but may be formed of bottom gate type thin film transistors. Since the switching elements SW1, SW2, and SW3 have the same configuration, the structure of the switching element SW1 will be described in detail below with a focus on the switching element SW1. The switching element SW1 includes a semiconductor layer SC formed on the first insulating layer 11. The semiconductor layer SC is covered with the second insulating layer 12. The second insulating layer 12 is also disposed on the first insulating layer 11.
The gate electrode WG of the switching element SW1 is formed on the second insulating layer 12 and is located immediately above the semiconductor layer SC. The gate electrode WG is covered with the third insulating layer 13. The third insulating layer 13 is also disposed on the second insulating layer 12.
The first insulating layer 11, the second insulating layer 12, and the third insulating layer 13 are formed of an inorganic material such as silicon oxide or silicon nitride, for example.

The source electrode WS and the drain electrode WD of the switching element SW1 are formed on the third insulating layer 13. The source electrode WS and the drain electrode WD are electrically connected to the semiconductor layer SC through contact holes that penetrate the second insulating layer 12 and the third insulating layer 13, respectively. The switching element SW1 is covered with the fourth insulating layer 14. The fourth insulating layer 14 is also disposed on the third insulating layer 13. For example, the fourth insulating layer 14 is formed of an organic material such as a transparent resin.
The reflective layer 4 is formed on the fourth insulating layer 14. The reflective layer 4 is formed of a metal material having a high light reflectance such as aluminum or silver. Note that the upper surface of the reflective layer 4 may be a flat surface or an uneven surface for imparting light scattering properties.

  The organic EL elements OLED1 to OLED3 are formed on the fourth insulating layer 14. That is, the organic EL elements OLED1 to OLED3 are located between the insulating substrate 10 and the film FL. In the illustrated example, the organic EL element OLED1 is electrically connected to the switching element SW1, the organic EL element OLED2 is electrically connected to the switching element SW2, and the organic EL element OLED3 is electrically connected to the switching element SW3. Yes. The organic EL elements OLED1 to OLED3 are each configured as a top emission type that emits red light, blue light, and green light toward the film FL side. Such organic EL elements OLED1 to OLED3 all have the same structure. In the illustrated example, the organic EL elements OLED1 to OLED3 are partitioned by ribs 15, respectively.

  The organic EL element OLED1 includes a pixel electrode PE1 formed on the reflective layer 4. The pixel electrode PE1 is in contact with the drain electrode WD of the switching element SW1, and is electrically connected to the switching element SW1. Similarly, the organic EL element OLED2 includes a pixel electrode PE2 electrically connected to the switching element SW2, and the organic EL element OLED3 includes a pixel electrode PE3 electrically connected to the switching element SW3. The pixel electrodes PE1, PE2, and PE3 are formed of a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO).

  For example, the organic EL element OLED1 includes an organic light emitting layer ORGB that emits blue light, the organic EL element OLED2 includes an organic light emitting layer ORGG that emits green light, and the organic EL element OLED3 includes an organic light emitting layer ORGR that emits red light. Yes. The organic light emitting layer ORGB is located on the pixel electrode PE1, the organic light emitting layer ORGG is located on the pixel electrode PE2, and the organic light emitting layer ORGR is located on the pixel electrode PE3. In addition, the organic EL elements OLED1 to OLED3 include a common electrode CE. The common electrode CE is located on the organic light emitting layers ORGB, ORGG, ORGR. The common electrode CE is also located on the rib 15. One of the pixel electrode PE and the common electrode CE is an anode, and the other is a cathode. The common electrode CE is made of, for example, a transparent conductive material such as ITO or IZO.

  The sealing layer 41 covers the organic EL elements OLED1, OLED2, and OLED3. The sealing layer 41 seals a member arranged between the insulating substrate 10. The sealing layer 41 suppresses intrusion of oxygen and moisture into the organic EL elements OLED1, OLED2, and OLED3, and suppresses deterioration of the organic EL elements OLED1, OLED2, and OLED3. In addition, the sealing layer 41 may be comprised from the laminated body of the inorganic film and the organic film.

  The film FL is disposed on the sealing layer 41. The film FL is, for example, a protective film or an optical film, and is formed using a transparent material. The film FL is bonded to the sealing layer 41 with the adhesive layer GL. The adhesive layer GL is formed using, for example, any of an acrylic material, an epoxy material, and polyimide.

  The support substrate SP is bonded to the lower surface 10B of the insulating substrate 10 on the side opposite to the film FL facing the upper surface 10A of the insulating substrate 10. The support substrate SP is bonded to the insulating substrate 10 by the adhesive layer AD. Note that the support substrate SP may include an adhesive layer AD. As the material of the support substrate SP, for example, a material that is excellent in heat resistance, gas barrier properties, moisture resistance, strength, and is inexpensive is preferable. The support substrate SP has, for example, heat resistance that does not change or deform at the process temperature in the process of manufacturing the display device DSP. In addition, the support substrate SP has, for example, a strength higher than that of the insulating substrate 10 and functions as a support layer that suppresses a situation in which the display panel PNL is bent in a state where no external stress is applied. Further, the support substrate SP has, for example, moisture resistance that suppresses intrusion of moisture or the like into the insulating substrate 10 and gas barrier property that suppresses intrusion of gas, and functions as a barrier layer. The support substrate SP is, for example, a film formed using polyethylene terephthalate.

In such a display device DSP, when each of the organic EL elements OLED1 to OLED3 emits light, the organic EL element OLED1 emits blue light, the organic EL element OLED2 emits green light, and the organic EL element OLED3. Emits red light. Therefore, color display of the display device DSP is realized.
The pixel PX illustrated in FIG. 1 is, for example, the smallest unit that forms a color image, and includes the organic EL elements OLED1 to OLED3.

  In the above configuration example, each of the organic EL elements OLED1 to OLED3 includes the organic light emitting layer ORGB that emits blue light, the organic light emitting layer ORGG that emits green light, and the organic light emitting layer ORGR that emits red light. It is not limited. The organic EL elements OLED1 to OLED3 may include a common organic light emitting layer. At this time, for example, the organic EL elements OLED1 to OLED3 emit white light. In such a configuration example, the color filter layer is disposed on the sealing layer 41.

FIG. 3 is a cross-sectional view including the non-display area NDA of the display device DSP shown in FIG. FIG. 3 shows only the configuration necessary for the description.
In the illustrated example, the first support substrate SP1 and the second support substrate SP2 are separated from each other in the second direction Y. In other words, the first protrusion PR1 and the second protrusion PR2 are separated from each other in the second direction Y. The first support substrate SP1 is disposed from the display area DA to the non-display area NDA, and the second support substrate SP2 is disposed in the non-display area NDA.

  The first support part SPP1 is located on the lower surface 10B side of the insulating substrate 10. The first support portion SPP1 has an upper surface PPA1 located on the insulating substrate 10 side and a lower surface PPB1 opposite to the upper surface PPA1. The upper surface PPA1 may be in contact with the insulating substrate 10. Further, another layer may be located between the upper surface PPA1 and the insulating substrate 10. The first protrusion PR1 is located at the tip of the first support portion SPP1 on the second support substrate SP2 side in the second direction Y. The first protrusion PR1 has a first surface PSA1 that intersects with the upper surface PPA1, and a lower surface PSB1 that intersects with the first surface PSA1. In the example illustrated in FIG. 3, the first surface PSA1 is separated from the insulating substrate 10 in the third direction Z and changes downward from the upper surface PPA1. The lower surface PSB1 is continuous with the lower surface PPB1. The thickness of the first protrusion PR1 is, for example, equal to or less than the thickness of the first support part SPP1. In addition, as long as the 1st protrusion part PR1 is spaced apart from the insulating substrate 10, thickness may be larger than the thickness of 1st support part SPP1. The first surface PSA1 and the lower surface PSB1 of the first projecting portion PR1 may each be linear, curved, or uneven. Further, the first surface PSA1 may be in contact with the insulating substrate 10.

  The second support part SPP2 is located on the lower surface 10B side of the insulating substrate 10. The second support part SPP2 has an upper surface PPA2 located on the insulating substrate 10 side and a lower surface PPB2 opposite to the upper surface PPA2. The upper surface PPA2 may be in contact with the insulating substrate 10. Further, another layer may be located between the upper surface PPA2 and the insulating substrate 10. The second protrusion PR2 is located at the tip of the second support portion SPP2 on the first support substrate SP1 side in the second direction Y. The second protrusion PR2 has a second surface PSA2 that intersects the upper surface PPA2, and a lower surface PSB2 that intersects the second surface PSA2. In the example shown in FIG. 3, the second surface PSA2 is separated from the insulating substrate 10 in the third direction Z and changes downward from the upper surface PPA2. The lower surface PSB2 is continuous with the lower surface PPB2. The thickness of the second protrusion PR2 is, for example, equal to or less than the thickness of the second support part SPP2. In addition, as long as the 2nd protrusion part PR2 is spaced apart from the insulated substrate 10, thickness may be larger than the thickness of 2nd support part SPP2. The second surface PSA2 and the lower surface PSB2 of the second protrusion PR2 may each be linear, curved, or uneven. Further, the second surface PSA2 may be in contact with the insulating substrate 10.

The first insulating layer 11 and the second insulating layer 12 extend to a position overlapping the end portion 10E of the insulating substrate 10. The third insulating layer 13 does not extend to a position where it overlaps with the groove part GR.
The signal wiring 6 faces the upper surface 10 </ b> A of the insulating substrate 10. The signal wiring 6 is disposed on the second insulating layer 12 and the third insulating layer 13 on the upper surface 10A side of the insulating substrate 10. In other words, the signal wiring 6 is located on the support substrate SP. The signal wiring 6 is continuously arranged from the display area DA to the non-display area NDA, and extends to a position overlapping the pad PD located on the end portion 10E side. The signal wiring 6 is formed of, for example, a laminate of titanium, aluminum, and titanium. The signal wiring 6 corresponds to a power supply line, various control wirings, and the like.

The fourth insulating layer 14 covers the signal wiring 6 and extends to a position overlapping the end portion 10E of the insulating substrate 10. Hereinafter, one end of the display panel including the second support substrate SP2, the insulating substrate 10, the first insulating layer 11, the second insulating layer 12, the fourth insulating layer 14, and the like may be referred to as a first side edge E1. . The fourth insulating layer 14 has a contact hole CH that penetrates to the signal wiring 6.
The pad PD faces the upper surface 10A of the insulating substrate 10. The pad PD is disposed on the fourth insulating layer 14 on the upper surface 10A side of the insulating substrate 10, and is also disposed in the contact hole CH. In other words, the pad PD is located on the support substrate SP. In the example shown in FIG. 3, the pad PD is superimposed on the second support substrate SP2. The pad PD is electrically connected to the signal wiring 6 in the contact hole CH. For example, the pad PD is formed of the same material in the same process as the pixel electrodes PE1, PE2, and PE3 shown in FIG. 2, and is formed using ITO, IZO, or the like.

  Note that the signal wiring 6 and the pad PD may be arranged in the same layer. At this time, the signal wiring 6 and the pad PD may be formed separately or may be formed integrally. Further, as shown in the drawing, the signal wiring 6 and the pad PD are arranged in different layers, and both are electrically connected through a contact hole formed in an interlayer insulating layer between the signal wiring 6 and the pad PD. May be.

  The rib 15, the sealing layer 41, the adhesive layer GL, and the film FL are disposed at a position that overlaps the first support substrate SP1 in the third direction Z, and do not extend to a position that overlaps the groove part GR. The sealing layer 41 covers the rib 15 and is in contact with the fourth insulating layer 14. The adhesive layer GL covers the sealing layer 41 and is in contact with the fourth insulating layer 14.

  The wiring board FPC1 is mounted on the display panel PNL on the fourth insulating layer 14. The wiring substrate FPC1 includes a core substrate 200, connection wirings 100 disposed on the lower surface side of the core substrate 200, and a drive IC chip 3 disposed on the upper surface side of the core substrate 200. The driving IC chip 3 functions as a signal supply source that supplies signals necessary for driving the display panel PNL. The position of the drive IC chip 3 is not particularly limited, and may be arranged on the lower surface side of the core substrate 200.

  The display panel PNL and the wiring board FPC1 are electrically connected and bonded to each other via an anisotropic conductive film 8 which is a conductive material. That is, the anisotropic conductive film 8 includes conductive particles dispersed in the adhesive. For this reason, by pressing and heating the wiring board FPC1 and the display panel PNL in the third direction Z from above and below with the anisotropic conductive film 8 interposed between the wiring board FPC1 and the display panel PNL, Both are electrically and physically connected. The anisotropic conductive film 8 is in contact with and electrically connected to the pad PD. The anisotropic conductive film 8 is in contact with and electrically connected to the connection wiring 100. Thereby, the connection wiring 100 is electrically connected to the pad PD and the signal wiring 6 through the anisotropic conductive film 8.

  The protective member PT covers a part of the fourth insulating layer 14. In the example shown in FIG. 3, the protective member PT also covers end portions of the wiring board FPC1, the film FL, the adhesive layer GL, and the like. Further, the protective member PT is in contact with the upper surface of the wiring board FPC1 and the upper surface of the film FL. The protective member PT reinforces the insulating substrate 10 between the wiring substrate FPC1 and the film FL. The protective member PT is formed using, for example, a resin. The protective member PT may include the fourth insulating layer 14.

  Here, in the present embodiment, the display panel PNL is positioned between the first area AR1 having the display area DA, the second area AR2 having the terminal portion T, and the first area AR1 and the second area AR2. A third region AR3. In other words, the support substrate SP has a first area AR1, a second area AR2, and a third area AR3. The first area AR1 corresponds to the first support substrate SP1, and the second area AR2 corresponds to the second support substrate SP2. The first region AR1 corresponds to, for example, a region where the first support portion SPP1 is attached to the insulating substrate 10. In other words, the first support part SPP1 is located in the first region AR1. The second area AR2 corresponds to, for example, an area where the second support portion SPP2 is attached to the insulating substrate 10. In other words, the second support part SPP2 is located in the second region AR2. The third region AR3 corresponds to the groove portion GR, the first projecting portion PR1, the second projecting portion PR2, and the like. In other words, the groove part GR, the first projecting part PR1, and the second projecting part PR2 are located in the third region AR3. In the third area AR3, for example, the first support part SPP1 and the second support part SPP2 do not correspond. The third area AR3 corresponds to an area that is bent when housed in a housing such as an electronic device. For example, the third region AR3 is bent so that the wiring board FPC1 and the wiring board FPC2 are disposed below the display panel PNL. At this time, the pad PD is also positioned below the display panel PNL. The third area AR3 is located in the non-display area NDA. In the second direction Y, the signal wiring 6 and the protection member PT extend from the first area AR1 to the second area AR2, and are arranged in the third area AR3. The protection member PT covers the signal wiring 6 from the first area AR1 to the second area AR2. The protection member PT covers the signal wiring 6 at least in the third region AR3.

FIG. 4 is a plan view showing the display panel PNL according to the first embodiment, and is a diagram showing the positional relationship between the first support substrate SP1 and the second support substrate SP2. In FIG. 4, the first support substrate SP <b> 1 is indicated by a diagonal line rising to the left, and the second support substrate SP <b> 2 is indicated by a diagonal line rising to the right.
The display panel PNL includes a first side edge E1 and a second side edge E2 extending in the first direction X, and a third side edge E3 and a fourth side edge E4 extending in the second direction. Yes. The first side edge E1 and the second side edge E2 face each other across the display area DA. The third side edge E3 and the fourth side edge E4 face each other across the display area DA. The first side edge E1 is located on the terminal portion T side. In plan view, the first support substrate SP1 overlaps the display area DA and the non-display area NDA, and the second support substrate SP2 overlaps the non-display area NDA.

  The first area AR1 overlaps the first support substrate SP1, for example, the first support portion SPP1 in plan view. The second area AR2 overlaps with the second support substrate SP2, for example, the second support portion SPP2 in plan view. The plurality of pads PD are arranged in the terminal portion T and arranged side by side in the first direction X. The third area AR3 overlaps the groove part GR, the first projecting part PR1, and the second projecting part PR2 in plan view, and extends from the side edge E3 of the display panel PNL to the side edge E4 along the first direction X. . That is, the third area AR3 is located between the first support part SPP1 and the second support part SPP2 in plan view. In other words, the third area AR3 is located between the display area DA and the terminal portion T in plan view. The plurality of signal wirings 6 are respectively connected to the pads PD, extend in the second direction Y in the third region AR3, and are arranged in the first direction X. That is, the signal wiring 6 extends from the first area AR1 toward the second area AR2. Further, as shown in FIG. 4, the third region AR3 may be formed with a smaller width along the first direction X than the region overlapping the first support substrate SP1 so that the third region AR3 can be easily bent. The third region AR3 may be formed to have the same width along the first direction X as the region overlapping the first support substrate SP1. At this time, the width of the second region AR2 in the first direction X may be the same as the width of the third region AR3 in the first direction X. In the illustrated example, the first area AR1 is formed in a rectangular shape in plan view, but may be formed in a round shape with rounded corners. In addition, the display area DA is formed in a rectangular shape when seen in a plan view, but may be formed in a round shape with rounded corners.

  FIG. 5 is a cross-sectional view illustrating an example of a state in which the third area AR3 of the display panel PNL according to the first embodiment is not bent. In FIG. 5, the third area AR3 extends in the second direction Y. In FIG. 5, the first area AR1, the third area AR3, and the second area AR2 are continuously arranged in this order in the second direction Y. In other words, the first area AR1 and the third area AR3 are adjacent to each other, and the third area AR3 and the second area AR2 are adjacent to each other. FIG. 5 shows a first boundary position (hereinafter simply referred to as a first position) P1 between the first area AR1 and the third area AR3, and a second boundary position between the third area AR3 and the second area AR2 ( Hereinafter, P2 and the center position P3 of the third area AR3 spaced from the first position P1 and the second position P2 by a distance Y1 are shown. For example, the first position P1 may coincide with the end of the first support part SPP1. For example, the second position P2 may coincide with the end portion of the second support portion SPP2.

  In the example shown in FIG. 5, the adhesive layer AD includes adhesive layers AD1 and AD2. The first support portion SPP1 is bonded to the insulating substrate 10 via an adhesive layer AD1 disposed from the first area AR1 to the third area AR3. The first protrusion PR1 includes a first end portion EN1 located on the first support portion SPP1 side, that is, the first region AR1 side in the third region AR3, and a side opposite to the first end portion EN1, that is, the third region. It has 2nd end part TP1 located in the front end side in AR3. In other words, the first end EN1 corresponds to an end on the upper surface PPA1 side, and the second end TP1 corresponds to an end on the lower surface PPB1 side. Note that the first end EN1 may be located in the first region AR1. The length Yp11 in the second direction Y of the first protrusion PR1 is smaller than the distance Y1. For example, it is desirable that the length Yp11 of the first protrusion PR1 is a length close to the distance Y1. Further, it is desirable that the angle θ1 formed by the first surface PSA1 and the lower surface PSB1 is smaller. For example, the angle θ1 is 45 ° or less. The thickness Zp11 of the first end EN1 is larger than the thickness Zp12 of the second end TP1. Further, the distance Z11 between the first end EN1 and the insulating substrate 10 in the third direction Z is smaller than the distance Z12 between the second end TP1 and the insulating substrate 10 in the third direction Z. That is, the second end TP1 is farther from the insulating substrate 10 than the first end EN1. In other words, the first surface PSA1 moves away from the insulating substrate 10 toward the second end TP1 from the first end EN1. The first projecting portion PR1 has, for example, a tapered shape (or a triangular shape) that tapers away from the insulating substrate 10 from the first end portion EN1 toward the second end portion TP1. An adhesive layer AD1 is located on the first end EN1. For example, the adhesive layer AD1 may be located from the display area DA to the first end EN1. The adhesive layer AD1 has a tapered shape that is continuous with the tapered shape of the first protruding portion PR1 between the insulating substrate 10 and the first end portion EN1. In other words, the adhesive layer AD1 has an inclined surface ADA1 that is located between the insulating substrate 10 and the first end EN1, and is continuous with the first surface PSA1. The slope ADA1 may be linear, may be curved, or may have irregularities. Note that the adhesive layer AD1 may not be positioned between the insulating substrate 10 and the first end portion EN1 as long as it is positioned between the insulating substrate 10 and the first support portion SPP1. In other words, the adhesive layer AD1 may not be located in the third area AR3 as long as it is located in the first area AR1. At this time, for example, the first projecting portion PR1 may have a first surface PSA1 that is inclined from the first support portion SPP1 to the second end portion TP1. Further, the adhesive layer AD1 may recede to the side opposite to the first projecting portion PR1 side between the insulating substrate 10 and the first support portion SPP1.

  The second support portion SPP2 is bonded to the insulating substrate 10 via the adhesive layer AD2 disposed from the first area AR2 to the third area AR3. The second protrusion PR2 includes a third end portion EN2 located on the second support portion SPP2 side, that is, the second region AR2 side in the third region AR3, and a side opposite to the third end portion EN2, that is, the third region. It has the 4th end part TP2 located in the front end side in AR3. In other words, the third end portion EN2 corresponds to an end portion on the upper surface PPA2 side, and the fourth end portion TP2 corresponds to an end portion on the lower surface PPB2 side. Note that the third end EN2 may be located in the second region AR2. The length Yp21 in the second direction Y of the second protrusion PR2 is smaller than the distance Y1. For example, the length Yp21 in the second direction Y of the second protrusion PR2 is desirably a length close to the distance Y1. The length Yp21 may be the same as the length Yp11, may be smaller than the length Yp11, or may be larger than the length Yp11. In one example, the length Yp21 is equal to or shorter than the length Yp11. Further, it is desirable that the angle θ2 formed by the second surface PSA2 and the lower surface PSB2 is smaller than 90 °. For example, the angle θ2 is 45 ° or less. The angle θ2 may be the same as the angle θ1, may be smaller than the angle θ1, or may be larger than the angle θ1. In one example, the angle θ2 is larger than the angle θ1. For example, the thickness Zp21 of the third end EN2 is larger than the thickness Zp22 of the fourth end TP2. The distance Z21 in the third direction Z between the third end EN2 and the insulating substrate 10 is smaller than the distance Z22 in the third direction Z between the fourth end TP2 and the insulating substrate 10. That is, the fourth end TP2 is farther from the insulating substrate 10 than the third end EN2. In other words, the second surface PSA2 moves away from the insulating substrate 10 toward the fourth end TP2 from the third end EN2. For example, the second projecting portion PR2 has a tapered shape that tapers away from the insulating substrate 10 from the third end portion EN2 toward the fourth end portion TP2. An adhesive layer AD2 is located on the third end EN2. For example, the adhesive layer AD2 may be located from the end 10E to the third end EN2 of the insulating substrate 10 described above. The adhesive layer AD2 has a tapered shape that is continuous with the tapered shape of the second projecting portion PR2 between the insulating substrate 10 and the third end portion EN2. In other words, the adhesive layer AD2 has a slope ADA2 that is located between the insulating substrate 10 and the third end portion EN2 and is continuous with the second surface PSA2. The slope ADA2 may be linear, may be curved, or may have irregularities. Note that the adhesive layer AD2 may not be positioned between the insulating substrate 10 and the third end portion EN2 as long as it is positioned between the insulating substrate 10 and the second support portion SPP2. In other words, the adhesive layer AD2 may not be located in the third area AR3 as long as it is located in the second area AR2. At this time, for example, the second protrusion PR2 may have a second surface PSA2 that is inclined from the second support portion SPP2 to the fourth end portion TP2. Further, the adhesive layer AD2 may recede to the side opposite to the second projecting portion PR2 side between the insulating substrate 10 and the second support portion SPP2.

  The first support substrate SP1 and the second support substrate SP2 may be formed by punching the support substrate SP and then applied to the insulating substrate 10 by applying the adhesive layer AD, or may be attached to the support substrate SP. After AD is applied and attached to the insulating substrate 10, it may be formed by laser processing. In one example, the first support substrate SP1 and the second support substrate SP2 can be accurately formed in desired positions and shapes by processing by laser processing.

  FIG. 6 is a cross-sectional view illustrating an example of a state in which the third region AR3 of the display panel PNL illustrated in FIG. 5 is bent. In FIG. 6, only the main components of the display device DSP according to the first embodiment are shown, and the other members are not shown. FIG. 6 shows the display panel PNL in which the third area AR3 is bent in the bending direction CD. In FIG. 6, the bending direction CD is from the third direction Z toward the second direction Y. In FIG. 6, the third region AR3 is bent in a semicircular shape along the bending direction CD in the ZY plane with the first position P1 as the bending start point (0 °). The second position P2 is located at a position rotated by 180 ° in the bending direction CD from the first position P1. That is, the second position P2 is located at 180 ° (end point) of the semicircular shape of the third region AR3. The first position P1 and the second position P2 are arranged on a straight line in the third direction Z. In other words, the first position P1 and the second position P2 are located on the same position in the second direction Y. In FIG. 6, the semicircular curvature center (hereinafter simply referred to as the center) O of the third region AR3, the curvature radius (hereinafter simply referred to as the radius) R of the bent third region AR3, Is shown. Hereinafter, in the third region AR3, the direction of the center O is referred to as the inner side, and the direction opposite to the inner side is referred to as the outer side. In the bent third area AR3, the lower surface 10B of the insulating substrate 10 positioned inside may be referred to as the inner surface 10B of the third area AR3, the inner surface 10B of the display panel PNL, or simply the inner surface 10B. The radius R is, for example, the distance from the center O to the inner surface 10B. In FIG. 6, the third area AR3 is an area from the position P1 to the position P2 in the bending direction CD. The third area AR3 is bent in a semicircular shape, but may not be in a semicircular shape. FIG. 6 shows the thickness TH1 of the first support part SPP1 and the thickness TH2 of the second support part SPP2. The thickness TH1 of the first support portion SPP1 corresponds to the thickness of the first end portion EN1. The thickness TH2 of the second support portion SPP2 corresponds to the thickness of the third end portion EN2. Note that the thickness TH1 includes the thickness of the first support portion SPP1 (the thickness of the first end portion EN1) and the thickness of the adhesive layer AD1 between the insulating substrate 10 and the first support portion SPP1. Good. Further, the thickness TH2 may include the thickness of the second support portion SPP2 (thickness of the third end portion EN2) and the thickness of the adhesive layer AD2 between the insulating substrate 10 and the second support portion SPP2. Good.

  The display device DSP further includes a cover member CM, a polarizing plate PL, an adhesive layer 50, an adhesive layer 51, and the like. The display panel PNL is bent in the third area AR3 below the polarizing plate PL so that the first area AR1 and the second area AR2 face each other. In other words, the display panel PNL is bent between the first support substrate SP1 and the second support substrate SP2. The third area AR3 is bent so that the terminal portion T is positioned below the display panel PNL. That is, the terminal portion T is located on the display area DA side in the second direction Y, and is located on the opposite side to the cover member CM side in the third direction Z. Further, the side edge E1 is located in the display area DA in the second direction Y, and is located on the opposite side to the cover member CM side in the third direction Z.

  The polarizing plate PL is disposed on the film FL. The cover member CM is disposed on the display panel PNL. The cover member CM extends from a position facing the display area DA in the second direction Y to a position facing the third area AR3. The cover member CM is formed using, for example, glass, but may be formed using a material other than glass. The cover member CM is bonded to the polarizing plate PL via the adhesive layer 51.

  The adhesive layer 50 is disposed between the first support substrate SP1 and the second support substrate SP2 and adheres both. The adhesive layer 50 is, for example, a double-sided tape. For example, the radius R can be defined by the thickness of the adhesive layer 50. A holding member may be disposed between the first support substrate SP1 and the second support substrate SP2. At this time, for example, the first support substrate SP1 is bonded to the upper surface of the holding member with an adhesive layer such as a double-sided tape, and the second support substrate SP2 is bonded to the lower surface of the holding member with an adhesive layer such as a double-sided tape.

  In the example shown in FIG. 6, the signal wiring 6 is located between the insulating substrate 10 and the protection member PT in the third region AR3. The insulating substrate 10 is bent in the third region AR3. In other words, the insulating substrate 10 is bent between the first support substrate SP1 and the second support substrate SP2. The insulating substrate 10 is located inside the signal line 6 in the third region AR3. The protection member PT is located outside the signal wiring 6 in the third region AR3. For example, in the third region AR3, the signal wiring 6 is disposed on or near the neutral surface where both the tensile stress and the compressive stress generated when the third region AR3 is bent are substantially 0 (zero). . Thus, by arranging the signal wiring 6 on the neutral surface or in the vicinity thereof, the possibility that the signal wiring 6 is disconnected can be reduced. Further, the signal wiring 6 has higher resistance to compressive stress than resistance to tensile stress. Therefore, the signal wiring 6 may be disposed inside the neutral plane in the third region AR3. Note that the signal wiring 6 may be disposed outside the neutral plane.

In the example illustrated in FIG. 6, the first support substrate SP1 (first region AR1) and the second support substrate SP2 (second region AR2) face each other in the third direction Z. The second end TP1 of the first protrusion PR1 is in contact with the inner surface 10B of the third region AR3 at the contact CP1. The distance from the vertex VT1 located on the first end EN1 of the first protrusion PR1 to the contact CP1 is, for example, π × R or less. The vertex VT1 is, for example, a contact point between the insulating substrate 10 and the first end EN1 at the position P1. Note that the second end TP1 may be separated from the inner surface 10B. Further, the vertex VT1 may be a contact point between the adhesive layer AD1 and the insulating substrate 10 at the position P1. The first surface PSA1 of the first projecting portion PR1 faces the inner surface 10B. The first surface PSA1 is separated from the inner surface 10B. The first surface PSA1 may be in contact with the inner surface 10B. The lower surface PSB1 of the first protrusion PR1 faces the lower surface PSB2 of the second protrusion PR2 in the third direction Z. The angle θ1 is preferably an angle represented by the following expression, for example.
θ1 = π / 4 × TH1 / R (Formula 1)
In addition, angle (theta) 1 may be angles other than the angle represented by Formula (1).

The fourth end TP2 of the second protrusion PR2 is in contact with the inner surface 10B of the third region AR3 at the contact CP2. The distance from the vertex VT2 located on the third end EN2 of the second protrusion PR2 to the contact CP2 is, for example, π × R or less. The vertex VT2 is, for example, a contact point between the insulating substrate 10 and the third end portion EN2 at the position P2. The fourth end TP2 may be separated from the inner surface 10B. Further, the vertex VT2 may be a contact point between the adhesive layer AD2 and the insulating substrate 10 at the position P2. The second surface PSA2 of the second protrusion PR2 faces the inner surface 10B. The second surface PSA2 is separated from the inner surface 10B. The second surface PSA2 may be in contact with the inner surface 10B. The angle θ2 is preferably an angle represented by the following expression, for example.
θ2 = π / 4 × TH2 / R (Formula 2)
In addition, angle (theta) 2 may be angles other than the angle represented by Formula (2).

Next, an example of a bending method of the third area AR3 of the display panel PNL described above will be described with reference to FIG.
FIG. 7 is a cross-sectional view showing a state where the third area AR3 of the display panel PNL shown in FIG. In FIG. 7, only the configuration necessary for the description is shown, and illustration of other members is omitted. In FIG. 7, the bending direction CD is from the second direction Y toward the third direction Z.

  In the example shown in FIG. 7, the first side edge E1 of the display panel PNL is lifted with the position P1 (vertex VT1) as the starting point of bending, and the third region AR3 is in the bending direction CD, and the first protrusion PR1 is first. It is bent along the plane PSA1. As shown in FIG. 7, the third area AR3 is gradually bent along the bending direction CD so that the second area AR2 extends in the second direction Y so as to face the first area AR1. For this reason, the radius of the third region AR3 gradually decreases.

  When the display panel PNL is bent with the position P1 (vertex VT1) as a starting point, the display panel PNL, for example, the angle θ1 of the first protrusion PR1 is small and the first protrusion is reduced in order to reduce the stress generated at the position P1. It is desirable that the length Yp11 of PR1 is longer. At this time, the angle θ2 of the second protrusion PR2 may be larger than the angle θ1 of the first protrusion PR1. Further, the length Yp21 of the second protrusion PR1 may be smaller than the length Yp11 of the first protrusion PR1. When the display panel PNL is bent with the position P2 (vertex VT2) as a starting point, it is desirable that the angle θ2 is small and the length Yp21 is long. At this time, the angle θ1 may be larger than the angle θ2. Further, the length Yp11 may be smaller than the length Yp21.

  According to the present embodiment, the display device DSP includes a display panel PNL having a first area AR1, a second area AR2, and a third area AR3 located between the first area AR1 and the second area AR2. ing. The display panel PNL includes an insulating substrate 10, a first support substrate SP1 corresponding to the first region AR1, and a second support substrate SP2 corresponding to the second region AR2. The first support substrate SP1 is attached to the insulating substrate 10 via the adhesive layer AD1. The first support substrate SP1 has a first support part SPP1 located in the first area AR1, and a first protrusion PR1 protruding from the first support part SPP1 to the third area AR3. The first projecting portion PR1 has a first surface PSA1 that moves away from the insulating substrate 10 toward the second end TP1 from the first end EN1. The second support substrate SP2 is affixed to the insulating substrate 10 via the adhesive layer AD2. The second support substrate SP2 has a second support part SPP2 located in the second area AR2, and a second protrusion part PR2 protruding from the second support part SPP2 to the third area AR3. The second projecting portion PR2 has a second surface PSA2 that moves away from the insulating substrate 10 toward the fourth end TP2 from the third end EN2. When the display panel PNL1 is bent using the position P1 as a bending start point, the third area AR3 is bent along the first surface PSA1 of the first protrusion PR1. Therefore, the display device DSP can reduce stress generated when the display panel PNL is bent. That is, the display device DSP can suppress disconnection of the signal wiring 6. Furthermore, the display device DSP can bend the third region AR3 with a desired radius of curvature by the first protrusion PR1 and the second protrusion PR2. Further, when the third region AR3 is bent, the second end TP1 of the first protrusion PR1 and the fourth end TP2 of the second protrusion PR2 protrude toward the inner surface 10B of the third region AR3. For example, at least one of the second end TP1 and the fourth end TP2 is in contact with the inner surface 10B. Therefore, even if it is the structure which adhere | attaches 1st support substrate SP1 and 2nd support substrate SP2 with the contact bonding layer 50, a deformation | transformation etc. of 3rd area | region AR3 can be suppressed. Therefore, a display device capable of improving reliability can be provided.

Next, a modification of the display device DSP according to the present embodiment will be described. In the modification of the display device DSP according to the present embodiment described below, the same parts as those in the first embodiment described above are denoted by the same reference numerals, and detailed description thereof is omitted. This will be described in detail focusing on the different parts. In the modification, the same effect as that of the first embodiment can be obtained.
The display device DSP according to the modification 1 is different in the configuration of the second support substrate SP2 from the display device DSP of the first embodiment.
FIG. 8 is a plan view showing a display panel PNL according to the first modification, and is a diagram showing a positional relationship between the first support substrate SP1 and the second support substrate SP2.
In the example shown in FIG. 8, the second support substrate SP <b> 2 has a second support portion SPP <b> 2 attached below the insulating substrate 10. The third region AR3 overlaps the groove part GR and the first projecting part PR1 in plan view. Note that the first support substrate SP1 may not include the first protrusion PR1, and the second support substrate SP2 may include the second protrusion PR2. At this time, the third region AR3 overlaps the groove part GR and the second projecting part PR2 in plan view.

FIG. 9 is a cross-sectional view illustrating an example of a state in which the third region AR3 of the display panel PNL illustrated in FIG. 8 is bent. In FIG. 9, only the main configuration of the display device DSP according to Modification 1 is shown, and the other members are not shown. FIG. 9 shows the display panel PNL in which the third area AR3 is bent in the bending direction CD.
In the example shown in FIG. 9, the end portion SPE2 of the second support portion SPP2 is located at the position P2. Note that the end portion SPE2 may be located on the third area AR3 side, or may be retracted in the opposite direction to the third area AR3 side. Moreover, when there is no 1st protrusion part PR1, the edge part of 1st support part SPP1 may be located in the position P1. Note that the end portion of the first support portion SPP1 may be positioned on the third region AR3 side, or may be retracted in the opposite direction to the third region AR3 side.
According to the first modification, the same effect as that of the above-described embodiment can be obtained.

The display device DSP according to the modification 2 is different in the configuration of the first support substrate SP1 and the second support substrate SP2 from the display device DSP of the embodiment and the modification described above.
FIG. 10 is a cross-sectional view illustrating an example of a state in which the third region AR3 of the display panel PNL according to Modification 2 is bent. In FIG. 10, only the main configuration of the display device DSP according to Modification 2 is shown, and the other members are not shown. FIG. 10 shows the display panel PNL in which the third area AR3 is bent in the bending direction CD.
In the example shown in FIG. 10, the second end TP1 of the first protrusion PR1 and the fourth end TP2 of the second protrusion PR2 are separated from the inner surface 10B of the third region AR3. For example, the length of the first protrusion PR1 in the second direction Y is the same as the length of the second protrusion PR2 in the second direction Y. Further, the angle θ1 is the same as the angle θ2. Note that the length of the first protrusion PR1 in the second direction Y may be different from the length of the second protrusion PR2 in the second direction Y. Further, the angle θ1 may be different from the angle θ2.
According to the second modification, the same effect as that of the above-described embodiment can be obtained.

The display device DSP according to the modification 3 is different in the configuration of the first support substrate SP1 and the second support substrate SP2 from the display device DSP of the embodiment and the modification described above.
FIG. 11 is a cross-sectional view illustrating an example of a state in which the third region AR3 of the display panel PNL according to Modification 3 is bent. In FIG. 11, only the main configuration of the display device DSP according to Modification 3 is shown, and the other members are not shown. FIG. 11 shows the display panel PNL in which the third area AR3 is bent in the bending direction CD.
In the example shown in FIG. 11, the first surface PSA1 of the first protrusion PR1 is curved from the first end EN1 toward the second end TP1. The first surface PSA1 is in contact with the inner surface 10B of the third region AR3. The first surface PSA1 may be separated from the inner surface 10B of the third region AR3. The second surface PSA2 of the second protrusion PR2 is curved from the third end EN2 toward the fourth end TP2. The second surface PSA2 is in contact with the inner surface 10B of the third region AR3. Note that the second surface PSA2 may be separated from the inner surface 10B of the third region AR3.
According to the third modification, the same effect as that of the above-described embodiment can be obtained.

The display device DSP according to the modification 4 is different in the configuration of the display panel PNL from the display device DSP of the embodiment and the modification described above.
FIG. 12 is a cross-sectional view illustrating an example of a state where the third region AR3 of the display panel PNL according to the modification 4 is not bent.
In the example shown in FIG. 12, the adhesive layer AD1 is located on the first surface PSA1. For example, the adhesive layer AD1 may be located from the display area DA to the second end TP1. The adhesive layer AD1 is separated from the insulating substrate 10 on the first surface PSA1. The adhesive layer AD1 may be adhered to the insulating substrate 10. The adhesive layer AD2 is located on the second surface PSA2. For example, the adhesive layer AD2 may be located from the end 10E to the fourth end TP2 of the insulating substrate 10 described above. The adhesive layer AD2 is separated from the insulating substrate 10 on the second surface PSA2. The adhesive layer AD2 may be adhered to the insulating substrate 10.

  In the modified example 4, the first support substrate SP1 and the second support substrate SP2 are formed by punching the support substrate SP, and then are applied to the insulating substrate 10 by applying the adhesive layer AD. Therefore, when affixing on the insulating substrate 10, there is a possibility that the first support substrate SP1 and the second support substrate SP2 are each shifted from a desired position.

  FIG. 13 is a cross-sectional view illustrating an example of a state in which the third area AR3 of the display panel PNL illustrated in FIG. 12 is bent. In FIG. 13, only the main components of the display device DSP according to the first embodiment are shown, and the other members are not shown. FIG. 13 shows the display panel PNL in which the third area AR3 is bent in the bending direction CD. The first position P1 and the second position P2 are shifted in the second direction Y.

In the example illustrated in FIG. 13, the lower surface PSB1 of the first protrusion PR1 does not face the lower surface PSB2 of the second protrusion PR2 in the third direction Z. In other words, the first protrusion PR1 does not face the second protrusion PR2. The fourth end TP2 of the second protrusion PR2 is separated from the inner surface 10B of the third region AR3. The lower surface PSB2 of the second projecting portion PR2 faces the lower surface PPB1 of the first support portion SPP1 in the third direction Z. In other words, the second projecting part PR2 faces the first support part SPP1 in the third direction Z. Note that the fourth end TP2 of the second protrusion PR2 may be in contact with the inner surface 10B. The lower surface PSB2 may not be opposed to the lower surface PSB1 in the third direction Z. In other words, the second protrusion PR2 does not have to face the first protrusion PR1. At this time, the second end TP1 is separated from the inner surface 10B. The lower surface PSB1 of the first projecting portion PR1 faces the lower surface PPB2 of the second support portion SPP2 in the third direction Z. In other words, the first projecting part PR1 faces the second support part SPP2 in the third direction Z.
According to the modified example 4, the same effect as that of the above-described embodiment can be obtained. In addition, the first support substrate SP1 and the second support substrate SP1 are formed when the first support substrate SP1 and the second support substrate SP2 are attached to the insulating substrate 10 by applying the adhesive layer AD after the support substrate SP is formed by die cutting. Even if the support substrate SP2 is deviated from the desired position, the display device DSP can reduce the stress generated when the display panel PNL is bent, and the third protrusion PR1 and the second protrusion PR2 can achieve the third curvature with a desired curvature radius. The area AR3 can be bent. In addition, the shape of the third region AR3 can be maintained in a desired shape. Therefore, a display device that can improve reliability can be provided.
In the above-described embodiment and modification, the display device DSP is an organic electroluminescence (EL) display device. However, the display device DSP may be a liquid crystal display device, an inorganic electroluminescence display device, or an LED display device. There may be.

  In addition, although some embodiment of this invention was described, these embodiment is shown as an example and is not intending limiting the range of invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the spirit of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

DSP ... Display device PNL ... Display panel DA ... Display area NDA ... Non-display area CM ... Cover member 50, 51 ... Adhesive layer 6 ... Signal wiring PT ... Protection member SP1 ... First support substrate SP2 ... Second support substrate PR1 ... First 1 protrusion PR2 ... 2nd protrusion.

Claims (12)

An insulating substrate having a signal wiring arranged in a first direction and a pad connected to an external circuit for supplying a signal to the signal wiring;
A support substrate provided on the back side opposite to the opposing surface facing the signal wiring and the pad of the insulating substrate,
The support substrate includes a first support substrate that overlaps the display area, and a second support substrate that is spaced apart from the first support substrate and overlaps the pad.
The first support substrate has a first end portion on the main surface side in contact with the insulating substrate, and a second end portion on the back surface side opposite to the main surface,
The second end is located closer to the second support substrate than the first end,
The display device, wherein the thickness of the second end is smaller than the thickness of the first end.   The display device according to claim 1, wherein the second end portion is farther from the insulating substrate than the first end portion.   The display device according to claim 1, wherein the first support substrate has a tapered shape that tapers from the first end toward the second end. A first adhesive layer that bonds the first support substrate and the insulating substrate;
The display device according to claim 1, wherein the first adhesive layer is located from the display region to the first end. A first adhesive layer that bonds the first support substrate and the insulating substrate;
The display device according to claim 1, wherein the first adhesive layer is located from the display region to the second end portion. The second support substrate has a third end on the main surface side and a fourth end on the back surface side,
The fourth end is located closer to the first support substrate than the third end,
The display device according to claim 1, wherein a thickness of the fourth end portion is smaller than a thickness of the third end portion.   The display device according to claim 6, wherein the fourth end portion is further away from the insulating substrate than the third end portion.   The display device according to claim 6, wherein the second support substrate has a tapered shape that tapers from the fourth end toward the third end. The second support substrate has a third end on the main surface side and a fourth end on the back surface side,
The fourth end is located closer to the first support substrate than the third end,
The second support substrate has a tapered shape that tapers from the third end portion toward the fourth end portion,
6. The display device according to claim 1, wherein the first angle of the tapered shape of the first support substrate is equal to or smaller than the second angle of the tapered shape of the second support substrate. 7. A second adhesive layer that bonds the second support substrate and the insulating substrate;
The display device according to claim 6, wherein the second adhesive layer is located from an end portion on the pad side of the insulating substrate to the third end portion. A second adhesive layer that bonds the second support substrate and the insulating substrate;
10. The display device according to claim 6, wherein the second adhesive layer is located from an end portion on the pad side of the insulating substrate to the fourth end portion. 10.   12. The insulating substrate according to claim 6, wherein the insulating substrate is bent between the first support substrate and the second support substrate, and the second support substrate faces the first support substrate. The display device described.

Images