KR20170132940A - Organic light emitting display panel, display device comprising the same and method for manufacturing the display device - Google Patents

Abstract

The purpose of the present invention is to provide an organic light emitting display device which can have a simple structure. The organic light emitting display device according to each embodiment of the present invention comprises a driving unit which is placed in a non-display area in a supporting substrate, drives a thin transistor array, and has a driving chip or a passive element mounted thereon. Since such organic light emitting display panel is not connected to a flexible film or a flexible substrate having the driving chip or the passive element mounted thereon, a processing defection rate in a connection process can be excluded, such that a yield rate can be increased and a manufacturing cost and time can be reduced. In addition, the organic light emitting display device further comprises a front protecting film which collectively covers the supporting substrates bonded to each other, a sealing film, and the driving unit on the supporting substrate. That is, because the organic light emitting display panel is not connected to the flexible film or the flexible substrate having the driving chip or the passive element mounted thereon, the front protecting film covering collectively the supporting substrate, the sealing film and the driving unit can be placed. Therefore, a process is simple, and even a side part can be protected.

Description

TECHNICAL FIELD [0001] The present invention relates to an organic light emitting display panel, a display device including the organic light emitting display panel, and a method of manufacturing the same. BACKGROUND ART < RTI ID = 0.0 >

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an organic light emitting display panel for displaying an image using an organic light emitting element, which is a self-light emitting element, a display including the same, and a method of manufacturing the display.

As the era of informationization becomes full-scale, the display field for visually displaying electrical information signals is rapidly developing. Accordingly, studies have been continuing to develop performance such as thinning, lightening, and low power consumption for various flat display devices.

Typical examples of such flat panel display devices include a liquid crystal display device (LCD), a plasma display panel (PDP), a field emission display (FED) An electroluminescence display device (ELD), an electro-wetting display device (EWD), and an organic light emitting display device (OLED).

These flat panel display devices include flat display panels for realizing images. The display panel includes a pair of substrates mutually adhered with a unique luminescent material or a polarizing material interposed therebetween.

Illustratively, the organic light emitting diode (OLED) includes an organic light emitting display panel that displays an image using an organic light emitting diode, which is a self light emitting type device.

The organic light emitting display panel includes a thin film transistor array defining a plurality of pixel regions and independently driving each pixel region, and a plurality of organic light emitting elements disposed on the thin film transistor array substrate and corresponding to a plurality of pixel regions.

The organic light emitting device includes first and second electrodes facing each other and a light emitting layer formed between the first and second electrodes and an organic light emitting material therebetween. Such an organic light emitting element emits light based on the driving current supplied from the thin film transistor array.

As described above, the organic light emitting display device displays an image using the organic light emitting element, which is a self light emitting element, so that it is not necessary to provide a separate light source. Therefore, the organic light emitting display device is advantageous in that it is thinner than a liquid crystal display device requiring a separate light source.

The organic light emitting display further includes a driving unit for driving the organic light emitting display panel.

In a general organic light emitting diode display, a driving unit includes a chip on film on which a driving chip is mounted, a flexible printed circuit board (FPCB) on which passive elements are mounted, and a control circuit board connected to the flexible film through a flexible circuit board .

That is, the driving chip or the passive element provided in the driving unit has a large capacity or a large size that can not be built in the organic light emitting display panel. Therefore, the organic light emitting display device generally includes a flexible film (COF) on which the driving chip is mounted and a flexible circuit board (FPCB) on which the passive device is mounted.

Since the flexible film and the flexible circuit board are provided separately as described above, a process of connecting the flexible film to the organic light emitting display panel, a process of connecting the flexible film and the flexible circuit board, The process of connecting the control circuit board must be performed individually. However, due to the film or substrate made of a soft material, there is a relatively large possibility that a process failure occurs in each connection process.

That is, due to the film or substrate made of a soft material, the alignment error becomes large, and short-circuiting or disconnection failure, defective pad disconnection, and poor substrate damage can easily occur.

In addition, when the organic light emitting display panel is manufactured to have flexibility, it is necessary to cover the outside of the organic light emitting display panel with a separate insulating material in order to reduce penetration of external oxygen and moisture and physical impact even in a curved shape. That is, a protective film made of a transparent insulating material is disposed on each of the front and rear surfaces of the organic light emitting display panel.

As described above, since the organic light emitting display panel is connected to the flexible film or the flexible substrate on which the driving chip or the passive element is mounted, the front protective film disposed on the front surface of the organic light emitting display panel is a flexible film Except for the pad connected to the pad. After the sacrificial substrate disposed on the back surface of the organic light emitting display panel is removed to manufacture the organic light emitting display panel, a back protective film is disposed on the back surface of the organic light emitting display panel.

As such, since the organic light emitting display panel is connected to the flexible film or the flexible substrate on which the driving chip or the passive element is mounted, the process of disposing the protective film on the front and back surfaces of the organic light emitting display panel has to be separately performed.

In addition, since the pads connected to the flexible film in the organic light emitting display panel can not be protected by the insulating film on the front surface, they are easily oxidized or corroded.

Further, there is a problem that a separate insulating member for covering the passive elements on the driving chip and the flexible circuit board on the flexible film must be further disposed.

These problems have limitations in that the structure of the organic light emitting diode display is simplified, and the yield of the OLED display is limited. Further, there is a problem in that there is a limit in reducing the time and cost for manufacturing the organic light emitting display device.

INDUSTRIAL APPLICABILITY The present invention relates to an organic light emitting display panel which is advantageous in simplifying the structure of a display device and can improve the yield of the display device and can be reduced in manufacturing time and manufacturing cost of the display device, A manufacturing method of a display device is provided.

The present invention provides an organic light emitting diode (OLED) display device capable of improving yield through a simplified structure, an organic light emitting display panel and a method of manufacturing the organic light emitting display device. A thin film transistor array disposed on a display region of the support substrate; a sealing film bonded to the support substrate and covering the plurality of organic light emitting elements; And a driving part which is disposed in a non-display area of the supporting substrate and drives the thin film transistor array and on which the driving chip or the passive element is mounted so that it needs to be connected to a separate flexible film or a flexible substrate on which the driving chip or the passive element is mounted Emitting display panel.

Here, the organic light emitting display panel may further include a front protective film for collectively covering the driving substrate on the supporting substrate, the sealing film, and the supporting substrate, because the pad for connecting the flexible film or the flexible substrate may be removed .

The present invention further provides a display device including an organic light emitting display panel including a driving part disposed on a supporting substrate and a control circuit board for supplying external power and control signals to the organic light emitting display panel. Here, since the organic light emitting display panel is directly connected to the control circuit board through the signal transmission member without a separate flexible film or flexible substrate, the tightening process can be further simplified.

According to another aspect of the present invention, there is provided a method of manufacturing a thin film transistor array, comprising the steps of: providing a supporting substrate on a sacrificial substrate; arranging a thin film transistor array defining a plurality of pixel regions in a display region of the supporting substrate; Attaching the sealing film to the supporting substrate, mounting the driving chip or the passive element on the circuit wiring of the driving portion, removing the sacrificial substrate, and removing the sacrificial substrate from the front surface And a step of disposing a protective film on the substrate.

Here, the step of disposing the front protective film comprises the steps of immersing the supporting substrate and the sealing film, which are mutually combined together, in a liquid insulating material in a state in which the driving chip or the passive element is mounted, And curing the liquid insulating material around the driving chip or the passive element to dispose the front protective film.

As described above, since the driving chip or the passive element is mounted on the supporting substrate, the front substrate, the sealing film, and the front protective film for collectively covering the periphery of the driving portion can be easily arranged.

The organic light emitting display panel according to each embodiment of the present invention includes a driver disposed in a non-display region of a support substrate. At this time, the driving section includes a circuit wiring formed at the same time as the thin film transistor array, and a driving chip or a passive element mounted on the circuit wiring.

Accordingly, there is no need to connect the flexible film or the flexible substrate on which the driving chip and the passive element are mounted and the organic light emitting display panel, and the defective rate in the connection process can be completely eliminated.

Since the organic light emitting display panel does not need to include a separate flexible film on which the driving chip and the passive element are mounted or a pad to which the flexible substrate is connected, the organic light emitting display panel may include a supporting substrate, a sealing film, And a protective film. With such a front protective film, not only the side of the supporting substrate and the sealing film but also the driving chip or the passive element of the driving unit can be collectively protected. In addition, the entire protective film can be relatively easily formed by a dipping process and a curing process.

Further, since the organic light emitting display panel is directly connected to the control circuit board through the signal transmission member, the structure of the organic light emitting display device can be simplified.

These advantages have the advantages that the yield of the organic light emitting display can be improved, and the manufacturing cost and manufacturing time can be reduced.

1 is a cross-sectional view of an OLED display panel according to a first embodiment of the present invention.
FIG. 2 is a top view of an OLED display panel, a control circuit substrate, and the OLED display according to the first embodiment of the present invention.
FIG. 3 is a view showing the thin film transistor array and the driving unit of FIG. 1 and FIG.
FIG. 4 is a diagram showing an equivalent circuit for each pixel region in FIG. 3. FIG.
FIG. 5 is a diagram illustrating a thin film transistor, an organic light emitting element, and a driver corresponding to any one of the pixel regions in the OLED display of FIGS. 1 to 4. FIG.
6 is a top view of an OLED display according to a second embodiment of the present invention.
7 is a flowchart illustrating a method of manufacturing an organic light emitting display according to each embodiment of the present invention.
Figs. 8 to 16 are diagrams showing respective steps of Fig. 7. Fig.

Hereinafter, an organic light emitting display according to each embodiment of the present invention, an organic light emitting display panel provided therein, and a method of manufacturing the organic light emitting display will be described in detail with reference to the accompanying drawings.

First, an organic light emitting display according to a first embodiment of the present invention and an organic light emitting display panel provided therein will be described with reference to FIGS. 1 to 5. FIG.

1 is a cross-sectional view of an OLED display panel according to a first embodiment of the present invention. FIG. 2 is a top view of an OLED display panel, a control circuit substrate, and the OLED display according to the first embodiment of the present invention. FIG. 3 is a view showing the thin film transistor array and the driving unit of FIG. 1 and FIG. FIG. 4 is a diagram showing an equivalent circuit for each pixel region in FIG. 3. FIG. 5 is a diagram illustrating a thin film transistor, an organic light emitting element, and a driver corresponding to any one of the pixel regions in the OLED display of FIGS. 1 to 4. FIG.

1, the organic light emitting diode OLED according to the first embodiment of the present invention includes a flexible support substrate 110 including a display area AA and a non-display area NA, A thin film transistor array 120 disposed on the display area AA of the thin film transistor array 110, a plurality of organic light emitting elements 130 disposed on the thin film transistor array 120, A driving part 150 disposed on the non-display area NA of the supporting substrate 110 and a front protective film 150 covering the supporting substrate 110, the sealing film 140, and the driving part 150 in a lump. And an organic light emitting diode (OLED) panel 100 including an organic light emitting diode (OLED)

The supporting substrate 110 is made of a soft material such as polyimide (PI) or the like.

2, the supporting substrate 110 includes a display region AA in which light corresponding to each pixel region PA is emitted so as to display an image, and a non-display region (display region) NA).

1 and 2, a portion BA of the non-display area NA adjacent to the display area AA is a bending area bent (bent) to the back side of the support substrate 110. [ When this bending area BA is bent toward the back side of the support substrate 110, another part of the non-display area NA where the driver 150 is disposed is disposed on the back side of the support substrate 110. [

The thin film transistor array (120 in FIG. 1) arranged in the display area AA includes a plurality of gate lines GL and a plurality of data lines DL arranged in a direction crossing each other. Each of the plurality of pixel regions PA is defined by a gate line GL and a data line DL intersecting with each other.

The thin film transistor array 120 and the organic light emitting device 130 connected thereto will be described later with reference to FIG. 3 to FIG.

Again, Fig. 1 will be described.

The sealing film 140 is adhered to the supporting substrate 110 and covers the plurality of organic light emitting elements 130. Owing to the sealing film 140, permeation of oxygen and moisture to the plurality of organic light emitting devices 130 can be prevented, and deterioration of the organic light emitting device 130 can be delayed.

The driver 150 includes a circuit wiring 151 disposed on the non-display area NA of the supporting substrate 110 together with the thin film transistor array 120 and a driving chip 152 mounted on the circuit wiring 151 ) Or at least one passive element (153). The driving unit 150 further includes a fixing connector 154 disposed at an edge of the supporting substrate 110.

The circuit wiring 151 is connected to each signal line of the thin film transistor array 120.

The driving chip 152 supplies a signal to each signal line of the thin film transistor array 120.

At least one passive element 153 includes at least one of a resistor, a capacitor, and an inductor for adjusting the magnitude or frequency of a signal generated in the driving unit 150.

2, the fixed connector 154 is mounted on the circuit wiring 151 of the driving part 150 and is connected to the signal transmission member 200.

Illustratively, the stationary connector 154 may be a member to which the signal transmitting member 200 is connected. The fixed connector 154 may be disposed in an area covering the edge of the supporting substrate 110 for easy coupling of the signal transmitting member 200.

The signal transmission member 200 includes connectors at both ends. The signal transmission member 200 is connected to the fixing connector 154 of the organic light emitting display panel 100 and the fixing connector 301 of the control circuit board 300 of FIG. That is, the driver 150 of the organic light emitting display panel 100 may be connected to the control circuit board 300 through the signal transmission member 200.

The control circuit board 300 supplies external power and control signals to the organic light emitting display panel 100.

As shown in FIG. 3, the thin film transistor array 120 includes a plurality of gate lines GL and a plurality of data lines DL, which intersect each other. A plurality of pixel regions PA are defined in the display region (AA in Fig. 2) by the gate line GL and the data line DL.

In FIG. 3, VDD and VSS are first and second driving power supplies for supplying driving current to a plurality of organic light emitting elements connected to the thin film transistor array 120.

The driving unit 150 includes a gate line driving unit G-DR for sequentially supplying gate signals to the plurality of gate lines GL, a data line driving unit D for supplying respective data signals to the plurality of data lines DL, -DR).

Although not shown in detail in FIGS. 1 and 2, the gate line driving unit G-DR may include a part corresponding to at least one end of the gate line GL in the non-display area NA A portion following at least one of the left and right sides).

The data line driver D-DR is connected to at least one of the upper and lower sides of the display area AA in the other part of the non-display area NA corresponding to at least one end of the data line DL Some).

Also, the gate line driver G-DR is composed of a circuit that can be implemented relatively easily. Therefore, the gate line driver G-DR does not include a separate driving chip or a passive element, and can be implemented similarly to the thin film transistor array 120. [

On the other hand, since the data line driver D-DR needs to supply the data signals to the plurality of data lines DL, the data line driver D-DR is composed of a relatively complicated circuit. In particular, the data signal has a magnitude enough to maintain the emission state of the organic light emitting element during each frame.

The data line driver D-DR may be a separate driving chip (152 in FIG. 2) mounted on the circuit wiring 151, or a separate driving chip mounted on the circuit wiring 151, in addition to the circuit wiring (151 in FIG. 2) implemented similarly to the thin film transistor array 120 And may further include a separate passive element (153 in Fig. 2).

4, an organic light emitting diode (OLED) (130 in FIG. 1) and a thin film transistor array 120 for driving the organic light emitting diode (OLED) 130 are disposed in each pixel region PA.

Specifically, each pixel region PA includes a driving thin film transistor T1 and an organic light emitting element ED, which are connected in series between a first driving power supply VDD having a high potential and a second driving power supply VSS having a low potential. A switching thin film transistor T2 connected between the gate line GL and the data line DL and a storage capacitor Cst connected between the driving thin film transistor T1 and the switching thin film transistor T2.

In this pixel region, when the switching thin film transistor T2 is turned on based on the gate signal of the gate line GL, the data signal of the data line DL through the switching thin film transistor T2 is applied to the storage capacitor Cst and / And is supplied to the driving thin film transistor T1. When the driving thin film transistor T1 is turned on based on the data signal, a predetermined driving current is supplied to the organic light emitting element ED. Then, the organic light emitting element ED emits light corresponding to the driving current.

5, the driving transistor Tl of the thin film transistor array (120 in FIG. 4) of each pixel region PA includes active layers ACT and ACT_S (not shown) disposed on the supporting substrate 110, A gate electrode GE disposed on the gate insulating film 121 covering the active layers ACT_AC and ACT_D and a source electrode disposed on the first interlayer insulating film 122 covering the gate electrode GE. (SE) and a drain electrode (DE).

The active layers ACT, ACT_S and ACT_D include a channel region ACT and a source region ACT_S and a drain region ACT_D disposed on both sides thereof.

The gate insulating film 121 is disposed on the supporting substrate 110.

The gate electrode GE is disposed on the gate insulating film 121 and overlaps the channel region ACT of the active layer.

The first interlayer insulating film 122 is disposed on the gate insulating film 121.

The source electrode SE and the drain electrode DE are disposed on the first interlayer insulating film 122. The source electrode SE is connected to the source region ACT_S of the active layer through the gate insulating film 121 and the contact hole passing through the first interlayer insulating film 122. [ The drain electrode DE is connected to the drain region ACT_D of the active layer through a contact hole passing through the gate insulating film 121 and the first interlayer insulating film 122.

In the driving thin film transistor T1, either the source electrode SE or the drain electrode DE is connected to the switching thin film transistor T2 together with the storage capacitor (Cst in FIG. 4) And is connected to the organic light emitting element ED. 5, the source electrode SE may be connected to the switching thin film transistor T2 and the drain electrode DE may be connected to the organic light emitting element ED in the driving thin film transistor T1 have.

The driving transistor Tl is covered with a second interlayer insulating film 123 disposed on the first interlayer insulating film 122.

The organic light emitting device (ED) 130 in FIG. 1 is disposed on the second interlayer insulating film 123 and includes first and second electrodes E1 and E2 opposed to each other and an organic layer OL ). Here, at least the light emitting layer (EML) is included. The organic layer OL may further include an electron transport layer (ETL) and a hole transport layer (HTL), and may further include an electron injection layer (EIL) and a hole injection layer (HIL).

The first electrode E1 is disposed on the second interlayer insulating film 123 and corresponds to a light emitting region that is a part of the pixel region PA. The first electrode E1 is connected to the drain electrode DE of the driving thin film transistor T1 through the contact hole CTH passing through the second interlayer insulating film 15. [ Here, according to the design, the first electrode E1 may be connected to the source electrode SE rather than the drain electrode DE of the driving thin film transistor T1.

The outer edge of the first electrode E1 is covered with the bank 131 formed on the second interlayer insulating film 123.

The organic layer OL is disposed on the first electrode E1 and the bank 131. [

The second electrode E2 is disposed on the organic layer OL.

The organic light emitting device ED is covered with a third interlayer insulating film 132 made of an insulating material that prevents penetration of oxygen or moisture. At this time, the third interlayer insulating film 132 may be arranged flat. The third interlayer insulating film 132 may have a multilayer structure in which a plurality of insulating materials having different compositions or composition ratios are alternately laminated.

The sealing film 140 is disposed on the third interlayer insulating film 132. Specifically, the sealing film 140 covers at least the display area AA to cover the plurality of organic light emitting elements ED.

When the third interlayer insulating film 132 completely covers the plurality of organic light emitting devices ED, the sealing film 140 may be disposed only on the third interlayer insulating film 132. [ 1, the sealing film 140 may be bonded to the supporting substrate 110 so as to completely cover the thin film transistor array 120 and a plurality of the organic light emitting devices 130. As shown in FIG.

As described above, the driving unit 150 is disposed in the non-display area NA, and based on the control signal of the control circuit board 300 (FIG. 2), the gate line GL of the thin film transistor array 120 And supplies a signal to each of the data lines DL.

The driving unit 150 includes a circuit wiring 151 disposed on the non-display area NA of the supporting substrate 110 and formed together with the thin film transistor array 120, Chip 152 or passive element 153. [

The circuit wiring 151 may be implemented by first, second and third wiring layers 151a, 151b and 151c.

The first wiring layer 151a is disposed on the gate insulating film 121 in the same manner as the gate electrode GE of the driving thin film transistor T1.

The second wiring layer 151b is disposed on the first interlayer insulating film 122 in the same manner as the source electrode SE and the drain electrode DE of the driving thin film transistor T1.

The third wiring layer 151c is disposed on the second interlayer insulating film 123 in the same manner as the first electrode EX1 of the organic light emitting device ED.

The driving chip 152 and the passive element 153 may be bonded to the third wiring layer 151c.

1 and 2, the driving unit 150 further includes a fixed connector 154 connected to the signal transmitting member 200. The fixed connector 154 is also bonded to the third wiring layer 151c, .

The front protective film 160 is disposed so as to collectively surround the periphery of the driving substrate 150 disposed around the supporting substrate 110 and the sealing film 140 and the non-display area NA of the supporting substrate 110 .

That is, the front surface protective film 160 covers the back surface of the supporting substrate 110, the upper surface of the sealing film 140, the upper surface of the driving part 150, and the side surfaces of the supporting substrate 110 and the sealing film 140, respectively. The front protective film 160 covers only a part of the fixed connector 154 so that the signal transmitting member 200 of FIG. 2 can be connected to the fixed connector 154 of the driving unit 150.

The front protective film 160 is formed by attaching the supporting substrate 110 and the sealing film 150 together and mounting the driving chip 152, the passive element 153 and the fixing connector 154 of the driving unit 150 , Immersing the resultant in a curable liquid insulating material, and thereby curing the insulating material around the supporting substrate 110, the sealing film 140, and the driving unit 150. Accordingly, the front protective layer 160 may be disposed to cover the supporting substrate 110, the sealing layer 140, and the driving unit 150 in a lump. Since the lamination process is not necessary when forming the front protective film 160, the defect occurrence rate due to the lamination process can be eliminated.

The front protective film 160 is made of an insulating material which is curable, has a viscosity easily controlled, and is transparent after curing. Illustratively, the front overcoat 160 may comprise a mixture of acrylic and urethane.

That is, the organic light emitting diode display panel 100 according to the first embodiment of the present invention includes a front protective layer 160 covering the supporting substrate 110, the sealing layer 140, and the driving portion 150, The front passivation layer 160 may be formed by a dipping process and a curing process. Therefore, the organic light emitting display panel 100 can easily and easily include a member to be protected from the outside.

As described above, according to the first embodiment of the present invention, the driving unit 150 for driving the thin film transistor array 120 is disposed on the flexible supporting substrate 110 in the same manner as the thin film transistor array 120, The driving chip 152 and the passive element 153 mounted on the supporting substrate 110 are mounted on the supporting substrate 110.

Accordingly, the organic light emitting diode OLED according to the first embodiment does not need to include a driving chip of the driving unit 150 and a separate flexible film or a flexible substrate for mounting the passive elements. That is, the organic light emitting display panel 100 does not need to be connected to a separate flexible film or a flexible substrate on which the driving chip and the passive elements are mounted, and is directly connected to the control circuit board 300.

Therefore, according to the first embodiment, it is not necessary to provide a separate flexible film or flexible substrate on which the driving chip and the passive element are mounted, and the organic light emitting display panel 100 is electrically connected to the control circuit board The organic light emitting display device of the present invention is advantageous in that the organic light emitting display device has a simpler structure than a general organic light emitting display device.

Since the process of connecting the organic light emitting diode display panel 100 to the flexible film or the flexible substrate may be omitted in manufacturing the organic light emitting diode OLED according to the first embodiment, By eliminating the defective rate, the yield can be improved.

Since the organic light emitting display panel 100 according to the first embodiment is not connected to a separate flexible film or a flexible substrate, it is not necessary to expose a pad for connection with the flexible film or the flexible substrate. Thus, the life of the organic light emitting diode OLED due to pad corrosion can be prevented from being reduced.

In addition, since the organic light emitting display panel 100 according to the first embodiment is not connected to the flexible film or the flexible substrate, the driving substrate 150 on the supporting substrate 110, the sealing film 140, And a front protective film 160 for collectively covering the periphery.

This front protective film 160 protects the back surface of the supporting substrate 110 and the upper surface of the sealing film 140 as well as the sides of each of the supporting substrate 110 and the sealing film 140 from the outside. Particularly, since the front protective film 160 is used, the driving chip 152 and the passive element 153 of the driving unit 150 can be protected from the outside in a lump.

Therefore, the organic light emitting diode OLED according to the first embodiment of the present invention can have a simpler structure, can improve the yield, and can prevent the lifetime from being reduced by the pad.

2, the supporting substrate 110 is formed in a rectangular shape and the fixing connector 154 is disposed on one side edge of the supporting substrate 110 (The lower edge of the supporting substrate 110 in Fig. 2). The fixed connector 154 should not be completely covered with the front surface protection film 160 for connection with the signal transmission member 200.

Since the front protective film 160 is formed through the dipping process and the curing process, some of the driving chips 152 or the passive elements 153 disposed around the fixed connector 154 are not covered with the front protective film 160 And can be exposed to the outside.

In order to solve this problem, a second embodiment of the present invention is provided as follows.

6 is a top view of an OLED display according to a second embodiment of the present invention.

6, the organic light emitting display panel 100 'according to the second embodiment includes a support substrate 110' including at least one protrusion 111 protruding from one side edge of a quadrangle 1 to 5 except that the fixing connector 154 of the driving unit 150 is mounted on the protruding portion 111 of the supporting substrate 110 ' Hereinafter, redundant description will be omitted.

According to the second embodiment, the supporting substrate 110 'includes an overall rectangle and a top surface in the form of at least one protrusion 111 protruding from one corner of the rectangle.

A rectangular region of the supporting substrate 110 'corresponds to the display region AA and the driving unit 150. In particular, the driving chip 152 and the passive element 153 provided in the driving unit 150 are mounted on a rectangular area of the supporting substrate 110 '.

The protruding portion 111 of the supporting substrate 110 'is an area for mounting the fixing connector 154.

The driving chip 152 and the passive element 153 need to be completely covered with the front protective film 160 while the fixing connector 154 of the driving part 150 is used for signal transmission It must not be completely covered with the front protective film 160 so as to be connected to the member 200.

Thus, according to the second embodiment, the driving chip 152 and the passive element 153 are mounted on a rectangular area of the supporting substrate 110 ', and the fixing connector 154 is mounted on the projection 111. The front surface protective film 160 corresponds to a rectangular area of the supporting substrate 110 'and is disposed so as not to correspond to the protruding portion 111. [ Illustratively, in the dipping process for the formation of the front protective film 160, at least one protrusion 111 can be fixed to the clipping means (not shown).

As a result, the projecting portion 111 of the supporting substrate 110 'can be easily removed in the dipping process. That is, the driving chip 152 and the passive element 153 are completely covered with the front protective film 160, and it is easy to realize that the fixing connector 154 is not completely covered with the front protective film 160.

Next, with reference to FIGS. 7 to 16, a method of manufacturing an organic light emitting display according to each embodiment of the present invention will be described.

7 is a flowchart illustrating a method of manufacturing an organic light emitting display according to each embodiment of the present invention. 8 to 16 are diagrams showing respective steps of FIG.

As shown in FIG. 7, a method of manufacturing an organic light emitting diode (OLED) according to the first and second embodiments of the present invention includes a step (S10) of providing a supporting substrate made of a soft material on a sacrificial substrate, A step (S20) of arranging the thin film transistor array and the circuit wiring of the driving unit on the substrate, a step (S30) of arranging a plurality of organic light emitting elements on the thin film transistor array, a step of sealing the sealing film covering the plurality of organic light emitting elements A step S50 of mounting a driving chip or a passive element on the circuit wiring of the driving unit, a step S60 of removing the sacrificial substrate, a step of forming a front protective film (S80) of bending a part of the non-display region of the support substrate (S80), and connecting the driver and the control circuit board through the signal transmission member (S90).

As shown in Fig. 8, a support substrate 110 made of a soft material is provided on a sacrificial substrate 400 made of a rigid material. (S10)

Illustratively, the sacrificial substrate 400 may be made of a rigid material such as glass, and the supporting substrate 110 may be made of a soft material such as polyimide (PI).

As in the first embodiment shown in FIG. 2, the supporting substrate 110 may be provided to include a rectangular upper surface.

Alternatively, as in the second embodiment shown in FIG. 6, the supporting substrate 110 'may be provided to include a top surface in the form of a rectangle and a protrusion 111 protruding from one side edge thereof.

The supporting substrates 110 and 110 'include a display area AA in which image display is realized and a non-display area NA which is an outer edge of the display area AA.

On the other hand, the following description will be made on the basis of the first embodiment.

As shown in Fig. 9, a thin film transistor array (120 in Figs. 3 and 4) including a plurality of driving thin film transistors T1 is arranged on a display area AA of a supporting substrate 110. Fig. At the same time, the circuit wiring 151 of the driving unit 150 for driving the thin film transistor array 120 is disposed on the non-display area NA of the supporting substrate 110. (S20)

The thin film transistor array 120 defines a plurality of pixel regions PA in the display region AA and independently drives each of the pixel regions PA.

3 and 4, the thin film transistor array 120 includes a gate line GL and a data line DL intersecting with each other, and a first gate electrode GL for supplying a driving current of the organic light emitting diode 130 And second driving power sources VDD and VSS. The thin film transistor array 120 further includes a driving thin film transistor T1, a switching thin film transistor T2 and a storage capacitor Cst corresponding to each pixel region PA.

The circuit wiring 151 of the driving unit 150 is connected to at least one of the gate line GL of the thin film transistor array 120, the data line DL and the first and second driving power lines VDD and VSS.

The step S20 of arranging the thin film transistor array 120 and the circuit wiring 151 includes the steps of disposing an active layer ACT, ACT_S, ACT_D made of a semiconductor material on the supporting substrate 110, Disposing a gate insulating film 121 covering the active layers ACT, ACT_S and ACT_D on the gate insulating film 121 and the gate electrode GE and the first wiring layer 151a made of the first metal layer on the gate insulating film 121; A step of disposing a first interlayer insulating film 122 covering the gate electrode GE and the first interconnection layer 151a on the gate insulating film 121 and a step of disposing a second interlayer insulating film 122 on the first interlayer insulating film 122, A step of disposing a source electrode SE and a drain electrode DE and a second wiring layer 151b made of a metal layer on the first interlayer insulating film 122 and a step of disposing a source electrode SE and a drain electrode DE on the first interlayer insulating film 122, And disposing a second interlayer insulating film 123 covering the wiring layer 151b.

As shown in FIG. 10, a plurality of organic light emitting elements ED corresponding to a plurality of pixel regions PA are arranged on the thin film transistor array 120. (S30)

The step S30 of disposing the plurality of organic light emitting devices ED includes the steps of disposing the first electrode E1 corresponding to the light emitting region of each pixel region PA on the second interlayer insulating film 123, A step of disposing a bank 131 covering the edge of the first electrode E1 on the two-layer insulating film 123 and a step of disposing the organic layer OL on the first electrode E1 and the bank 131 Disposing a second electrode E2 on the organic layer OL, and disposing a third interlayer insulating film 132 covering the second electrode E2.

In the step of arranging the plurality of organic light emitting devices ED in the step S30, the circuit wiring 151 of the driver 150 is formed on the second interlayer insulating film 123 A third wiring layer 151c may be further disposed.

As shown in Fig. 11, a sealing film 140 is disposed on the third interlayer insulating film 132. As shown in Fig. (S40) Here, the sealing film 140 may be directly or indirectly attached to the supporting substrate 110. [

The driver chip 152 or at least one passive element 153 is individually mounted on the circuit wiring 151 of the driver 150 as shown in Fig. (S50)

In addition, the fixing connector 154 of the driving unit 150 shown in Figs. 1 and 2 is mounted on the circuit wiring 151 as well.

Here, the mounting step (S50) of the driving chip 152 or the passive element 153 and the fixing connector 154 may be performed by a bonding process.

13, after the driving chip 153 or the passive element 154 is mounted on the supporting substrate 110 (S50), the sacrificial substrate 400 is removed. (S60)

As shown in Fig. 14, a front surface 110a covering the entire surface of the supporting substrate 110, the sealing layer 140, and the driving unit 150 disposed on the non-display area NA of the supporting substrate 110 collectively A protective film 160 is disposed. (S70)

The step of arranging the front surface protective film 160 includes a step of mounting the driving chip 152, the passive element 153 and the fixing connector 154 of the driving part 150 on the supporting substrate 110 And immersing the supporting substrate 110, the sealing layer 140, and the driving unit 150 in a liquid state.

Here, the front passivation layer 160 may be made of an insulating material that is curable, viscosity-controllable, and transparent after curing. Illustratively, the front overcoat 160 may be a mixture of acrylic and urethane.

Next, as shown in Fig. 15, a part of the non-display area NA of the support substrate 110 adjacent to the display area AA is bent to the back side of the support substrate 110. Next, as shown in Fig. Therefore, another part of the non-display area NA of the supporting substrate 110 is disposed on the back surface of the supporting substrate 110. [ (S80)

Illustratively, by bending a portion of the support substrate 110, a drive unit 150 disposed in the non-display area NA of the support substrate 110 is placed on the backside of the support substrate 110 .

16, the signal transmission member 200 is connected to the fixed connector 154 of the driving unit 150. [ Through the signal transmission member 200, the driving unit can be connected to the control circuit board 300 that supplies external power and control signals. (S90)

As described above, the manufacturing method of the organic light emitting display according to each embodiment of the present invention does not include a process of connecting the flexible film or the flexible substrate on which the driving chip or the passive element is mounted and the organic light emitting display panel. Therefore, the incidence of failure in the connection process can be completely excluded.

The driving chip 150 and the passive element 153 are mounted on the support substrate 110 and the sealing film 140 and the supporting substrate 110, And disposing the front protective film 160 (S70). That is, since it is not necessary to separately arrange the process of disposing the front protective film and the rear protective film and the process of disposing the member protecting the driving chip as in the conventional organic light emitting display device, the process can be further simplified. In addition, since the step of arranging the front protective layer 160 does not include a lamination process, the defect occurrence rate due to the lamination process can be eliminated.

As a result, the yield can be improved, and manufacturing cost and manufacturing time can be reduced.

In addition, since the side surfaces of the supporting substrate 110 and the sealing film 140 can be collectively protected by the front protective film 160, the prevention of penetration of oxygen and moisture can be further strengthened.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Will be clear to those who have knowledge of.

OLED: organic light emitting display 100: organic light emitting display panel
110: support substrate 120: thin film transistor array
130: plurality of organic light emitting elements 140: sealing film
150: driving part 151: circuit wiring
152: driving chip 153: passive element
154: fixed connector 160: front shield
200: signal transmission member 300: control circuit board

Claims (14)

A flexible support substrate including a display region and a non-display region outside the display region;
A thin film transistor array disposed on the display region of the support substrate and defining a plurality of pixel regions;
A plurality of organic light emitting elements arranged on the thin film transistor array and corresponding to a plurality of pixel regions;
A sealing film bonded to the supporting substrate and covering the plurality of organic light emitting elements; And
And a driving unit disposed in a non-display region of the supporting substrate to drive the thin film transistor array and to which a driving chip or a passive element is mounted.
The method according to claim 1,
Further comprising a front protective film which collectively surrounds the driving substrate on the supporting substrate, the sealing film, and the mutually adhered supporting substrate.
The method according to claim 1,
Wherein the driving unit is connected to a control circuit board that supplies external power and control signals through signal transmission members including connectors at both ends.
The method of claim 3,
Wherein the driving unit includes a fixed connector disposed at an edge of the supporting substrate and connected to the signal transmitting member.
The method of claim 3,
Wherein the upper surface of the support substrate has a quadrangular shape and at least one protrusion protruding from one side edge of the quadrangle,
Wherein the driver includes a fixed connector mounted on the at least one protrusion of the supporting substrate and connected to the signal transmitting member.
The method according to claim 1,
The thin film transistor array
A gate line and a data line which are mutually insulated and arranged in a mutually intersecting direction; And
And a thin film transistor disposed in a crossing region between the gate line and the data line,
The driving unit
A gate driver for driving the gate line;
A data driver driving the data lines; And
And a main driver for supplying control signals and power to the gate driver and the data driver, respectively.
The method according to claim 1,
Wherein a part of the non-display area of the support substrate adjacent to the display area is bent toward the back side of the support substrate, and another part of the non-display area of the support substrate is disposed on the back side of the support substrate.
An organic light emitting display panel according to any one of claims 1 to 7. And
And a control circuit board for supplying external power and control signals to the organic light emitting display panel.
Providing a support substrate including a display region and a non-display region outside the display region and made of a soft material, on a sacrificial substrate;
Disposing a thin film transistor array defining a plurality of pixel regions in the display region of the support substrate and arranging circuit wiring of a driver for driving the thin film transistor array in the non-display region;
Disposing a plurality of organic light emitting elements corresponding to a plurality of pixel regions on the thin film transistor array;
Attaching a sealing film covering the plurality of organic light emitting elements to the supporting substrate;
Mounting a driving chip or a passive element on the circuit wiring of the driving unit;
Removing the sacrificial substrate; And
And disposing a front protective film that collectively surrounds the sealing substrate and the supporting substrate.
10. The method of claim 9,
The step of disposing the front protective film
Immersing the mutually adhered support substrate and the sealing film in a liquid insulating material in a state where the driving chip or the passive element is mounted; And
And curing a liquid insulating material around the supporting substrate, the sealing film, and the driving chip or the passive element mounted on the supporting substrate to dispose the front protective film.
10. The method of claim 9,
In the step of mounting the driving chip or the passive element,
Wherein the fixed connector is further mounted on a part of the non-display area of the supporting substrate.
10. The method of claim 9,
Wherein the upper surface of the support substrate has a quadrangular shape and at least one protrusion protruding from one side edge of the quadrangle,
In the step of mounting the driving chip or the passive element,
Wherein the fixing connector is further mounted on the at least one protrusion of the supporting substrate.
13. The method according to claim 11 or 12,
After the step of disposing the front protective film,
Further comprising the step of connecting a signal transmission member including connectors at both ends to the fixed connector and connecting the driving unit to a control circuit board for supplying external power and control signals.
10. The method of claim 9,
After the step of disposing the front protective film,
Further comprising bending a portion of the non-display region of the support substrate adjacent to the display region to the backside of the support substrate and arranging another portion of the non-display region of the support substrate on the backside of the support substrate ≪ / RTI >

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