JP2004233757A - Manufacture method of optical waveguide element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacture method of optical waveguide element which has such advantages in the cost aspect that fine grinding for optical finishing is efficiently performed in a short period of time, and the consumption of consumable material like grinding liquid etc. is reduced. <P>SOLUTION: Optical waveguides 11, 12 are formed on a work wafer and a marker is formed in a direction along an input/output waveguide 12. By performing dicing on the basis of the marker, two diced surfaces y1, y2 in parallel along the input/output waveguide and two diced surfaces 19, 29 inclined at a prescribed angle from the direction orthogonal with respect to the input/output waveguide are obtained. Thereby, a wafer 10 is cut out into a parallelogram and the vicinity of the end part 13 of the input/output waveguide is subjected to dicing vertically to the diced surfaces y1, y2 and is faired into surfaces x19, x29 orthogonal to the optical axis of the input/output waveguide. The diced surfaces y1, y2 on the basis of the guide are opposed vertically to a grind stone surface 30 and are ground and, thereby, only a region part of the end part 13 is finished into an optical surface. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for manufacturing an optical waveguide element, and more specifically, dicing for cutting a waveguide pattern formed on a wafer into a predetermined shape, and grinding for finishing an end of an input / output waveguide to an optical surface. Regarding improvement.
[0002]
BACKGROUND OF THE INVENTION
With respect to optical devices, a PLC (Planer Lightwave Circuit) in which an optical waveguide is formed in a plane has been receiving attention. The PLC forms an optical waveguide on a flat substrate (wafer) made of silicon, quartz, or the like by applying a semiconductor process technology. Therefore, the optical waveguide is excellent in stability of characteristics, miniaturization, and mass productivity. The device has been manufactured and is being actively developed.
[0003]
In other words, in the manufacture of an optical waveguide element, after applying a semiconductor pattern technology such as photolithography or dry etching to form a waveguide pattern on a work wafer, dicing the periphery of the wafer to form a single chip into a predetermined shape. Cutting is performed. As shown in FIG. 1, the cut out optical waveguide element has a waveguide 11 on a substrate 10 in a predetermined pattern, and an end 13 of an input / output waveguide 12 is located on predetermined dicing surfaces x1 and x2. ing. Since the input / output waveguide 12 is connected to an optical fiber array, it is necessary to apply an optical finish to the end portion 13 in order to suppress the connection loss, and the corresponding dicing surfaces x1 and x2 are ground (polished). To obtain a so-called mirror surface.
[0004]
However, in such manufacturing, since the grinding for optical finishing is precision grinding with a reduced amount of grinding, there is a problem that grinding takes time and productivity is poor. Moreover, since the grinding is performed on the entire dicing surfaces x1 and x2, the area to be ground is large and the grinding conditions are poor. As a result, sagging occurs on the ground surface, a smooth surface cannot be obtained, and defects are likely to occur. In addition, a large amount of consumables such as a grinding fluid used for grinding is consumed, which is disadvantageous in terms of cost.
[0005]
SUMMARY OF THE INVENTION The present invention has been made in view of the above background, and has as its object to solve the above-described problems and to perform precision grinding for optical finishing in a short time and efficiently. An object of the present invention is to provide a method of manufacturing an optical waveguide device which can reduce consumption of a consumable material such as a liquid and is excellent in cost.
[0006]
[Means for Solving the Problems]
In order to achieve the above object, a method for manufacturing an optical waveguide device according to the present invention is a method for manufacturing an optical waveguide device in which a light waveguide is formed on a wafer and cut into a predetermined shape, In the pattern, the end of the input / output waveguide is set near a corner where two dicing surfaces are adjacent to each other, and in a grinding step after the dicing step, only a predetermined area including the input / output end faces the grindstone surface. By grinding, the region is processed into an optical surface for coupling with an optical fiber.
[0007]
In addition, a marker is provided in the direction along the input / output waveguide, the wafer has a cutout shape as a parallelogram, and one opposite side is scribed in parallel along the marker direction, and the other opposite side is scribed in the marker direction. On the other hand, dicing is performed by scribing at a predetermined inclination in the intersecting direction, and in the grinding step, the dicing surface cut out parallel to the marker direction may be opposed to the grinding wheel surface perpendicularly.
[0008]
Alternatively, a marker is provided in a direction orthogonal to the input / output waveguide, and the cutout shape of the wafer is a parallelogram, one opposite side is scribed in parallel along the marker direction, and the other opposite side is the marker. Dicing is performed by scribing at a predetermined inclination in a direction crossing the direction, and in the grinding step, the dicing surface cut out at an inclination crossing in the marker direction may be opposed to the grinding wheel surface perpendicularly. it can.
[0009]
On the premise of each of the above-described inventions, the pattern of the waveguide can be formed by a film forming process such as an ion exchange method, a CVD method, a flame deposition method, and a polymer method.
[0010]
Therefore, in the present invention, since the end of the input / output waveguide is located near the corner where two dicing surfaces are adjacent to each other, and only a predetermined area including the input / output end faces the grindstone surface, the grinding is performed. The target is limited to the predetermined area. That is, the area related to grinding is significantly reduced as compared with the conventional case.
[0011]
BEST MODE FOR CARRYING OUT THE INVENTION
FIG. 2 shows a first embodiment of the present invention. In this embodiment, the optical waveguide device has a configuration in which a light waveguide 11 is formed in a predetermined pattern on a flat substrate (wafer 10), and an input / output waveguide 12 is positioned on a predetermined dicing surface. ing.
[0012]
In manufacturing this optical waveguide device, the pattern of the waveguide 11 is such that the end 13 of the input / output waveguide 12 is set near a corner where two dicing surfaces are adjacent to each other. Then, in a grinding process after the dicing process, only a predetermined region including the end portion 13 of the input / output waveguide 12 is faced to the grindstone surface and ground, and the region portion is subjected to an optical surface for coupling with an optical fiber array. Process into
[0013]
More specifically, the optical waveguides 11 and 12 are formed on the work wafer 1 by a semiconductor process, and the marker 2 for determining the directionality of the waveguide pattern is formed. The marker 2 is formed in a direction along the input / output waveguide 12. That is, a plurality of markers 2 are provided in parallel with the input / output waveguide 12. The pattern of the waveguide 11 may be formed by an appropriate film forming process, for example, by a film forming process such as an ion exchange method, a CVD method, a flame deposition method, and a polymer method. Although not shown, the waveguide 11 may have a configuration of a plurality of channels in which a large number of channels are arranged and patterned.
[0014]
Here, the cut-out shape of the work wafer 1 is a parallelogram. Then, one opposite side is scribed in parallel along the direction in which the markers 2 are arranged to perform dicing to obtain two dicing surfaces y1 and y2 parallel to the input / output waveguide 12. The other side is scribed at a predetermined inclination in a direction crossing the arrangement direction of the markers 2 to perform dicing, and two dicing surfaces 19 and 29 inclined at a predetermined angle from the orthogonal direction with respect to the input / output waveguide 12. obtain.
[0015]
By the above dicing, the wafer 10 is cut into a parallelogram as an optical waveguide device. Further, in this dicing step, as shown in FIGS. 3A and 3B, the vicinity of the end portion 13 of the input / output waveguide 12 is diced perpendicular to the dicing surfaces y1 and y2 of the guide reference. The planes x19 and x29 orthogonal to the optical axis of the input / output waveguide 12 are arranged.
[0016]
Next, in the grinding step, as shown in FIG. 3B, the dicing surfaces y1 and y2 cut out in parallel with the direction in which the markers 2 are arranged are made to oppose perpendicularly to the grindstone surface 30, and this is set as a guide reference. And perform grinding. As a result, the opposing surfaces x19 and x29, that is, the region of the end portion 13 is finished to a predetermined smoothness, and an optical surface for coupling with the optical fiber array is obtained.
[0017]
In addition, as shown in FIG. 4, the thickness direction of the optical waveguide element is ground by being inclined with respect to the grindstone surface 30 to provide a predetermined inclination to the coupling with the optical fiber array to prevent reflection at the coupling. take.
[0018]
As described above, the end 13 of the input / output waveguide 12 is located near a corner where two dicing surfaces are adjacent to each other, and only predetermined regions x19 and x29 including the end 13 are opposed to the grindstone surface 30 for grinding. Since the grinding is performed, the grinding target is limited to the predetermined region, that is, the area related to grinding is significantly reduced as compared with the related art.
[0019]
For this reason, precision grinding for optical finishing can be performed efficiently in a short time, and the area related to grinding is reduced, which is advantageous in terms of sagging of the grinding surface and poor smoothness, and grinding with high precision. I can do it. As a result, the consumption of consumables such as grinding fluid can be reduced, which is excellent in cost.
[0020]
In the grinding process, the dicing surfaces y1 and y2, which are used as guide references, are perpendicularly opposed to the grindstone surface 30, so that the angle setting in the grinding device is easy and the workability is good, so that the grinding process can be stably performed. This is advantageous in that high accuracy can be obtained.
[0021]
Furthermore, in the dicing process, the vicinity of the end portion 13 of the input / output waveguide 12 is diced to be parallel to the grindstone surface 30, so that when grinding, chipping or cracking can be prevented when abutting against the grindstone surface 30, Since the regions are arranged in advance in parallel, the processing time of precision grinding can be further reduced.
[0022]
FIG. 5 shows a second embodiment of the present invention. In the second embodiment, as compared with the first embodiment, the arrangement of the marker 2 is changed, and the marker 2 is provided in a direction orthogonal to the input / output waveguide 12.
[0023]
The cut shape of the work wafer 1 is a parallelogram, and one of the opposite sides is scribed in parallel along the direction in which the markers 2 are arranged for dicing, and two dicing surfaces x1 and x2 orthogonal to the input / output waveguide 12 are formed. Get. The other opposite side is scribed at a predetermined inclination in a direction crossing the arrangement direction of the markers 2 to perform dicing, and two dicing surfaces y19 and y29 inclined at a predetermined angle are obtained from a parallel line along the input / output waveguide 12. In this case, the dicing surfaces y19 and y29 are used as a guide reference for the grinding, and the dicing surfaces y19 and y29 return to a posture perpendicular to the grindstone surface 30 so that the dicing surfaces x1 and x2 are returned. Is inclined at a predetermined angle.
[0024]
By the above dicing, the wafer 10 is cut into a parallelogram as an optical waveguide element. Further, in this dicing step, as shown in FIG. 6, the vicinity of the end 13 of the input / output waveguide 12 is diced perpendicularly to the dicing surfaces y19 and y29 of the guide reference, and faces in parallel to the grindstone surface 30. The planes x19 and x29 to be adjusted are prepared.
[0025]
Therefore, in the grinding step, as shown in FIG. 6, the dicing surfaces y19 and y29 cut out to a predetermined inclination are tilted back to be opposed to the grindstone surface 30 perpendicularly, and the grinding is performed using this as a guide reference. Therefore, the opposing surfaces x19 and x29, that is, the region of the end portion 13 is finished to a predetermined smoothness to obtain an optical surface for coupling with the optical fiber array.
[0026]
In this case, since the optical axis of the input / output waveguide 12 has a predetermined inclination with respect to the finished optical surfaces x19 and x29, the coupling of the optical fiber array is performed in the opposite direction corresponding to the coupling surface on the optical fiber array side. It is necessary to grind the inclined surface.
[0027]
Therefore, it is the same as the first embodiment, and only the predetermined areas x19 and x29 including the end portion 13 of the input / output waveguide 12 face the grindstone surface 30 for grinding, so that the object to be ground is limited to the predetermined area. That is, the area related to grinding is significantly reduced as compared with the related art. For this reason, precision grinding for optical finishing can be performed efficiently in a short time, which is advantageous in terms of sagging and poor smoothness of the grinding surface, and high precision grinding can be performed. As a result, the consumption of consumables such as grinding fluid can be reduced, which is excellent in cost. Note that the other configuration and operation and effect are the same as those of the above-described first embodiment, and a detailed description thereof will be omitted.
[0028]
FIG. 7 shows a third embodiment of the present invention. In the third embodiment, the pattern of the waveguide is changed. Accordingly, the outer shape of the optical waveguide element is formed in a polygonal shape. That is, in the present invention, since the input / output waveguide only needs to be located near the corner, the external shape may be appropriately set. In this case, the input / output waveguide 12 is formed into a substantially hexagonal shape in view of the pattern setting. ing.
[0029]
That is, on the work wafer 1, the input / output waveguides 12 are set in a pattern facing each other, the markers 2 are formed in a directionality along the input / output waveguides 12, and one opposite side is parallel to the marker 2 in the arrangement direction. Dicing is performed by scribing to obtain two dicing surfaces y1 and y2 parallel to the input / output waveguide 12. On the other side, since the input / output waveguide 12 is located at the center, dicing is performed by scribing the slope lines from the dicing surfaces y1 and y2 toward the center, and the input / output waveguide 12 is located near the intersection. The dicing surfaces 18, 19 and 28, 29 located are obtained.
[0030]
By the above dicing, the wafer 10 is cut into a substantially hexagonal shape as an optical waveguide device. Further, in this dicing step, the vicinity of the end portion 13 of the input / output waveguide 12 is diced perpendicularly to the dicing surfaces y1 and y2 of the guide reference, and a surface x19 orthogonal to the optical axis of the input / output waveguide 12 is formed. Adjust to x29.
[0031]
Next, in the grinding step, the dicing surfaces y1 and y2 cut out in parallel to the direction in which the markers 2 are arranged are opposed to each other perpendicularly to the grindstone surface, and grinding is performed using this as a guide reference. As a result, the opposing surfaces x19 and x29, that is, the region of the end portion 13 is finished to a predetermined smoothness, and an optical surface for coupling with the optical fiber array is obtained.
[0032]
Also in this case, the same as in the first embodiment, the object to be ground is limited to the predetermined areas x19 and x29 facing the grindstone surface, and the area related to the grinding is remarkably reduced as compared with the prior art. Precision grinding for grinding can be performed efficiently in a short period of time, which is advantageous in terms of sagging of the ground surface and poor smoothness, thereby enabling high-precision grinding. As a result, the consumption of consumables such as grinding fluid can be reduced, which is excellent in cost. Note that the other configurations, functions, and effects are the same as those of the above-described embodiments, and thus detailed description thereof will be omitted.
[0033]
【The invention's effect】
As described above, in the method for manufacturing an optical waveguide device according to the present invention, the end of the input / output waveguide is located near a corner where two dicing surfaces are adjacent to each other, and only a predetermined region including the input / output end is provided. Since the grinding is performed while facing the grindstone surface, the grinding target is limited to the predetermined region, that is, the area related to the grinding is significantly reduced as compared with the related art. For this reason, precision grinding for optical finishing can be performed efficiently in a short time, and the area related to grinding is reduced, which is advantageous in terms of sagging of the grinding surface and poor smoothness, and grinding with high precision. I can do it. As a result, the consumption of consumables such as grinding fluid can be reduced, and the cost is excellent.
[Brief description of the drawings]
FIG. 1 is a plan view showing a conventional example of an optical waveguide device using a PLC.
FIG. 2 is a plan view of a wafer showing the first embodiment.
FIG. 3 is a plan view illustrating dicing and grinding.
FIG. 4 is a side view illustrating finish grinding of an optical surface.
FIG. 5 is a plan view of a wafer showing a second embodiment.
FIG. 6 is a plan view illustrating dicing and grinding.
FIG. 7 is a plan view of a wafer showing a third embodiment.
[Explanation of symbols]
1 Work Wafer 2 Marker 10 Wafer 11 Waveguide 12 Input / Output Waveguide 13 End 30 Grinding Surface x1, x2, y1, y2 Dicing Surface 18, 19, 28, 29, y19, y29 Dicing Surface x19, x29 Opposing Surface

Claims (4)

A method for manufacturing an optical waveguide device, in which a light waveguide is formed on a wafer and cut into a predetermined shape,
The waveguide pattern, the end of the input and output waveguide is set near the corner where two dicing surfaces are adjacent to each other,
In the grinding step after the dicing step, the grinding surface is ground only by facing a predetermined area including the input / output end, and the area is processed into an optical surface for coupling with an optical fiber. A method for manufacturing an optical waveguide device, comprising: Providing a marker in the direction along the input / output waveguide,
The wafer has a cutout shape as a parallelogram, one opposite side is scribed in parallel along the marker direction, and the other opposite side is scribed at a predetermined inclination in a direction crossing the marker direction to perform dicing,
2. The method according to claim 1, wherein in the grinding step, a dicing surface cut in parallel with the marker direction is perpendicularly opposed to the grindstone surface. 3. Providing a marker in a direction orthogonal to the input / output waveguide,
The wafer has a cutout shape as a parallelogram, one opposite side is scribed in parallel along the marker direction, and the other opposite side is scribed at a predetermined inclination in a direction crossing the marker direction to perform dicing,
2. The method according to claim 1, wherein in the grinding step, a dicing surface cut at an inclination crossing the marker direction is perpendicularly opposed to the grindstone surface. 3. 4. The method according to claim 1, wherein the waveguide pattern is formed by a film forming process such as an ion exchange method, a CVD method, a flame deposition method, and a polymer method.

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