JP2004230555A - Polishing device and its operation method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a polishing device and an operation method for the polishing device which prevent a top ring and a dressing tool from being dried, while removing slurry stuck to the top ring and the dressing tool by maintaining a wet state with a washing liquid, when the top ring and the dressing tool stand by in positions outside a turntable. <P>SOLUTION: This polishing device is provided with the turntable 10 with an abrasive cloth stuck thereto, and the top ring 20 for holding a polishing object, and presses the polishing object held to the top ring 20, to the abrasive cloth of the turntable 10 to polish the polishing surface of the polishing object. The polishing device is further provided with a means (a wash water nozzle) for keeping at least the lower face of the top ring 20 in the wet state after the completion of polishing the polishing objects in one lot until the polishing objects in another lot is carried into the top ring 20. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

  The present invention relates to a polishing apparatus and a method of operating the same, and more particularly, to a polishing apparatus which can be kept wet while a top ring and a dressing tool cleaning apparatus are waiting at a position outside a turntable.

  FIG. 3 is a diagram showing a schematic plan configuration of the polishing apparatus. As shown in the figure, the polishing apparatus includes a turntable 10, a top ring 20, and a dressing tool 30 each having an abrasive cloth (not shown) adhered to the upper surface, and rotates (in the direction of arrow A). The object to be polished (not shown) held on the lower surface of the rotating top ring 20 (in the direction of arrow C) is pressed to polish the polished surface of the object to be polished and to the rotating polishing cloth of the turntable 10. The dressing tool 30 is pressed against the rotating dressing tool 30 to correct the time-dependent change due to the polishing of the polishing cloth to perform dressing.

  In the above-described polishing apparatus, the top ring 20 receives the object to be polished from the robot arm 60 or the like at the object transfer position D, polishes the object to be polished at the polishing position F through the path E, and moves the same path E after the polishing is completed. Returning to the polishing object transfer position D, passing the finished polishing object to the robot arm 60, receiving the polishing object again from the robot arm 60, and polishing the polishing object at the polishing position F in one lot. Until the polishing of the object to be polished is completed. After the polishing of the polished material of the one lot is completed, the top ring 20 waits at the position D until a lot to be conveyed is carried in, waiting for a lot. The position G is a standby position of the top ring 20 at the time of maintenance.

On the other hand, the dressing tool 30 presses its lower surface against the upper surface of the polishing cloth of the turntable 10 at the dressing position H, and corrects the polishing cloth by changing over time due to polishing or the like to perform dressing. After the dressing is completed, it moves to the standby position J through the path I, and waits at the standby position J until the next polishing.
Japanese Patent Publication No. Hei 7-508686 JP-A-7-251372

  In the above-described polishing apparatus, when the conventional top ring 20 waits at the standby position G at the time of maintenance, and when the dressing tool 30 waits at the standby position J, the top ring 20 and the dressing do not stay in a wet state. There is a problem that the slurry attached to the tool 30 dries and the dried slurry falls on the polishing cloth of the turntable 10 and adversely affects the polishing of the object to be polished.

  Since the present invention has been made in view of the above points, when the top ring and the dressing tool stand by at the position outside the turntable, the slurry adhered to the top ring and the dressing tool is removed by keeping the top ring and the dressing tool wet. In addition, an object of the present invention is to provide a polishing apparatus capable of preventing the top ring and the dressing tool from drying, and an operation method thereof.

  According to a first aspect of the present invention, there is provided a turntable having a polishing cloth attached thereto and a top ring for holding an object to be polished, wherein the turntable has a polishing cloth held by the top ring. In a polishing apparatus for pressing a polished object and polishing a polished surface of the polished object, after the top ring finishes polishing the polished object of one rod, until the polished object of another rod is carried in, the top ring is polished. A means for maintaining at least the lower surface in a wet state is provided.

  According to a second aspect of the present invention, in the polishing apparatus according to the first aspect, the means for maintaining the wet state is a nozzle that sprays a cleaning liquid onto at least a lower surface of the top ring.

  According to a third aspect of the present invention, in the polishing apparatus according to the second aspect, the means for maintaining the wet state is a control means for intermittently ejecting the cleaning liquid from the nozzle at a time interval during which at least the lower surface of the top ring does not dry. It is characterized by having.

  According to a fourth aspect of the present invention, in the polishing apparatus according to the first aspect, the means for maintaining a wet state includes a container filled with a cleaning liquid, and at least a lower surface of the top ring is immersed in the container to change the wet state. It is characterized by keeping.

  According to a fifth aspect of the present invention, in the polishing apparatus according to any one of the first to fourth aspects, the top ring is rotated while being kept wet.

  The invention according to claim 6, comprising a turntable to which a polishing cloth is attached, a top ring for holding the object to be polished, and pressing the object to be polished held by the top ring against the polishing cloth of the turntable. In the method of operating a polishing apparatus for polishing a polished surface of an object to be polished, after the polishing of the object to be polished of one lot is completed, the top ring is placed in a standby position until another object to be polished is loaded. It is characterized in that it is moved and at least the lower surface is kept wet.

  According to the present invention, the top ring device is provided with a means for keeping at least the lower surface of the top ring in a wet state after the top ring finishes polishing the object to be polished by one rod until the object to be polished by another rod is carried in. Therefore, at least the lower surface of the top ring can be maintained in the same state as during polishing, the object to be polished between the rods can be polished in the same state, and the cleaning effect by the wet means can be expected. Can also be eliminated.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a diagram showing a schematic configuration of a polishing apparatus according to the present invention. Note that, in FIG. 1, portions denoted by the same reference numerals as those in FIG. 3 indicate the same or corresponding portions. The same applies to other drawings. As shown in the figure, the polishing apparatus has a cleaning water nozzle 40 for spraying cleaning water 42 on the lower surface of the top ring 20 at the standby position G for maintenance and a cleaning water nozzle 40 on the lower surface of the dressing tool 30 at the standby position J. A washing water nozzle 41 for jetting water 43 is provided.

  In the polishing apparatus having the above-described configuration, the cleaning water 42 is jetted from the cleaning water nozzle 40 to the lower surface of the top ring 20 waiting at the standby position G during maintenance, and the lower surface of the top ring 20 is kept wet. At this time, by rotating the top ring 20, the lower surface can be uniformly wetted. Further, the washing water 43 is also sprayed from the washing water nozzle 41 onto the lower surface of the dressing tool 30 waiting at the standby position J after the dressing is completed, and the lower surface of the dressing tool 30 is kept wet. At this time, by rotating the dressing tool 30, the lower surface can be uniformly wetted.

  The main purpose of the injection of the washing water 42 and the washing water 43 by the washing water nozzle 40 and the washing water nozzle 41 is to maintain the lower surface of the top ring 20 and the lower surface of the dressing tool 30 in a wet state. The washing water 43 may be sprayed continuously while the top ring 20 and the dressing tool 30 are on standby, but may be sprayed intermittently at appropriate time intervals not drying in order to save the washing water. You may do it. By injecting the washing water intermittently as described above, it is possible to save expensive washing water such as pure water.

  In the above embodiment, the washing water nozzle 40 and the washing water nozzle 41 are used to wash the lower surface of the top ring 20 and the dressing tool 30. However, not only the lower surface but also a predetermined range including the lower surface becomes wet. The washing water nozzle may be configured to be maintained, or a plurality of washing water nozzles may be arranged.

  FIG. 2 is a diagram showing a schematic configuration of a top ring and a dressing tool cleaning device in the polishing device according to the present invention. As shown in the drawing, the top ring and dressing tool cleaning device includes a container 44 filled with cleaning water 46 at a standby position G for maintenance of the top ring 20 and a cleaning water 47 at a standby position J of the dressing tool 30. A filled container 45 is provided.

  In the polishing apparatus having the above configuration, the top ring 20 at the standby position G for maintenance is immersed in the washing water 46 in the container 44, and a predetermined area including the lower surface of the top ring 20 is wetted. At this time, by rotating the top ring 20, the cleaning effect is also improved. Further, the dressing tool 30 after the dressing is completed is immersed in the washing water 47 of the container 45 at the standby position J, and a predetermined area including the lower surface of the dressing tool 30 is kept wet. At this time, by rotating the dressing tool 30, the cleaning effect is also improved.

  Further, the container 44 is provided with a flow pipe 48 for keeping the level of the cleaning water at a predetermined level, and the cleaning water 46 can be saved by supplying the cleaning water from the supply pipe 49 little by little or intermittently. Similarly, the vessel 45 is provided with a flow pipe 50 for keeping the water level of the cleaning water at a predetermined level, and the cleaning water 47 can be saved by supplying the cleaning water from the supply pipe 51 little by little or intermittently. A drain pipe 52 and a drain pipe 53 are provided at the bottom of each of the containers 44 and 45.

  The containers 44 and 45 are disposed at the standby positions G and J on the outside of the turntable 10 as described above, respectively. The containers 44 and 45 are filled with the cleaning water 46 and the cleaning water 47, respectively. By immersing the ring 20 and the dressing tool 30, compared to the method in which the washing nozzle 40 and the washing water nozzle 41 shown in FIG. No polisher room. In addition, it is possible to save water for washing.

  In the above-described embodiment, both the top ring 20 and the dressing tool 30 are kept in the wet state at the standby positions G and J outside the turntable 10, but by keeping both in the wet state, The effect of preventing the dried slurry from dropping onto the polishing cloth of the turntable 10 and exerting an adverse effect is further enhanced, but in some cases, only one of the top ring 20 and the dressing tool 30 is wetted. It may be configured to keep the state.

It is a figure showing the schematic structure of the polish device provided with the top ring and the dressing tool cleaning device of the present invention. It is a figure showing the schematic structure of the polish device provided with the top ring and the dressing tool cleaning device of the present invention. FIG. 2 is a diagram illustrating a schematic configuration of a polishing apparatus.

Explanation of reference numerals

DESCRIPTION OF SYMBOLS 10 Turntable 20 Top ring 30 Dressing tool 40 Cleaning water nozzle 41 Cleaning water nozzle 42 Cleaning water 43 Cleaning water 44 Container 45 Container 46 Cleaning water 47 Cleaning water 48 Flow pipe 49 Supply pipe 50 Flow pipe 51 Supply pipe 52 Drain pipe 53 Drain tube

Claims (6)

A turntable to which a polishing cloth is attached, and a top ring for holding the object to be polished are provided. The object to be polished held by the top ring is pressed against the polishing cloth of the turntable to polish the polished surface of the object to be polished. In polishing equipment,
A polishing apparatus provided with means for keeping at least a lower surface of the top ring in a wet state after the top ring finishes polishing of one lot of the object to be polished until another object to be polished is carried in. . The polishing apparatus according to claim 1,
The polishing apparatus, wherein the means for maintaining the wet state is a nozzle for spraying a cleaning liquid onto at least a lower surface of the top ring. The polishing apparatus according to claim 2,
The polishing apparatus according to claim 1, wherein the means for maintaining the wet state includes a control means for intermittently spraying the cleaning liquid from the nozzle at a time interval during which at least the lower surface of the top ring does not dry. The polishing apparatus according to claim 1,
The polishing apparatus according to claim 1, wherein the means for maintaining the wet state includes a container filled with a cleaning liquid, and at least a lower surface of the top ring is immersed in the container to maintain the wet state. The polishing apparatus according to any one of claims 1 to 4,
The polishing apparatus according to claim 1, wherein the top ring is rotated while being kept wet. A turntable to which a polishing cloth is attached, and a top ring for holding the object to be polished are provided. The object to be polished held by the top ring is pressed against the polishing cloth of the turntable to polish the polished surface of the object to be polished. In the operation method of the polishing apparatus,
After the polishing of one lot of the object to be polished by the top ring is completed, the top ring is moved to a standby position and at least the lower surface is kept wet until the object to be polished of another lot is carried in. Polishing How to operate the device.

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