JP2004214290A - Substrate processing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which has reduced the cable connecting points using a connector. <P>SOLUTION: The substrate processing apparatus consists of a plurality of processing units (first chemical solution processing units 8a to 8c, second chemical solution processing units 15a to 15c, developing process units 30a to 30c), a transfer mechanism, and a plurality of blocks (BARC block 2, SC block 3, and SD block 4) comprising sub-controllers (sub-controllers SC2 to SC4 or the like). The sub-controller plays the role of receiving, for the control of each control object, the signal from the sensors provided for the control object (solution leak sensors S8, S15 and S30) and transferring such signal to the corresponding controller (chemical solution controller CC or the like). Accordingly, wires and connectors for individually connecting each sensor and controller can be saved. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a wiring configuration in a substrate processing apparatus including a plurality of processing units for performing a predetermined process on a semiconductor substrate, a glass substrate used for a liquid crystal device, or the like.
[0002]
[Prior art]
In a manufacturing process of a semiconductor device, a liquid crystal device, or the like, a substrate processing apparatus that performs various processes on a semiconductor substrate, a glass substrate, or the like is provided with a plurality of units including a plurality of processing units that perform one processing step. By combining a plurality of different types of processing units in order to continuously perform different processing steps, manufacturers are meeting the demand for improved throughput. The size of the device itself tends to increase.
[0003]
When manufacturing such large-sized substrate processing equipment and delivering it, due to the limited storage capacity of the transportation means, the equipment is manufactured in advance so that it can be divided into several components, and transported in a divided state. It is common to assemble at the delivery destination. In order to increase the efficiency of the assembly work in such a case, connect the supply pipes and cables of each supply pipe so that water and power supply lines can be easily connected to multiple processing units that perform the same processing. Techniques for consolidation have already been disclosed. (For example, refer to Patent Document 1).
[0004]
[Patent Document 1]
JP 2002-198276 A
[0005]
[Problems to be solved by the invention]
FIG. 5 is a diagram schematically showing a part of a control system of a conventional substrate processing apparatus 1000. The substrate processing apparatus 1000 shown in FIG. 5 includes, for example, processing units related to substrate processing, such as an apparatus having several (two in FIG. 5) processing units UN for performing a predetermined chemical solution processing on a substrate. It is assumed that some (four in FIG. 5) processing blocks BLK are provided. In addition, a main controller MC0 that controls the entire substrate processing apparatus 1000, a unit controller UC0 that is provided for each processing block BLK, and controls a processing unit that is provided in the processing block BLK, and a chemical liquid that is provided for each processing unit. And a chemical liquid controller CC0 that controls the chemical liquid supply in accordance with information from the liquid leakage sensor S0 that detects the pressure. These controllers are connected to the network N. The sensor S0 and the chemical liquid controller CC0 are connected by a signal line SL0, and are connected by a connector CN at the boundary of the processing block BLK. Although illustration is omitted for simplification of description, a heat treatment unit and the like, and a controller and a sensor necessary for the heat treatment unit may be provided.
[0006]
In the conventional substrate processing apparatus 1000, each of the unit controller UC0 and the chemical liquid controller CC0 performs only control processing relating to a processing unit or the like to be controlled, and the main controller MC0 supervises the control processing. It was necessary to transmit information individually to each control object for each controller.
[0007]
For this reason, even if the technology described in Patent Document 1 is used, as for the wiring cables that need to be installed between the respective blocks (the components of the substrate processing apparatus), the cables for the respective number of connectors are required. It was necessary to provide for each passing block. Also, although it is easier to remove than connecting all cables individually, the number of cables that need to be connected increases and the number and types of connectors that need to be connected naturally increase as the integration of devices progresses Therefore, only the technique disclosed in Patent Literature 1 limits the improvement of assembly work efficiency and the maintenance of connection reliability.
[0008]
The increase in cable length has also led to an increase in manufacturing costs. By using a system called a remote I / O or a wiring saving system that reduces the number of wirings, reliability can be improved, but it is disadvantageous in cost.
[0009]
The present invention has been made in view of the above-described problems, and has as its object to provide a substrate processing apparatus in which the number of cable connection points by connectors is reduced.
[0010]
[Means for Solving the Problems]
In order to solve the above problems, the invention according to claim 1 is an apparatus for performing a predetermined process on a substrate, wherein at least one processing unit, a transport unit that transports the substrate to the at least one processing unit, A plurality of partial control units provided in one processing unit and each including at least one sensor for detecting a state of the processing unit, and partial control means for controlling the at least one processing unit and the transport unit. Main control means for controlling the plurality of partial control means, and at least one specific control for controlling a specific control target corresponding to a detection target of the sensor in response to a signal from the at least one sensor Means, each of said partial control means, said main control means, and said at least one specific control means Ttowaku are connected, and wherein the at least one sensor, said same being the portion control means electrically connected provided in partial control unit, characterized in that.
[0011]
According to a second aspect of the present invention, in the substrate processing apparatus according to the first aspect, each of the partial control units is accommodated in an accommodating portion that can be adjacently arranged in a predetermined arrangement relationship. I do.
[0012]
According to a third aspect of the present invention, in the substrate processing apparatus according to the first or second aspect, at least one of the plurality of partial control units serves as the at least one processing unit by applying a chemical solution to the substrate. It is characterized by including at least one of a processing unit for performing the used processing and a heat treatment unit for heating or cooling the substrate.
[0013]
BEST MODE FOR CARRYING OUT THE INVENTION
<Overall configuration>
FIG. 1 is a plan view of a substrate processing apparatus 100 according to an embodiment of the present invention. The substrate processing apparatus 100 includes a resist coating process, a developing process, a predetermined heat treatment associated therewith, and a chemical solution related to a photolithography process for forming a predetermined circuit pattern on a semiconductor substrate (hereinafter, simply referred to as a “substrate”). It is a device that performs processing and the like. Note that FIG. 1 has a three-dimensional coordinate system in which a horizontal plane having the longitudinal direction of the substrate processing apparatus 100 as an x-axis direction is an xy plane, and a vertically upward direction is a z-axis.
[0014]
As shown in FIG. 1, a substrate processing apparatus 100 according to the present embodiment includes an indexer block (ID block) 1, an antireflection film processing block (BARC block) 2, a resist film processing block (SC block) 3, , A development processing block (SD block) 4 and an interface block (IFB block) 5. Each block accommodates a processing unit or the like for performing a target process. In the substrate processing apparatus 100, these five blocks are arranged adjacent to each other in the above order. On the side of the IFB block 5, an exposure apparatus (stepper) STP that performs a process of exposing a predetermined circuit pattern to the resist film is disposed adjacently. Each block is individually assembled to a frame (frame body), and the substrate processing apparatus 100 is configured by connecting the frames of each block in the above order. In the substrate processing apparatus 100, clean air is supplied into each block in a downflow state by predetermined supply means (not shown). As a result, in each block, adverse effects on the process due to the curling of particles and the airflow can be avoided. In addition, the inside of each block is maintained at a slightly positive pressure with respect to the outside to prevent intrusion of particles and contaminants. In particular, the pressure in the BARC block 2 is set to be higher than the pressure in the ID block 1. As a result, the atmosphere in the ID block 1 does not flow into the BARC block 2, so that the processing can be performed in each processing block without being affected by the external atmosphere.
[0015]
<ID block>
The ID block 1 is a part that receives an unprocessed substrate W from outside the substrate processing apparatus 100 and conversely, pays out the processed substrate W to the outside. The ID block 1 includes a cassette mounting table 6 on which a plurality (four in FIG. 1) of cassettes C capable of storing a predetermined number of substrates W in multiple stages are arranged, and an unprocessed substrate W from the cassette C in order. An indexer transport mechanism 7 is provided for taking out the processed substrate W for subsequent processing, receiving the processed substrate W, and storing the processed substrate W again in the cassette C in order.
[0016]
The indexer transport mechanism 7 includes a movable table 7a that can move horizontally on the cassette mounting table 6 in the Y-axis direction, a holding arm 7b on the movable table 7a that holds the substrate W in a horizontal posture, and a tip of the holding arm 7b. And a plurality of pins 10c (three are shown in FIG. 1) protruding inside the portion (see FIG. 2). The holding arm 7b is provided so as to be able to move up and down in the Z-axis direction, turn in a horizontal plane, and move forward and backward in the turning radius direction. The substrate W is held in a horizontal posture by the pins 10c.
[0017]
The delivery of the substrate W in the ID block 1 will be outlined. First, the indexer transport mechanism 7 horizontally moves to a position facing a predetermined cassette C. Subsequently, as the holding arm 7b moves up and down and moves forward and backward, the unprocessed substrate W stored in the cassette C is taken out. While holding the substrate W on the holding arm 7b, the indexer transport mechanism 7 horizontally moves to a position opposing the substrate platforms PASS1 and PASS2 described later. Then, the substrate W on the holding arm 7b is placed on the upper substrate platform PASS1 for unloading the substrate. When the processed substrate W is placed on the lower substrate rest part PASS2 for returning the substrate, the indexer transport mechanism 7 receives the processed substrate W on the holding arm 7b, and The processed substrate W is stored in the cassette C. Hereinafter, an operation of similarly taking out the unprocessed substrate W from the cassette C and transporting the unprocessed substrate W to the substrate platform PASS1, and receiving the processed substrate W from the substrate platform PASS2 and storing it in the cassette C is repeated.
[0018]
<BARC block, SC block, SD block>
FIG. 2 is a front view of the substrate processing apparatus 100. FIG. 3 is a diagram illustrating an arrangement configuration of the heat treatment unit TP when viewed from the same direction as FIG. Hereinafter, the BARC block 2, the SC block 3, and the SD block 4 will be described with reference to FIGS.
[0019]
The BARC block 2 is responsible for forming an antireflection film below the photoresist film to reduce standing waves and halation generated during exposure by the stepper STP. The BARC block 2 includes a first coating processing unit 8 that performs a process of coating an antireflection film on the surface of the substrate W, a first heat processing unit 9 that performs a heat treatment required for coating, a first coating processing unit 8 and a first coating processing unit. A first main transport mechanism 10A for transferring the substrate W to and from the heat treatment unit 9;
[0020]
The SC block 3 performs a process of forming a photoresist film on the substrate W on which the antireflection film has been formed. Note that in this embodiment, a chemically amplified resist is used as the photoresist. The SC block 3 includes a second coating processing unit 15 for performing a process of coating a photoresist film, a second heat processing unit 16 for performing a heat treatment required for coating, a second coating processing unit 15 and a second heat processing unit 16. And a second main transfer mechanism 10B for transferring the substrate W to the second main transfer mechanism 10B.
[0021]
The SD block 4 is a mechanism for performing development processing on the substrate W on which a predetermined circuit pattern has been exposed in the stepper STP. The SD block 4 includes a development processing unit 30 that performs a development process using a developer, a third heat treatment unit 31 that performs a heat treatment necessary for the development process, and transfer of the substrate W to the development processing unit 30 and the third heat treatment unit 31. And a third main transport mechanism 10 </ b> C.
[0022]
In the above BARC block 2, SC block 3, and SD block 5, the first main transport mechanism 10A, the second main transport mechanism 10B, and the third main transport mechanism 10C (hereinafter, these are referred to as "main transport mechanism 10"). ) Are sandwiched between the first coating processing unit 8, the second coating processing unit 15, and the developing processing unit 30 (hereinafter, these are collectively referred to as a "chemical processing unit LP"). The first heat treatment unit 9, the second heat treatment unit 16, and the third heat treatment unit 31 (hereinafter, these are collectively referred to as "heat treatment units TP") are arranged so as to be located on the back side of the apparatus. I have. That is, a chemical solution processing unit LP for performing a process using a predetermined chemical solution in each unit and a heat treatment unit TP for performing a heat treatment in each unit are separately provided with the main transport mechanism 10 interposed therebetween. The thermal influence from the TP on the chemical processing section LP is suppressed. Further, in the substrate processing apparatus 100 according to the present invention, a thermal partition (not shown) is provided on the front side (the main transport mechanism 10 side) of the heat treatment section TP, and the thermal partition also allows heat to be applied to the chemical processing section LP. This is a mode in which the influence is avoided.
[0023]
As shown in FIG. 2, in the first coating processing unit 8, the second coating processing unit 15, and the developing processing unit 30 constituting the chemical liquid processing unit LP, a plurality of processing units are stacked and arranged.
[0024]
In the first coating processing unit 8, three first coating processing units 8a to 8c are stacked and arranged. The first coating processing units 8a to 8c are respectively a spin chuck 11 that rotates while sucking and holding the substrate W in a horizontal posture, and a nozzle that supplies a coating liquid for an anti-reflection film onto the substrate W held on the spin chuck 11. 12 and the like.
[0025]
Similarly, in the second coating processing unit 15, three second coating processing units 15a to 15c are arranged in a stacked manner. The first coating processing units 15a to 15c respectively include a spin chuck 17 that rotates while sucking and holding the substrate W in a horizontal posture, and a nozzle 18 that supplies a coating liquid for a resist film onto the substrate W held on the spin chuck 17. And so on.
[0026]
Further, in the development processing section 30, five development processing units 30a to 30e are stacked and arranged. Each of the development processing units 30a to 30e includes a spin chuck 32 that rotates while sucking and holding the substrate W in a horizontal posture, a nozzle 33 that supplies a developing solution onto the substrate W held on the spin chuck 32, and the like.
[0027]
As shown in FIG. 3, in the first heat treatment unit 9, the second heat treatment unit 16, and the third heat treatment unit 31 configuring the heat treatment unit TP, a plurality of processing units are stacked and arranged in two rows. .
[0028]
In the first heat treatment unit 9, the substrate W is ripened to a predetermined temperature, a plurality of heating plates HP capable of maintaining the temperature, and a plurality of cooling plates capable of cooling the substrate W to a predetermined temperature and maintaining the temperature. In order to strengthen the adhesion of the resist film to the plate CP and the substrate W, a plurality of adhesion processing units AHL for heat-treating the substrate W in a vapor atmosphere of HMDS (hexamethyldisilazane) are provided as processing units, each having a predetermined position. Are arranged in layers. Further, a heater controller CONT that controls each part of the heat treatment unit TP is disposed below. In FIG. 3, it is assumed that the portions indicated by “x” are locations provided with a pipe wiring portion or secured as an empty space for adding a processing unit.
[0029]
Similarly, the second heat treatment unit 16 and the third heat treatment unit 31 also include a plurality of heating plates HP, a plurality of cooling plates CP, and the like as processing units. The point that each processing unit is stacked and arranged in two rows is similar to the first heat treatment unit 9. In addition, the third heat treatment unit 31 also includes substrate placement units PASS7 and PASS8 described below.
[0030]
In addition, it is preferable that a part of the heating plate HP is a temporary placement part additional heat plate provided in the substrate temporary placement part 19 for temporarily placing the heated substrate. In this case, in the main transport mechanism 10, the heated substrate W is temporarily placed on the substrate temporary storage unit 19, and the main transport mechanisms 10B to 10C can access the substrate temporary storage unit and receive the substrate. Since the substrate is not transferred directly to the heating plate HP, there is an advantage that the thermal influence on the main transport mechanisms 10B and 10C is minimized. FIG. 1 exemplarily shows an aspect in which the second heat treatment section 16 and the third heat treatment section 31 are provided with the substrate temporary placement section 19.
[0031]
Next, the main transport mechanism 10 (10A to 10C) will be described. The fourth main transport mechanism 10D provided in the IFB block 5 described later has the same configuration.
[0032]
In the main transport mechanism 10, two holding arms 10a and 10b are provided vertically on a base 10d (however, only one is shown in FIG. 1). Each of the holding arms 10a and 10b has a substantially C-shaped tip, and the substrate W is horizontally moved by a plurality of pins 10c (three in FIG. 1 are shown) protruding inside the tip. It can be held in a posture. The holding arms 10a and 10b are configured to be capable of turning in a horizontal plane, moving up and down in the Z-axis direction, and moving forward and backward in the turning radial direction by a drive mechanism (not shown).
[0033]
<IFB block>
The IFB block 5 transfers the substrate W between the substrate processing apparatus 100 and an adjacent stepper STP. The IFB block 5 includes an interface transport mechanism 35 for transferring the substrate W to and from the stepper STP, two edge exposure units EEW for exposing the peripheral edge of the substrate W coated with the photoresist in advance, and a stepper STP. A buffer SBF for temporarily storing the substrate W when the substrate W cannot be received, and a return buffer RBF for storing the substrate W when the subsequent processing unit cannot process the substrate W after exposure. A substrate platform PASS9, PASS10 for transferring a substrate W between the fourth main transport mechanism 10D and the interface transport mechanism 35, and a heating plate HP provided in the edge exposure unit EEW and the SD block 4. , And a fourth main transport mechanism 10 </ b> D that transfers the substrate W to these. Among them, the two EEWs, the return RBF, and the substrate platforms PASS9 and PASS10 are stacked in this order from the top. Each of the substrate mounting sending buffer SBF and the return buffer RBF includes a storage shelf that can store a plurality of substrates W in multiple stages.
[0034]
As shown in FIG. 2, the edge exposure unit EEW includes a spin chuck 36 that rotates while sucking and holding the substrate W in a horizontal posture, a light irradiator 37 that exposes the periphery of the substrate W held on the spin chuck 36, and the like. Have. The two edge exposure units EEW are stacked and arranged at the central portion of the IFB block 5.
[0035]
As shown in FIGS. 1 and 2, the interface transport mechanism 35 includes a movable base 35a movable in the horizontal direction (Y-axis direction) as indicated by an arrow AR2, and a substrate W on the movable base 35a. And a holding arm 35b for holding the arm. The holding arm 35b is moved up and down, turned, and moved forward and backward in the turning radial direction by a driving unit (not shown). The interface transport mechanism 35 has a constant movable range in the horizontal direction, and can transfer the substrate W to the stepper STP, the substrate platforms PASS9 and PASS10, and the sending buffer SBF at predetermined positions. It has become.
[0036]
<Delivery of board>
Next, the transfer of the substrate W in the substrate processing apparatus 100 will be described focusing on the transfer between adjacent blocks. As shown in FIG. 1, in the substrate processing apparatus 100, partition walls 13 are provided at boundaries between adjacent blocks to block the atmosphere of each other. Each of the partition walls 13 is provided with two substrate mounting portions PASS1 to PASS6 for mounting the substrate W on the upper and lower sides by partially passing through the partition wall 13.
[0037]
Now, between the ID block 1 and the BARC block 2, the substrate rests PASS 1 and PASS 2 are arranged in order from the upper side, and between the BARC block 2 and the SC block 3, the substrate rests PASS 3 and PASS 4 are similarly arranged. Similarly, PASS5 and PASS6 are provided between the SC block 3 and the SD block 4, respectively.
[0038]
Further, the substrate platforms PASS7 and PASS8 for transferring the substrate W between the SD block 4 and the IFB block 5 are provided in the third heat treatment unit 31 of the SD block 4 (see FIG. 3). Further, as described above, the IFB block 5 includes the substrate platforms PASS9 and PASS10. These are collectively referred to as a substrate platform PASS. Note that the ten substrate platforms PASS1 to PASS10 are provided at five locations in two stages, one above the other.
[0039]
<Control of substrate processing equipment>
Next, a control system of the substrate processing apparatus 100 and a control method thereof will be described. FIG. 4 is a diagram schematically illustrating a control system of the substrate processing apparatus 100, particularly, each unit constituting the chemical solution processing unit LP.
[0040]
The BARC block 2, the SC block 3, and the SD block 4, which include the first coating processing unit 8, the second coating processing unit 15, and the development processing unit 30, respectively, which constitute the chemical liquid processing unit LP, correspond to each. , And sub-controllers SC2 to SC4. Further, the substrate processing apparatus 100 is also provided with a main controller MC that controls each sub-controller. The main controller MC and the sub-controllers SC2 to SC4 are connected to each other by a network N. The network N is also connected to a chemical liquid controller CC that controls the supply of a chemical liquid from a predetermined supply source to a target processing unit. The ID block 1 and the IFB block 5 also have sub-controllers, which are respectively connected to the network N, but are omitted here for simplicity of discussion.
[0041]
Each of the sub-controllers SC2 to SC4 is connected to a processing unit provided in each block via a signal line, and the processing unit is controlled by the sub-controllers SC to SC4 via this signal line. For example, in the BARC block 2, three first coating processing units 8a to 8c provided in the first coating processing unit 8 and the sub-controller SC2 are connected by a signal line SL8a. In the SC block 3 and the SD block 4, similarly, each processing unit and the sub-controllers SC3 to SC4 are connected to the signal lines SL15a to SL30a. Although FIG. 2 shows a case where five SD units are provided, FIG. 4 shows only three for convenience of illustration. In addition, a transport mechanism and a sub-controller (not shown in FIG. 4) are also electrically connected by a predetermined signal line, and the transport mechanism is controlled via the signal line.
[0042]
The main controller MC is configured to be able to communicate with a host computer (not shown) that manages the entire semiconductor manufacturing process in which the substrate processing apparatus 100 according to the present embodiment is installed. The substrate processing apparatus 100 operates by the main controller MC and each sub-controller controlling each unit according to preset recipe data. The substrate processing status in each block is collected by the main controller MC via each sub-controller, and further transmitted to the host computer. Thus, the operating state of each block can be easily grasped by the host computer.
[0043]
In each block, each of the sub-controllers SC2 to SC4 controls the operation of the transport mechanism and each processing unit according to the setting of the recipe data. That is, it can be said that each block in the substrate processing apparatus 100 forms a partial control unit in which the sub-controller is used as a partial control unit. Each of the sub-controllers SC2 to SC4 receives the substrate W at the corresponding substrate platform PASS, sequentially transports the substrate W to a predetermined processing unit, and outputs the substrate W subjected to predetermined processing to the substrate platform PASS serving as an outlet. , A series of controls that are completed by placing them on each other are independently performed. This means that for each block, where the substrate W received from the processing unit or the substrate platform PASS is transported by the transport mechanism, at which time and at what priority the transport is executed, and This is realized by giving information on what conditions the substrate W is processed by the processing unit as recipe data. Except for referring to the mounting state of the substrate W in at most four substrate mounting portions PASS serving as entrances and exits of the substrate W, the transfer itself of the substrate W between adjacent blocks is not directly controlled. The effect of an operation in a block on other blocks can be reduced. Therefore, the control as a whole is simplified, and easy and flexible operation settings can be made in the recipe data.
[0044]
Further, each of the processing units constituting the chemical liquid processing section LP is provided with a liquid leakage sensor for detecting leakage of the chemical liquid in the unit. For example, each of the first coating units 8a to 8c is provided with a liquid leakage sensor S8 as shown in FIG. Similarly, the second coating processing units 15a to 15c and the developing processing units 30a to 30e are also provided with liquid leakage sensors S15 and S30, respectively. These leak sensors S8, S15, and S30 are also electrically connected to the sub-controllers SC2 to SC4 corresponding to the blocks provided with the respective signal lines SL8b, SL15b, and SL30b.
[0045]
For example, if a processing liquid leaks inside any of the processing units provided in any of the blocks, when a liquid leakage sensor provided in the processing unit detects this, the sub-controller to which the processing unit belongs , A leak detection signal is transmitted. In response to this, the sub-controller controls operations such as stopping the processing operation in the processing unit and transferring the processing to another processing unit, and transfers the detection signal to the chemical liquid controller CC through the network N. . In response to this, the chemical liquid controller CC controls operations such as stopping the supply of the chemical liquid to the processing unit and limiting the total supply amount.
[0046]
That is, in the case of the present embodiment, the main controller MC mainly adjusts the board transfer timing (scheduling) between the blocks, and each sub-controller transfers the board W by the transfer mechanism in each corresponding block and transfers the board to the block. That is, the operation of the included processing unit is controlled in an integrated manner while monitoring the operation state of the processing unit with a sensor.
[0047]
This eliminates the need for a signal line directly connecting the sensor and the chemical liquid controller as in the related art, so that the number of wirings and connectors can be reduced, and the space occupied by these components is also eliminated.
[0048]
In the case of a conventional substrate processing apparatus, when a new processing unit or the like is added, it is necessary to significantly modify the control program. In the case of the present invention, even if a new block is added, It suffices to add recipe data, and does not affect the control contents of adjacent existing blocks. Therefore, blocks can be easily and flexibly added. For example, between the SC block 3 and the SD block 44, a mode may be considered in which a block including an inspection processing unit for inspecting the thickness and line width of the resist film and a transport mechanism for transporting the inside of the block is added. Further, even if the blocks are added, the work of connecting the blocks and the like does not become complicated.
[0049]
<Modification>
In the above-described example, only the connection between the liquid leak sensor and the sub-controller in the chemical liquid processing unit LP has been described. However, regarding the sensors that obtain information necessary for control in each processing unit, including the heat treatment unit TP, Similarly, the signal line may be provided between the sub-controller and the sub-controller. Specifically, a flow rate sensor that monitors the supply amount of the chemical solution or pure water, a temperature sensor that detects the temperature, humidity, and atmospheric pressure inside the unit, a humidity sensor, a pressure sensor, and the temperature of the heating plate HP and the cooling plate CP are monitored. It can be applied to various sensors such as a temperature sensor. Once the signals from these sensors are sent to the sub-controller, they are further transmitted through the network N to the corresponding controllers such as temperature controllers and pressure controllers.
[0050]
【The invention's effect】
As described above, according to the first to third aspects of the present invention, since the detection signal from the sensor is transmitted to the specific control means through the partial control means, the sensor is directly connected to the specific control means. There is no need to provide signal lines, and the number of wirings and connectors can be reduced.
[0051]
According to the second and third aspects of the present invention, it is possible to assemble the substrate processing apparatus or increase the number of storage units without complicating the connection work.
[Brief description of the drawings]
FIG. 1 is a plan view of a substrate processing apparatus 100.
FIG. 2 is a front view of the substrate processing apparatus 100.
FIG. 3 is a diagram showing an arrangement configuration of a heat treatment unit TP.
FIG. 4 is a diagram schematically showing a control system of the substrate processing apparatus 100, in particular, each unit constituting the chemical solution processing unit LP.
FIG. 5 is a diagram schematically showing a control system of a conventional substrate processing apparatus.
[Explanation of symbols]
8a to 8c First coating unit
10 (10A to 10D) (first to fourth) main transport mechanisms
13 Partition wall
15a to 15c Second coating processing unit
30a-30e Development processing unit
100 substrate processing equipment
AHL Adhesion Processing Unit
C cassette
CC chemical liquid controller
CP cooling plate
EEW edge exposure unit
HP heating plate
N network
PASS (PASS1-PASS10) Substrate rest
S8, S15, S30 Liquid leakage sensor
W substrate

Claims (3)

An apparatus for performing a predetermined process on the substrate,
At least one processing unit;
Transport means for transporting the substrate to the at least one processing unit;
At least one sensor provided in the at least one processing unit, for detecting a state of the processing unit;
Partial control means for controlling the at least one processing unit and the transport means;
A plurality of partial control units each comprising
Main control means for controlling the plurality of partial control means,
In response to a signal from the at least one sensor, at least one specific control unit that controls a specific control target corresponding to the detection target of the sensor,
Each of the partial control means, the main control means, and the at least one specific control means are network-connected,
And,
The at least one sensor is electrically connected to the partial control unit provided in the same partial control unit;
A substrate processing apparatus characterized by the above-mentioned. The substrate processing apparatus according to claim 1,
The substrate processing apparatus, wherein each of the partial control units is accommodated in an accommodating portion that can be adjacently arranged in a predetermined arrangement relationship. The substrate processing apparatus according to claim 1 or 2, wherein:
At least one of the plurality of partial control units may include, as the at least one processing unit, at least one of a processing unit for performing processing using a chemical solution on a substrate and a heat treatment unit for heating or cooling the substrate. Characteristic substrate processing equipment.

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