JP2004207532A - Electronic component, method for manufacturing the same, electrooptical device, and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing electronic components for accurately mounting components without any inclination, the electronic components, an electrooptical device and an electric apparatus. <P>SOLUTION: A flexible wiring board as the electronic component comprises a board formed with a first connection terminal 51 and a second connection terminal 58, a capacitor 164 as a mounting component mounted across the first connection terminal 51 and the second connection terminal 58, and a mounting component holding member 61 formed on the board so that its length exceeds a width of the capacitor 164 in a direction substantially perpendicular to a line connecting the first connection terminal 51 with the second connection terminal 58. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an electronic component, an electro-optical device, an electronic device, and a method of manufacturing an electronic component in which mounted components such as an IC chip, a resistor, and a capacitor are mounted on a substrate.
[0002]
[Prior art]
For example, a liquid crystal device as an example of an electro-optical device includes a liquid crystal panel as an electro-optical panel and a wiring board as an electronic component electrically connected to the liquid crystal panel. The wiring board is configured such that connection terminals, IC chips, mounting components such as resistors and capacitors are arranged on the board. The mounted component is soldered on the substrate so as to straddle two connection terminals, for example, and these two connection terminals are electrically connected via the mounted component (for example, see Patent Document 1). Such a mounting component mounting process is performed by, for example, printing a solder paste on a substrate, mounting the mounted component, and heating the mounted component in a reflow furnace.
[0003]
[Patent Document 1]
JP-A-2002-207222 (page 2).
[0004]
[Problems to be solved by the invention]
In the above mounting process, for example, if the solder paste is not applied with a uniform thickness in the plane, the mounted component may be inclined, and a connection failure or a short circuit failure may occur. There has been a problem that the occurrence of such a connection failure or short-circuit failure causes an operation failure of the electro-optical device.
[0005]
An object of the present invention is to solve the above-mentioned problems and to provide a method of manufacturing an electronic component, an electronic component, an electro-optical device, and an electronic apparatus in which a mounted component is accurately mounted without inclination.
[0006]
[Means for Solving the Problems]
In order to solve the above-mentioned problems, an electronic component according to the present invention includes a step of forming a first connection terminal, a second connection terminal, and a mounting component holding member between these connection terminals on a substrate; And mounting a mounting component so as to straddle the second connection terminal.
[0007]
According to such a configuration of the present invention, by providing the mounted component holding member, the distance between the mounted component and the substrate can be supported substantially equal to the height of the mounted component holding member. Thus, the inclination of the mounted component can be prevented, and the distance between the mounted component and the substrate can be made substantially uniform in the plane, so that an electronic component free of mounting defects such as connection failure can be obtained.
[0008]
Further, in the forming step, the mounting component holding member may be configured to have a length exceeding a width of the mounting component in a direction substantially orthogonal to a line connecting the first connection terminal and the second connection terminal. It is characterized by forming.
[0009]
According to such a configuration, by forming the mounted component holding member so as to have a length exceeding the width of the mounted component, it is possible to prevent the mounted component from being tilted due to a displacement at the time of mounting the mounted component. In other words, even if a displacement occurs during mounting, particularly a displacement along a direction substantially orthogonal to a line connecting the first connection terminal and the second connection terminal, the mounted component is supported by the mounted component holding member. Since the distance between the mounted component and the substrate can be made substantially uniform in the plane without tilting the mounted component, it is possible to obtain an electronic component free from mounting defects such as poor connection. Here, it is preferable that the length of the mounted component is longer than the length of each connection terminal along a direction substantially orthogonal to a line connecting the first connection terminal and the second connection terminal. That is, the displacement in the direction substantially orthogonal to the line connecting the first connection terminal and the second connection terminal during mounting is large, and a part of the area of the mounting component to be connected to the connection terminal is not connected on a plane. Even if the mounted component is mounted in a state of protruding from the terminal, the mounted component is reliably supported by the mounted component holding member, and therefore the mounted component does not tilt.
[0010]
Further, in the forming step, the mounting component holding member is formed to have a height higher than a height of the connection terminal.
[0011]
According to such a configuration, for example, after mounting an adhesive member such as solder on the connection terminal so that its height is higher than the mounting component holding member, when mounting the mounting component, Can be implemented without tilting. In other words, even when the amounts of the adhesive members disposed on the first connection terminal and the second connection terminal are not equal, the mounted component is supported by the mounted component holding member, and thus the mounted component can be accurately removed without tilting. Can be implemented.
[0012]
Further, in the forming step, the mounting component holding member is formed to have a concave portion for supporting the mounting component.
[0013]
According to such a configuration, by providing the mounted component holding member, the distance between the mounted component and the substrate can be supported substantially equal to the height of the concave portion of the mounted component holding member. Thus, the inclination of the mounted component can be prevented, and the distance between the mounted component and the substrate can be made substantially uniform in the plane, so that an electronic component free of mounting defects such as connection failure can be obtained. In addition, since the concave portion for supporting the mounted component is provided, during mounting, there is no positional displacement along a line substantially orthogonal to the line connecting the first connection terminal and the second connection terminal, and the mounting accuracy is improved. .
[0014]
The forming step includes forming a conductive film on a substrate, forming a patterned resist layer on the conductive film, etching the conductive film using the resist layer as a mask, The mounting component holding member having the first connection terminal and the second connection terminal having the conductive film material, and a stacked film of the conductive film material and the resist layer material, wherein the resist layer is partially removed. And a step of forming
[0015]
According to such a configuration, the mounting component holding member can be formed using the connection terminal forming step, and the manufacturing efficiency is high.
[0016]
An electronic component according to another aspect of the invention is manufactured by the electronic component manufacturing method described above.
[0017]
According to such a configuration of the present invention, it is possible to obtain an electronic component having no mounting failure.
[0018]
Another electronic component of the present invention includes a substrate on which a first connection terminal and a second connection terminal are formed, and a mounting component mounted so as to straddle the first connection terminal and the second connection terminal. The first connection terminal and the second connection terminal are formed on the substrate so as to have a length exceeding the width of the mounting component in a direction substantially orthogonal to a line connecting the first connection terminal and the second connection terminal. And a mounting component holding member.
[0019]
According to such a configuration of the present invention, by providing the mounted component holding member, the distance between the mounted component and the substrate can be supported substantially equal to the height of the mounted component holding member. Thus, the inclination of the mounted component can be prevented, and the distance between the mounted component and the substrate can be made substantially uniform in the plane, so that an electronic component free of mounting defects such as connection failure can be obtained.
[0020]
Further, still another electronic component of the present invention is mounted so as to straddle the substrate on which the first connection terminal and the second connection terminal are formed and the first connection terminal and the second connection terminal. A mounting component, and a mounting component holding member having a concave portion formed on the substrate and supporting the mounting component between the first connection terminal and the second connection terminal. I do.
[0021]
According to such a configuration of the present invention, by providing the mounted component holding member, the distance between the mounted component and the substrate can be supported substantially equal to the height of the concave portion of the mounted component holding member. Thus, the inclination of the mounted component can be prevented, and the distance between the mounted component and the substrate can be made substantially uniform in the plane, so that an electronic component free of mounting defects such as connection failure can be obtained.
[0022]
According to another aspect of the invention, an electro-optical device includes an electro-optical panel and the above-described electronic component that is electrically connected to the electro-optical panel.
[0023]
According to such a configuration of the present invention, it is possible to obtain a high-quality electro-optical device without malfunction.
[0024]
An electronic apparatus according to another aspect of the invention includes the electro-optical device described above.
[0025]
According to such a configuration of the present invention, an electronic device without malfunction can be obtained.
[0026]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, a liquid crystal device as an electro-optical device having a flexible wiring board as an electronic component according to the present invention will be described as an example.
[0027]
First, the structure of the liquid crystal device will be described with reference to FIG.
[0028]
<Liquid crystal device>
FIG. 1 is a schematic perspective view showing the appearance of a liquid crystal device according to the present invention.
[0029]
The liquid crystal device 1 includes, for example, a liquid crystal panel 100 having a passive matrix structure, a pair of polarizing plates 140 and 150 arranged so as to sandwich the liquid crystal panel 100, and a flexible wiring board 163 electrically connected to the liquid crystal panel 100. are doing.
[0030]
As shown in FIG. 1, in the liquid crystal panel 100, a first substrate 110 having a first base 111 as a base and a second substrate 120 having a second base 121 as a base are provided with a sealing material (not shown). It is configured to be bonded to face each other. Liquid crystal (not shown) is sandwiched in a region surrounded by the first substrate 110, the second substrate 120, and the sealant.
[0031]
A plurality of parallel striped transparent electrodes 115 are formed on the inner surface of the first base material 111 (the surface facing the second base material 121), and a plurality of parallel striped transparent electrodes 115 are formed on the inner surface of the second base material 121. A transparent electrode 122 is formed. The transparent electrode 115 is conductively connected to a wiring 118A, and the transparent electrode 122 is conductively connected to a wiring 128. The transparent electrode 115 and the transparent electrode 122 are orthogonal to each other, and their intersection regions constitute a number of pixels arranged in a matrix, and these pixel arrangements constitute a liquid crystal display region.
[0032]
The first base member 111 has a substrate overhang 110T protruding from the second base member 121. The wiring 118A and the wiring 118B that is conductively connected to the wiring 128 via an upper / lower conductive part formed by a part of a sealing material are formed on the substrate overhang 110T. Further, an input terminal portion 119 composed of a plurality of wiring patterns formed independently is formed on the substrate overhang portion 110T. A semiconductor IC 160 having a built-in liquid crystal drive circuit and the like is mounted on the substrate overhang 110T so as to be conductively connected to the wirings 118A and 118B and the input terminal 119. A flexible wiring board 163 is connected to an end of the board extension 110T so as to be conductively connected to the input terminal section 119.
[0033]
Next, the flexible wiring board 163 and its manufacturing method will be described.
[0034]
<Flexible wiring board and its manufacturing method>
As shown in FIG. 1, the flexible wiring board 163 has a base material 165 as a substrate made of polyimide as a base material. An input terminal (not shown) electrically connected to the liquid crystal panel 100 and an output terminal (not shown) electrically connected to a circuit board (not shown) are arranged on the base material 165. ing. Further, as shown in FIG. 1, on the base material 165, mounted are components such as an IC chip (not shown), a resistor (not shown), and a capacitor 164. The mounting component is soldered on the substrate so as to straddle, for example, two connection terminals (not shown) formed on the base material 165, and these two connection terminals are electrically connected via the mounting component. Is done. The present invention is characterized by the structure of the portion of the flexible wiring board on which the mounted components are mounted, and will be described in detail below. In the present embodiment, the capacitor 164 is described as an example of an electronic component. However, it is needless to say that the present invention can be applied to a mounted component other than the capacitor, for example, an IC chip or a resistor. In addition, although a flexible wiring board has been described as an example of an electronic component, the present invention is not limited to this, and can be applied to a structure in which a mounting component is mounted on a substrate forming a liquid crystal panel as an electronic component, for example. Needless to say.
[0035]
(1st Embodiment)
The flexible wiring board 163 according to the first embodiment will be described with reference to FIGS. FIG. 2 is a partially enlarged perspective view of a region of the flexible wiring board 163 where the capacitor is mounted. FIG. 3A is a plan view of FIG. 2 as viewed from above. FIG. 3B is a cross-sectional view taken along line AA ′ in FIG.
[0036]
As shown in FIGS. 2 and 3, in a region where the capacitor of the flexible wiring board is mounted, the first connection terminal 51 and the second connection terminal 58 are arranged on the base material 165, and are straddled over these. The structure is such that a capacitor 164 as a mounting component is mounted. Further, between the first connection terminal 51 and the second connection terminal 58, a mounting component holding member 61 having a length exceeding the width a of the capacitor 164 in a direction substantially orthogonal to a line connecting them is provided. It is arranged on the base material 165. The capacitor 164 and the first connection terminal 51 and the second connection terminal 58 are bonded and electrically connected by solder 56, respectively. The first connection terminal 51 is formed by sequentially laminating an adhesive layer 57a, a Cu (copper) layer 60a, and an Au (gold) layer 59a. The second connection terminal 58 is formed by sequentially laminating an adhesive layer 57c, a Cu layer 60c, and an Au layer 59c. The Au layers 59a and 59c are layers formed on the surfaces of the Cu layers 60a and 60c in order to prevent oxidation of the Cu layers 60a and 60c. The mounting component holding member 61 is formed by sequentially laminating an adhesive layer 57b, a Cu layer 60b, and a resist layer 55. In this embodiment, as shown in FIGS. 3A and 3B, the capacitor 164 has a width a of 0.5 mm and a height e of 0.5 mm, for example. The mounting component holding member 61 has a width c of 0.2 to 0.4 mm and a height d of 30 μm. The height f of each of the first connection terminal 51 and the second connection terminal 58 is 12 μm. The mounting component holding member 61 is formed so that the height d is higher than the height f of the first connection terminal 51 and the second connection terminal 58, and the mounting component holding member 61 allows the mounting component holding member 61 to be connected to the base material 165. The distance from the mounted component is almost determined.
[0037]
Next, a method of manufacturing the above-described flexible wiring board will be described with reference to FIGS. FIG. 4 is a manufacturing flowchart. FIG. 5 is a manufacturing process diagram in a cross section corresponding to FIG.
[0038]
First, as shown in FIG. 5A, a Cu adhesive film 62 in which a Cu film 60 as a conductive film is formed on an adhesive film 57 on a base material 165 is bonded. Thus, the Cu film 60 is formed on the base material 165 via the adhesive film 57 (S1). Next, a resist film is formed on the Cu film 60 and is patterned into a predetermined shape to form a resist layer 55 '(S2).
[0039]
Next, the Cu adhesive film 62 is etched using the resist layer 55 'as a mask (S3). After that, the resist layer corresponding to the first connection terminal and the second connection terminal is removed by resist ashing while leaving only the resist layer that becomes a part of the mounted component holding member (S4). As a result, as shown in FIG. 5B, a convex mounted component holding member 61 formed by sequentially laminating the adhesive layer 57b, the Cu layer 60b, and the resist layer 55 is formed. Further, an adhesive layer 57a and a Cu layer 60a that become part of the first connection terminal, and an adhesive layer 57c and a Cu layer 60c that become part of the second connection terminal are formed. By thus forming the mounted component holding member at the same time as the formation of the connection terminal, there is no need to provide a separate step of forming the mounted component holding member, and the mounted component holding member can be formed efficiently.
[0040]
Next, a plating process is performed to form Au layers 59a and 59c on the Cu layers 60a and 60b, as shown in FIG. 5C (S5). Thus, the first connection terminal 51 in which the adhesive layer 57a, the Cu layer 60a as the conductive film material and the Au layer 59a are stacked, the adhesive layer 57c, the Cu layer 60c and the Au layer 59c as the conductive film material are stacked. The second connection terminal 58 is formed. Here, the height of the mounted component holding member 61 is formed to be higher than the heights of the first connection terminal 51 and the second connection terminal 58. As described above, a flexible wiring board before electronic components such as capacitors and IC chips are mounted is formed.
[0041]
Next, as shown in FIG. 5D, a solder paste 56 is printed on the first connection terminal 51 and the second connection terminal 58 (S6). Thereafter, as shown in FIG. 5E, the capacitor 164 is mounted so as to straddle the first connection terminal 51 and the second connection terminal 58 (S7). At this time, the solder 56 is crushed by the weight of the capacitor 164 itself, and the capacitor 164 is electrically connected to the first connection terminal 51 and the second connection terminal 58 via the solder 56. Thereafter, by heating in a reflow furnace (S8), the capacitor 164 is bonded to form a flexible wiring board 163 on which electronic components are mounted.
[0042]
In the present embodiment, by providing the mounted component holding member 61, the distance between the capacitor 164 and the base material 165 can be supported substantially equal to the height of the mounted component holding member 61. That is, even if the amount of solder or the like printed on each of the first connection terminal 51 and the second connection terminal 58 is different, for example, since the capacitor 164 is supported by the mounting component holding member 61, the capacitor 164 and the base The distance from the substrate 165 can be made substantially uniform in the plane. Further, for example, even if displacement occurs during mounting of the capacitor, since the capacitor 164 is supported by the mounted component holding member 61, the distance between the capacitor 164 and the base material 165 can be made substantially uniform in the plane. Therefore, a flexible wiring board free from poor connection can be obtained without mounting the capacitor 164 at an angle, and the liquid crystal device provided with the flexible wiring board does not have a malfunction such as a malfunction.
[0043]
Further, as shown in FIG. 3A, the mounting component holding member 61 is formed so as to have a length exceeding the width of the capacitor 164, thereby displacing the capacitor at the time of mounting the capacitor, in particular, the position along the x direction in the drawing. The inclination of the capacitor due to the displacement can be prevented. That is, in the structure without the mounting component holding member 61 as in the related art, the direction substantially perpendicular to the line connecting the first connection terminal 51 and the second connection terminal 58 (located in the y direction in the drawing) (the drawing). When the capacitors are mounted with their positions displaced along the (upper, x-directions), a difference in the amount of solder printed on each of the first connection terminal 51 and the second connection terminal 58, a printing shift of the solder paste, etc. There were inconveniences such as mounting the capacitor at an angle. On the other hand, in the present embodiment, even if a displacement occurs in the drawing x direction, since the capacitor 164 is supported by the mounting component holding member 61, the capacitor 164 is mounted without tilting, and there is no connection failure. A flexible wiring board can be obtained. Further, as in the present embodiment, the length of the mounted component holding member 61 along the x direction is longer than the length of each of the first connection terminal 51 and the second connection terminal 58 along the x direction. Is more effective. This is because even when the capacitor 164 is mounted in a state where the displacement in the x direction at the time of mounting the capacitor is large and a part of the region of the capacitor 164 to be connected to the connection terminal protrudes from the connection terminal on a plane. This is because the capacitor 164 can be supported by the mounted component holding member 61. As a result, the capacitor 164 is not mounted obliquely, and a flexible wiring board without connection failure can be stably obtained. The liquid crystal device provided with the flexible wiring board does not have a malfunction such as an operation failure.
[0044]
(2nd Embodiment)
In the first embodiment, the mounted component holding member is formed by using the connection terminal forming step. However, a step of forming the mounted component holding member separately from the connection terminal forming step may be provided. Hereinafter, a case where a mounting component holding member forming step is separately provided as a second embodiment will be described. The same structures as those of the first embodiment are denoted by the same reference numerals, and the description of the same structures and manufacturing steps as those of the first embodiment will be omitted, and different points will be mainly described.
[0045]
First, the structure will be described with reference to FIGS. FIG. 6 is a partially enlarged perspective view of a region of the flexible wiring board 163 where the capacitor is mounted. FIG. 7A is a plan view of FIG. 6 as viewed from above. FIG. 7B is a cross-sectional view taken along line BB ′ in FIG.
[0046]
As shown in FIGS. 6 and 7, in the second embodiment, the mounted component holding member 161 is formed only of a resist layer.
[0047]
Next, a method for manufacturing a flexible wiring board according to the second embodiment will be described with reference to FIGS. FIG. 8 is a manufacturing flowchart. FIG. 9 is a manufacturing process diagram in a cross section corresponding to FIG.
[0048]
First, as shown in FIG. 9A, a Cu adhesive film 62 in which a Cu film 60 as a conductive film is formed on an adhesive film 57 on a base material 165. Thus, the Cu film 60 is formed on the base material 165 via the adhesive film 57 (S1). Next, a first resist film is formed on the Cu film 60 and is patterned into a predetermined shape to form a first resist layer 70 (S2).
[0049]
Next, the Cu adhesive film 62 is etched using the first resist layer 70 as a mask (S3). After that, the first resist layer 70 is removed by resist ashing (S4). Thereby, as shown in FIG. 9B, an adhesive layer 57a and a Cu layer 60a to be a part of the first connection terminal and an adhesive layer 57c and a Cu layer 60c to be a part of the second connection terminal are formed. Is done.
[0050]
Next, as shown in FIG. 9C, a second resist film is formed, and is patterned to form a mounted component holding member 161 made of the second resist layer (S5).
[0051]
Next, plating is performed to form Au layers 59a and 59c on the Cu layers 60a and 60b as shown in FIG. 9D (S6). Thus, the first connection terminal 51 in which the adhesive layer 57a, the Cu layer 60a as the conductive film material, and the Au layer 59a are stacked, the adhesive layer 57c, the Cu layer 60c as the conductive film material, and the Au layer 59c are stacked. A second connection terminal 58 is formed. The mounting component holding member 161 is formed such that its height is higher than the heights of the first connection terminal 51 and the second connection terminal 58. As described above, a flexible wiring board before electronic components such as capacitors and IC chips are mounted is formed.
[0052]
Next, as shown in FIG. 9E, a solder paste 56 is printed on the first connection terminal 51 and the second connection terminal 58 (S7). Thereafter, as shown in FIG. 9F, the capacitor 164 is mounted so as to straddle the first connection terminal 51 and the second connection terminal 58 (S8). Thereafter, by heating in a reflow furnace (S9), the capacitor 164 is bonded to form a flexible wiring board 163 on which electronic components are mounted.
[0053]
As described above, the mounted component holding member can be formed only of the resist layer.
[0054]
(Third embodiment)
This embodiment differs from the above-described embodiment only in that the shape of the mounted component holding member is different. That is, in the above-described embodiment, the mounted component holding member has a convex shape, whereas in the third embodiment, the mounted component holding member has a concave shape that supports the mounted component. Hereinafter, the structure of the flexible wiring board according to the third embodiment will be described with reference to the drawings. Note that the same reference numerals are given to the same structures and manufacturing steps as in the above-described embodiment, and the description of the same structures and manufacturing steps as those in the above-described embodiment is omitted, and different points will be mainly described.
[0055]
First, the structure of the flexible wiring board will be described with reference to FIGS.
[0056]
FIG. 10 is a partially enlarged perspective view of a region of the flexible wiring board 163 where the capacitor is mounted. FIG. 11A is a plan view of FIG. 10 as viewed from above. FIG. 11B is a cross-sectional view taken along line CC ′ of FIG. FIG. 11C is a cross-sectional view taken along line DD ′ of FIG. 11A.
[0057]
As shown in FIGS. 10 and 11, the mounted component holding member 261 has a concave portion 261 a that supports a central portion of the capacitor 164. The mounting component holding member 261 is configured by sequentially laminating an adhesive layer 257b, a Cu layer 260b, and a resist layer 255, and the concave portion 261a is formed in the resist layer 255. Also in the present embodiment, the mounting component holding member 261 has a length that exceeds the width of the capacitor 164 in a direction substantially orthogonal to a line connecting the first connection terminal 51 and the second connection terminal 58. It is arranged on a substrate 165.
[0058]
Next, a method of manufacturing the above-described flexible wiring board will be described with reference to FIGS. FIG. 12 is a manufacturing flowchart. FIG. 13 is a manufacturing process diagram in a cross section corresponding to FIG.
[0059]
First, as shown in FIG. 13A, a Cu adhesive film 62 in which a Cu film 60 is formed on an adhesive film 57 is bonded on a base material 165. Thus, the Cu film 60 is formed on the base material 165 via the adhesive film 57 (S1). Next, a negative resist film 263 is formed on the Cu film 59 (S2). In the negative resist film 263, a portion irradiated with light in an exposure process described below is cured, and a portion not irradiated with light is removed by a cleaning process after the exposure process.
[0060]
Next, as shown in FIG. 13B, pattern exposure is performed using a mask 262 having a partially different light transmission amount (S3). The mask 262 includes a first mask portion 262a that completely blocks light during exposure, a second mask portion 262b that completely transmits light during exposure, and a light transmission amount during exposure that is smaller than that of the second mask portion 262b. And a third mask portion 262c that transmits light so as to reduce the amount of light. The second mask portion 262b corresponds to the first connection terminal 51 and the second connection terminal 58 to be formed later, and the convex portion of the mounted component holding member 261 to be formed later. The third mask portion 262c corresponds to the concave portion 261a of the mounted component holding member 261 to be formed later. After the exposure step, by performing cleaning, a resist layer 255 having a concave portion 261a that becomes a part of the mounted component holding member 261 is formed as shown in FIG. Here, although not shown, a resist layer is also formed on portions corresponding to the first connection terminal 51 and the second connection terminal 58.
[0061]
Next, the Cu adhesive film 62 is etched using the resist layer as a mask (S4). After that, the resist layer corresponding to the first connection terminal and the second connection terminal is removed by resist ashing while leaving only the resist layer 255 that becomes a part of the mounted component holding member (S5). Thus, as shown in FIG. 13D, a mounted component holding member 261 having a concave portion 261a in which the adhesive layer 257b, the Cu layer 260b, and the resist layer 255 are sequentially laminated is formed. By thus forming the mounted component holding member at the same time as the formation of the connection terminal, there is no need to provide a separate step of forming the mounted component holding member, and the mounted component holding member can be formed efficiently.
[0062]
Next, a plating process is performed to form an Au layer on the Cu layer (S6). Thereby, the first connection terminal 51 in which the adhesive layer 57a, the Cu layer 60a, and the Au layer 59a are stacked, and the second connection terminal 58 in which the adhesive layer 57c, the Cu layer 60c, and the Au layer 59c are stacked are formed. . The height of the concave portion 261a of the mounting component holding member 261 is formed to be higher than the height of the connection terminals 51 and 58. As described above, a flexible wiring board before electronic components such as capacitors and IC chips are mounted is formed.
[0063]
Next, a solder paste is printed on the first connection terminal 51 and the second connection terminal 58 (S7). Thereafter, as shown in FIG. 13E, the capacitor 164 is set so that the central portion of the capacitor 164 fits into the concave portion 261a of the mounted component holding member 261 and straddles the first connection terminal 51 and the second connection terminal 58. 164 (S8). Thereafter, by heating in a reflow furnace (S9), the capacitor 164 is bonded to form a flexible wiring board 163 on which electronic components are mounted.
[0064]
In this embodiment, the first connection terminal 51 and the second connection terminal are simply provided by mounting the mounting component holding member 261 having a concave portion for supporting the capacitor 164 and mounting the capacitor 164 in the concave portion. There is no displacement along a direction (x direction in FIG. 11A) that is substantially orthogonal to a line connecting 58 (located in the y direction on FIG. 11A), and the capacitor 164 is securely mounted. be able to. Therefore, accurate mounting can be performed, and a flexible wiring board in which a connection failure hardly occurs can be obtained.
[0065]
Further, in the present embodiment, by providing the mounted component holding member 261, the distance between the capacitor 164 and the base member 165 can be supported substantially equal to the height of the concave portion 261a of the mounted component holding member 261. That is, even if the amount of solder printed on each of the first connection terminal 51 and the second connection terminal 58 is different, for example, since the capacitor 164 is supported by the concave portion 261a, the connection between the capacitor 164 and the base base material 165 may occur. The distance can be made substantially in-plane uniform. Also, for example, even if the capacitor 164 is mounted with a displacement in the y direction (on FIG. 11A) when the capacitor is mounted, since the capacitor 164 is supported by the concave portion 261a, the distance between the capacitor 164 and the base member 165 is substantially reduced. It can be uniform in the plane. Therefore, a flexible wiring board free from poor connection can be obtained without mounting the capacitor 164 at an angle, and the liquid crystal device provided with the flexible wiring board does not have a malfunction such as a malfunction.
[0066]
(Fourth embodiment)
In the third embodiment, the resist layer having the concave portion that constitutes a part of the mounted component holding member is formed by using the pattern exposure. However, the resist layer may be formed by applying the resist twice. This will be described as an embodiment. Note that differences from the third embodiment will be mainly described.
[0067]
In the present embodiment, since the structure of the flexible wiring board is the same as that of the third embodiment, only the manufacturing method will be described with reference to FIGS.
[0068]
FIG. 14 is a manufacturing flowchart. FIG. 15 is a manufacturing process diagram in a cross section corresponding to FIG.
[0069]
First, the Cu adhesive film 62 in which the Cu film 59 is formed on the adhesive film 60 is bonded on the base material 165. Thus, the Cu film 59 is formed on the base material 165 via the adhesive film 60 (S1). Next, as shown in FIG. 15A, a resist film is formed on the Cu film 59, and is patterned to form a first resist layer 264 (S2). The first resist layer 264 is formed corresponding to the first connection terminal 51 and the second connection terminal 58 to be formed later, and the resist layer 255 of the mounted component holding member 261.
[0070]
Next, as shown in FIG. 15B, a second resist film is formed on the base material 165 including the first resist layer 264, and is patterned to form a second resist layer 265 (S3). . By forming the second resist layer 265, a concave portion 261a of the resist layer 255 is formed. Thus, a resist layer 255 having a concave shape formed by laminating the first resist layer 264 and the second resist layer 265 is formed. In FIG. 15B, in order to show that the first resist layer 264 and the second resist layer 265 are formed in different steps, respectively, the first resist layer 264 and the second resist layer 265 are formed. A dotted line is shown at the boundary of. Actually, since the first resist layer 264 and the second resist layer 265 are formed from the same material, the resist layer 255 in the present embodiment has the same form as the resist layer 255 in the third embodiment. .
[0071]
Next, the Cu adhesive film 62 is etched using the resist layer as a mask (S4). After that, the resist layer corresponding to the first connection terminal and the second connection terminal is removed by resist ashing while leaving only the resist layer 255 that becomes a part of the mounted component holding member (S5). As a result, as shown in FIG. 15C, a mounting component holding member 261 having a concave portion formed by sequentially laminating the adhesive layer 257b, the Cu layer 260b, and the resist layer 255 is formed.
[0072]
Next, a plating process is performed to form an Au layer on the Cu layer (S6). Thereby, the first connection terminal 51 in which the adhesive layer 57a, the Cu layer 60a, and the Au layer 59a are stacked, and the second connection terminal 58 in which the adhesive layer 57c, the Cu layer 60c, and the Au layer 59c are stacked are formed. . As described above, a flexible wiring board before electronic components such as capacitors and IC chips are mounted is formed.
[0073]
Next, a solder paste is printed on the first connection terminal 51 and the second connection terminal 58 (S7). Thereafter, as shown in FIG. 15D, the capacitor 164 is placed so that the center of the capacitor 164 fits into the concave portion 261a of the mounted component holding member 261 and straddles the first connection terminal 51 and the second connection terminal 58. Is implemented (S8). Thereafter, by heating in a reflow furnace (S9), the capacitor 164 is bonded to form a flexible wiring board 163 on which electronic components are mounted.
[0074]
As described above, the resist layer 255 which is a part of the mounted component holding member may be formed by applying the resist film twice. In the third and fourth embodiments, the resist layer which is a part of the mounting component holding member is formed simultaneously with the step of forming the resist layer used for patterning the connection terminals. The mounting component holding member may be formed in a step different from the step of forming the resist layer to be used. In this case, the mounted component holding member is composed of only the resist layer.
[0075]
<Embodiment of electronic device>
An embodiment in which a liquid crystal device including the liquid crystal panel is used as a display device of an electronic device will be described. FIG. 16 is a schematic configuration diagram illustrating the overall configuration of the present embodiment. The electronic device shown here has a liquid crystal panel 100 similar to the above, and control means 1200 for controlling the same. Here, the liquid crystal panel 100 is conceptually divided into a panel structure 100A and a driving circuit 100B including a semiconductor IC or the like. The control means 1200 includes a display information output source 1210, a display information processing circuit 1220, a power supply circuit 1230, and a timing generator 1240.
[0076]
The display information output source 1210 includes a memory such as a ROM (Read Only Memory) or a RAM (Random Access Memory), a storage unit such as a magnetic recording disk or an optical recording disk, and a tuning circuit for synchronizing and outputting a digital image signal. And is configured to supply display information to the display information processing circuit 1220 in the form of an image signal or the like in a predetermined format based on various clock signals generated by the timing generator 1240.
[0077]
The display information processing circuit 1220 includes various known circuits such as a serial-parallel conversion circuit, an amplification / inversion circuit, a rotation circuit, a gamma correction circuit, and a clamp circuit. Is supplied to the drive circuit 100B together with the clock signal CLK. The driving circuit 100B includes a scanning line driving circuit, a data line driving circuit, and an inspection circuit. The power supply circuit 1230 supplies a predetermined voltage to each of the above-described components.
[0078]
In the above-described embodiment, a case where the present invention is applied to a liquid crystal device as an electro-optical device has been described. However, the present invention is not limited to this. Display devices, FED (field emission display) devices, LED (light emitting diode) display devices, electrophoretic display devices, thin CRTs, small televisions using liquid crystal shutters, etc., devices using digital micromirror devices (DMD), etc. It can be applied to various electro-optical devices. That is, the present invention can be applied to a structure in which a mounted component is mounted on a substrate, and an electronic component free from poor connection can be formed.
[0079]
[Brief description of the drawings]
FIG. 1 is a perspective view of a liquid crystal device according to an embodiment.
FIG. 2 is a partially enlarged perspective view of the wiring board according to the first embodiment.
FIG. 3 is a plan view and a cross-sectional view of FIG. 2;
FIG. 4 is a manufacturing flowchart of the wiring board according to the first embodiment.
FIG. 5 is a manufacturing process diagram of the wiring board according to the first embodiment.
FIG. 6 is a partially enlarged perspective view of a wiring board according to a second embodiment.
7 is a plan view and a cross-sectional view of FIG.
FIG. 8 is a manufacturing flowchart of the wiring board according to the second embodiment.
FIG. 9 is a view showing a manufacturing process of the wiring board according to the second embodiment;
FIG. 10 is a partially enlarged perspective view of a wiring board according to a third embodiment.
11 is a plan view and a cross-sectional view of FIG.
FIG. 12 is a manufacturing flowchart of the wiring board according to the third embodiment.
FIG. 13 is a view showing the manufacturing process of the wiring board according to the third embodiment;
FIG. 14 is a manufacturing flowchart of the wiring board according to the fourth embodiment.
FIG. 15 is a view showing a manufacturing process of the wiring board according to the fourth embodiment;
FIG. 16 is a schematic configuration diagram of an electronic device.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Liquid crystal device, 51 ... 1st connection terminal, 55, 255 ... Resist layer, 58 ... 2nd connection terminal, 60 ... Cu film, 60a, 60b, 60c ... Cu layer, 61, 161, 261 ... Mounted component holding member, 163: flexible wiring board, 164: capacitor, 165: base material, 261a: recess

Claims (10)

Forming a first connection terminal, a second connection terminal, and a mounting component holding member between the connection terminals on the substrate;
Mounting a mounting component so as to straddle the first connection terminal and the second connection terminal. In the forming step, the mounting component holding member is formed so as to have a length exceeding a width of the mounting component in a direction substantially orthogonal to a line connecting the first connection terminal and the second connection terminal. The method for manufacturing an electronic component according to claim 1, wherein: 3. The method according to claim 1, wherein in the forming step, the mounting component holding member is formed to have a height higher than a height of the connection terminal. 3. The method of manufacturing an electronic component according to claim 1, wherein, in the forming step, the mounting component holding member is formed to have a concave portion that supports the mounting component. The forming step includes:
Forming a conductive film on the substrate;
Forming a patterned resist layer on the conductive film,
Etching the conductive film using the resist layer as a mask,
Removing the resist layer partially, and holding the mounted component having the first connection terminal and the second connection terminal having the conductive film material and the laminated film of the conductive film material and the resist layer material; The method for manufacturing an electronic component according to claim 1, further comprising: forming a member. An electronic component manufactured by the method for manufacturing an electronic component according to claim 1. A substrate on which the first connection terminal and the second connection terminal are formed;
A mounting component mounted so as to straddle the first connection terminal and the second connection terminal;
A mounting formed on the board between the first connection terminal and the second connection terminal so as to have a length exceeding a width of the mounting component in a direction substantially orthogonal to a line connecting the first connection terminal and the second connection terminal. An electronic component, comprising: a component holding member. A substrate on which the first connection terminal and the second connection terminal are formed;
A mounting component mounted so as to straddle the first connection terminal and the second connection terminal;
An electronic component, comprising: a mounting component holding member having a recess formed on the substrate and supporting the mounting component, between the first connection terminal and the second connection terminal. An electro-optic panel,
An electro-optical device comprising: the electronic component according to claim 6, which is electrically connected to the electro-optical panel. An electronic apparatus comprising the electro-optical device according to claim 9.

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