JP2004193626A5 - - Google Patents
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- Publication number
- JP2004193626A5 JP2004193626A5 JP2004028565A JP2004028565A JP2004193626A5 JP 2004193626 A5 JP2004193626 A5 JP 2004193626A5 JP 2004028565 A JP2004028565 A JP 2004028565A JP 2004028565 A JP2004028565 A JP 2004028565A JP 2004193626 A5 JP2004193626 A5 JP 2004193626A5
- Authority
- JP
- Japan
- Prior art keywords
- electrically insulating
- insulating support
- support substrate
- disposed
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12104399P | 1999-02-22 | 1999-02-22 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000050491A Division JP2000294406A (ja) | 1999-02-22 | 2000-02-22 | Ｐｔｃ回路保護装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004193626A JP2004193626A (ja) | 2004-07-08 |
| JP2004193626A5 true JP2004193626A5 (ko) | 2007-04-05 |
Family
ID=22394139
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000050491A Withdrawn JP2000294406A (ja) | 1999-02-22 | 2000-02-22 | Ｐｔｃ回路保護装置 |
| JP2004028565A Pending JP2004193626A (ja) | 1999-02-22 | 2004-02-04 | Ｐｔｃ回路保護装置 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000050491A Withdrawn JP2000294406A (ja) | 1999-02-22 | 2000-02-22 | Ｐｔｃ回路保護装置 |
Country Status (4)
| Country | Link |
|---|---|
| JP (2) | JP2000294406A (ko) |
| DE (1) | DE10007888A1 (ko) |
| FR (1) | FR2790136A1 (ko) |
| TW (1) | TW463443B (ko) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1714413A (zh) * | 2002-12-11 | 2005-12-28 | 伯恩斯公司 | 导电聚合物器件以及制造该器件的方法 |
| WO2004053898A2 (en) * | 2002-12-11 | 2004-06-24 | Bourns, Inc. | Encapsulated electronic device and method of manufacturing the same |
| CN103333385A (zh) * | 2013-05-29 | 2013-10-02 | 安徽荣玖光纤通信科技有限公司 | 一种铜导线ptc高分子导电材料及其制备方法 |
-
2000
- 2000-02-21 TW TW89102986A patent/TW463443B/zh not_active IP Right Cessation
- 2000-02-21 DE DE2000107888 patent/DE10007888A1/de not_active Withdrawn
- 2000-02-22 FR FR0002207A patent/FR2790136A1/fr not_active Withdrawn
- 2000-02-22 JP JP2000050491A patent/JP2000294406A/ja not_active Withdrawn
-
2004
- 2004-02-04 JP JP2004028565A patent/JP2004193626A/ja active Pending
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