JP2004192705A - Wiring processing device for optical pickup - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a device for processing a flexible wiring board of an optical pickup. <P>SOLUTION: A flexible wiring board on which electric components including a superimposition circuit 2 connected to the terminals 1a, 1b, 1c and 1d of a semiconductor laser element 1 are mounted is constructed in such a manner that a circuit is divided into a plurality of parts, connection parts 13a, 13b, 13c, 13d, 14a, 14b, 14c, and 14d are disposed, and the connection parts 13a, 13b, 13c, 13d, 14a, 14b, 14c, and 14d are connected to the terminal of the semiconductor laser element 1 in a superimposed manner. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an apparatus for processing a flexible wiring board on which high-frequency superposition for an optical pickup is mounted.
[0002]
[Prior art]
It is well known that a high-frequency superposition method of supplying a high-frequency current to a semiconductor laser element and driving the semiconductor laser element when writing and reproducing a DVD by an optical pickup is used. The oscillation circuit section constituting this high-frequency superposition module is configured by combining an active element such as a transistor in an IC, and an inductor (L), a capacitor (C), and a resistor (R) as external components. In some cases, noise transmitted as unnecessary radiation from the superimposing circuit is mixed into the control circuit to affect the operation of the optical pickup.
[0003]
FIG. 3 is a block diagram showing an example of a conventionally used flexible wiring circuit. Reference numeral 1 denotes a semiconductor laser element that emits a laser beam for performing a write or read operation on a storage medium, and has laser terminals 1a and 1b. , 1c and 1d. Reference numeral 2 denotes a superposition IC for transmitting a high frequency of 300 MHz to 450 MHz, and reference numeral 3 denotes an external LRC in which an external inductor (L), a resistor (R), and a capacitor (C) accompanying a transmission circuit of the superposition IC 2 are incorporated. is there.
[0004]
4 and 5 are LC filters connected between the semiconductor laser element 1 and the superimposed IC, 6, 7, 8, 9, and 10 are EMI filters for attenuating unnecessary frequencies, and 11 is a flexible board on which various electric components are mounted. Wiring boards 11a, 11b, 11c and 11d are used to connect circuits from electric components incorporated in the flexible wiring board 11 to the four laser terminals 1a, 1b, 1c and 1d of the semiconductor laser device 1 by soldering. Reference numeral 12 denotes a connector connected to a control circuit or the like.
[0005]
As for the various electric components configured as described above, a high frequency of 300 MHz to 450 MHz is transmitted from the superimposed IC 2 in which the electric components are arranged in the narrow flexible extension board 11 as shown in FIG. 3, but the semiconductor laser device 1 and the EMI filter 6 , 7, 8, 9, 10 and the mounting area of the parts is very small, so that the ground line must be designed thin, and a thin and long wiring pattern is not suitable for suppressing noise. It was.
[0006]
[Patent Document 1]
JP 2001-23216 A [Patent Document 2]
JP-A-06-236571
[Problems to be solved by the invention]
In recent years, optical pickups have been shifting to thinner ones. For thick optical pickups, the noise generated by the high-frequency superimposing circuit has been reduced by sufficiently strengthening the pattern, arranging appropriate components, and strengthening the ground line. I was able to do it. Recent optical pickups have a very small component mounting area due to a reduction in thickness, so that proper placement is impossible, so that a wiring line becomes longer and a ground line cannot be arranged thicker.
[0008]
In a conventional DVD player and the like, noise caused by unnecessary radiation from a superimposed circuit is eliminated by covering the electric circuit with a sheet metal of the housing, but in recent DVD players, the housing is made of plastic. And are vulnerable to unnecessary radiation.
[0009]
A DVD player having a plastic housing as described above needs to reduce noise of unnecessary radiation from a superimposing circuit incorporated in an optical pickup device.
[0010]
An object of the present invention is to provide a wiring processing device for an optical pickup that solves such a problem.
[0011]
[Means for Solving the Problems]
A flexible wiring board on which an electric component including a superimposed circuit connected to a terminal of the semiconductor laser element is mounted, the circuit is divided into a plurality of parts and connection parts are provided, and each of the connection parts is connected to a terminal of the semiconductor laser element. They are connected in layers.
[0012]
【Example】
FIG. 1 is a block diagram of a main part for explaining the present invention, and FIG. 2 is a plan view of a flexible wiring board according to the block diagram of FIG. In the drawing numbers, the same numbers as in the conventional example are used, and only the new numbers will be described. In the figure, reference numeral 13 denotes a first flexible wiring board connected to four laser terminals 1a, 1b, 1c, and 1d of the semiconductor laser element 1, and laser terminals 1a, 1b, 1c, and 1d of the semiconductor laser element 1. Are provided with connection portions 13a, 13b, 13c and 13d to be soldered to the.
[0013]
Reference numeral 14 denotes a second flexible wiring board connected to the semiconductor laser element 1 and provided with connection portions 14a, 14b, 14c, and 14d that are soldered to the laser terminals 1a, 1b, 1c, and 1d of the semiconductor laser element 1, The first flexible wiring board 13 and the second flexible wiring board 14 will be described later, and are divided into two flexible wiring boards.
[0014]
The first flexible wiring board 13 and the second flexible wiring board 14 thus divided are formed so that the bent portions 15a and 15b are simultaneously bent in a U-shape in the upper surface direction. The bent portion 16b is also shaped so as to be bent in a U-shape in the upper surface direction.
[0015]
In the flexible wiring board bent in this manner, the connection portions can be aligned in the same direction. In order to connect to the semiconductor laser device 1, first, the connection portion 13a arranged on the first flexible wiring board 13 is soldered to the terminal 1a of the semiconductor laser device 1, and the connection portions 13b, 1c are connected to the terminal 1b. The connection portion 13d is soldered to the connection portions 13c and 1d. Further, the connecting portion 14a disposed on the second flexible wiring board 14 is soldered to the terminal 1a of the semiconductor laser device 1, and the connecting portion 14b is connected to the terminal 1b, the connecting portion 14c is connected to the terminal 1b, and the connecting portion 14c is connected to the terminal 1b. The part 14d is soldered.
[0016]
By arranging the first flexible wiring board 13 and the second flexible wiring board 14 connected in this manner in a two-tiered manner, it is possible to design with a short wiring pattern and to make the circuit compact.
[0017]
【The invention's effect】
The present invention provides a flexible wiring board on which an electric component including a superimposed circuit connected to a terminal of a semiconductor laser element is mounted, the circuit is divided into a plurality of parts and connection portions are provided, and each terminal of the semiconductor laser element is Since the connection portions are overlapped and connected, it is possible to reduce the size of the wiring pattern of the flexible printed circuit board and to increase the size of the ground line. Unnecessary radiation can be greatly suppressed.
[0018]
Also, when soldering to the terminals of the semiconductor laser element, the connection portion of the first flexible wiring board is soldered and bent twice to solder the connection portion of the second flexible wiring board. It is an excellent thing that it becomes a surface and can be easily soldered.
[Brief description of the drawings]
FIG. 1 is a block diagram of one embodiment of the present invention.
FIG. 2 is a perspective view showing a flexible wiring board which is a block diagram shown in FIG. 1;
FIG. 3 is a block diagram showing an example of a conventional flexible wiring circuit.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Semiconductor laser element 1a, 1b, 1c, 1d Terminal 2 Superposition IC
13 First flexible wiring boards 13a, 13b, 13c, 13d Connection part 14 Second flexible wiring boards 14a, 14b, 14c, 14d Connection parts 15a, 15b Bend parts 16a, 16b Bend part

Claims (3)

A semiconductor laser element is used as a light source for generating a light beam for irradiating a signal recording medium. In an optical pickup device in which various optical components including the semiconductor laser element are incorporated in a housing, a superimposing circuit connected to a terminal of the semiconductor laser element is provided. An optical pickup characterized in that a flexible wiring board on which an electric component is mounted is divided into a plurality of circuits and provided with respective connection portions, and each of the connection portions is overlapped and connected to a terminal of the semiconductor laser element. Wiring processing equipment. A flexible printed circuit board on which an electric circuit including a superimposed circuit is mounted is divided into a first flexible printed circuit board and a second flexible printed circuit board, and the flexible printed circuit boards divided into the terminals of the semiconductor laser device are folded and connected. 2. The wiring processing device for an optical pickup according to claim 1, wherein the units are connected. 3. The wiring processing device for an optical pickup according to claim 2, wherein a plurality of bent portions of the flexible printed circuit board are provided and bent so that a connecting portion between the first flexible printed circuit board and the second flexible printed circuit board is on the same surface. .

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