CN1506953A - Wiring substrate and wiring method - Google Patents
Wiring substrate and wiring method Download PDFInfo
- Publication number
- CN1506953A CN1506953A CNA2003101201599A CN200310120159A CN1506953A CN 1506953 A CN1506953 A CN 1506953A CN A2003101201599 A CNA2003101201599 A CN A2003101201599A CN 200310120159 A CN200310120159 A CN 200310120159A CN 1506953 A CN1506953 A CN 1506953A
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- CN
- China
- Prior art keywords
- mentioned
- substrate
- circuit substrate
- circuit
- connecting portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
- G11B7/125—Optical beam sources therefor, e.g. laser control circuitry specially adapted for optical storage devices; Modulators, e.g. means for controlling the size or intensity of optical spots or optical traces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
Abstract
Provided is a device for processing a flexible wiring board of an optical pickup. A flexible wiring board on which electric components including a superimposition circuit 2 connected to the terminals 1a, 1b, 1c and 1d of a semiconductor laser element 1 are mounted is constructed in such a manner that a circuit is divided into a plurality of parts, connection parts 13a, 13b, 13c, 13d, 14a, 14b, 14c, and 14d are disposed, and the connection parts 13a, 13b, 13c, 13d, 14a, 14b, 14c, and 14d are connected to the terminal of the semiconductor laser element 1 in a superimposed manner.
Description
Technical field
The present invention relates to be used for the circuit board and the wiring method thereof of optic pick-up device.
Background technology
When the DVD that is made of optic pick-up device charged to or plays, it was well-known using the high frequency method of superposition, and it is driven high-frequency current semiconductor supply laser diode.The oscillatory circuit that constitutes the overlapping module of this high frequency is to be combined in the IC with active devices such as transistors with as inductance (L), electric capacity (C) and the resistance (R) etc. of optional feature and to constitute, owing to the noise of launching as unnecessary radiation from the high frequency superposing circuit is blended into the control circuit, thus influential to the action of optic pick-up device.
Fig. 3 is the block scheme of an expression previously used flexible printed circuit example, the 1st, and emission is used for medium is write or the semiconductor Laser device of the laser beam of read operation, is provided with four terminals such as laser terminal 1a, 1b, 1c, 1d.The 2nd, be used to launch the overlapping IC of 300MHz～450MHz high-frequency signal, the 3rd, be assembled with inductance (L), resistance (R), and the additional LRC of electric capacity (C) of the signal sending circuit of following above-mentioned overlapping IC2.
4 and 5 is the LC wave filters that are connected between above-mentioned semiconductor Laser device 1 and the above-mentioned overlapping IC, 6, the 7,8,9, the 10th, the electromagnetic interface filter that unwanted frequency is decayed, the 11st, the flexible circuit board of various electric components is being set, 11a, 11b, 11c, 11d are the connecting portions on the circuit of will draw from the electric component that is assembled on the above-mentioned flexible circuit board 11 4 laser terminal 1a being welded to semiconductor Laser device 1,1b, 1c, the 1d, the 12nd, and the connector that is connected with control circuit etc.
Various electric components of Gou Chenging although it is so, launch the high-frequency signal of 300MHz～450MHz as illustrated in fig. 3 by the overlapping IC2 in the narrow flexible circuit board 11, but this structure makes the wiring distance between semiconductor Laser device 1 and the EMI filtrator 6,7,8,9,10 elongated, and the practical set area of parts is considerably less.Therefore have to ground wire is designed to thinner, and elongated wiring diagram is unsuitable for Noise Suppression.
(patent documentation 1)
Jap.P. open report spy opens 2001-23216 number
(patent documentation 2)
Jap.P. open report spy opens flat 06-236571 number
In existing thick type optic pick-up device, adopt abundant wiring diagram of strengthening or measures such as suitable components configuration and reinforcement ground wire to alleviate the noise that the high frequency superposing circuit takes place.But nearest optic pick-up device becomes very little to slimming development, parts assembling area, extends owing to can not suitably disposing the length that makes wiring, and can not dispose thicker ground wire.
In devices such as existing DVD player, housing is made with sheet metal, suppresses the formed noise of unnecessary radiation that produced by superposing circuit with this sheet metal coating electrical loop, but in nearest DVD player, housing is by plastic, and the inhibition of unnecessary radiation is also just quite weakened.
Like this, housing must be suppressed by the formed noise of unnecessary radiation that is arranged on the superposing circuit generation in the optic pick-up device by the DVD player of plastic.
Summary of the invention
The present invention makes in order to address the above problem, and its objective is the circuit board and the wiring method thereof that are provided for optic pick-up device.
The circuit board of the present invention of making in order to achieve the above object, be used for optic pick-up device, semiconductor Laser device is shone the light source of the light beam on the signal recording medium as generation to above-mentioned optic pick-up device and the various optical elements that use, comprise above-mentioned semiconductor Laser device are assembled in the casing, wherein, on above-mentioned circuit board, carrying electric component with circuit; Whole circuit on the above-mentioned circuit board are divided into a plurality of partial circuit substrates; On the partial circuit substrate more than at least 2 in above-mentioned a plurality of partial circuit substrates, be respectively equipped with the terminal connecting portion that is connected with the terminal of above-mentioned semiconductor Laser device; Above-mentioned divided a plurality of partial circuit substrates are overlapping; The terminal of above-mentioned semiconductor Laser device is connected with the terminal connecting portion of above-mentioned overlapping partial circuit substrate respectively.
And in the invention described above, above-mentioned electric component preferably comprises the overlapping element that is used to export high-frequency signal.
In addition, in the invention described above, the whole circuit on the above-mentioned circuit board are divided into a plurality of partial circuit substrates more than at least 2 that comprise part 1 circuit substrate and part 2 circuit substrate; On above-mentioned part 1 circuit substrate and part 2 circuit substrate, be respectively equipped with the terminal connecting portion that is connected with the terminal of above-mentioned semiconductor Laser device; Be provided with the connecting circuit substrate that more than 1 place, connects part 1 circuit substrate and the 2nd circuit substrate at least; Have connecting portion between the 1st substrate that connects above-mentioned connecting circuit substrate and above-mentioned part 1 circuit substrate and be connected connecting portion between the 2nd substrate of above-mentioned connecting circuit substrate and above-mentioned part 2 circuit substrate; By with at least 1 bending in the connecting portion between connecting portion and the 2nd substrate between above-mentioned the 1st substrate, make above-mentioned part 1 circuit substrate and above-mentioned part 2 circuit substrate overlapping.
In addition, in the invention described above, the connecting portion both is bent between connecting portion and the 2nd substrate by making between above-mentioned the 1st substrate, makes above-mentioned part 1 circuit substrate and above-mentioned part 2 circuit substrate overlapping; After overlapping, the terminal connecting portion of above-mentioned part 1 circuit substrate be positioned in above-mentioned part 2 circuit substrate the terminal connecting portion directly over.
Moreover in the invention described above, the both sides of the terminal connecting portion of above-mentioned part 1 circuit substrate and the terminal connecting portion of above-mentioned part 2 circuit substrate see towards same direction from the closure of the terminal of above-mentioned semiconductor Laser device.
The wiring method of the present invention of making in order to achieve the above object, be used for optic pick-up device, semiconductor Laser device is shone the light source of the light beam on the signal recording medium as generation to above-mentioned optic pick-up device and the various optical elements that use, comprise above-mentioned semiconductor Laser device are assembled in the casing, wherein, on above-mentioned circuit board, carrying electric component with circuit; Whole circuit on the above-mentioned circuit board are divided into a plurality of partial circuit substrates; On the partial circuit substrate more than at least 2 in above-mentioned a plurality of partial circuit substrates, be respectively equipped with the terminal connecting portion that is connected with the terminal of above-mentioned semiconductor Laser device; Above-mentioned divided a plurality of partial circuit substrates are overlapping; The terminal of above-mentioned semiconductor Laser device is connected with the terminal connecting portion of above-mentioned overlapping partial circuit substrate respectively.
And above-mentioned electric component comprises the overlapping element of exporting high-frequency signal.
In addition, in the invention described above, the whole circuit on the above-mentioned circuit board are divided into a plurality of partial circuit substrates more than at least 2 that comprise part 1 circuit substrate and part 2 circuit substrate; The terminal connecting portion that is connected with the terminal of above-mentioned semiconductor Laser device is set respectively on above-mentioned part 1 circuit substrate and part 2 circuit substrate; Be provided with the connecting circuit substrate that more than 1 place, connects part 1 circuit substrate and part 2 circuit substrate at least; Be provided with connecting portion between the 1st substrate that connects above-mentioned connecting circuit substrate and above-mentioned part 1 circuit substrate and be connected connecting portion between the 2nd substrate of above-mentioned connecting circuit substrate and above-mentioned part 2 circuit substrate; By with at least 1 bending in the connecting portion between connecting portion and the 2nd substrate between above-mentioned the 1st substrate, make above-mentioned part 1 circuit substrate and above-mentioned part 2 circuit substrate overlapping.
Moreover in the invention described above invention, the connecting portion both sides are bent between connecting portion and the 2nd substrate by making between above-mentioned the 1st substrate, make above-mentioned part 1 circuit substrate and above-mentioned part 2 circuit substrate overlapping; After overlapping, make the terminal connecting portion of above-mentioned part 1 circuit substrate be positioned at above-mentioned part 2 circuit substrate the terminal connecting portion directly over.
In addition, in the invention described above, make the both sides of the terminal connecting portion of the terminal connecting portion of above-mentioned part 1 circuit substrate and part 2 circuit substrate, see all in the same direction from the terminal closure of above-mentioned semiconductor Laser device.
Description of drawings
Fig. 1 is the block scheme of expression one embodiment of the invention.
Fig. 2 A is the oblique view of the flexible circuit board of expression block scheme shown in Figure 1.
To be expression bend to side view when connecting semiconductor Laser device behind the S font with flexible circuit board to Fig. 2 B.
Fig. 3 is the block scheme of an example of the existing flexible printed circuit of expression.
Embodiment
Fig. 1 is the block scheme of explanation major part of the present invention.Fig. 2 A is the planimetric map of the flexible circuit board in the block scheme shown in Figure 1.Fig. 2 B is with the outboard profile of Fig. 1 when being connected semiconductor Laser device 1 after the flexible circuit board shown in Fig. 2 A bends to the S font.Label in the drawing uses the label identical with conventional example, only new label is described.
In each figure, flexible substrate 13 is and 4 the 1st flexible circuit boards that terminal is connected such as the laser terminal 1a of semiconductor Laser device 1,1b, 1c, 1d, terminal connecting portion 13a, 13b, 13c, 13d are being set on this substrate 13, and they are soldered on 4 terminal 1a, 1b, 1c, the 1d of semiconductor Laser device 1.Flexible substrate 14 is the 2nd flexible circuit boards that are connected with semiconductor Laser device 1, and terminal connecting portion 14a, 14b, 14c, 14d are being set on this substrate 14, and they also are soldered on the laser terminal 1a, 1b, 1c, 1d of semiconductor Laser device 1.As mentioned above, all flexible circuit board is divided into 2 flexible circuit boards such as above-mentioned the 1st flexible circuit board 13 and above-mentioned the 2nd flexible circuit board 14.
The 1st flexible circuit board 13 and the 2nd flexible circuit board 14 have locally-attached 2 connecting circuit substrate 17a, 17b between two substrates.Connecting circuit substrate 17a, 17b have bend 15a and bend 15b at the connecting portion with substrate 14, have bend 16a and bend 16b at the connecting portion with substrate 13.By this connecting circuit substrate substrate 13 and substrate 14 are electrically connected, constitute whole flexible circuit board.The length of this connecting circuit substrate 17a, 17b must be the length of guaranteeing to be suitable for forming following S font.
Like this, the 1st flexible circuit board 13 and above-mentioned the 2nd flexible circuit board 14 cut apart with the state that connects with the connecting circuit substrate portion all bend to bend 15a and bend 15b two parts the U font, again bend 16a and bend 16b two parts are bent to the U font and form.After with these bend bendings, whole flexible circuit board just forms the flexible substrate of the S font shown in Fig. 2 B.Promptly, at first two bend 15a, 15b on connecting circuit substrate 17a, the 17b are bent to U font as the trough shape.Secondly, will bend to U font with two bend 16a, the 16b that substrate 14 accompanies as the crest shape.Wherein, bend 16a and bend 16b when crooked, are being positioned bend 16a on connecting circuit substrate 17a, the 17b and bend 16b, making a, the b of substrate 13 and substrate 14, terminal connecting portion that c, d etc. are corresponding consistent with each other.These bends bendings are formed the S font.Crooked and form in the flexible circuit board of S font, can be directly over the terminal connecting portion 13a on the substrate 13,13b, 13c, 13d the pairing connecting portion of 14a, 14b, 14c, 14d of location substrate 14.In addition, when being configured as the S font, also can not make the terminal connecting portion of substrate 13 and substrate 14 relative, align but they are seen in same direction from the closure of semiconductor Laser device.
Below, according to Fig. 2 B explanation semiconductor Laser device 1 is connected to concrete operation on the flexible circuit board.With terminal 1a, 1b, 1c, the 1d of semiconductor Laser device 1, the hole on each the corresponding terminal connecting portion 13a by being arranged on substrate 13,13b, 13c, the 13d is inserted on the flexible circuit board before crooked shown in Fig. 1 and Fig. 2 A.Then, weld in order to connect semiconductor Laser device 1 and substrate 13.The connecting portion 13a that is configured on above-mentioned the 1st flexible circuit board 13 is welded on the terminal 1a of semiconductor Laser device 1, connecting portion 13b is welded on the terminal 1b, connecting portion 13c is welded on the terminal 1c, connecting portion 13d is welded on the terminal 1d, thus semiconductor Laser device 1 is connected with flexible circuit board 13.Then, flexible circuit board is bent to the S font as described above.Wherein and since connecting circuit substrate 17a, 17b not directly over the terminal connecting portion of substrate 13 and the terminal connecting portion of substrate 14 under, thereby when inserting semiconductor Laser device 1, do not have obstruction.Here, substrate 13, substrate 14 and connecting circuit substrate 17 are parallel to each other.
When being configured as the S font, the hole of each terminal connecting portion 14a of the correspondence by substrate 14,14b, 14c, the last setting of 14d is inserted into terminal 1a, 1b, 1c, the 1d of semiconductor Laser device 1 in the flexible circuit board of S font.The terminal connecting portion 14a of configuration on above-mentioned the 2nd flexible circuit board 14 is welded on the terminal 1a of semiconductor Laser device 1, terminal connecting portion 14b is welded to terminal 1b to be gone up, terminal connecting portion 14c is welded on the terminal 1c, terminal connecting portion 14d is welded on the terminal 1d, semiconductor Laser device 1 and flexible circuit board 14 are electrically connected.
Like this, the 1st flexible printed circuit board 13 that is connected with semiconductor Laser device 1 and the 2nd flexible printed circuit board 14 form and integrally are overlapped into 2 layers structure.Therefore, just can design, can also make the whole base plate densification with short wiring diagram.And when the terminal of welding semiconductor Laser device 1, the connecting portion to the 1st flexible printed circuit board 13 welds earlier, carry out then after 2 bendings, the connecting portion of the 2nd flexible printed circuit board is welded, like this, make welding portion at grade, just can easily weld.
The invention effect
Circuit board that the present invention relates to and wiring method thereof have following advantage.That is, can make the substrate overall compactization, the wiring on the circuit board is shortened.Owing to can carry out bigger wiring to ground wire, so the influence of the unnecessary radiation that the wiring route that can suppress to be connected with overlapping IC is launched.
Claims (10)
1. circuit board, be used for optic pick-up device, semiconductor Laser device is shone the light source of the light beam on the signal recording medium as generation to above-mentioned optic pick-up device and the various optical elements that use, comprise above-mentioned semiconductor Laser device are assembled in the casing, it is characterized in that, on above-mentioned circuit board, carrying electric component with circuit; Whole circuit on the above-mentioned circuit board are divided into a plurality of partial circuit substrates; On the partial circuit substrate more than at least 2 in above-mentioned a plurality of partial circuit substrates, be respectively equipped with the terminal connecting portion that is connected with the terminal of above-mentioned semiconductor Laser device; Above-mentioned divided a plurality of partial circuit substrates are overlapping; The terminal of above-mentioned semiconductor Laser device is connected with the terminal connecting portion of above-mentioned overlapping partial circuit substrate respectively.
2. circuit board as claimed in claim 1 is characterized in that, above-mentioned electric component comprises the overlapping element of exporting high-frequency signal.
3. circuit board as claimed in claim 1 or 2 is characterized in that, the whole circuit on the above-mentioned circuit board are divided into a plurality of partial circuit substrates more than at least 2 that comprise part 1 circuit substrate and part 2 circuit substrate; On above-mentioned part 1 circuit substrate and part 2 circuit substrate, be respectively equipped with the terminal connecting portion that is connected with the terminal of above-mentioned semiconductor Laser device; Be provided with the connecting circuit substrate that more than 1 place, connects part 1 circuit substrate and the 2nd circuit substrate at least; Have connecting portion between the 1st substrate that connects above-mentioned connecting circuit substrate and above-mentioned part 1 circuit substrate and be connected connecting portion between the 2nd substrate of above-mentioned connecting circuit substrate and above-mentioned part 2 circuit substrate; By with at least 1 bending in the connecting portion between connecting portion and the 2nd substrate between above-mentioned the 1st substrate, make above-mentioned part 1 circuit substrate and above-mentioned part 2 circuit substrate overlapping.
4. circuit board as claimed in claim 3 is characterized in that, the connecting portion both is bent between connecting portion and the 2nd substrate by making between above-mentioned the 1st substrate, makes above-mentioned part 1 circuit substrate and above-mentioned part 2 circuit substrate overlapping; After overlapping, the terminal connecting portion of above-mentioned part 1 circuit substrate be positioned in above-mentioned part 2 circuit substrate the terminal connecting portion directly over.
5. circuit board as claimed in claim 4, it is characterized in that, the both sides of the terminal connecting portion of above-mentioned part 1 circuit substrate and the terminal connecting portion of above-mentioned part 2 circuit substrate see towards same direction from the closure of the terminal of above-mentioned semiconductor Laser device.
6. wiring method, be used for optic pick-up device, semiconductor Laser device is shone the light source of the light beam on the signal recording medium as generation to above-mentioned optic pick-up device and the various optical elements that use, comprise above-mentioned semiconductor Laser device are assembled in the casing, it is characterized in that, on above-mentioned circuit board, carrying electric component with circuit; Whole circuit on the above-mentioned circuit board are divided into a plurality of partial circuit substrates; On the partial circuit substrate more than at least 2 in above-mentioned a plurality of partial circuit substrates, be respectively equipped with the terminal connecting portion that is connected with the terminal of above-mentioned semiconductor Laser device; Above-mentioned divided a plurality of partial circuit substrates are overlapping; The terminal of above-mentioned semiconductor Laser device is connected with the terminal connecting portion of above-mentioned overlapping partial circuit substrate respectively.
7. wiring method as claimed in claim 6 is characterized in that, above-mentioned electric component comprises the overlapping element of exporting high-frequency signal.
8. as claim 6 or 7 described wiring methods, it is characterized in that: the whole circuit on the above-mentioned circuit board are divided into a plurality of partial circuit substrates more than at least 2 that comprise part 1 circuit substrate and part 2 circuit substrate; On above-mentioned part 1 circuit substrate and part 2 circuit substrate, be respectively equipped with the terminal connecting portion that is connected with the terminal of above-mentioned semiconductor Laser device; Be provided with the connecting circuit substrate that more than 1 place, connects part 1 circuit substrate and part 2 circuit substrate at least; Be provided with connecting portion between the 1st substrate that connects above-mentioned connecting circuit substrate and above-mentioned part 1 circuit substrate and be connected connecting portion between the 2nd substrate of above-mentioned connecting circuit substrate and above-mentioned part 2 circuit substrate; By with at least 1 bending in the connecting portion between connecting portion and the 2nd substrate between above-mentioned the 1st substrate, make above-mentioned part 1 circuit substrate and above-mentioned part 2 circuit substrate overlapping.
9. wiring method as claimed in claim 8 is characterized in that, the connecting portion both sides are bent between connecting portion and the 2nd substrate by making between above-mentioned the 1st substrate, make above-mentioned part 1 circuit substrate and above-mentioned part 2 circuit substrate overlapping; After overlapping, make the terminal connecting portion of above-mentioned part 1 circuit substrate be positioned at above-mentioned part 2 circuit substrate the terminal connecting portion directly over.
10. wiring method as claimed in claim 9 is characterized in that, makes the both sides of the terminal connecting portion of the terminal connecting portion of above-mentioned part 1 circuit substrate and part 2 circuit substrate, sees all in the same direction from the terminal closure of above-mentioned semiconductor Laser device.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002358149 | 2002-12-10 | ||
| JP2002358149A JP4107953B2 (en) | 2002-12-10 | 2002-12-10 | Optical pickup wiring processing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1506953A true CN1506953A (en) | 2004-06-23 |
| CN1238848C CN1238848C (en) | 2006-01-25 |
Family
ID=32757953
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2003101201599A Expired - Fee Related CN1238848C (en) | 2002-12-10 | 2003-12-09 | Wiring substrate and wiring method |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4107953B2 (en) |
| KR (1) | KR100572656B1 (en) |
| CN (1) | CN1238848C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100375164C (en) * | 2005-01-18 | 2008-03-12 | 日立视听媒体股份有限公司 | Optical disk drive apparatus |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4803173B2 (en) * | 2005-03-15 | 2011-10-26 | 株式会社村田製作所 | Circuit board |
| JP2011198452A (en) | 2010-02-17 | 2011-10-06 | Sanyo Electric Co Ltd | Optical pickup apparatus |
-
2002
- 2002-12-10 JP JP2002358149A patent/JP4107953B2/en not_active Expired - Fee Related
-
2003
- 2003-12-09 KR KR1020030088863A patent/KR100572656B1/en not_active IP Right Cessation
- 2003-12-09 CN CNB2003101201599A patent/CN1238848C/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100375164C (en) * | 2005-01-18 | 2008-03-12 | 日立视听媒体股份有限公司 | Optical disk drive apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2004192705A (en) | 2004-07-08 |
| KR100572656B1 (en) | 2006-04-24 |
| CN1238848C (en) | 2006-01-25 |
| JP4107953B2 (en) | 2008-06-25 |
| KR20040050866A (en) | 2004-06-17 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20060125 Termination date: 20141209 |
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| EXPY | Termination of patent right or utility model |