KR100593821B1 - Wiring member of the optical head device - Google Patents

Abstract

The flexible wiring board 5 is provided with the sub board | substrate 16 connected to the semiconductor lasers 11 and 12 mounted in the optical head device 1, and has the front and back sides of the sub board | substrate 16 comprised from the double-sided board. The gland lines 17 and the hot side lines 18 and 19 are divided, respectively. This structure connects the sub-substrate 16 separate from the flexible wiring board 5 to the semiconductor lasers 11 and 12. At this time, even if the width of the sub-substrate 16 is narrowed down due to the wiring to the optical head device 1, the wiring patterns of the grand lines 17 and the hot side lines 18 and 19 of the semiconductor lasers 11 and 12. It is possible to secure the bold.

Semiconductor laser, sub board, optical head device, wiring

Description

Wiring member of optical head device {WIRING MEMBER FOR OPTICAL HEAD DEVICE}             

1 is an exploded perspective view showing an embodiment of a wiring member of an optical head device according to the present invention.

FIG. 2 is a perspective view showing an example in which the wiring member of the optical head device shown in FIG. 1 is applied to an optical disk device.

Fig. 3 is a perspective view illustrating the provision of a sub board on a flexible wiring board.

Fig. 4 is a plan view showing the external shape of the flexible wiring board and explaining the bending method.

Fig. 5 is a perspective view from the back side of the optical head device for explaining a state in which a sub substrate is connected to the first semiconductor laser and the second semiconductor laser.

FIG. 6 is a perspective view from the back of an optical head device for explaining a state in which a sub substrate is connected to a first semiconductor laser and a second semiconductor laser. FIG.

7 is a partial perspective view showing a predetermined portion of the rear surface of the optical head device for explaining a state where the laser drive IC is installed.

8 is a plan view for explaining the wiring of the outer surface of the sub board.

9 is a plan view illustrating the wiring on the rear surface of the sub substrate.

[Short description of symbols]

1 Optical head device 5) Flexible wiring board

10 optical housing 11 first semiconductor laser

12'second semiconductor laser 16'sub substrate

17 Grand Line 18, 19 Hot Side Line

The present invention is directed to a wiring member of an optical head device that connects an optical head device used for signal reading or signal writing to a signal recording medium and a circuit board provided in the apparatus main body on which the optical head device is mounted using a flexible wiring board. In particular, the present invention relates to a wiring member of an optical head device having a structure in which a sub board connected to a semiconductor laser is provided on a flexible wiring board.

BACKGROUND ART An optical recording and reproducing apparatus that optically reads or writes signals to a signal recording medium such as a disc by using laser light emitted from an optical head device is known.

In such an optical recording / reproducing apparatus, in general, the optical head device is supported to be movable in a direction crossing the signal track of the signal recording medium, and the optical head device and the apparatus main body on which the optical head device is mounted are mounted. The circuit board provided is connected using a flexible wiring board, and an electrical signal is transferred between the optical head device and the circuit board using the flexible wiring board.

For example, Japanese Unexamined Patent Publication No. 2000-3226, discloses a wiring member of an optical head device using a flexible wiring board for connection of an optical head device and a circuit board of the apparatus main body.

When there is an electrical component mounted in the optical head device, a circuit pattern for installing each electrical component at a predetermined position of a portion of the flexible wiring board connected to the optical head device, or connected to an electrical component incorporated in the optical head device Each circuit pattern is connected to each terminal of an electrical component by soldering.

The optical head device is equipped with a semiconductor laser serving as a light source, an optical detector for receiving laser light reflected by a signal recording medium, and a laser driving semiconductor integrated circuit (laser driving IC) for driving a semiconductor laser. In addition, electrical components such as coils, capacitors, resistors for setting circuit constants, or front monitor diodes for receiving the laser light emitted from the semiconductor laser are mounted to maintain the output light quantity of the semiconductor laser at a predetermined intensity. As disclosed in JP-A-2013, these electrical components are connected to a predetermined position of a portion along the optical head device in the flexible wiring board.

The positions of the various electrical components mounted on the optical head apparatus are set in consideration of the appearance of the optical head apparatus, the optical arrangement, the connection relations of the various electrical components, or the bending of the flexible wiring board. Since the size is limited depending on the appearance, each mounting portion for installing each electric component in the flexible wiring board branches into a branched shape and becomes a complicated shape.

By the way, in the case of the optical head apparatus corresponding to the signal recording and reproducing of the DVD and CD, a dedicated semiconductor laser is generally provided in each of the DVD and the CD, and the semiconductor laser for the CD and the semiconductor laser for the CD are mutually separated from the optical arrangement. Often placed away from the unit.

As a result, the distance for extending the flexible wiring board into a branch shape becomes long for connecting to the DVD semiconductor laser and the CD semiconductor laser, respectively. Along with this, an arrangement space for drawing out the flexible wiring board can be secured. Necessary and complicated layout design. Moreover, it is difficult to realize all wiring with one flexible wiring board.

In addition, when the shape of the flexible wiring board becomes complicated, the number of sheets that can be taken from the rectangular mold when manufacturing the flexible wiring board is reduced, and the manufacturing cost is high. There was a problem that the wiring patterns of the grand lines and the hot-side lines of the semiconductor lasers could not be secured thick due to the limitation of the width of the branched portion that became the transmission path of the substrate to the semiconductor laser.

According to the present invention, a sub substrate connected to a semiconductor laser mounted on an optical head device is provided on a flexible wiring board, the sub substrate is formed of a double-sided substrate, and divided into front and rear sides of the sub substrate to form a grand line and a hot side line. This makes it possible to connect a sub-substrate separate from the flexible wiring board to the semiconductor laser, and even if the width of the sub-substrate is narrowed down due to the wiring to the optical head device, the wiring pattern of the ground line and the hot-side line of the semiconductor laser. It is possible to secure the bold.

<Example>

1 is an exploded perspective view showing an embodiment of a wiring member of an optical head device according to the present invention, and FIG. 2 is a perspective view showing an example in which the wiring member of the optical head device shown in FIG. 1 is applied to an optical disk device.

The optical head device 1 corresponds to signal recording and reproducing of DVD and CD positive disks, and screws in a direction traversing the signal tracks of the disks (not shown) mounted on the turntable 2. It is supported by the shaft 3 and the guide shaft 4 to be movable.

The flexible wiring board 5 is drawn out from the upper surface of the optical head device 1 in the moving direction of the optical head device 1. The flexible wiring board 5 is such that the optical head device 1 is sandwiched in the thickness direction. The contact part 6 which becomes an electrical contact of the flexible wiring board 5 is connected to the circuit board 7 provided in the apparatus main body, and the said circuit board 7 and the optical head are overlapped. An electrical signal connecting the device 1 is formed.

As the optical head device 1, various electric parts incorporated or mounted in the optical housing 10 are used. As these electric parts, a first semiconductor laser serving as a laser light source having a wavelength suitable for each of the disks of the DVD and the CD ( 11) and the photodetector 13, the first semiconductor laser 11, and the second semiconductor laser 12, which receive the laser light reflected by the disks of the second semiconductor laser 12, the DVD and the CD, respectively. And a laser driving semiconductor integrated circuit (laser driving IC) 14. A coil, a capacitor, a resistor (not shown) for setting a circuit constant, or the amount of emitted light of the semiconductor laser is maintained at a predetermined intensity. For this purpose, there is a front monitor diode 15 which receives the laser light emitted from the first semiconductor laser 11 or the second semiconductor laser 12. The flexible wiring board 5 These electrical components are connected or installed.

As shown in Fig. 3, the first semiconductor laser 11 and the second semiconductor laser 12 are connected to a separate sub-substrate 16 provided on the flexible wiring board 5, and the sub-substrate 16 Indirectly provided on the flexible wiring board 5 through each other. In this case, each end of the sub board 16 is connected to each laser to which the first semiconductor laser 11 and the second semiconductor laser 12 are connected, respectively. The areas 16a and 16b are formed, and the middle of each of the laser connection areas 16a and 16b of the sub substrate 16 is the relay area 16c to be connected to the flexible wiring board 5.

Further, a second sub board 17 on which the laser drive IC 14 is mounted is disposed on the flexible wiring board 5. The second sub board 17 is located at a predetermined position of the flexible wiring board 5. The second sub-substrate 17 is a double-sided board, and a laser drive IC 14 is provided on the front surface thereof. An interconnection pattern is formed in each connection land connected to the flexible wiring board 5 and the laser drive IC 14.

4 shows the external shape of the flexible wiring board 5 including the sub board 16. The solid line portion is folded outward and the broken line portion is inward according to the external shape of the optical head device 1. As shown in FIG. Folded, the site where various electrical components are connected or installed is set at a predetermined position of the optical head device 1.

In the first semiconductor laser 11 and the second semiconductor laser 12, as shown in Figs. 5 and 6 showing different directions of the back surfaces of the optical head device 1, the optical housing 10 is located at different sides. The sub-substrate 16 is connected to each terminal of the first semiconductor laser 11 and each terminal of the second semiconductor laser 12, respectively.

In this way, the photodetector 13 and the front monitor diode 15 are provided at a predetermined position of the optical head device 1. In addition, the laser drive IC 14 of the optical head device 1 of FIG. It is provided in the predetermined angle of the back surface of the optical head apparatus 1 like the partial perspective view which shows the back surface of a predetermined site | part.

The sub board | substrate 16 is comprised from the multilayer board in which the wiring pattern is formed in both surfaces. The sub board | substrate 16 is a copper foil conductive pattern on both surfaces of the base film which consists of resin films, such as polyimide, respectively. The cover film which consists of resin films, such as a polyimide, is coat | covered, except for the solderable land area | region of each conductive pattern of front and back.

Each laser connection area 16a and 16b connected to the first semiconductor laser 11 and the second semiconductor laser 12, respectively, is provided at each end of the sub substrate 16. Each laser connection area is provided. In the middle of (16a) and (16b), a relay region (16c) for connecting to the flexible wiring board (5) is formed.

Wiring patterns are formed on the front and back of the sub-substrate 16, respectively. As shown in FIG. 6, the relay area 16c is formed on the front surface of the sub-substrate 16. As shown in FIG. ), And the grand line 17 is formed as an effective pattern connected to the flexible wiring board 5. The grand line 17 is common to the first semiconductor laser 11 and the second semiconductor laser 12. It is made.

On the other hand, hot side lines 18 and 19 are formed on the rear surface of the sub substrate 16 as an effective pattern connected to the flexible wiring board 5 via the relay region 16c as shown in FIG. The hot side lines 18 and 19 are provided independently of the first semiconductor laser 11 and the second semiconductor laser 12, respectively.

Each land of the relay region 16c to be soldered with the flexible wiring board 5 is formed only on the front surface of the sub-substrate 16, and the hot side line 18 formed on the rear surface of the sub-substrate 16 and 19 and each through-hole structure are electrically connected to the corresponding lands.

The first semiconductor laser 11 and the second semiconductor laser 12 are each composed of a laser diode. The hot side lines 18 and 19 of the sub substrate 16 are respectively the first semiconductor laser 11. And the anode of the laser diode of the second semiconductor laser 12. The grand line 17 of the sub-substrate 16 includes the first semiconductor laser 11 and the second semiconductor laser 12. Is connected to the cathode of the laser diode. In this way, a driving pulse for driving the first semiconductor laser 11 and the second semiconductor laser 12, respectively, is supplied via the sub substrate 16.

In this case, since the grand lines 17 and the hot side lines 18 and 19 of the first semiconductor laser 11 and the second semiconductor laser 12 are formed separately on the front and back of the sub substrate 16, Even when the width of the sub-substrate 16 is set narrow from the relationship of the layout space, the wiring patterns of the grand line 17 and the hot side lines 18 and 19 can be made to have a thickness capable of securing a necessary capacity. ．

The sub-substrate 16 is mounted along the rear surface of the outer shape of the optical housing 10, and the front surface on which the grand line 17 of the sub-substrate 16 is formed is disposed outside. By this, the hot side lines 18 and 19 are interposed between the grand line 17 and the optical housing 10, and a shielding effect can be obtained by the grand line 17. Therefore, the generation of noise radiated by the driving pulses of the first semiconductor laser 11 and the second semiconductor laser 12 supplied to the hot side lines 18 and 19 is reduced.

Since the wiring member of the head device according to the present invention has a structure in which a sub-substrate separate from the flexible wiring board is connected to the semiconductor laser, the distance for extending the flexible wiring board into a branched shape by the portion connected to the semiconductor laser is long. It can avoid the loss. Moreover, the layout space for drawing out the flexible wiring board can be reduced, and the layout design can be prevented from being complicated. Furthermore, when manufacturing the flexible wiring board, it can be taken from the rectangular mold. We can increase the number of sheets which there is and can hold down manufacturing costs.

In addition, since the grand line and the hot side line of the semiconductor laser are formed separately on the front and back of the sub substrate, the wiring pattern of the grand line and the hot side line of the semiconductor laser is thick even when the width of the sub substrate is narrowed from the wiring to the optical head device. It can be secured. Therefore, the inductance component of the wiring pattern which greatly influences the driving pulse of the semiconductor laser can be reduced, and the generation of the driving pulse of the semiconductor laser can be speeded up. Moreover, the plating thickness of the wiring pattern of the ground line and the hot side line can be mutually reduced. It is possible to do it differently, and it is possible to design with a high degree of freedom such as changing the capacitance component of the wiring pattern.

Further, when mounting the flexible wiring board to the optical head device by making the sub board conform to the external shape of the optical housing, the wiring pattern of the hot side line of the semiconductor laser is arranged by placing the side where the wiring pattern of the grand line of the sub board is formed outside. The generation of noise interposed between the wiring pattern of the grand line and the optical housing and radiated by the driving pulse of the semiconductor laser supplied to the hot side line can be reduced.

Moreover, when applied to the optical head apparatus provided with the 1st semiconductor laser and the 2nd semiconductor laser which respectively emit the laser beam suitable for a different signal recording medium, respectively, in a sub-substrate to a 1st semiconductor laser and a 2nd semiconductor laser, respectively. By forming a relay region connected with the flexible wiring board between each connected laser connection region, the pattern of each hot side line and the wiring pattern of each grand line of the first semiconductor laser and the second semiconductor laser are separated in the width direction of the sub substrate. Therefore, there is no need to form each wiring pattern of the first semiconductor laser and the second semiconductor laser, and there is an advantage that the width of each wiring pattern can be widely taken.

Claims (3)

In the wiring member of an optical head device, an optical head device used for signal reading or signal writing of a signal recording medium, and a circuit board provided on the main body of the device on which the optical head device is mounted are connected by a flexible wiring board. A sub board connected to the semiconductor laser mounted on the optical head device is provided on the flexible wiring board, The sub-substrate is composed of a double-sided substrate, and divided into its front and back, the gland line and the hot side line is formed, the wiring member of the optical head device. The method of claim 1, The sub-substrate is configured to be mounted in accordance with the external shape of the optical housing into which the optical element of the optical head device is incorporated, and to be disposed with the surface on which the grand line of the sub substrate is formed outward. ． The method of claim 1, The sub-substrate has first and second laser connection regions respectively connected to a first semiconductor laser and a second semiconductor laser that emit laser light suitable for different signal recording media, respectively, wherein the first and second And a relay region connected to the flexible wiring board between second laser connection regions.

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