200534267 九、發明說明： 【發明所屬之技術領域】 本發明為有關讀取信號記錄媒體的信號或者寫入信號 用的光學頭裝置，以及使用可撓性配線基板連接著搭載有 光學頭裝置的機器本體上設置的電路基板的光學頭裝置配 夂構件知'別是有關在可撓性配線基板上設置連接著半導 體雷射器的辅助基板的光學頭裝置配線構件。 【先前技術】 使用從光學頭裝置（optica〗 head device)中射出的雷 光學方式對光碟㈣號記_體進行讀取信號或者 舄入信號的光學記錄再生機是已知的。 在這樣的光學記錄再生機器中，_般光學頭裝置設 成能夠在橫切信號記錄媒體的信號執道（si㈣她_方 向^:=可撓性配線基板（flexible widng b〇ard)連接 :子頭破置和搭載此光學頭裝置的機器本體上設置的電 ;板^得❹此可祕轉基板，在上述光學頭裝置 和上述電路基板之間發送或接受電信號。 比如’在日本特開2G〇3_228866號公報中公 = = = :=樣的光學頭裝置和機器本體的電路基板 逆接的九予碩襄置的配線構件。 在光學頭裳置上搭載電氣構件的情 =基板上的光學頭裝置相連接部分的預定位置 =重電氣構件的電路圖案或與組裝成光學頭裝置的^ 目迷接的電路圖案。在各個電路圖案上分別通過錫二 3]6422 200534267 連接著I氣構件的各端。 在光學頭署+ 接你士 、 合載有構成光源的半導俨平J+ 口。 接收由信號記錄媒體反射牛W雷射裔、 體雷射器用的驅動g : 、先私測态和驅動半導 ic)。進而為了保掊π A帝、旦、旦电路（雷射器驅動 或為了將半導體φ 免谷、電阻， 要捉恭# / 田射叩的射出光量保持在預定的強戶，f 要搭载接党從半導體雷 、疋的強度，遇 /frnnf · 口射出雷射的丽監控_栖舻 •咖m〇nit〇rdi〇de)等電氣構件。正 ^月豆 2_-33咖號公報_所相，在可 ^寺開 著光學頭穿晉卹八锐性配線基板上在沿 子貝衣置部分的預定位 [發明要解決之課題] 接者^構件。 到光頭^置上搭载的各種電氣構件的位置’要考产 到先學頭裝置的外形、光學要考慮 闕係，式古Φ 土 —置^及各種^氣構件的連接 攄#與涵壯逆 仇1王配、、果基板芩曲來設定。由於根 據先學頭裝置的外形不同而 田万、根 配線基板上設置夂個兩气禮“又限制’使得在可撓性 支的複雜形狀吼構件的設置部位成為呈樹枝樣分 的t4:DTCD的信號記錄再生相對應的光學頭裝置200534267 IX. Description of the invention: [Technical field to which the invention belongs] The present invention relates to an optical head device for reading or writing signals from a signal recording medium, and a device equipped with an optical head device connected by a flexible wiring board. The optical head device distribution member of a circuit board provided on the main body is known as an optical head device wiring member provided with a flexible wiring board and an auxiliary substrate connected to a semiconductor laser. [Prior Art] An optical recording / reproducing machine that reads signals or inserts signals from an optical disc using a mine optically emitted from an optical head device is known. In such an optical recording / reproducing device, a general optical head device is provided so as to be able to be connected to a signal of a signal recording medium (si㈣she_direction ^: = flexible wiring board (flexible wiring board)): The head is broken and the electricity provided on the body of the machine equipped with the optical head device; the board can obtain the secretable substrate, and send or receive electrical signals between the optical head device and the circuit substrate. 2G〇3_228866 No. 2 = = =: == the optical head device and the circuit board of the machine body are connected in reverse to Jiu Shuoxiang's wiring member. When the optical head is mounted with electrical components = optical head on the substrate Predetermined position of the connection part of the device = circuit pattern of heavy electrical components or circuit pattern connected to the ^ head assembled into an optical head device. Each circuit pattern is connected to each of the gas components through tin 2 3642642 200534267. End. At the optical head + connected to your driver, the semi-conducting leveling J + port for the light source is incorporated. Receives the signal reflected from the signal recording medium, the driver for the laser, the driver for the body laser: drive Semiconducting ic). Furthermore, in order to protect the πA di, denier, and denier circuits (laser drive or to protect the semiconductor φ from valleys and resistors, it is necessary to catch Christine # / 田 射 恭 's output light quantity to a predetermined strong household. From the intensity of semiconductor mines and radon, meet the / frnnf · mouth shot laser monitor _ 舻 舻 • coffee mónitordóde) and other electrical components. Zheng ^ Yuedou 2_-33 Café No. _ So, the pre-position of the part along the zibei clothing on the eight-sharp wiring board with an optical head in Keji Temple [The problem to be solved by the invention] ^ Building. To the position of various electrical components mounted on the bald head, it is necessary to consider the appearance and optics of the first head device, and the system must be considered. The ancient Φ earth-set ^ and the connection of various air components 摅 # 与 涵 壮 逆Qiu 1 Wang matches, and the fruit substrate curls to set. Due to the difference in appearance of the Pioneer device, Tian Wan and Root wiring boards are equipped with a two-manifold "restriction", which makes t4: DTCD a branch-like structure at the location of the flexible branched complex shaped roar member. Optical head device corresponding to signal recording and reproduction
Of月况下，一般對D V σ ^ ^ 射器，DVD用主、曾挪 置專用的半導體雷 + ¥ "豆雷射斋和CD用半導體雷射哭 光學配置的關係看，經常配置在盥 °。攸/、 位置。 *、，二吊配且在與先學頭裝置彼此分離的 因此，為了連接DVD用半導體雷射器和⑶ 替射器，要將可撓性配線基板呈樹枝狀展開很長的距离 ^ 3]6422 6 200534267 1此^時，有必要確㈣來弓丨出可換性配線基板的 間，使得配置的設計複雜化。由一 置二 總體配線變得很困難。 Α &配、’泉基板貫現 當可撓性配線基板的形狀變得複雜 配:基板時，從矩形的模具中取出的件數就= 本的問題。而由於配置半導體雷射器的位置和作 性配線基板傳送到半導體雷射器的通道樹技 …:限制，就不能確保半導體雷射器的 的配線圖案線條粗大而成為問題。 …彳則踝 【發明内容】 (解決課題之手段） 本發明乃將連接於搭載在光學裳 <牛¥體雷射器 之辅助基板（sub board)設置於可撓性配線基板，將該輔助 基板由兩面基板構成，而分別在該輔助基板之表面與背面 形成接地線（ground line)與熱側線（h〇t side Hne)。由此作成 與:撓性配線基板為另外別體之輔助基板連接於半導體 雷射器之構成，由此以在光學頭裝置配線之關係即使輔旦: 基板之寬度狹小，仍可確保半導體雷射器之接地線與熱側 線之配線圖樣之粗大寬度。 本發明的目的在於提供一種光學頭裝置的配線構件。 該配線構件由可撓性配線基板連接著用來讀取信號記錄媒 肢的k唬或寫入信號的光學頭裝置和在搭載該光學頭裝置 的機器本體上設置的電路基板，與在光學頭裝置上搭載的 半導體雷射器相連接的輔助基板設置在上述柔性配線基板 316422 7 200534267 在其表面和背面上分 上，上述輔助基板由兩面基板構成 別形成地線和高壓侧線。 本發明的另一方面提供一種光學頭裝置的配線構件， -士所相光學頭裝置的配線部件卜上述辅助基板 裝有光學頭裝置的光學元件的光學殼體的外形安裝，並且 有將形成輔助基板地線的面配置在表面側的結構。-、…本發明還提供一種光學頭裝置的配線構件，在所 鲁光子，置的配線構件中，上述輔助基板包括第—和第二 二射裔連接區，所述第—和第二雷射器連接區分別連接著 刀別發出與不同信號記錄媒體相適合的雷射的第一 雷射器和第二半導體雷射器，在上述的第一和第二雷身^ 連接區之間，包括與上述柔性配線基板相連接的中繼區。 本發明在可撓性配線基板上設置辅助基板，該輔助基 反連接搭载在光學頭裝置的半導體雷射器，由兩面基板構 、此輔助基板’在辅助基板的表面和背面分別形成地線和 籲^則線。由此得到的可撓性配線基板，其結構使半導體雷 射與分綠的輔助基板相連接，從在光學頭裝置上配線的 關，看，即使輔助基板的寬度變窄，也能夠確保半導體雷 射器的地線和高壓侧線的配線圖案很粗。 (發明之效果） 本發明的光學頭裝置，由於其結構是將與可挽性配線 基，另外分別的輔助基板連接於半導體雷射器，就能夠避 免攸連接半‘體雷射裔的部分向可接性配線基板仲出的樹 技狀的距離變長。還能夠減小用來引出可换性配線基板的 316422 8 200534267 雜化。再有，在製造可 具中取出的件數增多， 配置空間，可以防止使配置設計複 撓性配線基板時，能夠從矩形的模 能夠降低製造成本。 由於在輔助基板的表面和背面分 崎，從在弁風筛壯乂成接地線和熱側 泉攸在先子碩裝置上的配線關係I， 度很窄，也能夠確保半導邱補助基板的見 ,^ 保牛^肢雷射裔的接地線和埶例缚的配 線圖案之寬度粗大，，削減 ：…、側、.表的配Of the month, generally speaking, the relationship between DV σ ^ ^ transmitters, DVD semiconductor masters, and semiconductor semiconductor lasers that have been moved + ¥ " Bean Laser Radio and CD semiconductor laser optical configuration, often deployed in the bathroom °. You /, location. *, The two hanging devices are separated from the first-student device. Therefore, in order to connect the semiconductor laser for DVD and the ⑶ replacer, the flexible wiring board must be extended in a tree shape for a long distance ^ 3] 6422 6 200534267 1 At this time, it is necessary to determine the space between the interchangeable wiring substrates, which complicates the design of the configuration. From one to two, overall wiring becomes difficult. Α & distribution, spring substrates are realized. When the shape of the flexible wiring substrate becomes complicated, the number of pieces taken out from a rectangular mold when the substrates are assembled = the problem of cost. And because of the location of the semiconductor laser and the channel tree technology of the active wiring substrate to the semiconductor laser…: restrictions, it is not possible to ensure that the wiring pattern of the semiconductor laser is thick and becomes a problem. … Ze Ankle [Content of the Invention] (Means to Solve the Problem) The present invention is to provide a sub board connected to an optical skirt < cattle body laser on a flexible wiring board, The substrate is composed of two-sided substrates, and ground lines and hot side lines are formed on the front and back surfaces of the auxiliary substrate, respectively. This makes it possible for the flexible wiring board to be a separate auxiliary board connected to the semiconductor laser, so that the relationship between the optical head device wiring can be ensured even if the auxiliary board is narrow: the semiconductor laser can still be secured. The width of the wiring pattern of the ground wire and hot side wire of the device. An object of the present invention is to provide a wiring member of an optical head device. The wiring member is connected by a flexible wiring board to an optical head device for reading signals from a signal recording medium limb, and a circuit board provided on a machine body equipped with the optical head device. An auxiliary substrate connected to the semiconductor laser mounted on the device is provided on the flexible wiring substrate 316422 7 200534267 on the front and back surfaces. The auxiliary substrate is composed of two-sided substrates to form a ground line and a high-voltage side line. According to another aspect of the present invention, there is provided a wiring member of an optical head device, the wiring member of the optical head device of the phase of the taxi, and the above-mentioned auxiliary substrate is provided with an external shape of the optical housing of the optical element of the optical head device, A structure in which the surface of the substrate ground is arranged on the front side. -... The present invention also provides a wiring member of an optical head device. In the wiring member provided by the Solutron, the auxiliary substrate includes first and second connection regions, the first and second lasers. The device connection area is respectively connected to the first laser device and the second semiconductor laser device that emit lasers suitable for different signal recording media. Between the above-mentioned first and second laser body connection areas, including A relay area connected to the flexible wiring substrate. According to the present invention, an auxiliary substrate is provided on a flexible wiring substrate. The auxiliary base is connected to a semiconductor laser mounted on an optical head device in reverse. The auxiliary substrate is composed of a two-sided substrate. Call ^ Ze line. The flexible wiring substrate thus obtained has a structure in which the semiconductor laser is connected to a green auxiliary substrate. From the point of wiring on the optical head device, even if the width of the auxiliary substrate is narrowed, the semiconductor laser can be ensured. The wiring pattern of the ground and high-voltage side wires of the radiator is very thick. (Effects of the Invention) Since the optical head device of the present invention is structured to connect the removable wiring substrate and a separate auxiliary substrate to the semiconductor laser, it is possible to avoid the partial connection of the semi-body laser. The tree-like distance in which the accessibility wiring substrate emerges becomes longer. It is also possible to reduce the 316422 8 200534267 hybrid used to lead the interchangeable wiring substrate. In addition, the number of parts to be taken out during manufacturing can be increased, and the layout space can be prevented. When a flexible wiring board is arranged in the layout design, a rectangular mold can be prevented, and the manufacturing cost can be reduced. Because the auxiliary substrate is divided on the front and back, the wiring relationship between the ground wire and the hot side spring Yoshiko's device on the auxiliary screen is very narrow, and it can also ensure the semi-conductor auxiliary substrate. See, ^ Bao Niu ^ limb laser descendant's ground wire and the wiring pattern of the wiring pattern are thick, reduce:…, side,.
rr I古作I旦于半¥月豆雷射器的驅動 脈衝有很大4的配線圖5 射器驅動脈衝上升高诘仆。、隹品拉L 熹求丰¥耝运 μ p 、 妾地線和熱側線配線圖案 的鍍層晷度可以不同，而使改變 由度的設計成為可能。 里成伤的南自 輔助基板形成的可撓 由於形成輔助基板的 所以半導體雷射器熱 案與光學殼體之間， 導體雷射器的驅動脈 再者，在光學殼體的外形上添加 性配線基板安裝在光學頭裝置上時， 接地線的配線周案的面配置在表面， 側線的配線圖案夾在接地線的配線圖 _這就能夠降低由於向熱侧線供給的半 衝而產生輻射所造成之雜訊。 在適用於具備向不同信號記錄媒體發出各自適合之雷 射，的，-半導體雷射器和第二半導體雷射器的光學頭裝 置k藉由在輔助基板上的第一半導體雷射器和第二半導 體雷射器分別連接的各雷射器連接區之間，形成與可撓性 ，線基板相連接的中繼區，即無需將第—半導體雷射器和 半導體雷射器的各個熱側線圖案及各接地線之配線圖 水向輔助基板之莧度方向分離而形成第一半導體雷射器和 3)6422 9 200534267 第二半導體雷射器的 寬度取得更寬的優點H Μ㈣各配線圓案的 【實施方式】 貫施例 1圖是表示本發明的光學頭裝置的配線部件-個實 展:1斜視圖’第2圖是表示在第1圖所示的光學頭 衣置的配線構件適用於光碟裝置的—個例子的斜視圖。、 和置1藉由螺杆3和導向轴4,能夠在與爾 上的光號記錄再生相對應的轉盤) 上的=圖中未顯示)的信號執道相橫切的方向上移動。 !的移5❹學頭裝置1上面向光學頭裝置 ^ ^ 祝性配線基板5在光學頭裝置工 的；度方向上折回，並夾持住光 配線基板5上電接點的接插件6，、車貝^且1。構成可撓性 μ 仵連接著設置在機哭本俨 上的電路基板7,形成連接此電 1本肢 •的電信號通路。 电路基板7和先學頭裝置！ 在光學頭裝置1上使用了梦Α —、土 t 上的各種電氣組件。作為這樣的電:氣组：載，光學殼體 構成適合於DVD和CD各種光碟二：二轉出：別 半導體雷射器11和第二半導體雷射哭'2 :二光源的弟-⑶各個光碟反射的雷射的光檢測器八叉由_和 導體雷射器11和第二半導體雷射 ：另驅動弟-半 體積體電路（雷射器驅動IC) 14:1的"射器驅動半導 圈、電容、電阻（圖中未顯示)，或電路參數的線 或用來保持半導體雷射器 31649? 10 200534267 的射出光量為預定強度的，接受從第一半導體雷射器u 或第一半導體雷射器12射出的雷射的（front monitor diode) 月ί)監控二極體15。在可撓性配線基板5上連接或設置這些 電氣組件。 如在第3圖上所示，第一半導體雷射器u和第二半導 體雷射器12連接著配置在柔性配線基板5上的分離的輔助 基板16上，經由此輔助基板16間接地設置在柔性配線基 ，2。在此情況下，輔助基板16的各個端部成為分別連接 著第-半導體雷射器11和第二半導體雷射器12的各雷射 器連接區16a、16b，輔助基板16的各雷射器連接區丨 16b的中間’成為與可撓性配線基才反5相連接的中、繼區l 另外’在可撓性配線基板5上設置安裝雷射器驅動 1C 14的第一 助基板】7。此第二輔助基板Η重疊地配置 在可撓性喊絲5的預定位置，介由料連接在可換性 口上輔助基板Π構成兩面基板，在其表面 (則表面）設置雷射器驅動咖，在其背面形成與可 配線基板5相連接的各連接焊盤（land)，以及橫:哭 驅動1C的配線圖案。 田射口口 第4圖表示包括輔助基柘 的外形形狀。根據光學頭裝置〗：：=性配線基板5 凸起，虛線部分是折疊凹人，在光$ ’ Λ線部分是折疊 上設定連接或設置各種電氣組装置 =和第？分別表示從不同方向 4置1月面，弟一半導體雷射 J九子頭 n和第二半導體雷射器 200534267 、刀安衣在光學设體〗0的不同側邊。輔助基板16分別 連接著第一半導體雷射器u的各接線端子和第二半 雷射器12的各接線端子。 、且 狀如此，光檢測器13和前監控二極體15設置在光學頭 $的預定位置。雷射器驅動Ici4，如在第7圖的表示 光=頭裝置丨的預定部位背面的斜視圖所示，設置在光學 頭I置1背面的預定角落中。 :助基板16由在兩面上形成配線圖案的多層基板構 助基板16，在㈣亞賴脂卿成的基膜 ==導電圖案，除了能夠錫焊表面和背面的各4 =的區域以外’都被由聚酿亞胺等樹脂膜形成的覆蓋膜 弟—¥體雷射11 12的各雷射ϋ連接區16a和 。在各雷射器連接區16a和⑽的中間 配線基板5相連接的中繼區16c。 锐注 如…圖和第9圖中所示’在輔助基板 月面，分別形成配線圖案。如在 面矛 板】6的表面(前表面)上，4二二在輔助基 ^ 、、、工過中繼區1 6c形成了作盔你 可撓性配線基板5相連接mu @ & /珉了作為與 對於第-半導體雷射;Γ:二案r線一 另 牙 + ¥體雷射器是同用的。 過中#「弟9圖中所示，在輔助基板16之背面，經 二中:=形成了作為連接著可換性配線基 效 0木的熱側線18和19。此熱側線18和19對於第—半導 J2 >16422 200534267 體雷射器11和第二半導體命 、 田射态12疋分別獨立机罟6 與可撓性配線基板5焊接 。又勺。 r 1〇 , X 7〒▲& 1 6c的各個焊盤 nd )，只在輔助基板丨6 輔助美姑7衣面（刖表面）上形成，在 輔助基板16的背面上形成 你 έ士拔办m广 …、1則、、展1 8和1 9分別通過穿孔 第一半導體雷射器1丨和第-车 雷射二極體構成。輔繼〗：一射器12分別由 ^卜 補力基板16的熱侧線1 8和19分Μ、鱼ϋ 著第一半導體帝射哭"Μ 4 ^ b刀別連接 托触e °° 1和弟二半導體雷射器12的雷射二 極脰的陽極。輔助其j Α 、一 fn 基板16的接地線20,連接著第-半導 月立雷射态11和第二半導齅+ 卞守 搞。 … 、a田射為12的雷射二極體的陰 °由此’經過辅助基板1 哭 刀別供給驅動第一半導體雷射 σο #弟一+ V體雷射器12的驅動脈衝。 成第丰由衣在輔助基板16的表面和背面分開形 2-丰導體雷射器η和第二半導體雷射器12各自的接 地、、表20和熱側線18 # # ^ ^ , 口此即使在由於配置空間的關 加使传辅助基板16的宽产芎宏尸彡 地線20和卿泉18, t…乍的情況下，也能夠將 ”、、惻'、泉18和19的配線圖案制得比較粗大，可以 崔保其必要的容量。 八輔助基板16安裝得與光學殼體1〇外形的背面相配 此％，將形成辅助基板1 6的接地線20的表面（前表 7Π配置在表面側。由此，熱侧線18和19就介於接地線 二和光學殼體10之間，能夠由接地線得到封閉的效果。 ^而減少了^於供給熱侧線1 8和19的第-半導體雷射器 上半V肢g射為12的驅動脈衝而產生輕射所造成 316422 13 200534267 的雜訊。 【圖式簡單說明】 〜第1圖是表示涉及本發明的光學料置配線部件一個 貫施例的展開斜視圖； 邻件：圖^表示如在第1圖中所示的光學頭裝置的配線 邻件適用於光碟裝置一個例子的斜视圖； μ第31是說明在錢配線基板5上設置輔助基板16 的斜視圖； 折-二=表示柔性配線基板5的外形的同_，還說明 听$方法的平面圖。 射器是說明在第—半導體雷射器11和第二半導體雷 、接者輔助基板16狀態，從光學頭裳置" 面硯祭的斜視圖； 射哭7圖是說明在第—半導體雷射器U和第二半導體雷 :。上連接者輔助基板16狀態，從光學頭裝置 面硯察的斜視圖；月 第7圖是表示說明雷射器驅動ich的設置狀態的光學 破，1的背面預定部位的部分斜視圖； 第/圖是說明輔助基板〗6表面喊的平面圖； 第9圖是5兒明輔助基板]6背面配線的平面圖。 【主要元件符號說明】 可撓性配線基板 第一半導體雷射器 1 光學頭裝置 10 光學殼體 12 第二半導體雷射器 3]6422 200534267 16 輔助基板 接地線 18、19熱側線 20rr I ancient work I once in half ¥ moon bean laser drive pulse has a large 4 wiring diagram Figure 5 The drive pulse of the transmitter is raised.隹, 隹 品 拉 熹 熹 求 丰 ¥ 耝 μ μ, The grounding and hot-side wire wiring patterns can have different plating degrees, making it possible to change the design of the degree of freedom. The flexible substrate formed by the auxiliary substrate is formed between the thermal case of the semiconductor laser and the optical housing due to the auxiliary substrate. The driving pulse of the conductive laser is added to the shape of the optical housing. When the wiring board is mounted on the optical head device, the wiring surface of the ground wire is arranged on the surface, and the wiring pattern of the side wire is sandwiched between the ground wire and the wiring pattern. This can reduce the radiation generated by the half punch supplied to the hot side wire. Noise caused. In the optical head device having a semiconductor laser and a second semiconductor laser, which are suitable for emitting laser signals to different signal recording media, the first semiconductor laser and the first semiconductor laser on the auxiliary substrate are used. The two semiconductor lasers are connected to the laser connecting area to form a relay zone connected to the flexible, wire substrate, that is, it is not necessary to connect the first semiconductor laser and each hot-side line of the semiconductor laser. The pattern and the wiring diagram of each ground wire are separated from each other in the direction of the auxiliary substrate to form the first semiconductor laser and 3) 6422 9 200534267 The width of the second semiconductor laser has a wider advantage. [Embodiment] FIG. 1 of the first embodiment is a wiring member showing the optical head device of the present invention-a real exhibition: 1 oblique view 'The second figure shows the application of the wiring member of the optical head garment shown in FIG. 1 An oblique view of an example for an optical disc device. With the screw 3 and the guide shaft 4, the and set 1 can move in the direction transverse to the signal direction on the turntable () = (not shown in the figure) corresponding to the above-mentioned optical number recording and reproduction. ! 'S movement 5❹The head unit 1 faces the optical head unit ^ ^ The wishing wiring substrate 5 is made in the optical head unit; folded back in the direction, and clamps the connector 6 of the electrical contact on the optical wiring substrate 5, Car shell ^^ 1. The flexible μ 仵 is connected to the circuit board 7 provided on the device ,, and forms an electrical signal path connecting the electric body 1 •. Circuit board 7 and learn head device! The optical head device 1 uses various electric components on the dream A, t. As such electricity: gas group: carrier, optical housing composition suitable for various discs of DVD and CD II: II turn out: Do not semiconductor laser 11 and second semiconductor laser cry '2: brother of two light sources-⑶ each The photodetector octopus of the laser reflected by the optical disc is driven by _ and the conductor laser 11 and the second semiconductor laser: another driver-semi-volume body circuit (laser driver IC) 14: 1 " emitter driver A semiconducting coil, a capacitor, a resistor (not shown in the figure), or a line of a circuit parameter is used to maintain a semiconductor laser 31649? 10 200534267 with a predetermined light intensity, and the first semiconductor laser u or the first A front monitor diode emitted by a semiconductor laser 12 monitors the diode 15. These electrical components are connected or provided on the flexible wiring board 5. As shown in FIG. 3, the first semiconductor laser u and the second semiconductor laser 12 are connected to a separate auxiliary substrate 16 disposed on the flexible wiring substrate 5, and are indirectly provided via the auxiliary substrate 16. Flexible wiring base, 2. In this case, each end portion of the auxiliary substrate 16 becomes each of the laser connection regions 16 a and 16 b connecting the first semiconductor laser 11 and the second semiconductor laser 12, and each laser of the auxiliary substrate 16. The middle of the connection area 16b becomes the intermediate and relay area 1 connected to the flexible wiring substrate 5 and also the first auxiliary substrate on which the laser driver 1C 14 is installed on the flexible wiring substrate 5] 7 . This second auxiliary substrate Η is superimposed and arranged at a predetermined position of the flexible yoke wire 5, and the auxiliary substrate Π is connected to the interchangeable port through a material to form a two-sided substrate. On each back surface, each connection land (land) connected to the wiringable substrate 5 is formed, and a horizontal: 1C wiring pattern is formed.田 射 口 口 Figure 4 shows the external shape including the auxiliary base. According to the optical head device :: = sex wiring substrate 5 is raised, the dotted line is folded and recessed, and the light $ ’Λ line is folded. Set the connection or set various electrical group devices = and the first? It is shown that the January surface is set from different directions, the first semiconductor laser J Jiuzitou n and the second semiconductor laser 200534267, and the knife anyi are on different sides of the optical device. The auxiliary substrate 16 is connected to each terminal of the first semiconductor laser u and each terminal of the second half laser 12 respectively. As such, the photodetector 13 and the front monitoring diode 15 are disposed at predetermined positions of the optical head $. The laser drive Ici4 is provided in a predetermined corner of the back of the optical head I as shown in the oblique view of the back of the predetermined portion showing the optical = head device. : The auxiliary substrate 16 is composed of a multi-layered substrate on which wiring patterns are formed on both sides. The auxiliary substrate 16 is formed on a base film of == conductive pattern, except for areas where each of the surface and the back surface can be soldered. Each of the laser ridge connection regions 16a and ¥, which is a cover film formed by a resin film such as polyimide, is a body laser 11-12. A relay area 16c connected to the intermediate wiring board 5 between each laser connection area 16a and ⑽. Sharp note As shown in Figures ... and Figure 9 ', wiring patterns are formed on the auxiliary substrate moon surface, respectively. For example, on the surface (front surface) of the surface spear board] 6, two two two formed a helmet on the auxiliary base ^ ,,, and the relay zone 1 6c. You can connect the flexible wiring substrate 5 to the mu @ & / It is used in the same way as for the -semiconductor laser; Γ: two cases r line one other tooth + ¥ body laser. Pass ## As shown in the figure, on the back of the auxiliary substrate 16, the second middle: = Hot-side wires 18 and 19 are formed to connect the interchangeable wiring base. The hot-side wires 18 and 19 are The first semiconducting J2 > 16422 200534267 body laser 11 and the second semiconductor, field shot state 12 (independent machine 6) are soldered to the flexible wiring board 5. Also scoop. R 1〇, X 7〒 ▲ & 1 6c each pad nd), is formed only on the auxiliary substrate 丨 6 auxiliary Meigu 7 clothing surface (） surface), on the back of the auxiliary substrate 16 to form your hand……, 1, The exhibitions 18 and 19 are respectively formed by perforating the first semiconductor laser 1 and the first-vehicle laser diode. Auxiliary: The first emitter 12 is composed of the hot-side wire 1 of the substrate 16 At 8 and 19 minutes, the fish is crying with the first semiconductor emperor " M 4 ^ b. Do not connect the anode of the laser diode 2 of the support contact e °° 1 and the second semiconductor laser 12. Aid its j Α, the ground line 20 of a fn substrate 16 is connected to the -semiconductor moon state 11 and the second semiconductor 齅 + 卞 Shou.…, A field of 12 of the laser diode From this Pass the auxiliary substrate 1 and do not supply the driving pulse for driving the first semiconductor laser σο # 弟 一 + V body laser 12. Cheng Difeng Youyi separates the 2-feng conductor laser on the front and back of the auxiliary substrate 16 η and the second semiconductor laser 12 are grounded, the table 20, and the hot-side line 18 # # ^ ^, even if the width of the auxiliary substrate 16 is widened due to the increase in the configuration space, the macroscopic ground line 20 In the case of He Qingquan 18, t ... At first glance, the wiring patterns of ",, 恻 ', Quan 18 and 19 can be made relatively thick, and Cui Bao can have the necessary capacity. The eight auxiliary substrates 16 are installed so as to match the rear surface of the optical housing 10, and the surface of the ground line 20 forming the auxiliary substrate 16 (the front table 7Π is arranged on the surface side. Thus, the hot-side lines 18 and 19 are Between the ground wire 2 and the optical housing 10, the sealing effect can be obtained by the ground wire. ^ And reduced ^ The upper half of the V-th limb of the semiconductor laser that supplies the hot-side wires 18 and 19 is shot as Noise caused by light emission caused by driving pulse of 12 is 316422 13 200534267. [Brief description of the drawings] ~ FIG. 1 is a developed oblique view showing an embodiment of the optical material wiring member related to the present invention; adjacent parts: Figure ^ shows a perspective view of an example in which the wiring head of the optical head device is suitable for an optical disk device as shown in Figure 1; Figure 31 is a perspective view showing that the auxiliary wiring board 16 is provided on the money wiring board 5; Two = The same as the outline of the flexible wiring board 5, and also describes the plan view of the method of listening. The transmitter is to explain the state of the first semiconductor laser 11 and the second semiconductor laser and receiver auxiliary substrate 16, from the optical head Set " oblique view of noodle burner; She Cry 7 It is an oblique view illustrating the state of the first semiconductor laser U and the second semiconductor laser: The connector auxiliary substrate 16 is viewed from the optical head device surface; FIG. 7 is a diagram illustrating the setting of the laser driver ich The state of the optical break, a partial oblique view of the predetermined portion of the back of the 1; Figure / Figure is a plan view illustrating the auxiliary substrate [6]; Figure 9 is a plan view of the 5 wiring of the auxiliary substrate [6]. ] Flexible wiring board First semiconductor laser 1 Optical head device 10 Optical housing 12 Second semiconductor laser 3] 6422 200534267 16 Auxiliary substrate ground wire 18, 19 Hot-side wire 20
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