CN107179584B - Optical conenctor - Google Patents
Optical conenctor Download PDFInfo
- Publication number
- CN107179584B CN107179584B CN201610135584.2A CN201610135584A CN107179584B CN 107179584 B CN107179584 B CN 107179584B CN 201610135584 A CN201610135584 A CN 201610135584A CN 107179584 B CN107179584 B CN 107179584B
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- China
- Prior art keywords
- optical
- gap
- reflection face
- light source
- bevel structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000003287 optical effect Effects 0.000 title claims abstract description 295
- 239000000758 substrate Substances 0.000 claims abstract description 49
- 230000011514 reflex Effects 0.000 claims abstract description 3
- 239000002184 metal Substances 0.000 claims description 21
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 20
- 239000013307 optical fiber Substances 0.000 claims description 7
- 229910052710 silicon Inorganic materials 0.000 claims description 7
- 239000010703 silicon Substances 0.000 claims description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000004568 cement Substances 0.000 claims description 4
- 239000004033 plastic Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 229910052573 porcelain Inorganic materials 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 6
- 238000010521 absorption reaction Methods 0.000 description 18
- 239000012535 impurity Substances 0.000 description 18
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 239000000835 fiber Substances 0.000 description 2
- 230000003760 hair shine Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4207—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms with optical elements reducing the sensitivity to optical feedback
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4206—Optical features
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
A kind of optical conenctor includes substrate, multiple optical channels, light source, bevel structure and optical detector.Optical channel is to communicating optical signals.Light source is located on substrate, to emit the first optical signal.Bevel structure has optical reflection face, and the first optical signal to emit light source reflexes at least one in optical channel.Optical detector is located on substrate, to the second optical signal emitted by at least one received from optical channel.Optical reflection face has an at least gap, and optical reflection face is made to be separated out at least two sections by this gap, and divided section is not connected in electrical property each other.Optical conenctor of the invention has effects that low electromagnetic crosstalk and low noise are interfered.
Description
Technical field
The invention relates to a kind of optical conenctors.
Background technique
In general, optical conenctor may include light source and optical fiber.In a kind of optical conenctor of pattern, light source can be straight
Connect the end face to quasi-fiber.Such design, when light source luminescent, the optical transmission direction phase of the light direction and optical fiber of light source
Together, axis light each other.In addition, in the optical conenctor of another pattern, it can be in optical connector designs optical reflection face, light
Source is located at below optical reflection face.Such design, when light source luminescent, the light of light source can be reflexed to light by optical reflection face
In fibre.The light direction of light source and the optical transmission direction of optical fiber are vertical, that is, optical axis is vertical.
However, being more easy to happen in the optical transmission system of multichannel each logical when the frequency of optical transport more develops toward high frequency
The problem of cross-talk (crosstalk) in road.Furthermore it is known that optical conenctor part it is numerous, assembling is complicated, and processing is not
Easily, thus increase encapsulation with the degree of difficulty that couples, be unfavorable for producing.
Summary of the invention
A technical solution of the invention is a kind of optical conenctor.
According to an embodiment of the present invention, a kind of optical conenctor includes substrate, multiple optical channels, light source, bevel structure
With optical detector.Optical channel is to communicating optical signals.Light source is located on substrate, to emit the first optical signal.Bevel structure tool
There is optical reflection face, the first optical signal to emit light source reflexes at least one in optical channel.Optical detector is located at
On substrate, to the second optical signal emitted by at least one received from optical channel.Optical reflection face has an at least gap,
Optical reflection face is set to be separated out at least two sections by this gap, and divided section is not connected in electrical property each other.
In an embodiment of the present invention, optical conenctor also includes upper cover.Bevel structure is located on upper lid.
In an embodiment of the present invention, optical channel is set on lid.
In an embodiment of the present invention, optical reflection face is the inclined-plane that the film containing metal component is formed in bevel structure
On.
In an embodiment of the present invention, the material of bevel structure is metal, and optical reflection face is the oblique of bevel structure
Face.
In an embodiment of the present invention, the length direction of the length direction vertical optical reflecting surface in gap.
In an embodiment of the present invention, the length direction in the parallel optical reflection face of the length direction in gap.
In an embodiment of the present invention, the width in gap is more than or equal to 50 μm.
In an embodiment of the present invention, the quantity in gap is multiple, and the gap is interlaced with each other.
In an embodiment of the present invention, the quantity in gap is multiple, and the sum of the width in the gap is more than or equal to 50 μ
m。
In an embodiment of the present invention, the inclined-plane of bevel structure has an at least fin, and the fin protrudes between this
Gap.
In an embodiment of the present invention, the inclined-plane of bevel structure has an at least groove, and the grooves recess is in this
Gap.
In an embodiment of the present invention, optical channel is optical fiber.
In an embodiment of the present invention, the material of substrate includes silicon, semiconductor, ceramics, resin, plastic cement.
In an embodiment of the present invention, optical conenctor also includes circuit board and driver.Circuit board bearing substrate.It drives
Dynamic device is located on circuit board, and driver is electrically connected light source.
In an embodiment of the present invention, optical conenctor also includes to turn impedance amplifier.Turn impedance amplifier and is located at circuit board
On, and turn impedance amplifier and be electrically connected optical detector.
In an embodiment of the present invention, light source is located at the same edge of substrate with optical detector.
In an embodiment of the present invention, light source is attached most importance to straight cavity surface emitting laser.
In an embodiment of the present invention, the material in optical reflection face includes gold.
In above embodiment of the present invention, since the optical reflection face of optical conenctor is separated out at least 2nd area by gap
Section, therefore wherein the first optical signal of light source can be reflexed to the optical channel of part, and optical reflection by a section in optical reflection face
Second optical signal of another part optical channel can be reflexed to optical detector by another section in face.In this way, work as light source luminescent
When, electromagnetism noise will not be transmitted to for reflecting optical channel by the section for the optical reflection face of the first optical signal of reflection source
The section in the optical reflection face of the second optical signal, and for reflecting the section in the optical reflection face of the second optical signal of optical channel also not
Electromagnetism noise can be transmitted to the section for the optical reflection face of the first optical signal of reflection source.Optical conenctor of the invention
Have effects that low electromagnetic crosstalk and low noise are interfered.
Another technical solution of the invention is a kind of optical conenctor.
According to an embodiment of the present invention, a kind of optical conenctor includes substrate, bevel structure, at least an impurity absorption
Film, multiple optical channels, light source and optical detector.Bevel structure has optical reflection face.Impurity absorption film is located at optical reflection face
On.Optical channel is set on substrate.Light source is located on substrate, to emit the first optical signal reflecting into through optical reflection face
Enter at least one in optical channel.Optical detector is located on substrate, to emitted by at least one received from optical channel, and passes through
Second optical signal of optical reflection face reflection.
In an embodiment of the present invention, metal mirror optical reflection face is that the film containing metal component is formed in inclined-plane
On the inclined-plane of structure.
In an embodiment of the present invention, the film containing metal component be located at impurity absorption film and bevel structure inclined-plane it
Between.
In an embodiment of the present invention, the quantity of impurity absorption film is two, and this two noises absorbing film is located at and contains
On opposite two surfaces of the film of metal component.
In an embodiment of the present invention, the material of bevel structure is metal, and metal mirror optical reflection face is oblique
The inclined-plane of face structure.
In an embodiment of the present invention, light source is located at the same edge of substrate with the optical detector.
In an embodiment of the present invention, the material of impurity absorption film includes the nonmetallic of light-permeable.
In above embodiment of the present invention, since the impurity absorption film of optical conenctor is located on optical reflection face, because
, when light source luminescent, impurity absorption film not only can absorb the noise of light source couples to optical reflection face for this, also can absorb from optics
Reflecting surface is coupled to the noise of optical detector.Optical conenctor of the invention has the function of low electromagnetic crosstalk and the interference of low noise
Effect.
Detailed description of the invention
Fig. 1 is painted the exploded view of optical conenctor according to an embodiment of the present invention;
Fig. 2 is painted the perspective view after the upper cover overturning of Fig. 1;
Fig. 3 A be painted Fig. 1 optical conenctor assembling after along line segment 3-3 sectional view;
Fig. 3 B be painted Fig. 1 optical conenctor assembling after along line segment 4-4 sectional view;
Fig. 4 A is painted sectional view of the optical conenctor close to light source side of another embodiment according to the present invention;
Fig. 4 B is painted sectional view of the optical conenctor close to optical detector side of Fig. 4 A;
Fig. 5 A is painted sectional view of the optical conenctor close to light source side of another embodiment according to the present invention;
Fig. 5 B is painted sectional view of the optical conenctor close to optical detector side of Fig. 5 A;
Fig. 6 is painted the partial enlarged view in the optical reflection face of another embodiment according to the present invention;
Fig. 7 is painted the partial enlarged view in the optical reflection face of another embodiment according to the present invention;
Fig. 8 is painted the partial enlarged view on the inclined-plane of the upper cover of another embodiment and optical reflection face according to the present invention;
Fig. 9 is painted the partial enlarged view on the inclined-plane of the upper cover of another embodiment and optical reflection face according to the present invention;
Figure 10 is painted the perspective view of the upper cover of another embodiment according to the present invention;
Figure 11 is painted sectional view of the upper cover along line segment 10-10 of Figure 10;
Figure 12 is painted another embodiment of the upper cover of Figure 11.
Specific embodiment
Multiple embodiments of the invention will be disclosed with attached drawing below, as clearly stated, the details in many practices
It will be explained in the following description.It should be appreciated, however, that the details in these practices is not applied to limit the present invention.Also
It is to say, in some embodiments of the present invention, the details in these practices is non-essential.In addition, for the sake of simplifying attached drawing, one
A little known usual structures will be painted in a manner of simply illustrating in the accompanying drawings with element.
Fig. 1 is painted the exploded view of optical conenctor 100 according to an embodiment of the present invention.Fig. 2 is painted the upper cover of Fig. 1
Perspective view after 120 overturnings.Simultaneously refering to fig. 1 with Fig. 2, optical conenctor 100 includes substrate 110, upper cover 120, bevel structure
122, multiple optical channels 140, light source 150 and (the Photo Detector of optical detector 160;PD), wherein light source 150 can be one
Electricity is turned the element of light by kind, also can be light to be switched to the element of light, and light can be turned electrically or optically turn by optical detector 160 to be a kind of
The element of light.Optical channel 140 can communicating optical signals.In the present embodiment, bevel structure 122 is located in upper cover 120, and light is logical
Road 140 is set in upper cover 120.Bevel structure 122 has optical reflection face 130.In addition, optical reflection face 130 has at least
One gap 132 makes optical reflection face 130 be separated out at least two sections 134,136 by gap 132.Optical channel 140 is located at substrate
Between 110 and upper cover 120.Light source 150 and optical detector 160 are located on substrate 110, and light source 150 and the equal position of optical detector 160
In the same edge 112 of substrate 110.
Fig. 3 A be painted Fig. 1 optical conenctor 100 assemble after along line segment 3-3 sectional view.Simultaneously refering to Fig. 2 and Fig. 3 A,
After upper cover 120 is assembled in substrate 110, the section 134 in optical reflection face 130 is located at 150 top of light source.That is, optics
The section 134 of reflecting surface 130 is at least partly weighed in the orthographic projection on substrate 110 with orthographic projection of the light source 150 on substrate 110
It is folded.When light source 150 shines, the first optical signal L1 that the section 134 in optical reflection face 130 can emit light source 150 is reflexed to
Partial optical channel 140.Since the optical reflection face 130 of optical conenctor 100 is separated out section 134,136 by gap 132, because
Electromagnetism noise will not be transmitted to section for the section 134 in the optical reflection face 130 of 150 first optical signal L1 of reflection source by this
136.In one embodiment of this invention, optical reflection face 130 is a kind of film containing metal component, this film can close for metal
Layer gold also can be multilayered structure, can also be to spread multiple conducting particles in dielectric film, and this film is by gap
132 sections separated are electrically not connected with, signal, the electromagnetism reflected it is hereby ensured that each section to each other
Noise will not interfere with each other.
One end of the optical channel 140 of Fig. 3 A towards optical reflection face 130 section 134 and optics optical light source 150, it is another
End may extend into another optical conenctor, and optics couples the optical detector of another optical conenctor.Implement in the present invention one
In example, optical channel 140 can be optical fiber, can be with vertical light path, as shown in Figure 3A, also towards the end face in optical reflection face 130
It can be an inclined surface (diagram does not indicate).In another embodiment of the invention, optical channel 140 can be a lens arrangement,
Other light transmission components, such as optical fiber, optical waveguide are transferred to after can focusing the light into.
In the present embodiment, the length direction D2 of the length direction D1 vertical optical reflecting surface 130 in gap 132.Gap
132 width W1 is more than or equal to 50 μm, to ensure that electromagnetism noise will not conduct between section 134,136, interferes.In addition,
The material of substrate 110 and upper cover 120 may include silicon, semiconductor or ceramics, and the construction of substrate 110 and upper cover 120 can be by light lithography
Technology (photolithography) generates, for example, upper cover 120 can etched processing procedure and generate the inclined-plane of bevel structure 122, and
Can have 35 degree to 55 degree of angle theta, such as 45 degree between the inclined-plane and horizontal plane of bevel structure 122.Implement in the present invention one
In example, substrate 110 and upper cover 120 are respectively provided with a contraposition part (diagram does not indicate), convenient for the combination of two substrates.Group can be reduced
The time of dress promotes the precision of processing, is conducive to produce.
Light source 150 can attach most importance to straight cavity surface emitting laser (Vertical Cavity Surface Emitting
Laser;VCSEL), the material in optical reflection face 130 may include gold, but be not intended to limit the invention.In present embodiment
In, optical reflection face 130 can be a kind of film containing metal component on the inclined-plane for be formed in bevel structure 122.In other realities
It applies in mode, the material of bevel structure 122 can be metal, then the inclined-plane of bevel structure 122 itself just can be directly as optics
Reflecting surface is not required to be additionally formed the film containing metal component.
Fig. 3 B be painted Fig. 1 optical conenctor 100 assemble after along line segment 4-4 sectional view.Simultaneously refering to Fig. 2 and Fig. 3 B,
After upper cover 120 is assembled in substrate 110, the section 136 in optical reflection face 130 is located at 160 top of optical detector.That is,
The section 136 in optical reflection face 130 and orthographic projection of the optical detector 160 on substrate 110 are least partially overlapped.Optical reflection face
Second optical signal L2 of another part optical channel 140 can be reflexed to optical detector 160 by 130 section 136.That is, light
Detector 160 can receive the second optical signal L2 emitted by the optical channel 140.
The section 136 and optics in one end of the optical channel 140 of Fig. 3 B towards optical reflection face 130 couple optical detector 160,
The other end may extend into another optical conenctor, and optics couples the light source of another optical conenctor.Implement in the present invention one
In example, the end face in optical channel 140 towards optical reflection face 130 also can be able to be an inclined surface with vertical light path, as shown in Figure 3B
(diagram does not indicate).
Simultaneously refering to Fig. 3 A and Fig. 3 B, due to optical conenctor 100 optical reflection face 130 by gap 132 be separated out to
Few two sections 134,136, and the section 134 in optical reflection face 130 and orthographic projection of the light source 150 on substrate 110 are at least partly
Overlapping, the section 136 in optical reflection face 130 and orthographic projection of the optical detector 160 on substrate 110 are least partially overlapped, therefore
Electromagnetism noise will not be transmitted to for anti-by the section 134 for the optical reflection face 130 of 150 first optical signal L1 of reflection source
The section 136 in the optical reflection face 130 of 140 second optical signal L2 of optical channel is penetrated, and is used to reflect 140 second optical signal of optical channel
Electromagnetism noise will not be transmitted to for 150 first optical signal L1's of reflection source by the section 136 in the optical reflection face 130 of L2
The section 134 in optical reflection face 130.In this way, which optical conenctor 100 of the invention has low electromagnetic crosstalk and low noise dry
The effect of disturbing.
Optical conenctor 100 also may include circuit board 170, driver 180 and turn impedance amplifier 190
(Transimpedance Amplifier;TIA), driver 180 can will be transferred to light after the signal processing electrically or optically of input
Source 150 turns impedance amplifier 190 then and can receive the light or electricity of optical detector 160 so that light source 150 launches the light for being loaded with signal
Signal, then will be exported after signal processing.170 bearing substrate 110 of circuit board, the material of circuit board 170 can with but be not limited to
Silicon, semiconductor, ceramics, resin, plastic cement etc..Driver 180 is located on circuit board 170, and is electrically connected light source 150.Turn resistance to put
Big device 190 is located on circuit board 170, and is electrically connected optical detector 160.In one embodiment of this invention, driver 180 can
It is placed on substrate 110.In one embodiment of this invention, the electric connection of itself and light source 150 and detector 160 of driver 180
Mode can be routing (wire bonding), as shown in Fig. 3 A and Fig. 3 B, also can pass through the silicon perforation (through on substrate 110
Silicon via) structure, it is connected in a manner of flip (Flip Chip).
The optical conenctor 100a that Fig. 4 A is painted another embodiment according to the present invention leans on the sectional view of 150 side of close to sources.
Fig. 4 B is painted sectional view of the optical conenctor 100a close to 160 side of optical detector of Fig. 4 A.Optical conenctor 100a includes substrate
110, upper cover 120, bevel structure 122, multiple optical channels 140, light source 150 and optical detector 160.With Fig. 3 A, Fig. 3 B embodiment party
The different place of formula is: the light source 150 and optical detector 160 of optical conenctor 100a is not disposed on substrate 110, but straight
It connects and is arranged on circuit board 170.Such design, what the optical reflection face 130 of bevel structure 122 can still emit light source 150
First optical signal L1 reflection and enter in optical channel 140, and optical detector 160 can receive emitted by the optical channel 140 and through light
Learn the second optical signal L2 that reflecting surface 130 reflects.
The optical conenctor 100b that Fig. 5 A is painted another embodiment according to the present invention leans on the sectional view of 150 side of close to sources.
Fig. 5 B is painted sectional view of the optical conenctor 100b close to 160 side of optical detector of Fig. 5 A.Optical conenctor 100b includes substrate
110, bevel structure 122, multiple optical channels 140, light source 150 and optical detector 160.It is different from Fig. 3 A, Fig. 3 B embodiment
Place is: optical conenctor 100b does not have upper cover 120, and the bevel structure 122 of optical conenctor 100b is located at substrate 110
On, and optical channel 140 is also disposed on substrate 110.In the present embodiment, substrate 110 can be circuit board or be held by circuit board
The substrate of load, and its material property of can choose includes plastic cement, silicon, semiconductor, ceramics.In addition, the light source of optical conenctor 100b
150 permeable conductive bumps 152, conducting wire 154 and routing are electrically connected driver 180, and optical detector 160 can pass through conductive stud
Block 162, conducting wire 164 and routing electric connection turn impedance amplifier 190.As optical conenctor 100b in use, bevel structure 122
The first optical signal L1 that optical reflection face 130 can emit light source 150 reflects and enters in optical channel 140, and optical detector 160
The the second optical signal L2 that can receive emitted by the optical channel 140 and reflected through optical reflection face 130.
It is repeated it will be understood that the element material described will not be repeated again with element connection relationship, conjunction is first chatted bright.With
In lower narration, it will illustrate the optical reflection face 130 of other patterns.
Fig. 6 is painted the partial enlarged view of the optical reflection face 130a of another embodiment according to the present invention.With Fig. 2 embodiment party
The different place of formula is: optical reflection face 130a has multiple gap 132a, 132b, and gap 132a, 132b are interlaced with each other.
In the present embodiment, the length direction D2 of the length direction D1 vertical optical reflecting surface 130a of gap 132a, and gap 132b
Length direction D2 collimating optics reflecting surface 130a length direction D2.In this way, which optical reflection face 130a can be by gap
132a, 132b are separated out four section 134a, 134b, 136a, 136b.Optical reflection face 130a may replace the optics of Fig. 2 to Fig. 5 B
Reflecting surface 130, depending on designer's demand.
Fig. 7 is painted the partial enlarged view of the optical reflection face 130b of another embodiment according to the present invention.With Fig. 2 embodiment party
The different place of formula is: optical reflection face 130b has multiple gap 132c, and the sum of width W2 of all gap 132c is big
In being equal to 50 μm, to ensure that electromagnetism noise will not conduct between section 134c, 136c of optical reflection face 130b, interfere.
In one embodiment of this invention, a light can respectively be corresponded to by the optical reflection face 130b section come being separated seen in multiple gap 132c
Channel 140, can be so that the signal that each optical channel 140 is conducted will not interfere with each other.Optical reflection face 130b may replace Fig. 2
To the optical reflection face 130 of Fig. 5 B, depending on designer's demand.
Fig. 8 is painted the inclined-plane of the bevel structure 122 of another embodiment according to the present invention and the part in optical reflection face 130
Enlarged drawing.The places different from Fig. 2 embodiment are: the inclined-plane of bevel structure 122 can also have fin 124, and fin 124
Protrude from the gap 132 in optical reflection face 130.That is, the position of fin 124 corresponds to the position in gap 132, fin 124
Surface could be formed with the material in optical reflection face 130, can also be formed without the material in optical reflection face 130.Fin 124 can
Bevel structure 122 applied to Fig. 2 to Fig. 5 B.
Fig. 9 is painted the partial enlargement with optical reflection face 130 of the bevel structure 122 of another embodiment according to the present invention
Figure.The places different from Fig. 2 embodiment are: 122 inclined-plane of bevel structure can also have groove 126, and groove 126 is recessed
Sink into the gap 132 in optical reflection face 130.That is, the position of groove 126 corresponds to the position in gap 132, groove 126
Surface could be formed with the material in optical reflection face 130, can also be formed without the material in optical reflection face 130.Groove 126 can answer
Bevel structure 122 for Fig. 2 to Fig. 5 B.
Figure 10 is painted the perspective view of the upper cover 120a of another embodiment according to the present invention.Figure 11 is painted the upper cover of Figure 10
Sectional view of the 120a along line segment 10-10.0 and Figure 11, optical reflection face 130c are formed in bevel structure 122 refering to fig. 1 simultaneously
Chamfered surface, and impurity absorption film 131 is formed on the 130c of optical reflection face.The places different from Fig. 2 embodiment are: light
The gap 132 that reflecting surface 130c does not have Fig. 2 is learned, but optical reflection face 130c is covered by impurity absorption film 131.In addition, noise
The material of absorbing film 131 may include the nonmetallic of light-permeable.
When impurity absorption film 131 connects with the optical reflection face 130c for not having gap 132 applied to the optics of Fig. 3 A and Fig. 3 B
When connecing device 100, impurity absorption film 131 and orthographic projection of the light source 150 on substrate 110 are least partially overlapped, and impurity absorption film
131 is least partially overlapped with orthographic projection of the optical detector 160 on substrate 110.Such design, it is miscellaneous when light source 150 shines
News absorbing film 131 not only can absorb the noise that light source 150 is coupled to optical reflection face 130c, also can absorb from optical reflection face
130c is coupled to the noise of optical detector 160.In this way, which optical conenctor 100 can still have low electromagnetic crosstalk and low noise
The effect of interference.In the present embodiment, optical reflection face 130c can be to be formed on the inclined-plane of bevel structure 122 to contain gold
Belong to the film of ingredient, and the film containing metal component is between impurity absorption film 131 and the inclined-plane of bevel structure 122, it is such
Film can be metal alloy layer, also can be multilayered structure, can also be to spread multiple conducting particles in dielectric film.At it
In his embodiment, the material of bevel structure 122 can be metal, then the inclined-plane of bevel structure 122 itself just can be directly as
Optical reflection face is not required to form the film containing metal component.
Figure 12 is painted another embodiment of the upper cover 120a of Figure 11.Optical reflection face 130c is to be formed in bevel structure
The film containing metal component on 122 inclined-plane.The places different from Figure 11 embodiment are: impurity absorption film 131,133
It is located on opposite two surfaces 135,137 of the film containing metal component.Wherein, impurity absorption film 133 is located at bevel structure
Between 122 inclined-plane and the surface 137 of the film containing metal component.
When impurity absorption film 131,133 and the optical reflection face 130c for not having gap 132 are applied to the light of Fig. 3 A and Fig. 3 B
When learning connector 100, impurity absorption film 131,133 and orthographic projection of the light source 150 on substrate 110 are least partially overlapped and miscellaneous
It interrogates absorbing film 131,133 and orthographic projection of the optical detector 160 on substrate 110 is least partially overlapped.Such design, works as light source
150 it is luminous when, impurity absorption film 131,133 not only can absorb light source 150 and is coupled to the noise of optical reflection face 130c, can also inhale
Receive the noise that optical detector 160 is coupled to from optical reflection face 130c.In this way, which optical conenctor 100 can still have low electricity
The effect of magnetic cross-talk and low noise interfere.
Although the present invention is disclosed above with embodiment, however, it is not to limit the invention, any to be familiar with this skill
Person, without departing from the spirit and scope of the present invention, when can be used for a variety of modifications and variations, therefore protection scope of the present invention is worked as
Subject to the scope of which is defined in the appended claims.
Claims (19)
1. a kind of optical conenctor, characterized by comprising:
One substrate;
Multiple optical channels, to communicating optical signals;
One light source is located on the substrate, to emit one first optical signal;
One bevel structure, has an optical reflection face, and first optical signal to emit the light source reflexes to the light and leads to
At least one in road;And
One optical detector is located on the substrate, which is set to the same side of the opposite bevel structure with the light source,
The optical detector is believed to one second light reflected emitted by at least one received from the optical channel and through the bevel structure
Number:
Wherein the optical reflection face has an at least gap, and the optical reflection face is made to be separated out at least two sections by the gap, and
The divided section is not connected in electrical property each other.
2. optical conenctor according to claim 1, which is characterized in that also include:
One upper cover, the bevel structure are located on this on lid.
3. optical conenctor according to claim 2, which is characterized in that the optical channel is set on this on lid.
4. optical conenctor according to claim 1, which is characterized in that the optical reflection face is one containing the thin of metal component
Film is formed on the inclined-plane of the bevel structure.
5. optical conenctor according to claim 1, which is characterized in that the material of the bevel structure is metal, and the light
Learn the inclined-plane that reflecting surface is the bevel structure.
6. optical conenctor according to claim 1, which is characterized in that the vertical optical reflection of the length direction in the gap
The length direction in face.
7. optical conenctor according to claim 1, which is characterized in that the parallel optical reflection of the length direction in the gap
The length direction in face.
8. optical conenctor according to claim 1, which is characterized in that the width in the gap is more than or equal to 50 μm.
9. optical conenctor according to claim 1, which is characterized in that the quantity in the gap is multiple, and the gap
It is interlaced with each other.
10. optical conenctor according to claim 1, which is characterized in that the quantity in the gap is multiple, and the gap
The sum of width be more than or equal to 50 μm.
11. optical conenctor according to claim 1, which is characterized in that the inclined-plane of the bevel structure is convex at least one
Rib, and the fin protrudes from the gap.
12. optical conenctor according to claim 1, which is characterized in that the inclined-plane of the bevel structure has an at least ditch
Slot, and the grooves recess is in the gap.
13. optical conenctor according to claim 1, which is characterized in that the optical channel is optical fiber.
14. optical conenctor according to claim 1, which is characterized in that the material of the substrate includes silicon, semiconductor, pottery
Porcelain, resin, plastic cement.
15. optical conenctor according to claim 1, which is characterized in that also include:
One circuit board carries the substrate;And
One driver is located on the circuit board, and is electrically connected the light source.
16. optical conenctor according to claim 15, which is characterized in that also include:
One turn of impedance amplifier is located on the circuit board, and is electrically connected the optical detector.
17. optical conenctor according to claim 1, which is characterized in that the light source and the optical detector are located at the substrate
Same edge.
18. optical conenctor according to claim 1, which is characterized in that the light source is attached most importance to straight cavity surface emitting laser.
19. optical conenctor according to claim 1, which is characterized in that the material in the optical reflection face includes gold.
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CN201610135584.2A CN107179584B (en) | 2016-03-10 | 2016-03-10 | Optical conenctor |
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CN201610135584.2A CN107179584B (en) | 2016-03-10 | 2016-03-10 | Optical conenctor |
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CN107179584A CN107179584A (en) | 2017-09-19 |
CN107179584B true CN107179584B (en) | 2019-06-14 |
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CN201610135584.2A Expired - Fee Related CN107179584B (en) | 2016-03-10 | 2016-03-10 | Optical conenctor |
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Families Citing this family (2)
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CN109407225A (en) * | 2018-11-09 | 2019-03-01 | 中国电子科技集团公司第三十研究所 | A kind of photoelectric coupling mechanism and its manufacturing method |
CN112485929B (en) * | 2019-09-12 | 2022-12-20 | 源杰科技股份有限公司 | Optical signal generating device |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5640483A (en) * | 1996-03-19 | 1997-06-17 | Ctx Opto-Electronics Corp. | Backlighting system utilizing total internal reflection |
CN1910486A (en) * | 2004-02-17 | 2007-02-07 | 浜松光子学株式会社 | Optical wiring board and method for manufacturing optical wiring board |
CN101542247A (en) * | 2007-06-08 | 2009-09-23 | 浜松光子学株式会社 | Spectroscopic module |
CN202421561U (en) * | 2011-12-26 | 2012-09-05 | 环隆科技股份有限公司 | Optical interconnect transmission module |
CN103135182A (en) * | 2011-12-02 | 2013-06-05 | 鸿富锦精密工业(深圳)有限公司 | Optical component encapsulation structure and encapsulation method thereof |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11126921A (en) * | 1997-10-23 | 1999-05-11 | Toshiba Electronic Engineering Corp | Optical transmission equipment |
-
2016
- 2016-03-10 CN CN201610135584.2A patent/CN107179584B/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5640483A (en) * | 1996-03-19 | 1997-06-17 | Ctx Opto-Electronics Corp. | Backlighting system utilizing total internal reflection |
CN1910486A (en) * | 2004-02-17 | 2007-02-07 | 浜松光子学株式会社 | Optical wiring board and method for manufacturing optical wiring board |
CN101542247A (en) * | 2007-06-08 | 2009-09-23 | 浜松光子学株式会社 | Spectroscopic module |
CN103135182A (en) * | 2011-12-02 | 2013-06-05 | 鸿富锦精密工业(深圳)有限公司 | Optical component encapsulation structure and encapsulation method thereof |
CN202421561U (en) * | 2011-12-26 | 2012-09-05 | 环隆科技股份有限公司 | Optical interconnect transmission module |
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