CN109407225A - A kind of photoelectric coupling mechanism and its manufacturing method - Google Patents
A kind of photoelectric coupling mechanism and its manufacturing method Download PDFInfo
- Publication number
- CN109407225A CN109407225A CN201811328379.3A CN201811328379A CN109407225A CN 109407225 A CN109407225 A CN 109407225A CN 201811328379 A CN201811328379 A CN 201811328379A CN 109407225 A CN109407225 A CN 109407225A
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- CN
- China
- Prior art keywords
- groove
- coupling mechanism
- substrate
- optical fiber
- photoelectric coupling
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4239—Adhesive bonding; Encapsulation with polymer material
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/424—Mounting of the optical light guide
- G02B6/4243—Mounting of the optical light guide into a groove
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
Abstract
The invention discloses a kind of photoelectric coupling mechanism and its manufacturing method, coupling mechanism is made of rigid printed circuit boards substrate, and the substrate has opposite first surface and second surface and the first groove and the second groove；First groove has orthogonal first reflecting surface and the second plane, and the angle of the first surface of first reflecting surface and substrate is 43 ° to 47 °, and metallic reflective coating or dielectric reflection film are coated on the first reflecting surface；Fiber orientation groove is provided between the first groove and the second groove.The present invention makes processing photoelectric coupling mechanism, and fixed optical fiber array interconnection substrate on rigid printed circuit boards material, compatible with traditional printed circuit board manufacture craft, without developing new laminating technology process and equipment；The configuration of the present invention is simple, manufacturing method exploitativeness is strong, at low cost, and assembly technology is simple, and tolerance is wide in range, and the coupling efficiency between parallel optoelectronic array chip and fiber array can be improved.
Description
Technical field
The present invention relates to a kind of photoelectric coupling mechanism and its manufacturing methods.
Background technique
With the rapid development of High-Speed Communication Technique, information content exponentially formula increases, mankind's urgent need electronic communication system
System has high speed, high bandwidth, large capacity, low error rate, low-power consumption and anti-electromagnetic interference capability.Traditional electric mutual contact mode can not
Meet current needs, it has also become the bottleneck of limitation high speed electronic communication system fast development.Photoelectricity using optical transport mode is mutual
Connection circuit can realize between electronic communication system inner panel, the high speed between component, chip, high bandwidth, high density, low-power consumption information
Transmission can effectively solve the transmission bottleneck of the electric interconnection technique of high speed.
The optical signal transmission layer of photoelectricity interconnection circuit generally uses optical fiber for transmission medium, and includes a plurality of optical fiber composition
Parallel optical fibre array.Since optical fiber is excellent low-loss transmission medium, the transmission loss of photoelectricity interconnection circuit is occurred mainly in
During parallel optoelectronic array chip receives and dispatches optical signal, i.e., parallel optoelectronic array chip passes through the coupling of coupling mechanism and fiber array
Conjunction process.It needs to carry out each light-path in each optical fiber and parallel optoelectronic array chip in photoelectricity interconnection circuit
High-precision is aligned, and just be can guarantee photoelectricity interconnection circuit coupling efficiency with higher, is reduced its loss.
Currently, one is process in fiber end face there are two types of parallel light battery core array chip and fiber array coupling paths
45 ° of optical flats carry out light-path each in each fibre core of the fiber array after processing and parallel optoelectronic array chip
It is aligned one by one.Another kind is to utilize lens array plus microlens array between parallel optoelectronic array chip and fiber array
Parallel optoelectronic chip and fiber array coupling efficiency with higher are guaranteed to light convergence characteristic.But by fiber array
Every fiber end face processes 45 ° of optical flats, and light cylinder aggregation properties are utilized, and the 45 ° of optics that need to control every optical fiber are flat
Angular deviation in face and parallel optoelectronic array chip alignment procedures, coupling tolerance is small, and coupling difficulty is big；And pass through lenticule battle array
The mode for arranging to be aligned, coupling tolerance is wide in range, but microlens array adjustment and inconvenient observation, and component is more, at high cost, dress
With process flow complicated and time consumption.
Summary of the invention
In order to overcome the disadvantages mentioned above of the prior art, the present invention provides a kind of photoelectric coupling mechanism and its manufacturing methods.
The technical solution adopted by the present invention to solve the technical problems is: a kind of photoelectric coupling mechanism, using rigid printing
Board substrate is made, and the substrate has opposite first surface and second surface and the first groove and the second groove, the
One groove and the second groove are processed from first surface to second surface to be recessed；First groove has orthogonal first
Reflecting surface and the second plane, for first reflecting surface towards the direction of the second groove, the angle with the first surface of substrate is 43 °
To 47 °, metallic reflective coating or dielectric reflection film are coated on the first reflecting surface；The end of the middle separated time of first groove and the second groove
Face is parallel；Fiber orientation groove is provided between the first groove and the second groove.
The present invention also provides a kind of manufacturing method of photoelectric coupling mechanism, first groove has orthogonal
First reflecting surface and the second plane are machined into using 90 ° of " V " type scribings；Second groove is processed by controlled depth milling technology
It forms, for optical fiber array interconnection substrate to be arranged, the optical fiber array interconnection substrate is fastened on using UV-cured adhesive
In second groove.
Compared with prior art, the positive effect of the present invention is:
1. present invention production processing photoelectric coupling mechanism on rigid printed circuit boards material, and fixed optical fiber array interconnection
Substrate, it is compatible with traditional printed circuit board manufacture craft, without developing new laminating technology process and equipment；
2. the present invention 45 ° of reflectings surface of manufacture processing on the rigid circuit boards substrate such as FR4 or PTFE, relative in optical fiber end
Face processes 45 ° of optical flats or uses microlens array, and structure is simple, and manufacturing method exploitativeness is strong, at low cost, assembly technology
Simply, tolerance is wide in range, and the coupling efficiency between parallel optoelectronic array chip and fiber array can be improved.
Detailed description of the invention
Examples of the present invention will be described by way of reference to the accompanying drawings, in which:
Fig. 1 is the schematic diagram of photoelectric coupling mechanism of the present invention；
Fig. 2 is the schematic cross-section of I-I in Fig. 1；
Fig. 3 is the application example schematic diagram of photoelectric coupling mechanism；
Fig. 4 is the schematic cross-section of II-II in Fig. 3；
Fig. 5 is the application example schematic diagram of second of photoelectric coupling mechanism.
Wherein, appended drawing reference are as follows:
| 100 | Photoelectric coupling mechanism | 14 | Fiber orientation groove |
| 200 | Photoelectric coupling mechanism application example | 15 | Optical fiber array interconnection substrate |
| 300 | Second of photoelectric coupling mechanism application example | 151 | Optical fiber |
| 11 | Rigid circuit board substrate | 121、173 | First reflecting surface |
| 111 | First surface | 122 | Second plane |
| 112 | Second surface | 17 | Reflecting module |
| 12、16 | First groove | 171 | Reflecting module first surface |
| 13 | Second groove | 172 | Reflecting module second surface |
| 131 | Second groove end face |
Specific embodiment
As shown in Figures 1 to 4, a kind of photoelectric coupling mechanism 100 of the invention is to utilize the rigidity printing electricity such as FR4 or PTFE
It is fabricated on road plate substrate 11, substrate 11 can be the materials such as FR4 or PTFE；Substrate 11 has opposite first surface
111 and second surface 112 and the first groove 12 and the second groove 13, the first groove 12 and the second groove 13 are by first surface
111 process recess to second surface 112；First groove 12 has orthogonal first reflecting surface 121 and second flat
Face 122 is process by 90 ° of " V " type scribing machines or other methods, and the first reflecting surface 121 is towards the direction of the second groove 13；Institute
The angle of the first reflecting surface 121 and the first surface 111 of substrate 11 stated is 45 °, and by emulation and experiment, which is 43 °
It can guarantee good coupling efficiency range to 47 °；First reflecting surface 121 must also plating metal reflectance coating or dieletric reflection
Membrane process process；Second groove 13 is process by technologies such as controlled depth millings, and main function is to utilize ultraviolet curing
Binder fastens the optical fiber array interconnection substrate 15 in the application example 200 of photoelectric coupling mechanism, and 13 size of the second groove is bigger
In the width and thickness of optical fiber array interconnection substrate 15；The middle separated time of first groove 12 is denoted as L1, the end face with the second groove 13
131 is parallel；Between the first groove 12 and the second groove 13 (in other words, the second plane 122 and the second groove end face 131 it
Between) there is the simple optical fiber positioning groove 14 for being no less than one, fluting direction is processed from first surface 111 to second surface 112
Recess, the cross-sectional shape of the positioning groove 14 are rectangle, inverted trapezoidal, U-typed or " V " type, 14 size root of locating slot
It is determined according to the diameter of optical fiber 151 in optical fiber array interconnection substrate 15；14 arrangement mode of fiber orientation groove at dividing at equal intervals
Cloth, spacing is determined according to parallel optoelectronic array chip light-path spacing, if vertical cavity surface emitting laser arrays or GaAs
PIN photoelectric detector array, it is preferred that the spacing of positioning groove 14 is 250 μm；It is buried in the optical fiber array interconnection substrate 15
The optical fiber 151 entered need to expose 3-5mm and is fastened in positioning groove 14 using UV curable binder, pass through the first reflecting surface 121
It is coupled with parallel optoelectronic array chip；The cup depth value of second groove 13 is greater than the fiber orientation groove 14
Cup depth value, depth difference is equal to 151 fibre core of optical fiber and to 15 bottom surface distance value of optical fiber array interconnection substrate subtracts optical fiber 151
Radius value.
In order to increase the flexibility of coupling mechanism manufacture, by the trapezoidal mould where first reflecting surface 121 of above-described embodiment
Block integrally is separated to form individual reflecting module from rigid printed circuit boards substrate 11, rigid printed circuit boards substrate 11
Surface after removing reflecting module constitutes the first groove 16 with the second plane 122 together.As shown in figure 5, another kind of the invention
The photoelectric coupling mechanism 300 of form includes rigid circuit board substrate 11 and reflecting module 17.The rigid circuit board substrate 11 is same
Sample has opposite first surface 111 and second surface 112 and the first groove 16 and the second groove 13, the first groove 16 and the
Two grooves 13 from first surface 111 to second surface recess 112；The reflecting module 17 has opposite first surface 171
With second surface 172, reflecting module end face is machined with the first reflecting surface 173, the first reflecting surface 173 and the first of reflecting module 17
The angle on surface 171 is 45 °；First groove 16 of the rigid circuit board substrate 11 is fastened anti-using UV-cured adhesive
Module 17 is penetrated, by emulation and experiment, after guaranteeing to fasten precision, the reflecting surface 173 and first surface 171 of the reflecting module 17
Angle is 43 ° to 47 ° and can guarantee good coupling efficiency range, the second groove 13 is fastened using UV-cured adhesive
Optical fiber array interconnection substrate 15；Between the first groove 16 and the second groove 13 of the rigid circuit board substrate 11, it is machined with not
Simple optical fiber positioning groove 14 less than one utilizes the light in UV-cured adhesive fastening optical fiber array interconnection substrate 15
Fibre 151；Parallel optoelectronic array chip is coupled by the first reflecting surface 173 of the reflecting module 17 with optical fiber 151.
The reflecting module 17 is potsherd, silicon wafer, sheet glass or sheet metal etc., after processing reflecting surface, plating metal
Reflectance coating or dielectric reflection film.
Claims (10)
1. a kind of photoelectric coupling mechanism, it is characterised in that: be made of rigid printed circuit boards substrate, the substrate has opposite
First surface and second surface and the first groove and the second groove, the first groove and the second groove from first surface to
Two surfaces processing recess；First groove has orthogonal first reflecting surface and the second plane, first reflecting surface
Towards the direction of the second groove, the angle with the first surface of substrate is 43 ° to 47 °, and it is anti-to be coated with metal on the first reflecting surface
Penetrate film or dielectric reflection film；The middle separated time of first groove is parallel with the end face of the second groove；The first groove and the second groove it
Between be provided with fiber orientation groove.
2. a kind of photoelectric coupling mechanism according to claim 1, it is characterised in that: the of first reflecting surface and substrate
The angle on one surface is 45 °.
3. a kind of photoelectric coupling mechanism according to claim 1, it is characterised in that: the cross section of the fiber orientation groove
Shape is rectangle, inverted trapezoidal, U-typed or " V " type.
4. a kind of photoelectric coupling mechanism according to claim 1, it is characterised in that: the fiber orientation groove divides at equal intervals
Cloth, spacing according to parallel optoelectronic array chip light-path spacing determine, size according in optical fiber array interconnection substrate optical fiber it is straight
Diameter determines.
5. a kind of photoelectric coupling mechanism according to claim 4, it is characterised in that: when the optical fiber array interconnection substrate is
When vertical cavity surface emitting laser arrays or GaAs PIN photoelectric detector array, the spacing of fiber orientation groove is 250 μm.
6. the manufacturing method of photoelectric coupling mechanism described in a kind of claim 1, it is characterised in that: the phase that first groove has
Mutually vertical the first reflecting surface and the second plane are machined into using 90 ° of " V " type scribings；Second groove passes through controlled depth milling
Technology is process, and for optical fiber array interconnection substrate to be arranged, the optical fiber array interconnection substrate is bonded using ultraviolet curing
Agent is fastened in the second groove.
7. the manufacturing method of photoelectric coupling mechanism according to claim 6, it is characterised in that: the optical fiber array interconnection base
The optical fiber being embedded in plate is exposed 3-5mm and is fastened in fiber orientation groove using UV curable binder, and the first reflecting surface is passed through
It is coupled with parallel optoelectronic array chip.
8. the manufacturing method of photoelectric coupling mechanism according to claim 7, it is characterised in that: the recess of second groove
Depth value is greater than the cup depth value of fiber orientation groove, and depth difference is equal to fiber core to optical fiber array interconnection substrate bottom surface
Distance value subtracts the radius value of optical fiber.
9. the manufacturing method of photoelectric coupling mechanism according to claim 6, it is characterised in that: will be where the first reflecting surface
Trapezoidal module integrally is separated to form individual reflecting module from rigid printed circuit boards substrate, rigid printed circuit boards base
Material removes the surface after reflecting module and constitutes the first groove together with the second plane.
10. the manufacturing method of photoelectric coupling mechanism according to claim 9, it is characterised in that: the reflecting module uses
Potsherd, silicon wafer, sheet glass or the independent processing and fabricating of sheet metal, plating metal reflectance coating or Jie on the first reflecting surface processed
Matter reflectance coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811328379.3A CN109407225A (en) | 2018-11-09 | 2018-11-09 | A kind of photoelectric coupling mechanism and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811328379.3A CN109407225A (en) | 2018-11-09 | 2018-11-09 | A kind of photoelectric coupling mechanism and its manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109407225A true CN109407225A (en) | 2019-03-01 |
Family
ID=65472440
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811328379.3A Pending CN109407225A (en) | 2018-11-09 | 2018-11-09 | A kind of photoelectric coupling mechanism and its manufacturing method |
Country Status (1)
| Country | Link |
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| CN (1) | CN109407225A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1610852A (en) * | 2001-09-12 | 2005-04-27 | 英特尔公司 | Optical/electrical interconnects and package for high speed signaling |
| CN1781043A (en) * | 2003-04-30 | 2006-05-31 | 株式会社藤仓 | Optical transceiver and optical connector |
| CN1853127A (en) * | 2003-09-22 | 2006-10-25 | 英特尔公司 | Connecting a component with an embedded optical fiber |
| TW201732338A (en) * | 2016-03-03 | 2017-09-16 | 源傑科技股份有限公司 | Optical connector |
| CN107179584A (en) * | 2016-03-10 | 2017-09-19 | 源杰科技股份有限公司 | Optical conenctor |
-
2018
- 2018-11-09 CN CN201811328379.3A patent/CN109407225A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1610852A (en) * | 2001-09-12 | 2005-04-27 | 英特尔公司 | Optical/electrical interconnects and package for high speed signaling |
| CN1781043A (en) * | 2003-04-30 | 2006-05-31 | 株式会社藤仓 | Optical transceiver and optical connector |
| CN1853127A (en) * | 2003-09-22 | 2006-10-25 | 英特尔公司 | Connecting a component with an embedded optical fiber |
| TW201732338A (en) * | 2016-03-03 | 2017-09-16 | 源傑科技股份有限公司 | Optical connector |
| CN107179584A (en) * | 2016-03-10 | 2017-09-19 | 源杰科技股份有限公司 | Optical conenctor |
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Application publication date: 20190301 |