CN202421561U - Optical interconnect transmission module - Google Patents

Optical interconnect transmission module Download PDF

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Publication number
CN202421561U
CN202421561U CN2011205767488U CN201120576748U CN202421561U CN 202421561 U CN202421561 U CN 202421561U CN 2011205767488 U CN2011205767488 U CN 2011205767488U CN 201120576748 U CN201120576748 U CN 201120576748U CN 202421561 U CN202421561 U CN 202421561U
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CN
China
Prior art keywords
optical
circuit board
printed circuit
light
area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2011205767488U
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Chinese (zh)
Inventor
林方正
吴祖修
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lightel Technologies Inc
Original Assignee
Lightel Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lightel Technologies Inc filed Critical Lightel Technologies Inc
Priority to CN2011205767488U priority Critical patent/CN202421561U/en
Application granted granted Critical
Publication of CN202421561U publication Critical patent/CN202421561U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to an optical interconnect transmission module, which comprises a printed circuit board, a carrier plate, at least one optical connection element and a light guide module. The printed circuit board is provided with a first area and a second area. The carrier plate is arranged in the first area of the printed circuit board, so that the flexibility of the first area is lower than that of the second area. The carrier plate is provided with a first surface. The optical connection element is arranged on the first surface of the carrier plate, and is electrically connected to the printed circuit board. The light guide module is provided with a shell and at least one reflecting mirror. The shell of the light guide module is arranged on the carrier plate, covers the optical connection element, and is provided with an upper surface, a lower surface, a first groove formed on the lower surface in a sunken way, a first optical channel and a second optical channel. The first optical channel is communicated with the first groove and the second optical channel. The reflecting mirror is arranged on the first optical channel. The optical connection element is opposite to the reflecting mirror through the first optical channel.

Description

The optical interconnection delivery module
Technical field
The utility model relates to a kind of optical interconnection delivery module, particularly relates to a kind of optical interconnection delivery module of avoiding the transmission ray deflection.
Background technology
See also shown in Figure 1; The optical interconnection delivery module 200 of existing convention has a printed circuit board (PCB) 210, a plurality of optical transmitter components 220, a cover plate 230, a plurality of lens 240 and a plurality of optical fiber 250; Said optical transmitter components 220 and this cover plate 230 are arranged at this printed circuit board (PCB) 210, and these optical transmitter components 220 these printed circuit board (PCB)s 210 of electric connection, and respectively this optical transmitter components 220 respectively has a light-emitting area 221; Respectively this optical fiber 250 respectively has an end face 251; This light-emitting area 221 and respectively this end face 251 is towards these lens 240 respectively respectively, said optical transmitter components 220 drives and radius by this printed circuit board (PCB) 210, and light focuses on via said lens 240 and transfers to respectively this optical fiber 250; This printed circuit board (PCB) 210 is easy to the stress skewness and produces the circuit board warpage in high-temperature technology; Said optical transmitter components 220 is if directly be arranged at this printed circuit board (PCB) 210, and the light that its width of cloth is penetrated will very easily produce skewness, thereby cause light transmissioning efficiency significantly to reduce.
This shows that above-mentioned existing optical interconnection delivery module obviously still has inconvenience and defective, and demands urgently further improving in structure and use.In order to solve the problem that the optical interconnection delivery module exists; Relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly; But do not see always that for a long time suitable design is developed completion; And common product does not have appropriate structure to address the above problem, and this obviously is the problem that the anxious desire of relevant dealer solves.Therefore how to found a kind of optical interconnection delivery module that has that volume is little, cost is low concurrently and can have the new structure of comprehensive adjustment function when using, real one of the current important research and development problem that belongs to, also becoming the current industry utmost point needs improved target.
Summary of the invention
The purpose of the utility model is, overcomes the defective that existing optical interconnection delivery module exists, and a kind of optical interconnection delivery module of new structure is provided, and technical matters to be solved is that a kind of optical interconnection delivery module is being provided, thereby is suitable for practicality more.
The purpose of the utility model and to solve its technical matters be that technical scheme below adopting realizes.Its that proposes according to the utility model comprises: a printed circuit board (PCB), and it has a first area and a second area; One support plate, it is arranged at this first area of this printed circuit board (PCB), so that the pliability of this first area is less than the pliability of this second area, this support plate has a first surface; At least one smooth link component, it is arranged at this first surface of this support plate, and this light link component electrically connects this printed circuit board (PCB); An and light guide module; It has a housing and at least one catoptron; This housing of this light guide module is arranged at this support plate and this light link component of cover cap, and this housing has a upper surface, a lower surface, is arranged with first groove, one first optical channel and one second optical channel in this lower surface, and this first optical channel is communicated with this first groove and this second optical channel; This catoptron is arranged at this first optical channel, this light link component by this first optical channel to should catoptron.
The purpose of the utility model and solve its technical matters and can also adopt following technical measures to come further to realize.
Aforesaid optical interconnection delivery module, wherein said this light link component can electrically connect by this support plate and this printed circuit board (PCB).
Aforesaid optical interconnection delivery module, wherein said its has a drive IC in addition, and this drive IC is arranged at this second area of this printed circuit board (PCB) and electrically connects this printed circuit board (PCB).
Aforesaid optical interconnection delivery module, wherein said this light link component can electrically connect by this support plate and this drive IC.
Aforesaid optical interconnection delivery module, wherein said this light link component has a second surface, and this catoptron has an inclined-plane, and this second surface of this light link component is towards this inclined-plane of this catoptron.
Aforesaid optical interconnection delivery module, wherein said this first optical channel and this second optical channel are vertical setting.
Aforesaid optical interconnection delivery module, wherein said this first groove has a madial wall, and this support plate has a side, and this madial wall of this first groove is attached at this side of this support plate.
Aforesaid optical interconnection delivery module, wherein said this light link component can be a light emitting diode (light-emitting diode) or a laser diode (laser diode).
Aforesaid optical interconnection delivery module, wherein said this support plate is made by silicon (silica) material.
Aforesaid optical interconnection delivery module, wherein said this light link component can be an optical detector (photo-detector).
The utility model compared with prior art has tangible advantage and beneficial effect.By technique scheme; The utility model optical interconnection delivery module can reach suitable technical progress property and practicality; And having the extensive value on the industry, it has advantage at least: to should catoptron, printed circuit board (PCB) be easy to produce unbalanced stress in high-temperature technology and the phenomenon that causes the circuit board warpage to this first optical channel; The utility model is arranged at this first area of this printed circuit board (PCB) and makes the pliability of this first area significantly reduce by this support plate; When this light link component was arranged at this support plate, because the pliability of this first area of this printed circuit board (PCB) is much smaller than this second area, so the situation that this light link component does not have an inclination produced; So when carrying out light transmission, light path can not produce skewness.
In sum; The utility model comprises a printed circuit board (PCB), a support plate, at least one smooth link component and a light guide module; This printed circuit board (PCB) has a first area and a second area, and this support plate is arranged at this first area of this printed circuit board (PCB), so that the pliability of this first area is less than this second area; This support plate has a first surface; This light link component is arranged at this first surface of this support plate, and this light link component electrically connects this printed circuit board (PCB), and this light guide module has a housing and at least one catoptron; This housing of this light guide module is arranged at this support plate and this light link component of cover cap; This housing has a upper surface, a lower surface, is arranged with first groove, one first optical channel and one second optical channel in this lower surface, and this first optical channel is communicated with this first groove and this second optical channel, and this catoptron is arranged at this first optical channel; And to should catoptron, printed circuit board (PCB) be easy to produce unbalanced stress in high-temperature technology and the phenomenon that causes the circuit board warpage this light link component by this first optical channel.The utility model has apparent progress technically, and has tangible good effect, really is a novelty, progress, practical new design.
Above-mentioned explanation only is the general introduction of the utility model technical scheme; In order more to know the technological means of understanding the utility model; And can implement according to the content of instructions, and for let the above-mentioned of the utility model with other purpose, feature and advantage can be more obviously understandable, below special act preferred embodiment; And conjunction with figs., specify as follows.
Description of drawings
Fig. 1: the side view of the optical interconnection delivery module of existing convention.
Fig. 2: according to a preferred embodiment of the utility model, a kind of exploded perspective view of optical interconnection delivery module.
Fig. 3: according to a preferred embodiment of the utility model, the combination stereogram of this optical interconnection delivery module.
Fig. 4: according to a preferred embodiment of the utility model, a side sectional view of this optical interconnection delivery module.
Fig. 5: according to a preferred embodiment of the utility model, the another side cut-open view of this optical interconnection delivery module.
100: optical interconnection delivery module 10: printed circuit board (PCB)
11: first area 12: second area
20: support plate 21: first surface
22: side 30: the light link component
31: second surface 40: drive IC
50: light guide module 51: housing
511: upper surface 512: lower surface
513: the first groove 513a: madial wall
515: the first optical channels of 514: the second grooves
Optical channel 52 in 516: the second: catoptron
521: inclined-plane 200: the optical interconnection delivery module
210: printed circuit board (PCB) 220: optical transmitter components
221: light-emitting area 230: cover plate
240: lens 250: optical fiber
251: end face
Embodiment
For further setting forth the utility model is to reach technological means and the effect that predetermined goal of the invention is taked; Below in conjunction with accompanying drawing and preferred embodiment; To its embodiment of optical interconnection delivery module, structure, characteristic and the effect thereof that proposes according to the utility model, specify as after.
See also Fig. 2, Fig. 3 and Fig. 4, a preferred embodiment of its utility model, a kind of optical interconnection delivery module 100 comprises a printed circuit board (PCB) 10, a support plate 20, at least one smooth link component 30 and a light guide module 50; This printed circuit board (PCB) 10 has a first area 11 and a second area 12, and this support plate 20 is arranged at this first area 11 of this printed circuit board (PCB) 10, so that the pliability of this first area 11 is less than this second area 12; This support plate 20 has a first surface 21, and this light link component 30 is arranged at this first surface 21 of this support plate 20, in the present embodiment; This light link component 30 electrically connects this printed circuit board (PCB) 10; Preferably, this light link component 30 can electrically connect by this support plate 20 and this printed circuit board (PCB) 10, and this light guide module 50 has a housing 51 and at least one catoptron 52; This housing 51 of this light guide module 50 is arranged at this support plate 20 and this light link component 30 of cover cap; This housing 51 has a upper surface 511, a lower surface 512, and is arranged with first groove 513, one first optical channel 515 and one second optical channel 516 in this lower surface 512, and this first optical channel is communicated with this first groove 513 and this second optical channel 516, and this catoptron 52 is arranged at this first optical channel 515; And this light link component 30 should catoptron 52 by 515 pairs of this first optical channels; Preferably, this housing 51 has second groove 514 that is arranged with in this upper surface 511 in addition, and this first optical channel 515 is communicated with these second grooves 514; This catoptron 52 is installed in this first optical channel 515 by this second groove 514; Please consult Fig. 2 again, this optical interconnection delivery module 100 has a drive IC 40 in addition, and this drive IC 40 is arranged at this second area 12 of this printed circuit board (PCB) 10 and electrically connects this printed circuit board (PCB) 10; In the present embodiment, this light link component 30 can electrically connect by this support plate 20 and this drive IC 40.
Please consult Fig. 4 again, this light link component 30 has a second surface 31, and this catoptron 52 has an inclined-plane 521; This second surface 31 of this light link component 30 is towards this inclined-plane 521 of this catoptron 52, and in addition, this first groove 513 has a madial wall 513a; This support plate 20 has a side 22, and this madial wall 513a of this first groove 513 is attached at this side 22 of this support plate 20, attaches each other by this madial wall 513a and this side 22; But the structural stability of this support plate 20 of efficient hardening and this housing 51, in semiconductor technology, this printed circuit board (PCB) 10 is behind overbaking (Curing), pressing (Lamination) and thermal cycle high-temperature technologies such as (Thermal cycle); This printed circuit board (PCB) 10 is stress skewness and produce warping phenomenon very easily; If this light link component 30 directly is arranged at this printed circuit board (PCB) 10, then its warping phenomenon will cause the transmission or the receiving light path deflection of this light link component 30, make light transmissioning efficiency significantly reduce; Be head it off; In the present embodiment, this support plate 20 is arranged at this first area 11 of this printed circuit board (PCB) 10 and makes the pliability of this first area 11 significantly reduce, so the pliability of this first area 11 is far below this second area 12; In addition; This support plate 20 adopts silicon (si1ica) materials to be made, because the silicon material has the characteristic that is difficult for buckling deformation, therefore is arranged at silicon system support plate and this support plate 20 when being arranged at this first area 11 of this printed circuit board (PCB) 10 when this light link component 30; The situation that this light link component 30 does not have inclination produces, so light path does not have the skewness generation.
Please consult Fig. 4 again, when this light link component 30 be a light emitting diode (Light-Emitting Diode, LED) or a laser diode (Laser Diode; LD) time, this light link component 30 is by these drive IC 40 drivings and make these light link component 30 width of cloth penetrate light, and light contacts this catoptron 52 via this first optical channel 515; In addition, this first optical channel 515 is vertical setting with this second optical channel 516, so light contacts this catoptron 52 via this first optical channel 515; Because this catoptron 52 is a completely reflecting mirror; Therefore light is advanced via the reflection of completely reflecting mirror and towards this second optical channel 516, and last light receives via the optical fiber (figure does not draw) of outside, to reach the effect that light sends; See also Fig. 5; When this light link component 30 be an optical detector (photo-detector, in the time of PD), light gets into this second optical channel 516 and contacts this catoptron 52 by this optical interconnection delivery module 100 outside optical fiber (figure does not draw); Because this catoptron 52 is a completely reflecting mirror; Therefore light is advanced towards this optical transmitter components 30 via the reflection of completely reflecting mirror and via this first optical channel 515, and last light is received by optical detector, to reach the effect of light-receiving.
This printed circuit board (PCB) 10 is easy to produce unbalanced stress in high-temperature technology and the phenomenon that causes the circuit board warpage; The utility model is arranged at this first area 11 of this printed circuit board (PCB) 10 and makes the pliability of this first area 11 significantly reduce by this support plate 20; When this light link component 30 is arranged at this support plate 20; Because the pliability of this first area 11 of this printed circuit board (PCB) 10 is much smaller than this second area 12; Therefore this light link component 30 situation of not having an inclination produces, so when carrying out light transmission, light path can not produce skewness.
The above; It only is the preferred embodiment of the utility model; Not being that the utility model is done any pro forma restriction, though the utility model with the preferred embodiment exposure as above, yet is not in order to limit the utility model; Anyly be familiar with the professional and technical personnel; In not breaking away from the utility model technical scheme scope, make a little change or be modified to the equivalent embodiment of equivalent variations when the technology contents of above-mentioned announcement capable of using, be the content that does not break away from the utility model technical scheme in every case;, all still belong in the scope of the utility model technical scheme any simple modification, equivalent variations and modification that above embodiment did according to the technical spirit of the utility model.

Claims (10)

1. optical interconnection delivery module is characterized in that it comprises:
One printed circuit board (PCB), it has a first area and a second area;
One support plate, it is arranged at this first area of this printed circuit board (PCB), so that the pliability of this first area is less than the pliability of this second area, this support plate has a first surface;
At least one smooth link component, it is arranged at this first surface of this support plate, and this light link component electrically connects this printed circuit board (PCB); And
One light guide module; It has a housing and at least one catoptron; This housing of this light guide module is arranged at this support plate and this light link component of cover cap, and this housing has a upper surface, a lower surface, is arranged with first groove, one first optical channel and one second optical channel in this lower surface, and this first optical channel is communicated with this first groove and this second optical channel; This catoptron is arranged at this first optical channel, this light link component by this first optical channel to should catoptron.
2. optical interconnection delivery module according to claim 1 is characterized in that this light link component can electrically connect by this support plate and this printed circuit board (PCB).
3. optical interconnection delivery module according to claim 1 is characterized in that it has a drive IC in addition, and this drive IC is arranged at this second area of this printed circuit board (PCB) and electrically connects this printed circuit board (PCB).
4. optical interconnection delivery module according to claim 3 is characterized in that this light link component can electrically connect by this support plate and this drive IC.
5. optical interconnection delivery module according to claim 1 is characterized in that this light link component has a second surface, and this catoptron has an inclined-plane, and this second surface of this light link component is towards this inclined-plane of this catoptron.
6. optical interconnection delivery module according to claim 1 is characterized in that this first optical channel and this second optical channel are vertical setting.
7. optical interconnection delivery module according to claim 1 is characterized in that this first groove has a madial wall, and this support plate has a side, and this madial wall of this first groove is attached at this side of this support plate.
8. optical interconnection delivery module according to claim 1 is characterized in that this light link component is a light emitting diode or a laser diode.
9. optical interconnection delivery module according to claim 1 is characterized in that this support plate is made by the silicon material.
10. optical interconnection delivery module according to claim 1 is characterized in that this light link component is an optical detector.
CN2011205767488U 2011-12-26 2011-12-26 Optical interconnect transmission module Expired - Fee Related CN202421561U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011205767488U CN202421561U (en) 2011-12-26 2011-12-26 Optical interconnect transmission module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011205767488U CN202421561U (en) 2011-12-26 2011-12-26 Optical interconnect transmission module

Publications (1)

Publication Number Publication Date
CN202421561U true CN202421561U (en) 2012-09-05

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ID=46746309

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011205767488U Expired - Fee Related CN202421561U (en) 2011-12-26 2011-12-26 Optical interconnect transmission module

Country Status (1)

Country Link
CN (1) CN202421561U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103176250A (en) * 2011-12-26 2013-06-26 环隆科技股份有限公司 Optical interconnection transmission module
CN107179584A (en) * 2016-03-10 2017-09-19 源杰科技股份有限公司 Optical conenctor
CN109613661A (en) * 2018-08-15 2019-04-12 苏州旭创科技有限公司 Optical module

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103176250A (en) * 2011-12-26 2013-06-26 环隆科技股份有限公司 Optical interconnection transmission module
CN107179584A (en) * 2016-03-10 2017-09-19 源杰科技股份有限公司 Optical conenctor
CN107179584B (en) * 2016-03-10 2019-06-14 源杰科技股份有限公司 Optical conenctor
CN109613661A (en) * 2018-08-15 2019-04-12 苏州旭创科技有限公司 Optical module
CN109613661B (en) * 2018-08-15 2024-05-07 苏州旭创科技有限公司 Optical module

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120905

Termination date: 20181226

CF01 Termination of patent right due to non-payment of annual fee