CN103176250A - Optical interconnection transmission module - Google Patents
Optical interconnection transmission module Download PDFInfo
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- CN103176250A CN103176250A CN2011104612662A CN201110461266A CN103176250A CN 103176250 A CN103176250 A CN 103176250A CN 2011104612662 A CN2011104612662 A CN 2011104612662A CN 201110461266 A CN201110461266 A CN 201110461266A CN 103176250 A CN103176250 A CN 103176250A
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Abstract
The invention relates to an optical interconnection transmission module which comprises a printed circuit board, a carrier, at least one optical interconnecting component and a light guide module. The printed circuit board is provided with a first area and a second area. The carrier is disposed on the first area of the printed circuit board to allow flexibility of the first area to be smaller than that of the second area. The carrier is provided with a first surface. The optical interconnecting component is disposed on the first surface and electrically connected the printed circuit board. The light guide module is provided with a shell and at least one reflecting mirror, the shell is disposed on the carrier and covers the light interconnecting component, the shell is provided with an upper surface, a lower surface, a first groove recessed on the lower surface, a first optical channel and a second optical channel, the first optical channel is communicated with the first groove and the second optical channel, the reflecting mirrors are disposed in the first optical channel, and the optical interconnecting component corresponds to the reflecting mirrors through the first optical channel.
Description
Technical field
The present invention relates to a kind of optical interconnection delivery module, particularly relate to a kind of optical interconnection delivery module of avoiding the transmission ray deflection.
Background technology
see also shown in Figure 1, existing known optical interconnection delivery module 200 has a printed circuit board (PCB) 210, a plurality of optical transmitter components 220, one cover plate 230, a plurality of lens 240 and a plurality of optical fiber 250, those optical transmitter components 220 and this cover plate 230 are arranged at this printed circuit board (PCB) 210, and this optical transmitter components 220 is electrically connected this printed circuit board (PCB) 210, respectively this optical transmitter components 220 respectively has a light-emitting area 221, respectively this optical fiber 250 respectively has an end face 251, respectively this light-emitting area 221 and respectively this end face 251 towards these lens 240 respectively, those optical transmitter components 220 drive and radius by this printed circuit board (PCB) 210, light transfers to respectively this optical fiber 250 via those lens 240 focusing, only, this printed circuit board (PCB) 210 is easy to the stress skewness and produces the circuit board warpage in high-temperature technology, if those optical transmitter components 220 directly are arranged at this printed circuit board (PCB) 210, the light that its width is penetrated will very easily produce skewness, thereby cause light transmissioning efficiency significantly to reduce.
This shows, above-mentioned existing optical interconnection delivery module obviously still has inconvenience and defective, and demands urgently further being improved in structure and use.In order to solve the problem of above-mentioned existence, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, completed by development but have no for a long time applicable design always, and common product does not have appropriate structure to address the above problem, this is obviously the problem that the anxious wish of relevant dealer solves.Therefore how to found a kind of novel optical interconnection delivery module, real one of the current important research and development problem that belongs to, also becoming the current industry utmost point needs improved target.
Summary of the invention
The object of the invention is to, overcome the defective that existing optical interconnection delivery module exists, and provide a kind of novel optical interconnection delivery module, be arranged at this first area of this printed circuit board (PCB) and make the pliability of this first area significantly reduce by this support plate, when this light link component is arranged at this support plate, due to the pliability of this first area of this printed circuit board (PCB) much smaller than this second area, therefore this light link component does not have the situation generation of inclination, therefore when carrying out light transmission, light path can not produce skewness.
The object of the invention to solve the technical problems realizes by the following technical solutions.According to a kind of optical interconnection delivery module that the present invention proposes, it comprises: a printed circuit board (PCB), and it has a first area and a second area; One support plate, it is arranged at this first area of this printed circuit board (PCB), so that the pliability of this first area is less than the pliability of this second area, this support plate has a first surface; At least one smooth link component, it is arranged at this first surface of this support plate, and this light link component is electrically connected this printed circuit board (PCB); An and light guide module, it has a housing and at least one catoptron, this housing of this light guide module is arranged at this support plate and this light link component of cover cap, this housing has a upper surface, a lower surface, is arranged with the first groove, one first optical channel and one second optical channel in this lower surface, this first optical channel is communicated with this first groove and this second optical channel, this catoptron is arranged at this first optical channel, this light link component by this first optical channel to should catoptron.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid optical interconnection delivery module, wherein this light link component is electrically connected by this support plate and this printed circuit board (PCB).
Aforesaid optical interconnection delivery module, wherein this circuit module separately has a drive IC, and this drive IC is arranged at this second area of this printed circuit board (PCB) and is electrically connected this printed circuit board (PCB).
Aforesaid optical interconnection delivery module, wherein this light link component is electrically connected by this support plate and this drive IC.
Aforesaid optical interconnection delivery module, wherein this light link component has a second surface, and this catoptron has an inclined-plane, and this second surface of this light link component is towards this inclined-plane of this catoptron.
Aforesaid optical interconnection delivery module, wherein this first optical channel and this second optical channel are vertical setting.
Aforesaid optical interconnection delivery module, wherein this first groove has a madial wall, and this support plate has a side, and this madial wall of this first groove is attached at this side of this support plate.
Aforesaid optical interconnection delivery module, wherein this light link component is a light emitting diode (light-emitting diode) or a laser diode (laser diode).
Aforesaid optical interconnection delivery module, wherein this support plate is to be made by silicon (silica) material.
Aforesaid optical interconnection delivery module, wherein this light link component is an optical detector (photo-detector).
The present invention compared with prior art has obvious advantage and beneficial effect.By technique scheme, optical interconnection delivery module of the present invention has following advantages and beneficial effect at least: the present invention is arranged at this first area of this printed circuit board (PCB) and makes the pliability of this first area significantly reduce by this support plate, when this light link component is arranged at this support plate, due to the pliability of this first area of this printed circuit board (PCB) much smaller than this second area, therefore this light link component does not have the situation generation of inclination, therefore when carrying out light transmission, light path can not produce skewness.
Above-mentioned explanation is only the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of instructions, and for above and other purpose of the present invention, feature and advantage can be become apparent, below especially exemplified by preferred embodiment, and the cooperation accompanying drawing, be described in detail as follows.
Description of drawings
Fig. 1 is the side view that has known optical interconnection delivery module now.
Fig. 2 is according to a preferred embodiment of the present invention, a kind of exploded perspective view of optical interconnection delivery module.
Fig. 3 is according to a preferred embodiment of the present invention, the combination stereogram of this optical interconnection delivery module.
Fig. 4 is according to a preferred embodiment of the present invention, a side sectional view of this optical interconnection delivery module.
Fig. 5 is according to a preferred embodiment of the present invention, the another side cut-open view of this optical interconnection delivery module.
100: the optical interconnection delivery module
10: printed circuit board (PCB)
11: first area 12: second area
20: support plate
21: first surface 22: side
30: the light link component
31: second surface
40: drive IC
50: light guide module
51: housing 511: upper surface
512: 513: the first grooves of lower surface
513a: 514: the second grooves of madial wall
516: the second optical channels of 515: the first optical channels
52: catoptron 521: inclined-plane
200: the optical interconnection delivery module
210: soft surname printed circuit board (PCB) 220: optical transmitter components
221: light-emitting area 230: cover plate
240: lens 250: optical fiber
251: end face
Embodiment
Reach for further setting forth the present invention technological means and the effect that predetermined goal of the invention is taked, below in conjunction with accompanying drawing and preferred embodiment, its embodiment of optical interconnection delivery module, structure, feature and effect thereof to foundation the present invention proposes are described in detail as follows.
see also Fig. 2, Fig. 3 and shown in Figure 4, it is a preferred embodiment of the present invention, a kind of optical interconnection delivery module 100 comprises a printed circuit board (PCB) 10, one support plate 20, at least one smooth link component 30 and a light guide module 50, this printed circuit board (PCB) 10 has a first area 11 and a second area 12, this support plate 20 is arranged at this first area 11 of this printed circuit board (PCB) 10, so that the pliability of this first area 11 is less than this second area 12, this support plate 20 has a first surface 21, this light link component 30 is arranged at this first surface 21 of this support plate 20, in the present embodiment, this light link component 30 is electrically connected this printed circuit board (PCB) 10, preferably, this light link component 30 can be electrically connected by this support plate 20 and this printed circuit board (PCB) 10, this light guide module 50 has a housing 51 and at least one catoptron 52, this housing 51 of this light guide module 50 is arranged at this support plate 20 and this light link component 30 of cover cap, this housing 51 has a upper surface 511, a lower surface 512, one is arranged with the first groove 513 in this lower surface 512, one first optical channel 515 and one second optical channel 516, this first optical channel is communicated with this first groove 513 and this second optical channel 516, this catoptron 52 is arranged at this first optical channel 515, and this light link component 30 should catoptron 52 by 515 pairs of this first optical channels, preferably, this housing 51 separately has second groove 514 that is arranged with in this upper surface 511, this first optical channel 515 is communicated with this second groove 514, this catoptron 52 is installed in this first optical channel 515 by this second groove 514, please consult again the 2nd figure, this optical interconnection delivery module 100 separately has a drive IC 40, this drive IC 40 is arranged at this second area 12 of this printed circuit board (PCB) 10 and is electrically connected this printed circuit board (PCB) 10, in the present embodiment, this light link component 30 can be electrically connected by this support plate 20 and this drive IC 40.
please consult again Fig. 4, this light link component 30 has a second surface 31, this catoptron 52 has an inclined-plane 521, this second surface 31 of this light link component 30 is towards this inclined-plane 521 of this catoptron 52, in addition, this first groove 513 has a madial wall 513a, this support plate 20 has a side 22, this madial wall 513a of this first groove 513 is attached at this side 22 of this support plate 20, attach each other by this madial wall 513a and this side 22, but the structural stability of this support plate 20 of efficient hardening and this housing 51, in semiconductor technology, this printed circuit board (PCB) 10 is through overbaking (Curing), after the high temperature techniques such as pressing (Lamination) and thermal cycle (Thermal cycle), this printed circuit board (PCB) 10 is stress skewness and produce warping phenomenon very easily, if this light link component 30 directly is arranged at this printed circuit board (PCB) 10, its warping phenomenon will cause transmission or the receiving light path deflection of this light link component 30, make light transmissioning efficiency significantly reduce, be head it off, in the present embodiment, this support plate 20 is arranged at this first area 11 of this printed circuit board (PCB) 10 and makes the pliability of this first area 11 significantly reduce, therefore the pliability of this first area 11 is far below this second area 12, in addition, this support plate 20 adopts silicon (silica) material to be made, has the characteristic that is difficult for buckling deformation due to the silicon material, therefore when this light link component 30 is arranged at silicon support plate processed and this support plate 20 and is arranged at this first area 11 of this printed circuit board (PCB) 10, the situation that this light link component 30 does not have inclination produces, therefore light path does not have the skewness generation.
please consult again Fig. 4, when this light link component 30 is a light emitting diode (Light-Emitting Diode, LED) or one laser diode (Laser Diode, LD) time, this light link component 30 drives and makes these light link component 30 width penetrate light by this drive IC 40, light contacts this catoptron 52 via this first optical channel 515, in addition, this first optical channel 515 is vertical setting with this second optical channel 516, therefore light contacts this catoptron 52 via this first optical channel 515, because this catoptron 52 is a completely reflecting mirror, therefore light is via the reflection of completely reflecting mirror and advance towards this second optical channel 516, last light receives via the optical fiber (figure does not draw) of outside, the effect that sends to reach light, see also Fig. 5, when this light link component 30 is an optical detector (photo-detector, PD) time, light enters this second optical channel 516 and contacts this catoptron 52 by the optical fiber (figure does not draw) of this optical interconnection delivery module 100 outsides, because this catoptron 52 is a completely reflecting mirror, therefore light is via the reflection of completely reflecting mirror and advance towards this optical transmitter components 30 via this first optical channel 515, last light is received by optical detector, to reach the effect of light-receiving.
This printed circuit board (PCB) 10 is easy to produce unbalanced stress in high-temperature technology and the phenomenon that causes the circuit board warpage, the present invention is arranged at this first area 11 of this printed circuit board (PCB) 10 and makes the pliability of this first area 11 significantly reduce by this support plate 20, when this light link component 30 is arranged at this support plate 20, due to the pliability of this first area 11 of this printed circuit board (PCB) 10 much smaller than this second area 12, therefore this light link component 30 does not have the situation generation of inclination, therefore when carrying out light transmission, light path can not produce skewness.
the above, it is only preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, although the present invention discloses as above with preferred embodiment, yet be not to limit the present invention, any those skilled in the art, within not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, any simple modification that foundation technical spirit of the present invention is done above embodiment, equivalent variations and modification, all still belong in the scope of technical solution of the present invention.
Claims (10)
1. optical interconnection delivery module is characterized in that it comprises:
One printed circuit board (PCB), it has a first area and a second area;
One support plate, it is arranged at this first area of this printed circuit board (PCB), so that the pliability of this first area is less than the pliability of this second area, this support plate has a first surface;
At least one smooth link component, it is arranged at this first surface of this support plate, and this light link component is electrically connected this printed circuit board (PCB); And
One light guide module, it has a housing and at least one catoptron, this housing of this light guide module is arranged at this support plate and this light link component of cover cap, this housing has a upper surface, a lower surface, is arranged with the first groove, one first optical channel and one second optical channel in this lower surface, this first optical channel is communicated with this first groove and this second optical channel, this catoptron is arranged at this first optical channel, this light link component by this first optical channel to should catoptron.
2. optical interconnection delivery module according to claim 1, is characterized in that wherein this light link component is electrically connected by this support plate and this printed circuit board (PCB).
3. optical interconnection delivery module according to claim 1, is characterized in that wherein this circuit module separately has a drive IC, and this drive IC is arranged at this second area of this printed circuit board (PCB) and is electrically connected this printed circuit board (PCB).
4. optical interconnection delivery module according to claim 3, is characterized in that wherein this light link component is electrically connected by this support plate and this drive IC.
5. optical interconnection delivery module according to claim 1, is characterized in that wherein this light link component has a second surface, and this catoptron has an inclined-plane, and this second surface of this light link component is towards this inclined-plane of this catoptron.
6. optical interconnection delivery module according to claim 1 is characterized in that wherein this first optical channel and this second optical channel are vertical setting.
7. optical interconnection delivery module according to claim 1, is characterized in that, wherein this first groove has a madial wall, and this support plate has a side, and this madial wall of this first groove is attached at this side of this support plate.
8. optical interconnection delivery module according to claim 1, is characterized in that wherein this light link component is a light emitting diode or a laser diode.
9. optical interconnection delivery module according to claim 1, is characterized in that wherein this support plate is to be made by the silicon material.
10. optical interconnection delivery module according to claim 1, is characterized in that wherein this light link component is an optical detector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104612662A CN103176250A (en) | 2011-12-26 | 2011-12-26 | Optical interconnection transmission module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104612662A CN103176250A (en) | 2011-12-26 | 2011-12-26 | Optical interconnection transmission module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103176250A true CN103176250A (en) | 2013-06-26 |
Family
ID=48636226
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011104612662A Pending CN103176250A (en) | 2011-12-26 | 2011-12-26 | Optical interconnection transmission module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103176250A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104280835A (en) * | 2013-07-11 | 2015-01-14 | 鸿富锦精密工业（深圳）有限公司 | Optical coupling module and photovoltaic conversion device |
| CN106034000A (en) * | 2015-03-12 | 2016-10-19 | 中兴通讯股份有限公司 | Optical signal transmission system, optical signal transmission method and communication device |
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| CN1779970A (en) * | 2004-11-22 | 2006-05-31 | 安捷伦科技有限公司 | Optical rotation system for optoelectronic module |
| US20090154877A1 (en) * | 2007-12-12 | 2009-06-18 | Enplas Corporation | Optically coupled device and optical module including optically coupled device |
| CN102162885A (en) * | 2011-05-03 | 2011-08-24 | 苏州旭创科技有限公司 | Parallel optical transceiving component for high-speed transmission |
| CN102183829A (en) * | 2011-05-03 | 2011-09-14 | 苏州旭创科技有限公司 | Light receiving and transmitting assembly for broadband parallel optics |
| CN202083815U (en) * | 2011-05-03 | 2011-12-21 | 苏州旭创科技有限公司 | Photic transmit-receive assembly for parallel transmission |
| CN202421561U (en) * | 2011-12-26 | 2012-09-05 | 环隆科技股份有限公司 | Optical interconnect transmission module |
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2011
- 2011-12-26 CN CN2011104612662A patent/CN103176250A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1779970A (en) * | 2004-11-22 | 2006-05-31 | 安捷伦科技有限公司 | Optical rotation system for optoelectronic module |
| US20090154877A1 (en) * | 2007-12-12 | 2009-06-18 | Enplas Corporation | Optically coupled device and optical module including optically coupled device |
| CN102162885A (en) * | 2011-05-03 | 2011-08-24 | 苏州旭创科技有限公司 | Parallel optical transceiving component for high-speed transmission |
| CN102183829A (en) * | 2011-05-03 | 2011-09-14 | 苏州旭创科技有限公司 | Light receiving and transmitting assembly for broadband parallel optics |
| CN202083815U (en) * | 2011-05-03 | 2011-12-21 | 苏州旭创科技有限公司 | Photic transmit-receive assembly for parallel transmission |
| CN202421561U (en) * | 2011-12-26 | 2012-09-05 | 环隆科技股份有限公司 | Optical interconnect transmission module |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104280835A (en) * | 2013-07-11 | 2015-01-14 | 鸿富锦精密工业（深圳）有限公司 | Optical coupling module and photovoltaic conversion device |
| CN106034000A (en) * | 2015-03-12 | 2016-10-19 | 中兴通讯股份有限公司 | Optical signal transmission system, optical signal transmission method and communication device |
| CN106034000B (en) * | 2015-03-12 | 2018-06-22 | 南京中兴软件有限责任公司 | Light signal transmission system, method and optical communication equipment |
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Application publication date: 20130626 |