TWM460379U - Multi-beam laser device - Google Patents

Abstract

A multi-beam laser device includes a package base; a submount mounted on the package base; and a plurality of laser dies mounted on the submount; wherein a specified angle formed by two directions of laser beams is between 2 DEG to 180 DEG.

Description

Multi-beam laser element

The present invention relates to a laser element, and more particularly to a multi-beam laser element.

Today's laser diodes can emit multi-beam lasers. Taking a two-beam laser diode as an example, it is applied to an optical pickup in an optical disc player or a computer disc drive. Basically, a laser diode in the optical pickup can generate a laser beam onto the optical disk, and the laser beam reflected by the optical disk can be analyzed to obtain information in the optical disk. Taking a CD player for a computer as an example, a laser diode emits a CD laser beam when processing a CD disc; when processing a DVD disc, the laser diode emits a DVD laser beam.

Furthermore, the laser diode applied to the optical pickup has two laser beams that are parallel to each other and whose angle does not exceed 2 degrees.

In the case of a laser diode with more beams, a laser bar on a laser printer can simultaneously emit more laser beams. However, the laser beams on the laser strips also need to be parallel to each other. The angle of the laser beam must be less than 2 degrees.

As can be seen from the above description, the plurality of laser beams emitted by the multi-beam laser diode or the laser bar are parallel to each other.

This creation is directed to a multi-beam laser element that can simultaneously emit multiple laser beams and that none of the two laser beams are parallel to each other. In the preferred case, the angle between any two laser beams can be set between 2 and 180 degrees.

The present invention relates to a multi-beam laser component, comprising: a package base; an adhesive substrate is fixed on the package base; and a plurality of laser crystal grains fixed on the adhesive substrate, and the lasers The grain system emits a plurality of laser beams; wherein an angle between any two of the laser beams is greater than or equal to 2 degrees and less than or equal to 180 degrees.

The present invention relates to a multi-beam laser element, comprising: a package base; a first adhesive substrate fixed on the package base; a first laser die fixed on the first adhesive substrate, And the first laser beam emits a first laser beam; a second adhesive substrate is fixed on the package base; and a second laser die is fixed on the second adhesive substrate, and the The second laser element emits a second laser beam; wherein the direction of the first laser beam forms a specific angle with the direction of the second laser beam.

The present invention relates to a multi-beam laser element, comprising: a package base; a first laser unit fixed on the package base, and the first laser unit emits a first laser beam; And a second laser unit fixed to the package base, and the second laser unit emits a second laser beam; wherein the direction of the first laser beam and the second laser beam The direction forms a specific angle.

Furthermore, in the present invention, the package base is a protrusion on a base in a transistor appearance open package; or the package base is a base in a lead frame package.

In order to better understand the above and other aspects of the present invention, the preferred embodiments are described below, and in conjunction with the drawings, the detailed description is as follows:

410‧‧‧round metal base

410a‧‧‧protrusion

420a, 420b, 420c, 420d‧‧‧ pins

450‧‧‧Adhesive substrate

561‧‧‧First laser beam

562‧‧‧First laser grain

563‧‧‧second laser beam

564‧‧‧Second laser grain

565‧‧‧ Third laser beam

566‧‧‧ Third laser grain

567‧‧‧fourth laser beam

568‧‧‧4th laser grain

569‧‧‧5th laser beam

570‧‧‧Laser unit

572‧‧‧reflecting elements

574‧‧‧Laser grain

621‧‧‧5th laser beam

622‧‧‧ fifth laser unit

623‧‧‧First laser beam

624‧‧‧First laser unit

625‧‧‧second laser beam

626‧‧‧second laser unit

627‧‧‧the third laser beam

629‧‧‧4th laser beam

630‧‧‧First adhesive substrate

632‧‧‧Second adhesive substrate

641‧‧‧First laser beam

642‧‧‧First laser grain

643‧‧‧second laser beam

645‧‧‧ Third laser beam

646‧‧‧second laser grain

647‧‧‧fourth laser beam

650‧‧‧third laser grain

651‧‧‧5th laser beam

660‧‧‧ plastic case

662‧‧‧Base

664a, 664b, 664c‧‧‧ pins

670‧‧‧Adhesive substrate

671‧‧‧First laser beam

672‧‧‧First laser grain

673‧‧‧second laser beam

674‧‧‧second laser grain

675‧‧‧the third laser beam

676‧‧‧third laser grain

FIG. 1 is a schematic diagram of an open appearance package of a transistor.

Figure 2A shows a first embodiment of the novel multi-beam laser element.

Figure 2B depicts a second embodiment of the novel multi-beam laser element.

Figure 2C depicts a third embodiment of the novel multi-beam laser element.

Figure 3 shows the multi-beam laser element shown in the lead frame package. intention.

Since conventional multi-beam laser diodes are only capable of emitting mutually parallel laser beams, it is impossible to produce a laser beam having a specific angle. Therefore, this creation aims to develop a multi-beam laser element that can emit a specific angle. Moreover, the laser element of the present invention fixes a plurality of laser die to the package base, so that the laser crystal grains on the package base generate laser beams in different directions, thereby completing the small volume. Multi-beam laser components.

Please refer to FIG. 1 , which is a schematic diagram of a transistor appearance open package (Transistor Outline package, abbreviated as TO package). Wherein, the circular metal base 410 has a protruding portion 410a. A plurality of pins 420a, 420b, 420c, 420d pass through the metal base 410 for transmitting electrical signals. Furthermore, a submount 450 or a plurality of adhesive substrates may be fixed to the projections 410a of the circular metal base 410. According to the embodiment of the present invention, a plurality of laser dies (not shown) are fixed to the adhesive substrate 450 and electrically connected to the selective and plurality of pins 420a, 420b, 420c, 420d. Basically, the manner of electrical connection can utilize various methods, such as a wire bond, etc., and details are not described herein again. The following description only shows the arrangement relationship between the adhesive substrate 450 and the protruding portion 410a. The circular metal base 410 and the plurality of supporting legs 420a, 420b, 420c, and 420d are not illustrated.

Please refer to FIG. 2A, which illustrates a first embodiment of the novel multi-beam laser element. An adhesive substrate 450 is fixed to the projection 410, and four laser crystal grains 562, 564, 566, 560 and a laser unit 570 are fixed to a surface of the adhesive substrate 450. Wherein, the first laser beam 562 emits the first laser beam 561, the second laser crystal grain 564 emits the second laser beam 563, the third laser crystal grain 566 emits the third laser beam 565, and the fourth laser beam The shot die 568 emits a fourth laser beam 567; and the first laser beam 561, the second laser beam 563, the third laser beam 565, and the fourth laser beam 567 are on the same plane, and This plane is divided into four quadrants.

Further, the laser element unit 570 emits a fifth laser beam 569, and the fifth laser beam 569 is perpendicular to the plane. That is, the laser unit 569 is perpendicular to the first laser beam 561, the second laser beam 563, the third laser beam 565, and the fourth laser beam 567. The laser unit 570 includes a reflective element 572 and a laser die 574. As can be seen from Figure 3A, the direction of the beam is varied via reflective element 572 such that the fifth laser beam 569 emitted by laser unit 570 can be perpendicular to the plane.

The multi-beam laser element described above is exemplified by a five-beam laser element. Of course, the multi-beam laser element of Figure 2A can also be suitably modified to become a four-beam laser element, a three-beam laser element, or a two-beam laser element. For example, two of the above-described laser grains 562, 564, 566, 568 and laser unit 570 will be removed to form a three-beam laser element.

Please refer to FIG. 2B, which illustrates a second embodiment of the novel multi-beam laser element. One of the six surface protrusions 410a is fixed to the base (not shown), and the other five surfaces are fixed to a laser unit 622, 624, 626, wherein two of the laser units are fixedly protruded The back of the portion 410a cannot be drawn. Moreover, the structure of each of the laser units 622, 624, 626 is the same. Taking the fifth laser unit 622 as an example, it includes a reflective element 623 and a laser die 624.

Furthermore, the first laser unit 624 emits the first laser beam 623, the second laser unit 626 emits the second laser beam 625, and the third laser unit (not shown) emits the third laser beam 627, A fourth laser unit (not shown) emits a fourth laser beam 629. Since the protrusion 410a is a rectangular parallelepiped, the first laser beam 623, the second laser beam 625, the third laser beam 627, and the fourth laser beam 629 are on the same plane, and the plane is divided into four. Quadrant. Similarly, the fifth laser unit 622 emits a fifth laser beam 621, and the fifth laser beam 621 is perpendicular to this plane. That is, the fifth laser beam 621 is perpendicular to the first laser beam 623, the second laser beam 625, the third laser beam 627, and the fourth laser beam 629.

The multi-beam laser element described above is exemplified by a five-beam laser element. Of course, the multi-beam laser element of Figure 2B can also be modified as appropriate. Become a four-beam laser element, a three-beam laser element, or a two-beam laser element. I will not repeat them here.

Please refer to FIG. 2C, which illustrates a third embodiment of the novel multi-beam laser element. The first surface of the protruding portion 410a is fixed with a first adhesive substrate 630, the second surface is fixed with a second adhesive substrate 632, and the first surface and the second surface of the protruding portion 410a are perpendicular to each other.

Furthermore, two laser grains 642, 646 are fixed on the first adhesive substrate 630. The two laser grains 642 and 646 are laser grains with double-sided light output. As shown in FIG. 2C, the first laser beam 642 emits a first laser beam 641 and a second laser beam 643. The angle between the first laser beam 641 and the second laser beam 643 is 180 degrees; The laser die 646 emits a third laser beam 645 and a fourth laser beam 647. The angle between the third laser beam 646 and the fourth laser beam 647 is 180 degrees. Furthermore, the first laser beam 641, the second laser beam 643, the third laser beam 645, and the fourth laser beam 647 are on the same plane, and the plane is divided into four quadrants.

Furthermore, a third laser die 650 is fixed on the second adhesive substrate 632. The third laser crystal 650 emits a fifth laser beam 651, and the fifth laser beam 651 is perpendicular to the plane. That is, the fifth laser beam 651 is perpendicular to the first laser beam 641, the second laser beam 643, the third laser beam 645, and the fourth laser beam 647.

The multi-beam laser element described above is exemplified by a five-beam laser element. Of course, the multi-beam laser element of Figure 2C can also be suitably modified to become a four-beam laser element, a three-beam laser element, or a two-beam laser element. For example, removing the second adhesive substrate 632 and the third laser die 650 can form a four-beam laser element. The three-beam laser element can be formed by replacing the first laser die 642 with the second laser die 646 with a single-sided light-emitting die, or a three-beam laser can be formed after removing the second laser die 646. Shooting components. The way it changes is very diverse and will not be repeated here.

Please refer to Figure 3, which shows the use of a lead frame. A schematic diagram of a multi-beam laser element completed by a package. The plastic housing 660 of the leadframe package structure includes a base 662 and a plurality of pins 664a, 664b, and 664c extending through the plastic housing 660. The pin 664b is connected to the base 622 as a reference voltage base, and the reference voltage can be a ground voltage. Furthermore, the adhesive substrate 670 is fixed to the base 662.

As shown in FIG. 3, three laser grains 672, 674, 676 are fixed to a surface of the adhesive substrate 670. Wherein, the first laser crystal 672 emits a first laser beam 671, the second laser crystal 674 emits a second laser beam 673, and the third laser crystal grain 676 emits a third laser beam 675; The laser beam 671 is perpendicular to the second laser beam 673 and the third laser beam 675.

Of course, the multi-beam laser element of the above FIG. 3 is exemplified by a three-beam laser element. Similarly, if a laser unit 570 as shown in FIG. 2A is added to the adhesive substrate 670, a four-beam laser element can be formed. Of course, the present invention can also modify the first laser crystal grain 671 to the laser unit 570 as in FIG. 2A; and change the second laser crystal grain 674 and the third laser crystal grain 676 to two light emitting surfaces. The laser grains are properly adjusted in position. Thus, the lead frame package structure can be used to complete the novel five-beam laser element.

As can be seen from the above description, the present invention fixes a plurality of laser elements to an adhesive substrate before packaging, and appropriately adjusts the position of the laser elements to form a multi-beam laser element. The present invention is not limited to the TO package and the lead frame package, and can be applied to a chip on board. Therefore, the novel has the advantages of small size and low cost. Therefore, the application of the novel multi-beam laser element to the laser level will have greater advantages.

Furthermore, the material of the adhesive substrate of the present invention may be an adhesive substrate of a metal material or a ceramic material. Furthermore, in the present invention, the package base can be used as a general term for the projection 410a or the base 662 in the lead frame package.

It can be seen from the above description that the angle between any two laser beams emitted by the multi-beam laser element of the present invention is not about 90 degrees or about 180 degrees. However, the present invention is not limited thereto, and the novel multi-beam laser element has The position of the laser grains can be adjusted such that the angle between any two of the laser beams is adjusted to be greater than or equal to 2 degrees and less than or equal to 180 degrees. .

In summary, although the present invention has been disclosed above in the preferred embodiments, it is not intended to limit the present invention. Those skilled in the art can make various changes and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of this new type is subject to the definition of the scope of the patent application.

410a‧‧‧protrusion

450‧‧‧Adhesive substrate

561‧‧‧First laser beam

562‧‧‧First laser grain

563‧‧‧second laser beam

564‧‧‧Second laser grain

565‧‧‧ Third laser beam

566‧‧‧ Third laser grain

567‧‧‧fourth laser beam

568‧‧‧4th laser grain

569‧‧‧5th laser beam

570‧‧‧Laser unit

572‧‧‧reflecting elements

574‧‧‧Laser grain

Claims (13)

A multi-beam laser element includes: a package base; an adhesive substrate is fixed on the package base; and a plurality of laser crystal grains fixed on the adhesive substrate, and the plurality of laser crystal grains emit a plurality A laser beam; wherein an angle between any two of the laser beams is greater than or equal to 2 degrees and less than or equal to 180 degrees. The multi-beam laser element according to claim 1, wherein the package base is a protrusion on a base in a transistor appearance open package; or the package base is a wire A base in the package. The multi-beam laser element according to claim 1, wherein the adhesive substrate is a metal material or an adhesive substrate of a ceramic material. The multi-beam laser element according to claim 3, wherein a part of the laser crystal grains are laser grains with two sides emitting light. A multi-beam laser element includes: a package base; a first adhesive substrate fixed on the package base; a first laser die fixed on the first adhesive substrate, and the first The first laser beam is emitted from the first laser beam; a second adhesive substrate is fixed on the package base; and a second laser die is fixed on the second adhesive substrate, and the second laser element is A second laser beam is emitted; wherein the direction of the first laser beam forms a specific angle with the direction of the second laser beam. The multi-beam laser element according to claim 5, wherein the package base is a protrusion on a base in a transistor appearance open package; or the package base is a wire A base in the package. The multi-beam laser element according to claim 5, wherein the first adhesive substrate and the second adhesive substrate are a metal material or an adhesive substrate of a ceramic material. The multi-beam laser element of claim 5, wherein the specific angle is greater than or equal to 2 degrees and less than or equal to 180 degrees. The multi-beam laser element of claim 5, wherein the first laser crystal grain or the second laser crystal grain is a laser crystal grain with two sides emitting light. A multi-beam laser element includes: a package base; a first laser unit fixed to the package base, and the first laser unit emits a first laser beam; and a second mine a second unit of the laser beam, wherein the second laser beam emits a second laser beam; wherein the direction of the first laser beam forms a specific angle with the direction of the second laser beam . The multi-beam laser element according to claim 10, wherein the package base is a protrusion on a base in a transistor appearance open package; or the package base is a wire A base in the package. The multi-beam laser element of claim 10, wherein the specific angle is greater than or equal to 2 degrees and less than or equal to 180 degrees. The multi-beam laser element of claim 10, wherein the first laser unit comprises a reflective element and a laser die, wherein a beam emitted by the laser die passes through the reflective component Reflecting to form the first laser beam.