JPH06268385A - Electronic circuit module device - Google Patents

Abstract

PURPOSE:To make it possible to realize high-density mounting with a simple construction by providing a case and a flexible printed circuit board which has electronic parts attached on the surface on one side and another surface of the board on the opposite side being arranged along at least two or more neighboring surfaces on the inner surfaces of the case. CONSTITUTION:This module device comprises a case 12 having an upper lid 1 and a lower lid 2 of the case and a flexible printed circuit board 6; the upper lid 1 has a flat plate shape and the lower lid 2 has a box shape thereby connecting both lids together, the flexible circuit board 6 has electronic parts only on one surface on one side, and the other surface on the opposite side is arranged along two or more surfaces on the inner surfaces of the box-shaped case 12. For example, electronic parts 5 are mounted on the wiring pattern on the one surface thereby forming an electronic circuit; and the flexible circuit board is bent and inserted along the three inner surfaces of the top surface, side surface and bottom surface of the upper lid 1 and lower lid 2 of the case, and connections a made by soldering. This makes the mounting density extremely high.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit module device used for constructing a unit having functions such as amplification, oscillation, control, and composite functions thereof.

[0002]

2. Description of the Related Art As electronic devices have become more and more complex in recent years, modularizing each function of the electronic devices to construct an electronic circuit module device is a versatile technique for the purpose of facilitating the configuration of the electronic device itself. Many are used. Further, in various electronic devices, there are active movements toward miniaturization and weight reduction, and accordingly, there is a strong demand for miniaturization of electronic circuit module devices.

In response to these demands, electronic circuit modules
The device is in the direction of mounting components with high density. At the same time, the applications are diversifying, and for example, an electronic circuit module device mounted on a movable part such as an optical head of an optical disk device is required. A conventional electronic circuit module device is shown in FIGS. That is, FIG. 5 is a perspective view of a conventional electronic circuit module device, and FIG. 6 is a sectional view thereof. In FIGS. 5 and 6, reference numeral 1 is a case upper lid, 2 is a case lower lid, 3 is a double-sided printed wiring board, 4 is a through capacitor penetrating the case upper lid 1, and 5 is an electronic component.

In this electronic circuit module, the cases 1 and 2 prevent internal electromagnetic circuits from being affected by electromagnetic waves from the outside, or electromagnetic waves generated in the internal electronic circuits leak to the outside. It has a shield role so that it is not made of metal. The double-sided printed circuit board 3 has electronic components 5 mounted on both the front and back sides in order to make the electronic circuit module itself compact, and the material is a rigid material such as glass epoxy.
Further, the feedthrough capacitor 4 functions as a bypass capacitor in order to prevent the electromagnetic wave from entering and leaking from the lead drawing portion and to enhance the shield effect, and at the same time, to lead the lead wire.
It also has the role of a lead, and normally the wiring of the external electronic circuit is soldered to the outer lead of the feedthrough capacitor 4.
Particularly in the case of an electronic circuit module device mounted on a movable part such as an optical head of an optical disk device, a flexible printed circuit board is often soldered.

As described above, the electronic circuit module device having a specific function is unitized, and the target characteristics can be obtained by only supplying a constant power from the device side.

[0006]

However, in this electronic circuit module, since it is necessary to provide the case upper lid 1 or the like with a mechanism for holding the double-sided mounting printed circuit board 3 in the hollow, the case upper lid 1 or the like is not provided. It has a drawback that the structure becomes complicated. In addition, productivity is low because it has parts that are not suitable for automatic mounting by machines such as feedthrough capacitors, and it is difficult to secure the positional accuracy of the terminals of feedthrough capacitors.
Other electronic circuit boards, flexible printed circuit boards, etc.
However, it has a defect that the bondability with the wiring is poor.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an electronic circuit module device capable of high-density mounting with a simple structure.

[0008]

According to a first aspect of the present invention, there is provided an electronic circuit module device comprising: a case; and two or more cases having an electronic component on one side thereof and the other side of which is at least adjacent to the inner surface of the case. And a flexible printed circuit board arranged along the surface. The electronic circuit module according to claim 2.
According to a first aspect of the present invention, in the device, the case has a board drawing portion, one end of the flexible printed board is drawn out from the board drawing portion, and the drawing means is provided with connecting means for connecting to an external electronic circuit. .

An electronic circuit module device according to a third aspect of the present invention is the electronic circuit module device according to the second aspect, wherein the case is made of metal, and the chip is provided between the wiring lead and the ground lead of the flexible printed circuit board which passes through the board drawing portion inside the board drawing portion. The capacitor is mounted, and a connecting portion for connecting the board lead-out portion and the ground lead of the flexible printed board passing through the board lead-out portion is provided.

[0010]

According to the electronic circuit module device of claim 1,
Since one surface of the flexible printed circuit board having no electronic component is arranged along at least two adjacent surfaces of the inner surface of the case, the mounting density of the electronic component can be improved and the structure is simple. Therefore, the cost can be reduced. Further, since the electronic components can be mounted on the flexible printed circuit board in the expanded state of the flexible printed circuit board, automatic mounting is easy.

According to a second aspect of the electronic circuit module device of the present invention, in the first aspect, the case has a board drawing-out portion, one end of the flexible printed board is drawn out from the board drawing-out portion, and the drawn-out portion is external. Since the connecting means for connecting to the electronic circuit is provided, in addition to the function of claim 1, the bondability with the external electric circuit is good. According to a third aspect of the electronic circuit module device of the present invention, in the second aspect, the case is made of metal, and the chip capacitor is provided between the wiring lead and the ground lead of the flexible printed circuit board that passes through the board drawing portion inside the board drawing portion. And a connection part for connecting the ground lead of the flexible printed circuit board passing through the board lead-out part and the board lead-out part. It is possible to prevent the influence on the invasion and leakage of electromagnetic waves.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a sectional view of an electronic circuit module device according to the first embodiment, and FIG. 2 is a perspective view thereof. In FIG. 1, 1 is a case upper lid, 2 is a case lower lid, 5 is an electronic component, 6 is a flexible printed circuit board,
Reference numeral 7 is an external connection means.

This electronic circuit module device is composed of a case 12 consisting of a case upper lid 1 and a case lower lid 2 and a flexible printed circuit board 6. In the case 12, the case upper lid 1 has a flat plate shape, and the case lower lid 2 has a box shape, and both are connected by a connecting means. In addition, a board drawing-out portion 14 is provided by forming a gap between the case upper lid 1 and the case lower lid 2. Reference numeral 13 is a mounting portion.

The plexiable printed circuit board 6 is provided with the electronic component 5 on one side and is arranged so that the opposite side is along at least two adjacent inner surfaces of the case 12. In the embodiment, the electronic component 5 is mounted on the wiring pattern on one side to form an electronic circuit, and the upper surface of the case upper lid 1 and the case lower lid 2 are provided on the inner surface extending over the three sides. It is bent and inserted, and is adhered by soldering, etc., so that the mounting density is high.

Further, one end of the flexible printed board 6 is drawn out from the board drawing-out portion 14, and a connecting means 7 is provided, which is a plug for connecting to an external electronic circuit. According to this embodiment, one surface of the flexible printed circuit board 6 which does not have the electronic component 5 is disposed along at least two adjacent surfaces of the inner surface of the case 12, so that the electronic component 5 is mounted. Since the density can be improved and the structure is simple, the cost can be reduced. Further, since the electronic component 5 can be mounted on the flexible printed circuit board 6 in the expanded state of the flexible printed circuit board, automatic mounting is easy.

Further, the case 12 has a substrate drawing portion 14,
Since one end of the flexible printed circuit board 6 is drawn out from the board drawing-out portion 14 and the connecting means 7 for connecting to the external electronic circuit is provided in the drawn-out portion, the connection with the external electric circuit is good. A second embodiment of the present invention is shown in FIG. That is, this electronic circuit module device is applied to a semiconductor laser, and in the first embodiment, the case lower lid 2 is used.
A thick metal is used for forming the concave portion 15, the through hole 16 is formed in the bottom surface of the concave portion 15, the semiconductor laser 8 is press-fitted into the concave portion 15, and the lead 17 of the semiconductor laser 8 is formed through the through hole 16. It is connected to a predetermined portion of the flexible printed circuit board 6 through the.

This allows an electric signal from the electronic circuit module device to be applied directly to the semiconductor laser 8. Further, the case lower lid 2 also serves as a holder for the semiconductor laser 8 so that the semiconductor laser 8 can be fixed to an optical base such as an optical disk device. In addition, an optical base such as an optical disk device is often a movable part,
Even in such a case, since the lead is pulled out by the flexible printed board 6, the connection with the device is completed only by inserting the connecting means 7 of the flexible printed board 6 into the socket of the external circuit.

In the electronic circuit module device of this embodiment, by constructing an oscillator of several hundred MHz band, a small-sized and easy-to-mount high-frequency superimposition for reducing semiconductor laser noise, which is indispensable in an optical disk device. The module can be configured. A third embodiment of the present invention is shown in FIG. That is, this electronic circuit module device is applied to a high-frequency superimposing circuit, and the case 12 is made of metal for shielding, and is flexible inside the board drawing portion 14 and connected to the connecting means 7 through the board drawing portion 14. The chip capacitor 9 is mounted between the wiring lead 18 and the ground lead 17 of the printed board 6, and the board lead-out portion 1
It has a connecting portion 11 that connects the ground lead 17 of the flexible printed circuit board 6 passing through 4 and the board drawing portion 14. The connection portion 11 of the embodiment is formed by solder.

According to this embodiment, the chip capacitor 9
The bypass circuit can prevent the influence of the electromagnetic wave from entering or leaking from the outside. That is, when the high-frequency superimposing circuit in the case 12 and the external circuit are connected by the connecting means 7 of the flexible printed circuit board 6, unnecessary radiation is generated from the circuit of the flexible circuit board 6 to the outside, and a noise source of other signal processing circuits. Will cause malfunction of the equipment. In this case, in the case 12 of the electronic circuit module device, since the chip capacitor 9 is connected between the signal lead 18 and the ground lead 17 in the immediate vicinity of the board drawing portion 14, the chip capacitor 9 is mounted on the signal lead 18 and externally. It is possible to reduce unnecessary radiation that is about to go out to the circuit by dropping it to the ground. In addition, unnecessary radiation can be reduced by blocking a part of the board lead-out portion 14 with the connection portion 11, and at the same time, the case 12 and the ground can be shared, so that the ground can be strengthened. As a result, it is possible to realize an electronic circuit module device in which unnecessary radiation is sufficiently reduced.

[0020]

According to the electronic circuit module device of the present invention, one surface of the flexible printed circuit board having no electronic component is arranged along at least two adjacent surfaces of the inner surface of the case. Therefore, the mounting density of electronic components can be improved, and the structure is simple, so that the cost can be reduced. Further, since the electronic components can be mounted on the flexible printed circuit board in the unfolded state of the flexible printed circuit board, there is an effect that automatic mounting is easy.

According to a second aspect of the electronic circuit module device of the present invention, in the first aspect, the case has a board drawing-out portion, one end of the flexible printed board is drawn out from the board drawing-out portion, and the drawn-out portion is external. Since the connection means for connecting to the electronic circuit is provided, in addition to the effect of the first aspect, the bondability with the external electric circuit is good. According to a third aspect of the electronic circuit module device of the present invention, in the second aspect, the case is made of metal, and the chip capacitor is provided between the wiring lead and the ground lead of the flexible printed circuit board that passes through the board drawing portion inside the board drawing portion. And a connection part for connecting the ground lead of the flexible printed circuit board passing through the board lead-out part and the board lead-out part. It is possible to prevent the influence on the invasion and leakage of electromagnetic waves.

[Brief description of drawings]

FIG. 1 is a sectional view of an electronic circuit module device according to a first embodiment of the present invention.

FIG. 2 is a perspective view of the appearance.

FIG. 3 is a sectional view of an electronic circuit module device according to a second embodiment.

FIG. 4 is a perspective view of an electronic circuit module device according to a third embodiment.

FIG. 5 is a perspective view of a conventional electronic circuit module device.

FIG. 6 is a sectional view thereof.

[Explanation of symbols]

 5 Electronic parts 6 Flexible printed circuit board 12 Case

Claims (3)

[Claims] 1. A case and an electronic component on one surface, and the other surface on the opposite side is adjacent to at least the inner surface of the case.
An electronic circuit module device having a flexible printed circuit board arranged along one or more surfaces. 2. The case has a board drawing portion, and one end of the flexible printed board is drawn out from the board drawing portion.
2. The electronic circuit module device according to claim 1, wherein a connecting means for connecting to an external electronic circuit is provided in the lead-out portion. 3. The case is made of metal, and a chip capacitor is mounted between a wiring lead and a ground lead of a flexible printed circuit board that passes through the board drawing section inside the board drawing section, and a flexible print that passes through the board drawing section. The electronic circuit module device according to claim 2, further comprising a connecting portion that connects the ground lead of the substrate and the substrate drawing portion.